JPH0195045A - Preparation of multilayer printed wiring board - Google Patents
Preparation of multilayer printed wiring boardInfo
- Publication number
- JPH0195045A JPH0195045A JP62254079A JP25407987A JPH0195045A JP H0195045 A JPH0195045 A JP H0195045A JP 62254079 A JP62254079 A JP 62254079A JP 25407987 A JP25407987 A JP 25407987A JP H0195045 A JPH0195045 A JP H0195045A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- laminated
- vacuum
- bag
- platen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 17
- 238000001816 cooling Methods 0.000 abstract description 11
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、多層プリント配線板の積層ラミネート工程に
おいて、熱と圧力の制御によりハイドロプレス方式を用
いて積層する配線板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for manufacturing a wiring board in which multilayer printed wiring boards are laminated using a hydropress method by controlling heat and pressure.
（従来の技術）
従来は、第２図に図示するように、真空バッグ８内部に
多層配線板を製造するためのエポキシ、フェノール、ポ
リエステル等の耐熱性樹脂と、紙、ガラス布帛などの基
材を重ね合わせた数枚−組の基板材料４を、離型フィル
ム９及び仕切りプレート１０などによって挾み込み、積
層状態に多層に重ね合わゼ、上下にアルミ製のトッププ
レート５、ボトムプレート３を重ね合わせたプレプレグ
を配置し、真空バッグ８内のエアーを吸引して、該バッ
グ８により材料４をタイトに圧着し、加熱装置によって
加熱して材料を所定の溶融状態にしてラミネートし、配
線基板として積層接着している。(Prior Art) Conventionally, as shown in FIG. 2, a heat-resistant resin such as epoxy, phenol, or polyester and a base material such as paper or glass fabric were used to manufacture a multilayer wiring board inside a vacuum bag 8. A set of several sheets of substrate material 4, which are stacked together, is sandwiched between a release film 9, a partition plate 10, etc., and stacked in multiple layers to form a laminated state.A top plate 5 and a bottom plate 3 made of aluminum are stacked on top and bottom. The combined prepregs are placed, the air in the vacuum bag 8 is sucked, the material 4 is tightly crimped with the bag 8, and the material is heated with a heating device to melt the material to a predetermined state and then laminated to form a wiring board. Laminated and bonded.
この場合、バッグ８は、積層された配線基板用材料４の
側面に直接密着して圧着して材料を固定するものである
。この場合、圧着後の加熱及び冷却操作においては、上
下からの熱伝導速度よりも材料４に対する側部からの熱
伝導速度が早く、材料側面の外側部分だけが先に加熱あ
るいは冷却されてしまうため、積層接着後のラミネート
製品の内部と周囲との間の厚味むらが発生し易い。その
ため、材料４側部に樹脂の溶融による食み出しが発生し
、そのため材料内部と端縁部との厚さが不均一になるな
ど、特にハイフロータイブの樹脂を材料として使用した
場合は、その傾向が顕著である。In this case, the bag 8 is brought into direct close contact with the side surface of the laminated wiring board material 4 and is crimped to fix the material. In this case, in the heating and cooling operations after crimping, the rate of heat conduction from the side to the material 4 is faster than the rate of heat conduction from above and below, and only the outer part of the side of the material is heated or cooled first. After lamination and adhesion, uneven thickness tends to occur between the inside and the surroundings of the laminated product. As a result, protrusion occurs on the sides of the material 4 due to melting of the resin, resulting in uneven thickness between the inside of the material and the edges, especially when high-flow type resin is used as the material. The trend is remarkable.
（発明の目的）
本発明は、加圧、加熱時点及び加圧、加熱後の冷却操作
において；加圧、加熱を均一に行ない、冷却時において
は、加工材料が急激に冷却されるのを防止して、加工材
料に対する均一な厚さと、平面性、待にハイフローな樹
脂基板材料を用いた場合におけるそれを得ることを目的
とするものである。(Objective of the Invention) The present invention is aimed at: performing pressure and heating uniformly during pressurization, heating, and cooling operations after pressurization and heating; and preventing the processing material from cooling rapidly during cooling. The purpose of this invention is to obtain uniform thickness and flatness of the processed material, especially when using a high-flow resin substrate material.
（発明の構成）
本発明は、多層プリント配線板の積層ラミネート工程に
おいて、吸引孔を備えたプラテン、あるいは該プラテン
上に載置するディスパージョンプレート上に、ボトムプ
レート、仕切りプレート及び離型性フィルム、積層ラミ
ネート用配線基板材料、離型性フィルムをこの順に重ね
合わせたものを一単位として複数単位積層し、その最上
層にトッププレートを重ね合わせてプレプレグを構成し
、プレプレグの少なくとも側部に空間部形成用のコの字
型等の治具を配置した後、全体を真空バッグにて真空吸
引して材料を圧着及び加熱してラミネートすることを特
徴とする多層プリント配線板の製造方法である。(Structure of the Invention) The present invention provides a method for disposing a bottom plate, a partition plate, and a release film on a platen equipped with suction holes or a dispersion plate placed on the platen in a lamination process of a multilayer printed wiring board. , a wiring board material for laminated laminate, and a release film are laminated in this order as one unit, and a plurality of units are laminated as one unit, and a top plate is stacked on the top layer to form a prepreg, and a space is formed at least on the side of the prepreg. This is a method for producing a multilayer printed wiring board, which is characterized in that after arranging a U-shaped jig for forming parts, the entire board is vacuum-suctioned in a vacuum bag, the materials are crimped, heated, and laminated. .
本発明方法を一実施例に従って詳細に説明する。The method of the present invention will be explained in detail according to one embodiment.
第１図は本発明の一実施例における製造工程を説明する
側面図である。吸引用の孔設部１ａを備えるプラテン１
上に、ディスパージョンプレート２を載置し、該プレー
ト２上に該プレートと同サイズのボトムプレート３を載
置する。該ボトムプレート３は、その左右両側に材料位
置決め用ガイドビン１１を立設するための差込部３ａを
備える。FIG. 1 is a side view illustrating the manufacturing process in one embodiment of the present invention. A platen 1 equipped with a suction hole 1a
A dispersion plate 2 is placed on top, and a bottom plate 3 of the same size as the plate is placed on top of the plate 2. The bottom plate 3 is provided with insertion portions 3a on both left and right sides thereof for erecting guide bins 11 for material positioning.
そして、該差込部３ａには、ボトムプレート３下側より
ガイドビン１１を差し込んで立設するものである。そし
て位置決め用のガイドビン１１を差し込むためのビン孔
４ａを協えた離型性フィルム９、仕切りプレート１０．
基板材料４等のプレプレグにガイドビン１１を差し込み
、位置合わせと同時に多層に揃えて重ね合わせる。そし
て、離型性フィルム９、仕切りプレート１ｏによって数
枚−組の基板材料４を多数組順次積層し、最上部にはア
ルミなど金属製のトッププレート５を積層する。次に重
ね合わせ基板材料プレプレグの側部のプラテン上にコの
字型治具６を載置する。コの字型治具６はその空間部７
側を、前記重ね合わせた材料４のプレプレグ側部に対向
させて配置する。The guide bin 11 is inserted into the insertion portion 3a from below the bottom plate 3 and is erected. A releasable film 9 and a partition plate 10 each have a hole 4a for inserting a guide pin 11 for positioning.
The guide bin 11 is inserted into a prepreg such as the substrate material 4, and simultaneously aligned and stacked in multiple layers. Then, a large number of sets of substrate materials 4 are sequentially laminated using a releasable film 9 and a partition plate 1o, and a top plate 5 made of metal such as aluminum is laminated on top. Next, a U-shaped jig 6 is placed on the platen on the side of the stacked substrate material prepreg. The U-shaped jig 6 has its space 7
The sides are placed opposite the prepreg sides of the superimposed material 4.
配置した治具６の最上部は、積層重合した基板材料４と
同じ高さにすることが望ましい。次に、プレプレグ及び
コの字型治具６仝体を耐熱性の柔軟なシート材料からな
る真空バッグ８により被覆して、バッグ８の材料装填用
開放部を、シールテープ１２等によりシールする。そし
て、プラテン１の吸引口１ａより真空吸引してバッグ８
内に負圧を与え、外圧によりバッグ８をプレプレグ側に
タイトに圧着させる。そして、バッグ８外側より加熱す
ることによって、各組の重ね合わせ基板材料４を溶融し
て加圧しながら接着し、続いて加熱解除して冷却し、真
空吸引を解除して、バッグ内に数組の配線板を製造する
ものである。空間部７を形成するための治具としては、
コの字型治具の他に、櫛刃状の治具なと適宜選択できる
。It is desirable that the top of the placed jig 6 be at the same height as the laminated and polymerized substrate material 4. Next, the prepreg and the U-shaped jig 6 are covered with a vacuum bag 8 made of a heat-resistant flexible sheet material, and the material loading opening of the bag 8 is sealed with a seal tape 12 or the like. Then, the bag 8 is vacuum-suctioned from the suction port 1a of the platen 1.
Negative pressure is applied inside and the bag 8 is tightly crimped to the prepreg side by external pressure. Then, by heating from the outside of the bag 8, each set of overlapping substrate material 4 is melted and bonded under pressure, then the heating is removed and cooled, the vacuum suction is released, and several sets of board materials are placed inside the bag. The company manufactures wiring boards of As a jig for forming the space 7,
In addition to the U-shaped jig, a comb-shaped jig can be selected as appropriate.
第３図は、本発明方法の他の実施例の説明図であり、真
空吸引バッグ８の外側に、該バッグ全体を外側より密封
可能に被覆する外板１３を設けたものである。このバッ
グ８内に基板形成用材料４等プレプレグを装填し、プレ
プレグの側部に空間形成用の治具を配置した後、バッグ
８を真空吸引した後、外板１３の高圧空気吹込口より高
圧エアーを圧入してバッグ８の材料４に加わる圧着力を
高めるようにしたものである。FIG. 3 is an explanatory diagram of another embodiment of the method of the present invention, in which an outer plate 13 is provided on the outside of the vacuum suction bag 8 to sealably cover the entire bag from the outside. After loading a prepreg such as substrate forming material 4 into the bag 8 and arranging a jig for forming a space on the side of the prepreg, the bag 8 is vacuum-suctioned, and then high pressure is Air is press-fitted to increase the pressure applied to the material 4 of the bag 8.
（発明の作用）
本発明方法によれば、基板材料４等プレプレグ積層体の
側部に空間を形成するための治具を設置して真空バッグ
８により加圧して、外側より加熱溶融し、側部に空間を
保持した状態で、重ね合わゼ基板材料４を接着ラミネー
トするものであり、このバッグ８を真空吸引して加圧し
たとき、材料４側部とコの字型治具６との空間７部分に
真空部分が生じて熱の伝導率が低下する。そのため、プ
レプレグの側面からの加熱速度が減少でき、プレプレグ
の側部だけが内部に対して過度に加熱されるようなこと
がなく、上下よりの加熱操作による熱伝導及び側部から
のゆるやかな熱伝導によって、プレプレグが加熱溶融さ
れる。そのため、基板材料４の重ね合わ「内部の加熱に
比較して材料４側部が過度に溶融進行覆ることがなく、
従って材料４の側部における溶融金み出しがない。また
、冷却する場合においては、真空空間７部分によってプ
レプレグ側面の冷却速度が減速され、上下からの冷却作
用及び側面からの緩かな冷却作用によって均一な冷却操
作が行なえるものである。このため、本発明方法によっ
てｇＩ層ラミネートされて製造した配線板は、厚味にむ
らが発生せず、弯曲や歪曲の発生を防止することができ
るものである。(Function of the invention) According to the method of the present invention, a jig for forming a space on the side of the prepreg laminate such as the substrate material 4 is installed, and pressure is applied by the vacuum bag 8 to heat and melt from the outside. The overlapping substrate material 4 is adhesively laminated with a space maintained between the side parts of the material 4 and the U-shaped jig 6 when this bag 8 is vacuum-suctioned and pressurized. A vacuum portion is created at 7, and the thermal conductivity decreases. Therefore, the heating rate from the sides of the prepreg can be reduced, and only the sides of the prepreg will not be excessively heated to the inside, and heat conduction from the top and bottom heating operations and gradual heat generation from the sides. The prepreg is heated and melted by conduction. Therefore, when the substrate material 4 is overlaid, the sides of the material 4 do not melt excessively compared to internal heating.
Therefore, there is no molten metal seepage on the sides of the material 4. In addition, when cooling, the cooling speed of the side surfaces of the prepreg is reduced by the vacuum space 7, and a uniform cooling operation can be performed by the cooling action from above and below and the gentle cooling action from the sides. Therefore, the wiring board manufactured by laminating the gI layer according to the method of the present invention has no unevenness in thickness and can prevent the occurrence of curvature or distortion.
また、基板材料４のラミネートによるボイド（気泡）の
発生を少なくするためにハイフロータイブの樹脂を基板
材料４として使用した場合でも、積層ラミネートの加熱
圧着工程中において、材料４の側部への食み出しのない
ように良好にｆＩＩＩｌｌｌすることができるものであ
る。Furthermore, even when high-flow type resin is used as the substrate material 4 in order to reduce the generation of voids (bubbles) due to lamination of the substrate material 4, corrosion of the side portions of the material 4 may occur during the heat compression bonding process of the laminated laminate. It is possible to perform fIIIllll well so that there is no protrusion.
（発明の効果）
本発明方法によれば、プリント配線板等配線板の積層製
造において、重ね合わせられた基板材料の内部と側端部
との加熱、冷却を均一にして厚味にむらを発生させずに
、精度よく製造することができ、ＷＡ造に使用１−る配
ＩＩ基板材料の材質が異なる場合でも、温度の制御が行
ないやすく、多品種同時生産が可能になる。また、基板
の材質としてハイフロータイブのいずれを使用しても温
度コントロールが行ない易く、基板材料の重ね合わせ枚
数を従来よりも条目に設定して￥ＩＪ造する場合でも均
一な厚味の配線板を製造することができるものである。(Effects of the Invention) According to the method of the present invention, in the laminated manufacturing of wiring boards such as printed wiring boards, heating and cooling of the inside and side edges of stacked board materials is uniform, thereby eliminating uneven thickness. Even if the materials used for the first and second wiring board materials used in WA manufacturing are different, temperature can be easily controlled and a wide variety of products can be produced simultaneously. In addition, temperature control is easy no matter which type of high-flow type board material is used, and wiring boards with uniform thickness can be achieved even when the number of stacked board materials is set in a row compared to conventional methods and IJ manufacturing is performed. It is something that can be manufactured.
第１図は本発明における一実施例の工程を説明する側面
図、第２図は従来の工程の側面図、第３図は本発明にお
ける他の実施例の工程を説明する側面図である。
特 許 出 願 人
凸版印刷株式会社
代表者 鈴 木 和 夫FIG. 1 is a side view illustrating the process of one embodiment of the present invention, FIG. 2 is a side view of the conventional process, and FIG. 3 is a side view illustrating the process of another embodiment of the present invention. Patent application: Kazuo Suzuki, Representative of Toppan Printing Co., Ltd.
Claims (1)
程において、吸引孔を備えたプラテン、あるいは該プラ
テン上に載置するディスパージョンプレート上に、ボト
ムプレート、仕切りプレート及び離型性フィルム、積層
ラミネート用配線基板材料、離型性フィルムをこの順に
重ね合わせものを一単位層として複数単位積層し、その
最上層にトッププレートを重ね合わせてプレプレグを構
成し、少なくともプレプレグの側部に、空間部を形成す
るコの字型等の治具を配置し、全体を真空バッグにて真
空吸引して前記材料を圧着及び加熱してラミネートする
ことを特徴とする多層プリント配線板の製造方法。In the lamination process in the production of multilayer printed wiring boards, a bottom plate, a partition plate, a release film, and a wiring board material for lamination are placed on a platen equipped with suction holes or a dispersion plate placed on the platen. A prepreg is formed by laminating a plurality of release films in this order as one unit layer, and a top plate is superimposed on the top layer, and a space is formed at least on the side of the prepreg. 1. A method for manufacturing a multilayer printed wiring board, which comprises arranging a jig such as a letter shape, vacuum suctioning the entire body in a vacuum bag, pressing and heating the materials, and laminating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62254079A JPH06378B2 (en) | 1987-10-08 | 1987-10-08 | Method for manufacturing multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62254079A JPH06378B2 (en) | 1987-10-08 | 1987-10-08 | Method for manufacturing multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0195045A true JPH0195045A (en) | 1989-04-13 |
| JPH06378B2 JPH06378B2 (en) | 1994-01-05 |
Family
ID=17259931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62254079A Expired - Lifetime JPH06378B2 (en) | 1987-10-08 | 1987-10-08 | Method for manufacturing multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06378B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07124972A (en) * | 1993-10-29 | 1995-05-16 | Mitsui Toatsu Chem Inc | Method and device for molding material |
| KR100390011B1 (en) * | 2001-07-26 | 2003-07-04 | 삼성전기주식회사 | Autoclave for preparing the high performance ball grid array substrate and method for preparing the HP-BGA using the same |
| EP1386726A1 (en) * | 2002-07-31 | 2004-02-04 | Fox Technologies S.r.l. | A process and device for pressing multi-layered cards |
| US6708401B2 (en) * | 2000-03-29 | 2004-03-23 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing article having electronic circuit |
| WO2008082907A1 (en) * | 2006-12-29 | 2008-07-10 | 3M Innovative Properties Company | Apparatus for mounting laminates on substrates and methods thereof |
| JP2010186848A (en) * | 2009-02-12 | 2010-08-26 | Fujitsu Ltd | Method of manufacturing electronic component unit |
| JP2014143345A (en) * | 2013-01-25 | 2014-08-07 | Murata Mfg Co Ltd | Method of manufacturing thermoplastic resin multilayer substrate |
| CN107053819A (en) * | 2017-06-06 | 2017-08-18 | 济南月宫冷冻设备有限公司 | Laminating machine and laminating machine system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103770437B (en) * | 2014-02-13 | 2015-11-18 | 朱丹华 | Adjustable positive/negative-pressure compound road |
-
1987
- 1987-10-08 JP JP62254079A patent/JPH06378B2/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07124972A (en) * | 1993-10-29 | 1995-05-16 | Mitsui Toatsu Chem Inc | Method and device for molding material |
| US6708401B2 (en) * | 2000-03-29 | 2004-03-23 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing article having electronic circuit |
| KR100390011B1 (en) * | 2001-07-26 | 2003-07-04 | 삼성전기주식회사 | Autoclave for preparing the high performance ball grid array substrate and method for preparing the HP-BGA using the same |
| EP1386726A1 (en) * | 2002-07-31 | 2004-02-04 | Fox Technologies S.r.l. | A process and device for pressing multi-layered cards |
| WO2008082907A1 (en) * | 2006-12-29 | 2008-07-10 | 3M Innovative Properties Company | Apparatus for mounting laminates on substrates and methods thereof |
| JP2010186848A (en) * | 2009-02-12 | 2010-08-26 | Fujitsu Ltd | Method of manufacturing electronic component unit |
| JP2014143345A (en) * | 2013-01-25 | 2014-08-07 | Murata Mfg Co Ltd | Method of manufacturing thermoplastic resin multilayer substrate |
| CN107053819A (en) * | 2017-06-06 | 2017-08-18 | 济南月宫冷冻设备有限公司 | Laminating machine and laminating machine system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06378B2 (en) | 1994-01-05 |
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