JP2005035181A - Molding apparatus for resin molded article and molding method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that a transfer surface in a transfer plate is cooled down more than other portions in transfer molding, since it is deprived of heat by a resin plate-shaped body being molded, and therefore a distributed temperature of the transfer plate becomes uneven, which makes it impossible to perform uniform transfer molding of the resin plate-shaped body, regarding a molding apparatus of a resin molded article which comprises a cooling board, the transfer plate brought into contact with and cooled by the cooling board after heating and a pressing mechanism of the transfer plate and wherein the transfer plate is pressed against the resin plate-shaped body to conduct the transfer molding of this body. <P>SOLUTION: The molding apparatus of the resin molded article is equipped with the cooling board 7, the transfer plate 9 which has at the back a contact face brought into contact with and separated from the cooling board 7 and has a transfer face 9a on the surface, a heating mechanism of the transfer plate 9 and the pressing mechanism 4 which presses the transfer face 9a against the resin plate-shaped body A1 to conduct the transfer molding. The apparatus is equipped with a temperature regulating mechanism 15 which lessens a difference in the distributed temperature in the transfer plate 9 except for the occasion when the transfer molding is made on the resin plate-shaped body A1 by the pressing mechanism 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention comprises a cooling plate, a transfer plate that is brought into contact with and cooled by the cooling plate after heating, and a pressing mechanism for the transfer plate. By pressing the transfer plate against a resin plate, the resin The present invention relates to a molding apparatus for a resin molded product that performs transfer molding on a plate-like body and a molding method thereof.

  It consists of a cooling plate, a hot plate that is brought into contact with the cooling plate after heating and cooled, a film body, and a film body operating means, and by pressing the hot plate through the film body against the laminated plate As a molding apparatus that heats and pressurizes a laminate, the one described in Patent Document 1 is known. However, in the one described in Patent Document 1, the temperature of the central portion of the hot plate that presses the laminated plate becomes lower than the temperature of the peripheral portion during continuous lamination molding, and the distribution temperature becomes non-uniform. There was a problem that it was not possible to perform proper lamination molding.

Patent Document 2 describes an optical disk molding apparatus by injection molding in which a stamper is separated from a temperature adjusting unit when resin material is injected, the stamper is heated by induction heating, and then the stamper is solidified when the resin material is solidified. The temperature control unit is brought into contact with the support unit, and the resin material is rapidly solidified to increase the productivity of the optical disc. However, since the thing of patent document 2 is made to flow high temperature molten resin, it was not necessary to consider the distribution temperature difference in a stamper, and it could perform continuous shaping | molding.
Japanese Patent Laid-Open No. 2001-79865 (Claim 1, FIGS. 1 to 5) JP-A-8-132498 (Claim 1, FIG. 1)

  Therefore, the present invention comprises a cooling plate, a transfer plate that is brought into contact with the cooling plate after being heated and cooled, and a pressing mechanism for the transfer plate, and by pressing the transfer plate against the resin plate-like body, Regarding a molding device for resin molded products that performs transfer molding on a resin plate-like body, the transfer surface of the transfer plate is deprived of heat by the molded resin plate-like body at the time of transfer molding, so cooling proceeds from other parts. An object of the present invention is to solve the problem that the distribution temperature of the transfer plate becomes non-uniform and the transfer plate cannot be uniformly formed on the resin plate.

  A molding apparatus for a resin molded product according to claim 1 of the present invention includes a cooling plate, a transfer plate having a contact surface that contacts and is separated from the cooling plate on the back surface, and a transfer surface on the surface. A molding apparatus for a resin molded product, comprising: a heating mechanism for a transfer plate; and a pressing mechanism that performs transfer molding by pressing a transfer surface against the resin plate-like body, and is for the resin plate-like body by the pressing mechanism. It is characterized in that a temperature adjusting mechanism for reducing the distribution temperature difference in the transfer plate is provided at a time other than the transfer molding.

  A molding apparatus for a resin molded product according to claim 2 of the present invention includes a cooling plate, a transfer plate having a contact surface that contacts and separates from the cooling plate on the back surface and a transfer surface on the surface, Molding of a resin molded product provided with a transfer plate heating mechanism, a pressing mechanism for pressing a transfer surface against a resin plate to perform transfer molding, and a transfer stage for pressing against the resin plate A temperature adjustment plate that is in contact with the transfer plate when the transfer surface is not transferred to the resin plate-like body, and a temperature adjustment unit that is provided near the transfer stage and adjusts the temperature of the temperature adjustment plate And a temperature adjusting plate moving mechanism for reciprocally moving the temperature adjusting plate between the temperature adjusting unit and the transfer stage.

  According to a third aspect of the present invention, there is provided a molding apparatus for a resin molded product according to the second aspect, wherein the surface of the transfer plate is composed of a transfer surface that is in contact with the resin plate-like body and the other non-transfer surface. The adjustment plate has a surface abutted against the surface of the transfer plate, and the surface is larger than the outer shape of the transfer surface and includes a non-transfer surface around the transfer surface.

  According to a fourth aspect of the present invention, there is provided the molding apparatus for a resin molded product according to the second or third aspect, wherein the temperature adjusting plate moving mechanism is configured to move the temperature of the resin molded product transferred from the transfer stage. The adjustment plate is moved from the temperature adjustment unit to the transfer stage.

  According to a fifth aspect of the present invention, there is provided a molding method for a resin molded product comprising: a cooling plate; a transfer plate that is brought into contact with the cooling plate after being heated and cooled; and the transfer plate is pressed against the resin plate-like body for transfer. It consists of a pressing mechanism that performs molding and a temperature adjustment mechanism that reduces the difference in temperature distribution on the transfer plate. After performing transfer molding by pressing the transfer plate against the resin plate, the temperature adjustment mechanism It is characterized in that a difference in distribution temperature in the transfer plate is reduced.

  The present invention comprises a cooling plate, a transfer plate that comes into contact with the cooling plate after being heated and cooled, and a pressing mechanism for the transfer plate. By pressing the transfer plate against a resin plate, Because the temperature distribution mechanism that adjusts the distribution temperature difference of the transfer plate that occurs when performing transfer molding to the plate-like body is adjusted by a time other than during the transfer molding of the resin plate-like body, And uniform transfer molding.

  An embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is a cross-sectional view of a molding apparatus for a resin molded product according to the present invention. Similarly, FIG. 2 is a cross-sectional view of a molding apparatus for a resin molded product according to the present invention, and shows a state in which a distribution temperature difference of a transfer plate is reduced by a temperature adjustment mechanism. FIG. 3 is a diagram showing the distribution temperature on the surface of the transfer plate 9 after transfer molding.

  As shown in FIG. 1, the molding apparatus for a resin molded product according to the present invention includes a press apparatus 1 and a temperature adjusting mechanism 15 disposed in the vicinity thereof. The press apparatus 1 is provided with a lower mold 3 placed on a bed 2 and an upper mold 6 fixed to a ram 4 of a pressing cylinder, which is a pressing mechanism, and mounted on an upper movable plate 5 that can be moved up and down. It has been. In addition, about the press mechanism of the press apparatus 1, it is not limited to the thing by the said ram 4, The thing of the other mechanism using an electric motor may be used. The resin molded product A2 transferred and molded in the present invention is an LCD light guide plate as an example, but may be a component such as a panel of another display device, or other molded product such as a disk substrate or a lens. There may be.

  The lower mold 3 will be described in detail. On the bed 2, a flat plate-like cooling board 7 constituting a part of the lower mold 3 is attached. The cooling plate 7 has a plurality of temperature adjusting medium passages 8 formed therein and is controlled to a predetermined temperature. On the bed 2, a holder 10 is attached in the vicinity of the cooling plate 7 in order to prevent a later-described transfer plate 9 from being separated from the cooling plate 7 by a certain distance. Further, a spring 11 as a transfer plate moving mechanism for moving the transfer plate 9 in contact with and away from the cooling plate 7 is attached near the inside of the holder 10 on the bed 2, and the other end of the spring 11 holds the transfer plate 9. It is fixed to the holding part 12 to hold. The transfer plate moving mechanism may use an actuator such as a cylinder. The holding part 12 is brought into contact with the holder 10 when the spring 11 is extended. A plurality of electrodes are fixed to the holding portion 12, and the electrodes are connected to terminals 13, respectively. A transfer plate 9 is fixed to the holding portions 12 and 12 facing each other with the cooling plate 7 interposed therebetween.

  The transfer plate 9 is formed of a plate-like body having a smaller heat capacity than the cooling plate 7 or a temperature adjusting plate 16 described later. In this embodiment, the transfer plate 9 is obtained by bonding a rubber sheet, which is an insulator and an elastic body, to a stainless steel plate having a thickness of 3 mm. On the surface of the stainless steel plate, which is the surface of the transfer plate 9, fine irregularities for performing transfer molding are formed, and a portion in contact with the resin plate A1 is a transfer surface 9a. A contact surface is formed on the surface of the rubber sheet which is the back surface of the transfer plate 9 so as to be parallel to the surface of the cooling plate 7. The transfer plate 9 comes into contact with the cooling plate 7 when the spring 11 contracts. Further, when the transfer plate 9 is separated from the cooling plate 7, a heating mechanism is provided that is energized from a power source (not shown) through the terminal 13 and the electrode of the holding unit 12 to generate resistance heat. The heating mechanism for the transfer plate 9 may be other methods such as induction heating.

  In the present embodiment, the area of the surface where the fine irregularities are formed on the surface of the transfer plate 9 is transferred by placing resin plate bodies of various sizes or a plurality of resin plate bodies simultaneously. It is provided in the area more than the magnitude | size of resin plate-shaped object A1 so that shaping | molding is possible. As for the transfer plate 9, in addition to this embodiment, a stamper having fine irregularities with a thickness of about 0.1 mm may be attached to the surface of the stainless steel plate with the above thickness. Further, the rubber sheet of the transfer plate 9 is not essential, and the rubber sheet may be fixed to the cooling plate 7 or the like. Further, the rubber sheet may be provided separately from the transfer plate 9 and the cooling plate 7, and in this case, the contact surface of the transfer plate 9 and the cooling plate 7 are indirectly provided via the rubber sheet and its holding member. Will abut.

  When the transfer plate 9 is not pressed by the ram 4, the transfer plate 9 is located away from the cooling plate 7 by the elastic force of the spring 11, and the transfer plate 9 is moved by the ram 4 through the resin plate A 1. When pressed, the spring 11 is contracted and the contact surface and the cooling board 7 are brought into contact. Moreover, in the press apparatus 1 of this embodiment, all the pressing force by the ram 4 reaches the resin plate A1 via the transfer surface 9a of the transfer plate 9.

  Further, in the press device 1 of the present embodiment, the upper mold 6 has the same structure as the lower mold 3 described above, and transfer molding is performed on the resin plate A1 between the upper mold 6 and the lower mold 3. The transfer stage 14 to be performed is formed, and transfer molding is performed on both surfaces of the resin plate A1 by the transfer plate 9 of the lower mold 3 and the transfer plate 9 of the upper mold 6. However, the present invention only needs to have the transfer plate 9 on at least one of the lower mold 3 and the upper mold 6.

  Next, the temperature adjustment mechanism 15 for reducing the distribution temperature difference of the transfer plate 9 in the resin molded product molding apparatus of the present invention will be described. The temperature adjusting mechanism 15 makes the distribution temperature difference of the transfer plate 9 generated at the time of transfer molding substantially equal after the transfer molding. In the present embodiment, the temperature adjustment mechanism 15 includes the temperature adjustment plate 16 that is in direct contact with the transfer plate 9 and the temperature of the temperature adjustment plate 16 when the ram 4 is not being transferred to the resin plate A1. And a temperature adjusting plate moving mechanism 18 for reciprocating the temperature adjusting plate 16 between the temperature adjusting unit 17 and the transfer stage 14.

  The temperature adjustment plate 16 is made of a material having good thermal conductivity, and in the present embodiment, is made of a stainless plate. The areas of the surfaces 16 a and 16 b of the temperature adjustment plate 16 that are in contact with the transfer plate 9 are the same as the area of the transfer plate 9. However, the size of the surfaces 16a and 16b of the temperature adjusting plate 16 is larger than the outer shape of the transfer surface 9a and the non-transfer surface 9c around the transfer surface (the area between the one-dot chain line and the two-dot chain line in FIG. 3). Any size is acceptable. In the present embodiment, the temperature adjustment plate 16 has a thickness of 10 mm, but the heat capacity of the temperature adjustment plate 16 is preferably at least three times that of the transfer plate 9.

  1, in the vicinity of the transfer stage 14 of the press apparatus 1, a temperature adjusting unit 17 for adjusting the distribution temperature on the temperature adjusting plate 16 to be substantially constant is disposed. Although the details of the temperature adjustment unit 17 are omitted, a cooling pipe, a blower, and the like are provided, and the temperature adjustment plate 16 is blown evenly from the upper surface and the lower surface side of the temperature adjustment plate 16. The distribution temperature is made uniform and the desired temperature is obtained.

  Next, a temperature adjustment plate moving mechanism 18 that reciprocates the temperature adjustment plate 16 between the temperature adjustment unit 17 and the transfer stage 14 will be described. Between the temperature adjusting unit 17 and the transfer stage 14, a holding unit 19 that holds the temperature adjusting plate 16 and two guide rails 20 that are used when the holding unit 19 is reciprocated are installed. . Although details of the holding portion 19 are not illustrated, the holding portion 19 includes a carrier that holds the temperature adjusting plate 16 from both sides and a cylinder mechanism that is an actuator that drives the carrier, and the temperature adjusting plate 16 can be held or opened freely. Can be done. A cylinder 21 for reciprocating the clamping part 19 along the guide rail 20 is disposed on the side of the temperature adjustment part 17, and a rod of the cylinder 21 is connected to the clamping part 19.

  Further, in the present embodiment, the resin plate A1 that has been carried on the conveyor 22 is carried into the transfer stage 14 of the press device 1, and the molded resin product A2 that has been molded is carried out onto the conveyor 22 again. A molded product moving mechanism 23 is provided. The molded product moving mechanism 23 includes a transfer arm 23b to which a plurality of suction cups 23a for adsorbing the resin plate A1 and the resin molded product A2, a lifting mechanism 23c for moving the transfer arm 23b up and down, and a horizontal movement of the arm. It consists of a moving mechanism 23d and the like. The molded product moving mechanism 23 is horizontally moved in the same direction in synchronization with the temperature adjusting plate moving mechanism 18 when the resin plate A1 is carried in and the resin molded product A2 is carried out. In addition, you may use another well-known moving mechanism for the above-mentioned molded article moving mechanism 23 and the temperature adjusting plate moving mechanism 18.

  Next, the operation of the molding apparatus for resin molded products will be described. In the state shown in FIG. 1, the molded product moving mechanism 23 carries the normal temperature resin plate A <b> 1 into the transfer stage 14 of the press device 1, and the temperature adjustment plate 16 is positioned inside the temperature adjustment unit 17 to adjust the temperature. Shows the state where is performed. Thereafter, the molded product moving mechanism 23 releases the suction of the resin plate A1 and places the resin plate A1 on the transfer surface 9a of the transfer plate 9 of the lower mold 3. Then, when the transfer arm 23b of the molded product moving mechanism 23 leaves the transfer stage 14, transfer molding is started. First, the ram 4 of the pressing mechanism is lowered, and the transfer plate 9 of the upper mold 6 is brought into contact with the upper surface of the resin plate A1. Then, energization is started from a power source (not shown) to the transfer plates 9 and 9 of the lower die 3 and the upper die 6, and the transfer plates 9 and 9 are simultaneously heated by resistance. The procedure for placing the resin plate A1 and starting the heating of the transfer plate 9 is such that the transfer plate 9 is first heated and then the resin plate A is placed on the transfer surface 9a. May be.

  In this state, the ram 4 has not yet been lowered for all strokes, and neither the cooling plate 7 of the upper mold 6 and the transfer plate 9 nor the cooling plate 7 of the lower mold 3 and the transfer plate 9 are both. Since it is not yet in contact, the transfer plates 9, 9 are heated rapidly. When the transfer stage 14 of the press apparatus 1 is provided in the vacuum chamber, the transfer stage 14 is depressurized at the same time. Then, after the transfer plate 9 reaches a predetermined temperature or a predetermined time elapses, the ram 4 is re-driven to bring the cooling plate 7 and the transfer plate 9 into direct contact or indirectly through a rubber film, and transfer The transfer surface 9a of the plate 9 is brought into contact with the resin plate A1, and the resin plate A1 is pressed through the transfer plate 9 to perform transfer molding. At this time, heating of the transfer plate 9 is stopped before and after the contact between the cooling plate 7 and the transfer plate 9. As a result, for the resin plate A1, the temperature of the transfer plate 9 is increased in the initial stage of transfer molding, so that the transfer can be performed well. In the latter stage of transfer molding, the temperature of the transfer plate 9 is reduced to the cooling plate. 7, the molding time can be shortened, and the release from the transfer plate 9 can be improved.

  At this time, the temperature of the transfer surface 9a of the transfer plate 9 is pressed by the resin plate A1 at room temperature, so that the heat is taken away by the resin plate A1 and becomes lower than the temperature of the non-transfer surface 9b. As a result, the peripheral portion 9d of the transfer surface 9a adjacent to the non-transfer surface 9b is affected by the heat from the non-transfer surface 9b. Therefore, there is a distribution temperature difference between the central portion 9e and the peripheral portion 9d on the transfer surface 9a. Will occur. When the next molding is performed in such a state, since the distribution temperature on the transfer surface 9a is not uniform, the transfer is uneven with respect to the resin plate A1.

  Therefore, in the molding apparatus for resin molded products of the present invention, the temperature adjustment mechanism 15 reduces the distribution temperature difference in the transfer plate 9 after transfer molding. When the ram 4 of the transfer plate press device 1 rises upward and the transfer molding to the resin plate A1 is completed and the resin molded product A2 is molded, the resin molded product A2 is moved to the molded product moving mechanism 23. As a result, the transfer stage 14 moves to the carry-out conveyor 22. At the same time, as shown in FIG. 2, the temperature adjustment plate 16 stored in the temperature adjustment unit 17 and cooled to a uniform temperature is carried into the transfer stage 14 by the temperature adjustment plate moving mechanism 18, and the temperature adjustment plate 16. The surface 16 a is placed on the transfer plate 9 of the lower mold 3. Then, the ram 4 is lowered again, and the transfer plate 9 of the upper mold 6 and the transfer plate 9 of the lower mold 3 are brought into contact with the contact surfaces 16b and 16a of the temperature adjusting plate 16, respectively, and are pressed by the ram 4 to be pressed. The distribution temperature difference between the transfer plate 9 and the transfer plate 9 of the lower mold 3 is reduced and made substantially uniform. At this time, the temperature adjustment plate 16 is formed in a size larger than the outer shape of the resin plate A1 to be molded and including the non-transfer surface 9c around the transfer surface. Since it is placed so as to be in contact with the non-transfer surface 9c around the transfer surface, the non-transfer surface 9c around the transfer surface is also strongly pressed by the cooling plate 7, and the non-transfer surface 9c around the transfer surface and the transfer surface are transferred. The temperature of the peripheral portion 9d of the surface 9a is lowered. When the distribution temperature between the central portion 9e and the peripheral portion 9d of the transfer surface 9a becomes substantially uniform, the ram 4 is raised, the temperature adjusting plate 16 is moved to the temperature adjusting portion 17, and the next resin plate-like body A1 is carried into the transfer stage 14 of the press apparatus 1 from the conveyor 22.

  In the resin molded product molding apparatus of this embodiment, the temperature adjustment plate 16 is brought into contact with the entire transfer plate 9 to cool the transfer plate 9 substantially uniformly, thereby reducing the distribution temperature difference of the transfer plate 9. ing. However, the temperature adjusting plate 16 is brought into contact with only the non-transfer surface 9b of the transfer plate 9, or only the non-transfer surface 9b and the peripheral portion 9d of the transfer surface 9a, and only the contacted portion is cooled. May be. Instead of cooling the transfer plate 9 by the temperature adjustment plate 16, the temperature adjustment plate 16 is set to at least the temperature of the peripheral portion 9d of the transfer surface 9a of the transfer plate 9 after transfer molding. May be brought into contact with the transfer surface 9a to reduce the distribution temperature difference of the transfer plate 9. Further, the temperature adjustment plate 16 may be obtained by attaching a thin rubber sheet or the like to the surfaces 16 a and 16 b in order to protect the transfer surface 9 a of the transfer plate 9. You may make it contact | abut.

  Further, as the temperature adjustment mechanism 15, instead of the temperature adjustment plate 16, the temperature-adjusted air or the like may be directly blown to the whole or a part of the transfer plate 9 in the press device 1. Further, at a time other than the transfer molding, the transfer plate 9 is unloaded from the transfer stage 14 of the press device 1 to the outside of the press device 1 and inserted into the temperature adjusting unit 17, and the temperature difference of the distribution temperature of the transfer plate 9 is adjusted. 17 may be made uniform directly. In that case, it is desirable to rotate a plurality of transfer plates 9. Furthermore, the distribution temperature of the transfer surface 9a of the transfer plate 9 can be increased by preheating the resin plate A1 before transfer molding, or by using a mechanism such as lowering the temperature distribution of the cooling plate 7 toward the periphery. The difference can be relaxed.

  The present invention is not enumerated one by one, but is not limited to the embodiments and examples described above, and it goes without saying that the present invention can be applied to modifications made based on the spirit of the present invention. That is.

It is sectional drawing of the shaping | molding apparatus of the resin molded product of this invention. It is sectional drawing of the shaping | molding apparatus of the resin molded product of this invention, Comprising: It is a figure which shows the state which is reducing the distribution temperature difference of a transfer plate with the temperature adjustment mechanism. It is a figure which shows the distribution temperature in the surface of the transfer plate after transfer molding.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Press apparatus 2 Bed 3 Lower mold 4 Ram 5 Upper movable board 6 Upper mold 7 Cooling board 8 Temperature control medium path 9 Transfer plate 9a Transfer surface
9b Non-transfer surface 9c Non-transfer surface around transfer surface 9d Peripheral portion 9e Center portion 10 Holder 11 Spring 12 Holding portion 13 Terminal 14 Transfer stage 15 Temperature adjustment mechanism 16 Temperature adjustment plate 16a, 16b Surface 17 Temperature adjustment portion 18 Temperature adjustment Plate moving mechanism 19 Nipping part 20 Guide rail 21 Cylinder 22 Conveyor 23 Molded product moving mechanism 23a Suction cup 23b Transport arm 23c Lifting mechanism 23d Moving mechanism A1 Resin plate A2 Resin molded product

Claims (5)

A cooling panel,
A transfer plate having a contact surface on the back surface that is in contact with and separated from the cooling plate and having a transfer surface on the surface;
A heating mechanism of the transfer plate;
A pressing device that presses the transfer surface against a resin plate to perform transfer molding, and a molding device for a resin molded product,
At times other than during transfer molding to the resin plate-like body by the pressing mechanism,
A molding apparatus for a resin molded product, comprising a temperature adjusting mechanism for reducing a difference in distribution temperature in the transfer plate. A cooling panel,
A transfer plate having a contact surface on the back surface that is in contact with and separated from the cooling plate and having a transfer surface on the surface;
A heating mechanism of the transfer plate;
A pressing mechanism that presses the transfer surface against a resin plate to perform transfer molding;
A transfer stage for pressing the resin plate-like body, and a molding device for a resin molded product comprising:
A temperature adjusting plate that comes into contact with the transfer plate at a time other than during transfer molding to the resin plate-like body by the pressing mechanism;
A temperature adjusting unit provided in the vicinity of the transfer stage for adjusting the temperature of the temperature adjusting plate;
An apparatus for molding a resin molded product, comprising: a temperature adjustment plate moving mechanism that reciprocally moves the temperature adjustment plate between the temperature adjustment unit and the transfer stage. The surface of the transfer plate consists of a transfer surface abutting on the resin plate-like body and other non-transfer surfaces,
The temperature adjustment plate has a surface that comes into contact with the surface of the transfer plate,
The apparatus for molding a resin molded product according to claim 2, wherein the surface is larger than the outer shape of the transfer surface and includes a non-transfer surface around the transfer surface. The temperature adjusting plate moving mechanism is
The said temperature adjustment board is moved to the said transfer stage from the said temperature adjustment part when carrying out the resin molded product by which transfer molding was carried out from the said transfer stage, The said transfer stage is characterized by the above-mentioned. Molding equipment for resin molded products. A cooling panel,
A transfer plate that is brought into contact with and cooled by the cooling plate after heating;
A pressing mechanism that presses the transfer plate against a resin plate to perform transfer molding;
A temperature adjusting mechanism for reducing the distribution temperature difference in the transfer plate,
After performing transfer molding by pressing the transfer plate against the resin plate,
A molding method of a resin molded product, wherein the temperature difference mechanism reduces a distribution temperature difference in the transfer plate.

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