200804075 4 (1) 九、發明說明 【發明所屬之技術領域】 本發明係關於，將具有微細圖案之壓模緊壓於熱塑性 樹脂板的表面，以在熱塑性樹脂板的表面上轉印微細圖案 之技術；特別是關於在模壓成形後容易使熱塑性樹脂板從 壓模進行脫模之技術。 Φ 【先前技術】 使用熱塑性樹脂材料，在真空或減壓狀態之真空室內 熱轉印微細圖案之模壓成形裝置爲既有技術。該模壓成形 裝置，例如應用於液晶顯示面板用的熱塑性樹脂製的導光 板之製造等等。 這種模壓成形裝置，係將具有微細圖案之壓模緊壓於 熱塑性樹脂板的表面，當完成圖案的轉印後，必須使熱塑 性樹脂板從壓模進行脫模。然而，壓模可能緊貼於熱塑性 鲁 樹脂板的表面而無法順利地進行脫模。針對這種情形，專 利文獻1記載著，對加工對象物與壓模之接觸面噴吹空 氣’將空氣送入加工對象物與壓模之間以進行脫模。 〔專利文獻1〕曰本特開2006- 1 67788號公報 使用噴吹t虱之脫模，當加工對象物與壓模之間產生 些微間隙時，噴吹空氣能送入加工對象物與壓模間之間隙 (脫模面）而能發揮良好作用。 【發明內容】 -4- 200804075 4； (2) 然而，當壓模與加工對象物之間形成真空時，加工 象物與壓模之間完全沒有間隙。因此，即使進行氣體之 吹，氣體可能無法送入加工對象物與壓模之間，而造成 法脫模。這種現象，在真空或接近真空之減壓狀態進行 壓成形時，特別容易發生。 於是，本發明之目的係提供一種模壓成形裝置，當 壓模緊壓於加工對象物而完成圖案之轉印後，容易使加 φ 對象物從壓模確實地進行脫模。 依據本發明一實施態樣之模壓成形裝置（1 )，係 備：用來對板狀的熱塑性加工對象物（2)實施模壓成形 第1及第2模具（35 a，35b)、用來對前述第1及第2模具 施加熱及冷卻之第1及第2溫度調節部（3 4a，34b)、用來 前述第1及第2溫度調節部的溫度控制成目標溫度之溫 控制裝置（60)、用來噴吹空氣之空氣噴嘴（41，41);將前 第1及第2模具緊壓於前述加工對象物的兩面而進行模 • 成形後’使用來自前述空氣噴嘴之空氣使前述加工對象 從前述第1及第2模具進行脫模。前述溫度控制裝置係 備加熱控制手段以及冷卻控制手段；該加熱控制手段， 將前述第1及第2模具緊壓於前述加工對象物而進行模 成形時’係將前述第1及第2溫度調節部都加熱控制成 述加工對象物的軟化溫度以上之目標溫度；該冷卻控制 段’在前述空氣噴嘴噴吹出空氣時，係將前述第1及第 温度調節部冷卻控制成前述軟化溫度以下之互相不同的 標溫度。 對 噴 Μ y\\\ 模 將 工 具 之 實 將 度 述 壓 物 具 在 壓 、r· 刖 手 2 巨 -5- 200804075 ‘ (3) 在較佳的實施態樣，前述冷卻控制手段係控制成：將 前述第1及第2溫度調節部從前述軟化溫度以上之目標溫 度冷卻成前述互相不同的目標溫度。 在另一較佳的實施形態，前述冷卻控制手段係控制 成：將前述第1及第2溫度調節部冷卻後進行再加熱，而 使前述第1及第2溫度調節部成爲前述互相不同的目標溫 度。 φ 依據本發明一實施態樣之模壓成形方法，係使用模壓 成形裝置（1)之模壓成形方法，該模壓成形裝置（1)係具 備：用來對板狀的熱塑性加工對象物（2)實施模壓成形之 第1及第2模具（3 5 a，3 5 b)、用來對前述第1及第2模具實 施加熱及冷卻之第1及第2溫度調節部（3 4a，34b)、用來噴 吹空氣之空氣噴嘴（41，41);該模壓成形方法包括：前述第 1及第2溫度調節部將前述第1及第2模具加熱至前述加 工對象物的軟化溫度以上之步驟、將前述加熱至軟化溫度 φ 以上之第1及第2模具緊壓於前述加工對象物的兩面而進 行模壓成形之步驟、在前述模壓成形後將前述第1及第2 模具間之距離擴大既定距離，朝向前述第1及第2模具分 別和前述加工對象物之接觸面噴吹來自前述空氣噴嘴之空 氣的步驟、在前述噴吹空氣時，將前述第1及第2溫度調 節部冷卻成不同的目標溫度之步驟。 【實施方式】 以下，針對本發明一實施形態之模壓成形裝置，使用 -6 - 200804075 ' (4) 圖式來做說明。 第1圖係顯示本發明之模壓成形裝置1之槪略構造。 模壓成形裝置1，如第1圖所示係具備：用來模壓加 工對象物2之模壓部3 0、以及用來控制模壓部3 0之構 造。用來控制模壓部30之構造係具備：用來使滑件2 1上 下運動之電動機（伺服馬達11，11)、用來將伺服馬達11，11 的旋轉轉換成滑件2 1的直線運動之動力轉換機構（滑輪 φ 12，12、確動皮帶13，13、滾珠螺桿14，14)、用來驅動伺服 馬達η，1 1之控制器1 7、用來調節壓模3 5的溫度之溫度 控制裝置60。控制器1 7，係根據滑件位置檢測手段23，23 的輸出，而輸出藉由位置控制來驅動伺服馬達11，11之控 制訊號；並根據加壓力檢測手段24，24之輸出，而輸出藉 由加壓力控制來驅動伺服馬達1 1，1 1之控制訊號。以下會 對控制器1 7所輸出之控制訊號做詳細說明。當伺服放大 器16，16接收來自控制器17之控制訊號後，根據該控制 • 訊號與編碼器1 5 ,1 5之輸出來控制輸出至伺服馬達1 1，1 1 之電流。亦即，依據控制器1 7之指示使伺服馬達1 1動 作’而使安裝於滑件2 1之後述壓模3 5接近或遠離加工對 象物2。此外，依據控制器1 7之指示使壓模3 5·緊壓於加 工對象物2，而對加工對象物2實施模壓成形。 加工對象物2，係熱塑性樹脂板，例如爲丙烯酸酯製 或聚碳酸酯製之導光用板。壓模35a，35b，例如是在表面 具有凹凸形狀（待形成於導光板表面）之不鏽鋼製或鎳製之 0·2〜2.0mm厚的薄板。 -7- (5) (5)200804075 第2圖係顯示模壓部3 〇的詳細構造之截面圖，第3 圖係顯示模壓部30與溫度控制裝置60的詳細構造。 模壓部3 0係具有：結合於滑件21之上殼體3 1與結 合於承板22之下殼體32。隨著滑件21之上下移動，上 殼體31會進行上下移動。又在上殼體31與下殼體32之 接觸部分，分別安裝著真空密封件3 9，3 9，3 9，3 9。又當上 殻體31下降而使上殻體31所安裝之真空密封件3 9,3 9和 下殼體32所安裝之真空密封件3 9,39接觸時，會在上殼 體3 1及下殼體32的內部形成密閉空間（真空室）。 下殼體32具備用來噴吹空氣之空氣噴嘴41，41。當模 壓成形後，爲了使加工對象物2從壓模3 5脫模，係將空 氣噴吹至壓模3 5與加工對象物2的接觸面附近。以下會 對噴吹空氣之時點等做說明。 在下殼體32設有大氣開放口 36及真空吸引口 37。 大氣開放口 36係透過真空閥46使大氣進入。真空吸引口 37係透過真空閥45連接於真空泵40。當真空室內形)成真 空或減壓狀態時，將真空閥45打開並將真空閥46關閉， 用真空泵40進行真空抽吸。使大氣進入真空室內時，將 真空閥45關閉並將真空閥46打開。在下殼體32，安裝 有用來檢測真空室內的氣壓之壓力檢測器（未圖示）。 在上殼體3 1及下殼體3 2各個之內側，從外側向內側 依序積層以下構件··隔熱板33(33a，33b)、板狀之溫度調 節容器（以下稱溫度調節板）34(3 4a，34b)、用來將既定的凹 凸圖案轉印於加工對象物2之模具之壓模35(35a，35b)。 200804075 v (6) 在溫度調節板34a，34b，設有用來檢測溫度調節板的溫度 之溫度檢測器38a，38b。 在溫度調節板34的內部設有流路，以使供給自溫度 控制裝置60之液體或氣體等的流體通過。藉由使既定溫 度的流體流過該流路，以進行壓模3 5之加熱及冷卻。如 後述般，溫度控制裝置60 ’藉由控制流過溫度調節板34 內的流路之流體溫度’以決定溫度調節板34之加熱溫度 φ 及冷卻溫度。 溫度控制裝置60 ’係將溫度調節板34的溫度控制成 目標溫度。例如’溫度控制裝置60 ’係使用高溫蒸氣（用 來加熱溫度調節板3 4的介質）、低溫冷卻水（用來冷卻的 介質），將其中任一方供給至上下之溫度調節板34a，34b 各個。亦即，溫度控制裝置60係具備：供冷卻水流入之 冷卻水供給口 62、供蒸氣流入之蒸氣供給口 63、用來排 出冷卻水之冷卻口回流口 6 4、用來從溫度調節板3 4除去 φ 冷卻水之空氣供給口 6 5。 各供給口 62、63 ’分別連接於用來將蒸氣或冷卻水 供給至上下的溫度調節板3 4 a，3 4 b之供給管線6 6 ’冷卻水 回流口 64，係連接於延伸自上下的溫度調節板34a，3 4b之 排水管線67。在各供給口 62、63與供給管線06之間配 置電磁閥611〜616。如後述般，藉由控制電磁閥611〜 616之開閉，以進行上下的溫度調節板34a，34b之加熱及 冷卻。 溫度控制裝置6 0，可獨立控制上下的溫度調節板 -9- 200804075 ^ (7) 34a，34b，以使上下的溫度調節板34a，34b形成 將溫度調節板34加熱或冷卻時，係預先設定 設定溫度，溫度控制裝置6〇從中選擇一個溫 溫度。例如，在本實施形態，如第4圖所示， 溫度調節板34a，34b的溫度，係設定2組加壽 組冷卻用模式，而以其中任一個溫度模式進 φ 接著說明，將溫度調節板3 4加熱或冷卻 控制裝置60之控制。 首先，在加熱時，溫度控制裝置 60 613,614,615 打開，將電磁閥 611，612,616,61 此，對上下的溫度調節板34a，34b供給來自蒸: 之蒸氣，而進行加熱。這時，溫度控制裝置 溫度感測器38a，38b來監測上下的溫度調節板 別的溫度。 φ 例如，在選擇「加熱1」之溫度模式時， 置60對上溫度調節板34a供給蒸氣，當溫度 度Hu 1時關閉電磁閥6 1 3。電磁閥6 1 3關閉後 上溫度調節板3 4a供給蒸氣，因此上溫度調節 度開始下降。當上溫度調節板34a之溫度低 Hul時，溫度控制裝置60再度打開電磁閥6 始對上溫度調節板34a供給蒸氣。藉由控制該 之開閉，能使上溫度調節板34a的溫度維持 Hul，因此溫度調節板34a能將壓模35a加熱 不同溫度。 複數個目標 度作爲目標 關於上下的 托用模式、2 行加熱或冷 時關於溫度 將電磁閥 7關閉。藉 氣供給口 6 3 6 0，係藉由 34a，34b 個 溫度控制裝 超過設定溫 ，會停止對 板34a之溫 於設定溫度 • 1 3，再度開 電磁閥6 1 3 於設定溫度 至設定溫度 -10 - 200804075 、 (8)200804075 4 (1) EMBODIMENT OF THE INVENTION [Technical Field] The present invention relates to pressing a stamper having a fine pattern on the surface of a thermoplastic resin sheet to transfer a fine pattern on the surface of the thermoplastic resin sheet Technology; in particular, a technique for easily releasing a thermoplastic resin sheet from a stamper after press molding. Φ [Prior Art] A molding apparatus for thermally transferring a fine pattern in a vacuum chamber in a vacuum or a reduced pressure state using a thermoplastic resin material is a prior art. The press molding apparatus is applied to, for example, the manufacture of a light guide plate made of a thermoplastic resin for a liquid crystal display panel. In this press forming apparatus, a stamp having a fine pattern is pressed against the surface of a thermoplastic resin sheet, and after the transfer of the pattern is completed, the thermoplastic resin sheet must be released from the stamper. However, the stamper may be in close contact with the surface of the thermoplastic resin sheet and cannot be smoothly released. In this case, Patent Document 1 discloses that air is blown to the contact surface between the object to be processed and the stamper. Air is sent between the object to be processed and the stamper to release the mold. [Patent Document 1] Unexamined-Japanese-Patent No. 2006- 1 67788, when the mold is blown, when a slight gap is formed between the object to be processed and the stamper, the blown air can be sent to the object to be processed and the stamper. The gap (release surface) can play a good role. SUMMARY OF THE INVENTION -4- 200804075 4; (2) However, when a vacuum is formed between the stamper and the object to be processed, there is no gap between the processed object and the stamper. Therefore, even if a gas is blown, the gas may not be sent between the object to be processed and the stamper, causing the mold to be released. This phenomenon is particularly likely to occur when press forming under vacuum or near vacuum. Accordingly, an object of the present invention is to provide a press molding apparatus which can easily release a φ object from a stamper after the stamper is pressed against the object to be processed and the pattern is transferred. A press molding apparatus (1) according to an embodiment of the present invention is provided for performing press molding of first and second molds (35a, 35b) on a sheet-shaped thermoplastic object (2) for use in a pair The first and second temperature adjustment units (34a, 34b) for applying heat and cooling to the first and second molds, and temperature control means for controlling the temperature of the first and second temperature adjustment units to a target temperature (60) Air nozzles (41, 41) for blowing air; after the first and second molds are pressed against both sides of the object to be molded, after molding, the air is processed by using the air from the air nozzle. The object was released from the first and second molds. The temperature control device is provided with a heating control means and a cooling control means for adjusting the first and second temperature when the first and second molds are pressed against the object to be processed and molded. Each of the parts is heated and controlled to a target temperature equal to or higher than a softening temperature of the object to be processed; and the cooling control section 'cools the first and second temperature adjusting units to and below the softening temperature when the air nozzle blows air. Different standard temperatures. For the sneeze y\\\ mold, the actual value of the tool is described in the pressure, r· 刖手 2 巨-5- 200804075 ' (3) In a preferred embodiment, the aforementioned cooling control means is controlled The first and second temperature adjustment units are cooled from the target temperature equal to or higher than the softening temperature to the target temperatures different from each other. In another preferred embodiment, the cooling control means controls the first and second temperature adjustment units to be reheated, and the first and second temperature adjustment units are mutually different targets. temperature. Φ The press molding method according to one embodiment of the present invention is a press molding method using a press molding apparatus (1) for performing a sheet-shaped thermoplastic processing object (2). The first and second molds (3 5 a, 3 5 b) for press molding, and the first and second temperature adjustment portions (34a, 34b) for heating and cooling the first and second molds, An air nozzle (41, 41) for blowing air; the press molding method includes the step of heating the first and second molds to a softening temperature of the object to be processed by the first and second temperature adjusting portions, and The first and second molds heated to a softening temperature φ or more are pressed against both surfaces of the object to be subjected to press molding, and the distance between the first and second dies is increased by a predetermined distance after the press molding. a step of blowing air from the air nozzle toward the contact surface between the first and second molds and the object to be processed, and cooling the first and second temperature adjustment units to different targets when the air is blown Temperature step . [Embodiment] Hereinafter, a press molding apparatus according to an embodiment of the present invention will be described using -6 - 200804075 ' (4). Fig. 1 is a schematic view showing a schematic configuration of a press forming apparatus 1 of the present invention. As shown in Fig. 1, the press molding apparatus 1 is provided with a molded portion 30 for molding the object 2 to be processed, and a structure for controlling the molded portion 30. The structure for controlling the molding portion 30 is provided with motors (servo motors 11, 11) for moving the slider 2 1 up and down, for converting the rotation of the servo motors 11, 11 into a linear motion of the slider 2 1 Power conversion mechanism (pulley φ 12, 12, positive belt 13, 13, ball screw 14, 14), controller 17 for driving the servo motor η, 1 1 , temperature for adjusting the temperature of the stamp 35 Control device 60. The controller 17 outputs the control signals of the servo motors 11, 11 by position control according to the outputs of the slider position detecting means 23, 23; and outputs the output according to the output of the pressure detecting means 24, 24 The control signal of the servo motor 1 1,1 1 is driven by the pressure control. The control signals output from the controller 17 will be described in detail below. When the servo amplifiers 16, 16 receive the control signal from the controller 17, the current output to the servo motor 1 1,1 1 is controlled based on the output of the control signal and the encoders 15 5 , 15 . That is, the servo motor 11 is actuated according to the instruction of the controller 17 to cause the stamper 35, which will be described later, to be attached to the slider 2 1 to approach or move away from the processed object 2. Further, the stamper 35 is pressed against the workpiece 2 in accordance with an instruction from the controller 17, and the object 2 is subjected to press molding. The object 2 to be processed is a thermoplastic resin sheet, for example, a light guide sheet made of acrylate or polycarbonate. The stampers 35a, 35b are, for example, sheets of 0. 2 to 2.0 mm thick made of stainless steel or nickel having irregularities on the surface (to be formed on the surface of the light guide plate). -7- (5) (5) 200804075 Fig. 2 is a cross-sectional view showing a detailed structure of the molded portion 3, and Fig. 3 shows a detailed structure of the molded portion 30 and the temperature control device 60. The molded portion 30 has a housing 31 that is coupled to the upper member of the slider 21 and a housing 32 that is coupled to the lower portion of the carrier 22. As the slider 21 moves up and down, the upper casing 31 moves up and down. Further, vacuum sealing members 3 9, 3 9, 3 9, 3 9 are attached to the contact portions of the upper casing 31 and the lower casing 32, respectively. When the upper casing 31 is lowered to bring the vacuum seals 3, 39 mounted on the upper casing 31 into contact with the vacuum seals 39, 39 mounted on the lower casing 32, the upper casing 31 and The inside of the lower casing 32 forms a closed space (vacuum chamber). The lower casing 32 is provided with air nozzles 41, 41 for blowing air. After the press molding, in order to release the object 2 from the stamper 35, air is blown to the vicinity of the contact surface of the stamper 35 and the object 2 to be processed. The following will explain the timing of blowing air. The lower casing 32 is provided with an atmosphere opening port 36 and a vacuum suction port 37. The atmosphere opening port 36 allows the atmosphere to enter through the vacuum valve 46. The vacuum suction port 37 is connected to the vacuum pump 40 through a vacuum valve 45. When the vacuum chamber is in a vacuum or decompressed state, the vacuum valve 45 is opened and the vacuum valve 46 is closed, and vacuum suction is performed by the vacuum pump 40. When the atmosphere is introduced into the vacuum chamber, the vacuum valve 45 is closed and the vacuum valve 46 is opened. A pressure detector (not shown) for detecting the air pressure in the vacuum chamber is attached to the lower casing 32. On the inner side of each of the upper casing 31 and the lower casing 3, the following members are stacked in order from the outer side to the inner side, and the heat insulating plates 33 (33a, 33b) and the plate-shaped temperature regulating container (hereinafter referred to as a temperature adjusting plate) 34 (3 4a, 34b), a stamper 35 (35a, 35b) for transferring a predetermined uneven pattern to a mold of the object 2 to be processed. 200804075 v (6) Temperature detectors 38a, 38b for detecting the temperature of the temperature adjustment plate are provided in the temperature adjustment plates 34a, 34b. A flow path is provided inside the temperature adjustment plate 34 to allow a fluid such as a liquid or a gas supplied from the temperature control device 60 to pass therethrough. The heating and cooling of the stamper 35 are performed by flowing a fluid of a predetermined temperature through the flow path. As will be described later, the temperature control device 60' determines the heating temperature φ and the cooling temperature of the temperature adjusting plate 34 by controlling the temperature of the fluid flowing through the flow path in the temperature adjusting plate 34. The temperature control device 60' controls the temperature of the temperature adjustment plate 34 to the target temperature. For example, the 'temperature control device 60' uses high-temperature steam (a medium for heating the temperature adjustment plate 34), low-temperature cooling water (a medium for cooling), and supplies one of them to the upper and lower temperature adjustment plates 34a, 34b. . In other words, the temperature control device 60 includes a cooling water supply port 62 through which the cooling water flows, a steam supply port 63 through which the steam flows, a cooling port return port 64 for discharging the cooling water, and a temperature adjustment plate 3 for use. 4 The air supply port 65 of the φ cooling water is removed. Each of the supply ports 62, 63' is connected to a supply line 6 6 'cooling water return port 64 for supplying steam or cooling water to the upper and lower temperature regulating plates 3 4 a, 3 4 b, and is connected to the upper and lower sides. The drain line 67 of the temperature regulating plates 34a, 34b. Solenoid valves 611 to 616 are disposed between the supply ports 62, 63 and the supply line 06. As will be described later, by controlling the opening and closing of the electromagnetic valves 611 to 616, the upper and lower temperature adjusting plates 34a and 34b are heated and cooled. The temperature control device 60 can independently control the upper and lower temperature adjustment plates -9- 200804075 ^ (7) 34a, 34b so that the upper and lower temperature adjustment plates 34a, 34b are formed when the temperature adjustment plate 34 is heated or cooled. The temperature is set, and the temperature control device 6 selects a temperature from it. For example, in the present embodiment, as shown in Fig. 4, the temperature of the temperature adjustment plates 34a and 34b is set to two sets of the life-span group cooling mode, and the temperature mode is set to φ in any one of the temperature modes. 3 4 Control of heating or cooling control device 60. First, at the time of heating, the temperature control devices 60 613, 614, 615 are opened, and the solenoid valves 611, 612, 616, 61 are supplied with steam from the upper and lower temperature regulating plates 34a, 34b for heating. At this time, the temperature control device temperature sensors 38a, 38b monitor the temperature of the upper and lower temperature regulating plates. φ For example, when the temperature mode of "heating 1" is selected, 60 pairs of upper temperature regulating plates 34a are supplied with steam, and when the temperature degree Hu1 is closed, the electromagnetic valves 6 1 3 are closed. After the solenoid valve 6 1 3 is closed, the upper temperature regulating plate 34a supplies steam, so the upper temperature adjustment degree starts to decrease. When the temperature of the upper temperature regulating plate 34a is low Hul, the temperature control device 60 opens the solenoid valve 6 again to supply the vapor to the upper temperature regulating plate 34a. By controlling the opening and closing, the temperature of the upper temperature regulating plate 34a can be maintained at Hul, so that the temperature regulating plate 34a can heat the stamper 35a at a different temperature. A plurality of target degrees are targeted. Regarding the upper and lower support modes, 2 lines of heating or cold, the temperature is related to the solenoid valve 7 being closed. By the gas supply port 6 3 6 0, the temperature is controlled by the 34a, 34b temperature exceeds the set temperature, the temperature of the plate 34a is stopped at the set temperature • 1 3, and the solenoid valve 6 1 3 is again opened to the set temperature. -10 - 200804075 , (8)
Hul。 在加熱下溫度調節板3 4b的情形，同樣地’溫度控制 裝置60控制電磁閥614之開閉以維持設定溫度H11。藉 此，溫度調節板34b能將壓模35b加熱至設定溫度H11 ° 這時，藉由使電磁閥613及電磁閥614獨立地進行開 閉，能將上下的溫度調節板34a，34b及壓模35a，35b分別 加熱至不同的溫度。 此外，在選擇「加熱2」之溫度模式時’上下的溫度 調節板34a，34b之設定溫度分別爲Hu2及H12 ’並進行與 「加熱1」的情形同樣的控制。 另一方面，在冷卻時，溫度控制裝置60將電磁閥 611，612,6 16 打開’將電磁閥 613,614,615,617 關閉。藉 此，對上下的溫度調節板34a，3 4b供給冷卻水’以冷卻溫 度調節板3 4a，3 4b。和加熱情形相同’藉由溫度感測器 38a，38b來監測上下的溫度調節板34a，34b的溫度，根據 監測結果，如下述般進行溫度調節板34a，34b之溫度控 制。 亦即，在選擇「冷卻1」之溫度模式時’對上溫度調 節板3 4a供給冷卻水’當溫度低於設定溫度Cu 1時關閉電 磁閥6 1 1。藉由關閉電磁閥6 1 1 ’會停止對上溫度調節板 3 4 a供給冷卻水，而使上溫度調節板3 4 a之溫度下降趨 緩。關於下溫度調節板3 4b也是同樣地’對下溫度調節板 34b供給冷卻水，當溫度低於設定溫度C11時關閉電磁閥 612。如此，可將上下的溫度調節板34a，34b分別冷卻至 -11 - 200804075 Ο) 設定溫度Cul，Cll，同時，利用冷卻後之溫度調節板 3 4a，3 4b能將壓模3 5a，3 5b冷卻至設定溫度Cul，Cll。 這時，藉由使電磁閥6 1 1及電磁閥6 1 2獨立地進行開 閉，能將上下的溫度調節板3 4 a，3 4 b及壓模3 5 a，3 5 b分別 冷卻至不同的溫度。 此外，在選擇「冷卻2」之溫度模式時’上下的溫度 調節板34a，34b之設定溫度分別爲Cu2及C12 ’並進行與 「冷卻1」的情形同樣的控制。 此外，爲了防止溫度調節板3 4之過度冷卻’可將溫 度調節板3 4上多餘的冷卻水施以排水。該排水’係在關 閉電磁閥611,612的狀態下，藉由打開電磁閥617來進 行。 接著，使用第5〜9圖，說明用本實施形態之模壓成 形裝置 1對加工對象物進行模壓動作之1週期。 第5 A〜D圖，係顯示將加工對象物2施以模壓之第1 模壓動作中，1週期之各種狀態的時間變化。亦即，第 5A圖顯示上下方向的滑件之位置變化，第5B圖顯示模壓 加壓力之變化，第5 C圖顯示溫度調節板3 4之溫度變化， 第5D圖顯示真空室內之氣壓變化。 第6A〜D圖係示意顯示模壓部30的1週期的動作狀 態。圖中以S 1〜S4表示滑件位置的變化。S 1〜S4係對應 於第5A圖之縱軸上的S1〜S4。 第7圖係顯示模壓加工之1週期的處理順序之流程 圖。 -12-Hul. In the case of heating the temperature regulating plate 34b, the temperature control means 60 controls the opening and closing of the solenoid valve 614 to maintain the set temperature H11. In this way, when the temperature regulating plate 34b can heat the stamper 35b to the set temperature H11, the upper and lower temperature adjusting plates 34a and 34b and the stamper 35a can be opened and closed by the electromagnetic valve 613 and the electromagnetic valve 614 independently. 35b is heated to different temperatures, respectively. Further, when the temperature mode of "heating 2" is selected, the set temperatures of the upper and lower temperature adjusting plates 34a, 34b are Hu2 and H12', respectively, and the same control as in the case of "heating 1" is performed. On the other hand, upon cooling, the temperature control device 60 opens the solenoid valves 611, 612, 6 16 ' to close the solenoid valves 613, 614, 615, 617. Thereby, cooling water ' is supplied to the upper and lower temperature regulating plates 34a, 34b to cool the temperature adjusting plates 34a, 34b. The temperature is the same as that of heating. The temperature of the upper and lower temperature regulating plates 34a, 34b is monitored by the temperature sensors 38a, 38b, and the temperature of the temperature regulating plates 34a, 34b is controlled as follows based on the monitoring results. That is, when the "cooling 1" temperature mode is selected, "the cooling water is supplied to the upper temperature regulating plate 34a". When the temperature is lower than the set temperature Cu1, the electromagnetic valve 6 1 1 is closed. By closing the solenoid valve 6 1 1 ', the supply of cooling water to the upper temperature regulating plate 34a is stopped, and the temperature drop of the upper temperature regulating plate 34a is slowed down. Similarly to the lower temperature adjustment plate 34b, cooling water is supplied to the lower temperature adjustment plate 34b, and when the temperature is lower than the set temperature C11, the electromagnetic valve 612 is closed. In this way, the upper and lower temperature adjustment plates 34a, 34b can be respectively cooled to -11 - 200804075 Ο) set temperatures Cul, C11, and at the same time, the molds 3 5a, 3 5b can be pressed by the cooled temperature adjustment plates 3 4a, 3 4b Cool to the set temperature Cul, Cll. At this time, by opening and closing the electromagnetic valve 61 1 and the electromagnetic valve 6 1 2 independently, the upper and lower temperature adjustment plates 3 4 a, 3 4 b and the stamps 35 5 a, 3 5 b can be separately cooled to different ones. temperature. Further, when the temperature mode of "cooling 2" is selected, the set temperatures of the upper and lower temperature adjusting plates 34a, 34b are Cu2 and C12', respectively, and the same control as in the case of "cooling 1" is performed. Further, in order to prevent excessive cooling of the temperature regulating plate 34, excess cooling water on the temperature adjusting plate 34 may be drained. This drain is performed by opening the solenoid valve 617 while the solenoid valves 611, 612 are closed. Next, a cycle in which the object to be processed is subjected to the molding operation by the press molding apparatus 1 of the present embodiment will be described with reference to the fifth to ninth drawings. In the fifth A to D drawings, the time change of each state in one cycle in the first molding operation in which the object 2 is molded is shown. That is, Fig. 5A shows the positional change of the slider in the up and down direction, Fig. 5B shows the change of the pressurization plus pressure, Fig. 5C shows the temperature change of the temperature adjustment plate 34, and Fig. 5D shows the change of the air pressure in the vacuum chamber. Figs. 6A to 6D schematically show the operation state of the one-cycle of the molded portion 30. In the figure, changes in the position of the slider are indicated by S 1 to S4. S 1 to S 4 correspond to S1 to S4 on the vertical axis of Fig. 5A. Fig. 7 is a flow chart showing the processing sequence of one cycle of the molding process. -12-
200804075 ^ (10) 首先，在時刻0，滑件2 1位於上限位置s 1。g 加工對象物2被搬入模壓部3 0 (S 1 1 )。開始藉由控制 進行位置控制，使滑件2 1下降至上下真空密封件 互相接觸之位置S2(S12)。 當滑件21下降至S2時（時刻tl)，真空泵40廣 行真空室內之真空抽吸（S 13)。藉此，如第5D圖所元 空室內的壓力開始降低。 在時刻tl以後，和真空抽吸動作並行，如第5C 示，溫度控制裝置6 0依「加熱1」之溫度模式開始 上下溫度調節板34a，34b的加熱（S14)。在第1模壓動 「加熱 1」之上下溫度調節板 34a，34b的設定 (Hul，Hll)相等，此設定溫度比加工對象物2之軟化 Tg高3 0°C以上。因此，例如，當加工對象物2爲丙 酯的情形，Hul=Hll = 120 〜140°C。 接著，當上下的溫度調節板34a，34b之溫度大致 設定溫度（Hu 1，H11)，且真空室內之真空度到達預定 定真空度P時（時刻t2)，藉由控制器1 7之加壓力控 使滑件21下降。這時，如第5B圖所示，控制器17 滑件21下降而成爲所設定之加壓力L，以加壓力L 模35對加工對象物2進行模壓（S 15)。維持此加壓力 段時間以對加工對象物2進行模壓成形。 以加壓力L進行模壓時，如第5A圖所示，滑 大致位於S3的位置。然而，這時並未實施位置控制 是實施加壓力控制，因此，隨著溫度調節板34a,34b :時， 器17 3 9,39 丨始進 :，真 圖所 進行 丨作， 溫度 溫度 烯酸 :到達 之設 丨制， 會使 用壓 L 一 件21 ，而 及加 -13- 200804075 ' (11) 工對象物2因加熱及冷卻所產生之熱膨脹與熱收縮’滑件 21的位置也會稍微上下移動，而使加壓力保持一定。 接著，溫度控制裝置60，如第5C圖所示，從溫度t3 起，以「冷卻1」的溫度模式開始進行上下溫度調節板 34 a，34b的冷卻（S16)。這時，滑件21的位置（第5A圖）、 滑件加壓力（第5B圖）、真空室內的氣壓（第5D圖）維持不 變 〇 φ 在第1模壓動作，「冷卻1」之溫度調節板34a，34b 之設定溫度Cul，C11，都比加工對象物之軟化溫度Tg爲 低，且上溫度調節板34a之設定溫度Cul和下溫度調節板 34b之設定溫度C11設定成不同（例如Cnl>Cll)。因此， 當加工對象物爲丙烯酸酯的情形，Cul與C11可在50〜90 °C之間。 當上下的溫度調節板34a，34b的溫度冷卻至「冷卻 1」之設定溫度時，控制器1 7藉由位置控制，使滑件2 1 φ 上昇既定距離ΔΗ而將上下壓模35a，35b間的距離擴大， 滑件21移動至位置S4(S 17)。在此，滑件21之移動距離 ΔΗ，只要不致使真空室打開，且能在加工對象物2的表 面與壓模3 5之間形成供噴吹空氣送入的間隙即可。 這時，在上下溫度調節板34a，3 4b之溫度不同的狀態 下使滑件2 1上昇，利用加工對象物2之上面與下面之間 所產生之溫度梯度使加工對象物2發生彎曲變形。利用該 彎曲，會在上下的壓模3 5a, 3 5b和加工對象物2之間形成 些微間隙。在此，加工對象物2之彎曲越小越好。因此， -14- 200804075 、 (12) 藉由將移動距離ΔΗ及設定溫度Cul，Cll最佳化，能以最 小彎曲進行加工對象物2之脫模。 在時刻t4 ’使大氣進入真空室（S1 8)，同時從空氣噴 嘴41朝向加工對象物2的上下面和壓模35a，35b之間噴 吹空氣（S19)，藉此，在加工對象物2和壓模35a，35b間將 空氣送入，而使加工對象物2從壓模進行脫模。空氣噴吹 是進行既定的時間（在此，是在時刻t4〜t5之間）。 φ 之後，溫度控制裝置60，以「冷卻2」的溫度模式將 上下溫度調節板34a，34b實施冷卻（S20)。 在「冷卻2」’溫度調節板之設定溫度Cu2，cl2爲同 一溫度，且比「冷卻1」之上下溫度調節板34a，34b之設 疋溫度Cul，Cll爲低。藉由使設定溫度Cu2與C12形成相 等，能矯正加工對象物2之彎曲。因此，加工對象物爲丙 烯酸酯的情形，Cu2與C12可設定在40〜70 °C之間。 當上下溫度調節板34a, 34b之溫度到達「冷卻2」之 φ 設定溫度Cu2，C12時（時刻t5)，藉由對滑件21進行位置 控制使其上昇至上限位置S 1 (S2 1 )，如此可將成形後的加 工對象物2取出。 然後，說明第2模壓動作。主要是針對其和第丨模壓 動作之不同點做說明。 第8圖及第9圖係顯示：在將加工對象物2實施模壓 之第2模壓動作中，1週期的各種狀態之時間變化的曲線 圖及流程圖。第2模壓動作，在時刻t3爲止係和第〗模 壓動作相同。因此，其流程圖之步驟S3 1〜S35，係和第1 15- 200804075 ' (13) 模壓動作之步驟S 1 1〜S 1 5相同。 在第2模壓動作，於時刻t3以後，溫度控制裝置 60，根據設定溫度設定成Cnl=Cll之「冷卻1」的溫度模 式，將溫度調節板3 4 a，3 4 b予以冷卻（S 3 6)。此處之設定溫 度Cul，Cll都在加工對象物2之軟化溫度Tg以下。接 著，當溫度調節板34a, 3 4b冷卻至設定溫度後，亦即到達 時刻t4時，溫度控制裝置60根據「加熱2」之溫度模式 φ 將溫度調節板34a，34b予以再加熱（S37)。 這時之設定溫度Ηιι2，Η12都在加工對象物2之軟化溫 度Tg以下，且上溫度調節板34a之設定溫度Ηιι2和下溫 度調節板 3 4 b之設定溫度 Η12設定成不同（例如 Hu2>H12)。 以「加熱2」模式進行加熱而使加工對象物2產生溫 度梯度時，藉由控制器1 7進行位置控制，使滑件2 1上昇 AH移動至S4的位置（S38)。當滑件21移動至S4後，在 φ 時刻t5,使大氣進入真空室（S3 9)，同時由空氣噴嘴41朝 向加工對象物2之上下面與壓模35之間噴吹空氣（S4〇)， 藉此，和第1模壓動作的情形同樣地，對稍微彎曲之加工 對象物2和壓模3 5 a，3 5 b之間吹入空氣，而使加工對象物 2從壓模35a，35b進行脫模。 亦即，在第2模壓動作，當上下的壓模35a，35b 一日 冷卻至加工對象物2的軟化溫度以下之相同溫度後，將上 下壓模35a，35b再度加熱成不同的溫度（軟化溫度以下）， 使加工對象物2產生溫度梯度而形成彎曲。 -16- 200804075 ' (14) 之後，和第1模壓動作的情形同樣地，根據「冷卻 2」之溫度模式將上下溫度調節板34a,34b冷卻至相同溫 度（S41)，使滑件21上昇至上限位置S1(S42)。 上述本發明之實施形態，僅是用來說明本發明之例 示，本發明的範圍並不限定於該等實施形態。在不脫離本 發明要旨的範圍內，當然能以其他各種態樣來實施本發 明。 φ 例如，在上述實施形態，雖是針對在真空進行模壓成 形的情形做說明，但本發明也適用於在非真空狀態進行模 壓成形的情形。另一方面，像上述實施形態般在真空進行 模壓成形時，特別是壓模和加工對象物之接觸面容易形成 真空而造成脫模困難，因此本發明特別有效。 【圖式簡單說明】 第1圖係顯示本實施形態之模壓成形裝置 1之槪略 構造。 第2圖係顯示模壓部3 〇的詳細構造之截面圖。 第3圖係顯示模壓部3 0與溫度控制裝置6 0之詳細構 造。 第4圖係顯示加熱及冷卻的目標溫度之設定模式。 第5 A〜D圖係顯示第〗模壓動作之1週期的各種狀 態之時間變化。 第6 A〜D圖係示意顯示模壓部3 〇之1週期的動作狀 態。 -17- 200804075 ' (15) 第7圖係顯示第1模壓動作之模壓加工之1週期的處 理順序之流程圖。 第8圖係顯示第2模壓動作之1週期的各種狀態之時 間變化。 第9圖係顯示第2模壓動作之模壓加工之1週期的處 理順序之流程圖。 φ 【主要元件對照表】 1 :模壓成形裝置 U :伺服馬達 1 2 :滑輪 U :確動皮帶 1 4 :滾珠螺桿 1 5 :編碼器 1 6 :伺服放大器 • 1 7 :控制器 21 :滑件 22 :承板 23 :滑件位置檢測手段 24 :加壓力檢測手段 30 :模壓部 31 :上殼體 32 :下殼體 3 3 :隔熱板 -18- 200804075 ι (16) 34a，34b :溫度調節板 35a，35b :壓模 3 6 :大氣開放口 37 :真空吸引口 38a，38b :溫度感測器 3 9 :真空密封件 40 :真空泵 41 :空氣噴嘴 60 :溫度控制裝置200804075 ^ (10) First, at time 0, the slider 2 1 is located at the upper limit position s 1. g The object 2 to be processed is carried into the molded portion 30 (S 1 1 ). At the beginning of the position control by the control, the slider 2 1 is lowered to a position S2 where the upper and lower vacuum seals contact each other (S12). When the slider 21 is lowered to S2 (time t1), the vacuum pump 40 performs vacuum suction in the vacuum chamber (S 13). Thereby, the pressure in the chamber of the element as shown in Fig. 5D starts to decrease. After the time t1, in parallel with the vacuum suction operation, as shown in Fig. 5C, the temperature control device 60 starts heating of the upper and lower temperature adjustment plates 34a, 34b in the "heating 1" temperature mode (S14). The setting (Hul, H11) of the temperature adjusting plates 34a and 34b is equal to the upper side of the first pressing operation "heating 1", and the set temperature is higher than the softening Tg of the object 2 by more than 30 °C. Therefore, for example, when the object 2 is a propyl ester, Hul = Hll = 120 to 140 °C. Next, when the temperature of the upper and lower temperature adjustment plates 34a, 34b is substantially set to a temperature (Hu 1, H11), and the vacuum degree in the vacuum chamber reaches a predetermined fixed degree of vacuum P (time t2), the pressure is applied by the controller 17. Control causes the slider 21 to descend. At this time, as shown in Fig. 5B, the slider 17 of the controller 17 is lowered to the set pressing force L, and the workpiece 2 is molded by the pressing L die 35 (S15). This pressing step time is maintained to press-form the object 2 to be processed. When the pressing is performed by the pressing force L, as shown in Fig. 5A, the sliding is substantially at the position of S3. However, at this time, the position control is not implemented to carry out the pressure control. Therefore, as the temperature adjustment plates 34a, 34b:, the devices 17 3 9, 39 start, the true picture is processed, the temperature temperature is the acid: When the arrival system is set, the pressure L piece 21 will be used, and the addition -13- 200804075 ' (11) The object 2 will be slightly expanded due to thermal expansion and heat shrinkage due to heating and cooling. Move, and keep the pressure constant. Next, as shown in Fig. 5C, the temperature control device 60 starts the cooling of the upper and lower temperature adjustment plates 34a and 34b in the temperature mode of "cooling 1" from the temperature t3 (S16). At this time, the position of the slider 21 (Fig. 5A), the pressure applied by the slider (Fig. 5B), and the pressure in the vacuum chamber (Fig. 5D) remain unchanged. 〇 φ is in the first molding operation, and the temperature of the "cooling 1" is adjusted. The set temperatures Cul, C11 of the plates 34a, 34b are both lower than the softening temperature Tg of the object to be processed, and the set temperature Cul of the upper temperature regulating plate 34a and the set temperature C11 of the lower temperature adjusting plate 34b are set to be different (for example, Cnl> Cll). Therefore, when the object to be processed is an acrylate, Cul and C11 may be between 50 and 90 °C. When the temperature of the upper and lower temperature adjustment plates 34a, 34b is cooled to the set temperature of "cooling 1", the controller 17 raises the slider 2 1 φ by a predetermined distance ΔΗ by position control to move the upper and lower stampers 35a, 35b. The distance is enlarged, and the slider 21 is moved to the position S4 (S 17). Here, the moving distance ΔΗ of the slider 21 may be such that a gap between the surface of the object 2 and the stamper 35 to be supplied with the blowing air can be formed without opening the vacuum chamber. At this time, the slider 2 1 is raised in a state where the temperatures of the upper and lower temperature adjustment plates 34a, 34b are different, and the object 2 is bent and deformed by the temperature gradient generated between the upper surface and the lower surface of the object 2 to be processed. By this bending, a slight gap is formed between the upper and lower stampers 35a, 35b and the object 2 to be processed. Here, the smaller the curvature of the object 2 is, the better. Therefore, -14-200804075, (12) By optimizing the moving distance ΔΗ and the set temperatures Cul, C11, the object 2 can be released with the minimum bending. At the time t4', the atmosphere is introduced into the vacuum chamber (S18), and air is blown from the air nozzle 41 toward the upper and lower surfaces of the object 2 and the stampers 35a and 35b (S19), whereby the object 2 is processed. Air is fed between the stampers 35a and 35b, and the object 2 is released from the stamper. Air blowing is performed for a predetermined time (here, between time t4 and t5). After φ, the temperature control device 60 cools the upper and lower temperature adjustment plates 34a, 34b in the "cooling 2" temperature mode (S20). The set temperatures Cu2 and cl2 of the "cooling 2"' temperature regulating plate are the same temperature, and are lower than the set temperatures Cul, C11 of the temperature adjusting plates 34a, 34b above the "cooling 1". By forming the set temperatures Cu2 and C12 in phase, the bending of the object 2 can be corrected. Therefore, in the case where the object to be processed is acrylate, Cu2 and C12 can be set between 40 and 70 °C. When the temperature of the upper and lower temperature adjustment plates 34a, 34b reaches the φ set temperature Cu2, C12 of "cooling 2" (time t5), the slider 21 is positionally controlled to rise to the upper limit position S 1 (S2 1 ), Thus, the object 2 to be processed can be taken out. Next, the second molding operation will be described. It mainly explains the difference between it and the third molding action. Fig. 8 and Fig. 9 are graphs and flowcharts showing temporal changes in various states of one cycle in the second molding operation of molding the object 2 to be processed. The second molding operation is the same as the first molding operation at time t3. Therefore, the steps S3 1 to S35 of the flowchart are the same as the steps S 1 1 to S 1 5 of the first 15-200804075 ' (13) molding operation. In the second molding operation, after time t3, the temperature control device 60 sets the temperature mode of "cooling 1" of Cnl=C11 according to the set temperature, and cools the temperature adjustment plates 3 4 a, 3 4 b (S 3 6 ). Here, the set temperatures Cul and C11 are both below the softening temperature Tg of the object 2 to be processed. Then, when the temperature adjusting plates 34a, 34b are cooled to the set temperature, that is, when the time t4 is reached, the temperature control means 60 reheats the temperature adjusting plates 34a, 34b in accordance with the "heating 2" temperature mode φ (S37). At this time, the set temperature Ηιι2, Η12 is below the softening temperature Tg of the object 2, and the set temperature Ηι2 of the upper temperature adjustment plate 34a and the set temperature Η12 of the lower temperature adjustment plate 344 are set to be different (for example, Hu2>H12). . When heating is performed in the "heating 2" mode to cause a temperature gradient in the object 2, the positional control by the controller 17 causes the slider 2 1 to move AH to the position of S4 (S38). When the slider 21 is moved to S4, the atmosphere is entered into the vacuum chamber at time t5 (S3 9), and air is blown between the upper surface of the object 2 and the stamper 35 by the air nozzle 41 (S4〇). In the same manner as in the case of the first molding operation, air is blown between the object 2 to be slightly bent and the stampers 35a, 3b, and the object 2 is processed from the stamper 35a, 35b. Release the mold. In other words, in the second molding operation, when the upper and lower dies 35a, 35b are cooled to the same temperature below the softening temperature of the object 2, the upper and lower dies 35a, 35b are again heated to different temperatures (softening temperature). Hereinafter, the object 2 is subjected to a temperature gradient to form a curve. -16- 200804075' (14) After that, similarly to the case of the first molding operation, the upper and lower temperature adjustment plates 34a, 34b are cooled to the same temperature in accordance with the "cooling 2" temperature mode (S41), and the slider 21 is raised to Upper limit position S1 (S42). The embodiments of the present invention are merely illustrative of the present invention, and the scope of the present invention is not limited to the embodiments. The present invention can of course be embodied in other various forms without departing from the scope of the invention. φ For example, in the above embodiment, the case where the vacuum molding is performed is described. However, the present invention is also applicable to the case where the press molding is performed in a non-vacuum state. On the other hand, in the case of press molding by vacuum in the above-described embodiment, the contact surface between the stamper and the object to be processed is likely to be easily formed into a vacuum, which makes it difficult to release the mold. Therefore, the present invention is particularly effective. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a schematic configuration of a press molding apparatus 1 of the present embodiment. Fig. 2 is a cross-sectional view showing the detailed structure of the molded portion 3''. Fig. 3 shows the detailed construction of the molded portion 30 and the temperature control device 60. Figure 4 shows the setting mode of the target temperature for heating and cooling. The fifth A to D graph shows the time variation of various states of the first cycle of the first molding operation. The sixth A to D drawings schematically show the operation state of the one-cycle of the molded portion 3 〇. -17- 200804075 ' (15) Fig. 7 is a flow chart showing the processing sequence of one cycle of the molding process of the first molding operation. Fig. 8 is a view showing the time variation of various states of one cycle of the second molding operation. Fig. 9 is a flow chart showing the processing sequence of one cycle of the press working of the second molding operation. Φ [Main component comparison table] 1 : Molding forming device U : Servo motor 1 2 : Pulley U : Actuating belt 1 4 : Ball screw 1 5 : Encoder 1 6 : Servo amplifier • 1 7 : Controller 21 : Sliding member 22: carrier 23: slider position detecting means 24: pressure detecting means 30: molding portion 31: upper casing 32: lower casing 3 3: heat shield -18 - 200804075 ι (16) 34a, 34b: temperature Adjustment plates 35a, 35b: stamper 36: atmosphere opening port 37: vacuum suction port 38a, 38b: temperature sensor 39: vacuum seal 40: vacuum pump 41: air nozzle 60: temperature control device