CN106827614A - Pressure head stability Design mechanism long - Google Patents
Pressure head stability Design mechanism long Download PDFInfo
- Publication number
- CN106827614A CN106827614A CN201710070435.7A CN201710070435A CN106827614A CN 106827614 A CN106827614 A CN 106827614A CN 201710070435 A CN201710070435 A CN 201710070435A CN 106827614 A CN106827614 A CN 106827614A
- Authority
- CN
- China
- Prior art keywords
- pressure head
- adjustment seat
- pressure
- design mechanism
- stability design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B1/00—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen
- B30B1/32—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen by plungers under fluid pressure
- B30B1/38—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen by plungers under fluid pressure wherein the plungers are operated by pressure of a gas, e.g. steam, air
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/065—Press rams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/34—Heating or cooling presses or parts thereof
Abstract
The invention discloses a kind of pressure head stability Design mechanism long, including power drive assem, guidance set, X/Y to adjusting part and pressure head executive module, the power drive assem is connected with the X/Y by extension spring to adjusting part, the pressure head executive module is located at lower sections of the X/Y to adjusting part, and the guidance set is located at the side.The present invention uses split-type design, reduces the weight of ram movement part, improves the stability of this pressure of large scale IC, expands the scope of application of product, improves the precision of IC laminatings, can meet the Production requirement of high-end product.Rational mechanism for regulating pressure head parallelism, improves the stability of pressure head parallelism, it is not necessary to often adjustment, greatly reduces maintenance cost, is that client improves production efficiency.
Description
Technical field
The present invention relates to liquid crystal module apparatus field, it is used in COG, FOG equipment, completes masters of the IC or FPC on LCD
Pressure bonding.
Background technology
, it is necessary to by IC and FPC together with the connection of LCD, this process is needed in the last handling process of liquid crystal module
Want two operations completions, precompressed (PRE-BONDIND) and main pressure (MAIN BONDIND).Pressure head stability Design mechanism long is used for
Latter operation.In prepressing procedures, IC or FPC is tentatively fitted on LCD by ACF, then, in main pressure operation
In, the pressure head of constant temperature applies constant pressure on IC or FPC, and the temperature of ACF will reach 180 DEG C, and by certain hour, (IC leads to
Often it is 8 seconds, FPC is usually 12 seconds), realize the final laminating of IC or FPC.Although the operation seems simple, but have high
Pressure accuracy control and bonding (BONDIND) required precision.ACF particles explosion first is uniform.Secondly, particularly with nation
Determine for IC, the circuit on BUMP and LCD on IC is corresponding, and spacing (PITCH) very little between circuit, it is desirable to complete
Aligning accuracy after main pressure is ± 3 μ.And the quality (particle explosion uniformity and bonding precision) of product is main by main heading machine
Structure ensures.Therefore, the performance of pressure head structure directly determines bonding quality.
Existing pressure heads mechanism its there is following technological deficiency:
1., the demand that technology can not meet large scale IC work be present, it is impossible to be applicable all of product requirement.
2nd, whole pressure heads mechanism (including XY adjustment mechanisms) is integrated design with the remainder of pressure head, follows pressure head one
Motion is played, weight is excessive.
3rd, mechanism for regulating pressure head parallelism can cause part deformation, or even part of damage in adjustment.
4th, this pressure bonding (MAIN BONDING) precision of IC or FPC are low.
The content of the invention
The present invention proposes a kind of pressure head stability Design mechanism long, solves and cannot meet in the prior art large scale IC works
Make, integrated design causes weight excessive and the low problem of precision.
The technical proposal of the invention is realized in this way:
A kind of pressure head stability Design mechanism long, including power drive assem, guidance set, X/Y are to adjusting part and pressure
Head executive module, the power drive assem is connected with the X/Y by extension spring to adjusting part, the pressure head execution group
Part is located at lower sections of the X/Y to adjusting part, and the guidance set is located at the side.
Further, the power drive assem includes cylinder and cylinder mounting seat, and the cylinder is fixed on the cylinder
In mounting seat, the cylinder mounting seat both sides are provided with prominent screw, and one end of the extension spring is fixed on the screw, institute
Cylinder mounting seat is stated to be fixed on vertical base plate.
Further, the guidance set includes the buffer being fixed on base plate and accurate slide rail.
Further, the X/Y includes X to adjustment seat and Y-direction adjustment seat to adjusting part, and the X is fixed to adjustment seat
In the top of the Y-direction adjustment seat, the X is described to adjusting screw and lock-screw is equipped with adjustment seat and Y-direction adjustment seat
Adjusting screw is used to adjust the X to adjustment seat and the position of Y-direction adjustment seat, after the lock-screw is used to that good position will to be adjusted
X locked to adjustment seat and Y-direction adjustment seat.
Further, the pressure head executive module includes pressure head, calandria, thermal insulation board, heat insulation and the radiating of strip
Block, the number of the radiating block is 2, is respectively provided at the two ends of the Y-direction adjustment seat, and the heat insulation is fixed on the radiating block
Lower section, the thermal insulation board, calandria and the pressure head are fixedly connected sequentially from top to down.
Further, also including radiator fan, the radiator fan is screwed in the cylinder mounting seat.
Further, the setting temperature of the pressure head is 300 DEG C.
The beneficial effects of the present invention are:Using split-type design, the weight of ram movement part is reduced, improve big
The stability of size IC this pressure, expands the scope of application of product, improves the precision of IC laminatings, can meet the life of high-end product
Product demand.Rational mechanism for regulating pressure head parallelism, improves the stability of pressure head parallelism, it is not necessary to often adjustment, subtracts significantly
Maintenance cost is lacked, has been that client improves production efficiency.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
Other accompanying drawings are obtained with according to these accompanying drawings.
Fig. 1 is the structural representation of pressure head stability Design mechanism long of the invention;
Fig. 2 is the Structure explosion diagram of pressure head stability Design mechanism long of the invention.
In figure, 1- cylinders;2- cylinder mounting seats;3- base plates;4- extension springs;5- buffers;6-X is to adjustment seat;7- essences
Close slide rail;8-Y is to adjustment seat;9- radiating blocks;10- heat insulations;11- thermal insulation boards;12- calandrias;13- pressure heads;14- radiation airs
Fan.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
As depicted in figs. 1 and 2, the present invention proposes a kind of stability Design mechanism of pressure head long 13, including power drive group
, to adjusting part and the executive module of pressure head 13, power drive assem is by extension spring 4 with X/Y to tune for part, guidance set, X/Y
Section component connection, the executive module of pressure head 13 is located at lower sections of the X/Y to adjusting part, and guidance set is located at side.
Power drive assem includes cylinder 1 and cylinder mounting seat 2, and cylinder 1 is fixed in cylinder mounting seat 2, and cylinder is installed
2 both sides of seat are provided with prominent screw, and one end of extension spring 4 is fixed on the screw, and cylinder mounting seat 2 is fixed on vertical bottom
On plate 3.
Guidance set includes the buffer 5 being fixed on base plate 3 and accurate slide rail 7
X/Y includes X to adjustment seat 6 and Y-direction adjustment seat 8 to adjusting part, and X is fixed on Y-direction adjustment seat 8 to adjustment seat 6
Top, X is used to adjust X to regulation to adjusting screw and lock-screw, adjusting screw is equipped with adjustment seat 6 and Y-direction adjustment seat 8
The position of seat 6 and Y-direction adjustment seat 8, lock-screw is used to lock the X adjusted after good position to adjustment seat 6 and Y-direction adjustment seat 8.
X/Y is separated to adjusting part with calandria 12, completely cut off heat transfer of the heat of pressure head 13 to adjustment mechanism.Therefore, pressure head 13
Depth of parallelism stability is improved, and greatly reduces depth of parallelism adjustment frequency.An adjustment axis, and zero are respectively used in XY both directions
There is built-in back-moving spring, simple structure is easily adjusted, and improves the depth of parallelism regulated efficiency of pressure head 13 between part.
The executive module of pressure head 13 includes pressure head 13, calandria 12, thermal insulation board 11, heat insulation 10 and the radiating block 9 of strip,
The number of radiating block 9 is 2, is respectively provided at the two ends of Y-direction adjustment seat 8, and heat insulation 10 is fixed on the lower section of radiating block 9, thermal insulation board
11st, calandria 12 and pressure head 13 are fixedly connected sequentially from top to down.Because pressure head long 13 is heavier, radiating block 9 is adopted in the middle of part
With the structure of split, to mitigate the weight of whole pressure head 13, stability of the pressure head long 13 to this pressure of large scale IC is realized.Pressure head
13 insulating portions employ double thermal insulation structure, and internal with air heat dissipation channel, effectively prevent calandria 12 to slide rail
Heat conducts, it is ensured that the kinematic accuracy of pressure head 13, extends the life-span of slide rail.Pressure head 13 is using high temperature resistant, wear-resistant, expansion
The small ceramic material of coefficient, it is ensured that stability of the pressure head 13 in heating process, improves Product Precision.
Present invention additionally comprises radiator fan 14, radiator fan 14 is screwed in cylinder mounting seat 2.
The setting temperature of pressure head 13 is 300 DEG C.
Operational process of the invention:
1.1 operation preparations:Adjustment pressure head 13 press against the depth of parallelism of platform with LCD.Dextrorotation or left-handed Y-direction adjustment seat 8
On adjusting screw, Y-direction adjustment seat 8 can band dynamic head 13 do corresponding Y-direction together and swing, dextrorotation or left-handed X are in adjustment seat 6
Adjusting screw, X to adjustment seat 6 can band dynamic head 13 be corresponding X together to swing.Be press against in LCD and pressure-sensitive is placed on platform
Paper, and decline pressure head 13, is pressed on pressure-sensitive paper, and the time is less than 0.3 second, will pressure head 13 rise.According to the color of pressure-sensitive paper
Situation of change, the adjusting screw in difference turn X adjustment seats and Y-direction adjustment seat 8.Pressure head 13 press against platform with LCD can be correspondingly
Tend to parallel.Pressure-sensitive paper is placed on it press against platform again, pressure head 13 is declined, the color change of pressure-sensitive paper, root are observed again
According to color change situation, the depth of parallelism again to pressure head 13 is adjusted according to the method described above.Until the color of pressure-sensitive paper is in pressure
Uniformity in the range of first 13.Then, locking X is to adjustment seat 6 and the lock-screw of Y-direction adjustment seat 8.
1.2 regulation magnitude of back pressure.Pressure on IC is acted on, it is necessary to simultaneously to cylinder 1 in order to accurately control pressure head 13
The different source of the gas of both sides supply pressure, control pressure head 13 to act on the power on IC using both pressure differentials.Cylinder 1 is enterprising
The pressure of gas port is referred to as main pressure, and the pressure of lower air inlet is referred to as back pressure.First by main pressure regulation to zero pressure, then, progressively
The precise pressure regulating valve of turn back pressure, promotes the mechanism of pressure head 13 so that pressure head 13 can be rested in stroke range with lower on hand
Optional position is motionless, and now, pressure head 13 can not automatically decline because of gravity.It is exactly now the back-pressure for needing.Due to the hair
It is bright to have used the split-type design of radiating block 9, the weight of the mechanism kinematic part of pressure head 13 is significantly reduced, therefore, it is possible to cause pressure head
13 is more stable when large scale IC is pushed.
1.3 heat up pressure head 13, until reaching the setting temperature of pressure head 13, (displays temperature of temp controlled meter is about 300
℃)。
1.4 operational processes.When LCD reaches working position, cylinder 1 can decline under program, by slide rail band dynamic pressure
First 13 are moved together, until the working face of pressure head 13 is fallen within the IC or FPC of LCD, and continues to keep the constant pressure of a period of time, IC is protected
The time for holding constant pressure is generally 8 seconds, and FPC is kept for the time of constant pressure be generally 12 seconds.Then pressure head 13 rises.Complete IC or FPC
Bonding (BONDING) on LCD.
The stability Design mechanism of pressure head long 13, can be non-using the structure connected by spring between cylinder 1 and slide rail
In the case that ideal line is moved, the self-adapting float of pressure head 13, and flying height is adjustable, self adaptation sensitivity is high.This spring is also
Serve as the effect of mechanical vibration damping, in the moment that pressure head 13 is contacted with LCD, the position of pressure head 13 will rapidly shift in Z-direction, this
When telescopic spring compensate deviation post rapidly, it is and rapid steady, hence it is evident that to reduce the shock loading for acting on glass substrate.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Within god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (7)
1. a kind of pressure head stability Design mechanism long, it is characterised in that:Including power drive assem, guidance set, X/Y to regulation
Component and pressure head executive module, the power drive assem are connected with the X/Y by extension spring to adjusting part, the pressure
Head executive module is located at lower sections of the X/Y to adjusting part, and the guidance set is located at the side.
2. pressure head stability Design mechanism long according to claim 1, it is characterised in that:The power drive assem includes
Cylinder and cylinder mounting seat, the cylinder are fixed in the cylinder mounting seat, and the cylinder mounting seat both sides are provided with prominent
Screw, one end of the extension spring is fixed on the screw, and the cylinder mounting seat is fixed on vertical base plate.
3. pressure head stability Design mechanism long according to claim 1 and 2, it is characterised in that:The guidance set includes
The buffer and accurate slide rail being fixed on base plate.
4. pressure head stability Design mechanism long according to claim 1 and 2, it is characterised in that:The X/Y is to adjusting part
Including X to adjustment seat and Y-direction adjustment seat, the X is fixed on the top of the Y-direction adjustment seat to adjustment seat, and the X is to adjustment seat
Be equipped with adjusting screw and lock-screw in Y-direction adjustment seat, the adjusting screw is used to adjust the X to adjustment seat and Y-direction
The position of adjustment seat, the lock-screw is used to adjust the X after good position to adjustment seat and the locking of Y-direction adjustment seat.
5. pressure head stability Design mechanism long according to claim 4, it is characterised in that:The pressure head executive module includes
The pressure head of strip, calandria, thermal insulation board, heat insulation and radiating block, the number of the radiating block is 2, is respectively provided at the Y-direction
The two ends of adjustment seat, the heat insulation is fixed on the lower section of the radiating block, and the thermal insulation board, calandria and the pressure head are from upper
And under be fixedly connected sequentially.
6. pressure head stability Design mechanism long according to claim 1 or 5, it is characterised in that:Also include radiator fan, institute
Radiator fan is stated to be screwed in the cylinder mounting seat.
7. pressure head stability Design mechanism long according to claim 6, it is characterised in that:The setting temperature of the pressure head is
300℃。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710070435.7A CN106827614A (en) | 2017-02-09 | 2017-02-09 | Pressure head stability Design mechanism long |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710070435.7A CN106827614A (en) | 2017-02-09 | 2017-02-09 | Pressure head stability Design mechanism long |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106827614A true CN106827614A (en) | 2017-06-13 |
Family
ID=59122569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710070435.7A Pending CN106827614A (en) | 2017-02-09 | 2017-02-09 | Pressure head stability Design mechanism long |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106827614A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108356503A (en) * | 2018-02-28 | 2018-08-03 | 业成科技(成都)有限公司 | Pressing device |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2779442Y (en) * | 2005-03-11 | 2006-05-10 | 陈栋栋 | Compression head apparatus |
CN101011870A (en) * | 2007-02-03 | 2007-08-08 | 中国电子科技集团公司第二研究所 | Mechanism for regulating pressure head parallelism |
JP2008018447A (en) * | 2006-07-12 | 2008-01-31 | Komatsu Sanki Kk | Apparatus and method for press forming |
CN101140363A (en) * | 2007-09-28 | 2008-03-12 | 友达光电(苏州)有限公司 | Press mark testing apparatus |
CN101339019A (en) * | 2008-07-30 | 2009-01-07 | 友达光电(厦门)有限公司 | Press mark detection device and press mark test method |
CN101515076A (en) * | 2009-02-16 | 2009-08-26 | 太原风华信息装备股份有限公司 | Main pressure mechanism used for a liquid crystal display (LCD) module binding process |
CN101556923A (en) * | 2008-12-04 | 2009-10-14 | 上海微松半导体设备有限公司 | Pressure control mechanism of semiconductor packaging device loading head |
CN201437284U (en) * | 2009-07-14 | 2010-04-14 | 深圳才纳半导体设备有限公司 | Electronic tag solidification pressure transmitting device |
CN101728142A (en) * | 2008-12-30 | 2010-06-09 | 四川虹欧显示器件有限公司 | Method for adjusting hot-pressing apparatus |
CN101973011A (en) * | 2010-09-08 | 2011-02-16 | 中国科学院长春光学精密机械与物理研究所 | Crystal curing press head applied to electronic tag back-off encapsulation equipment |
CN102749044A (en) * | 2012-06-26 | 2012-10-24 | 深圳市华星光电技术有限公司 | Parallel detection system and method |
CN203267209U (en) * | 2013-04-03 | 2013-11-06 | 深圳市深科达气动设备有限公司 | Constant temperature type large-size touch screen hot press |
CN204773753U (en) * | 2015-06-24 | 2015-11-18 | 苏州光宝康电子有限公司 | FPC pressurize pressure head mechanism |
CN204882062U (en) * | 2015-08-19 | 2015-12-16 | 昆山龙腾光电有限公司 | Indentation detecting system |
CN204964075U (en) * | 2015-09-07 | 2016-01-13 | 昆山龙腾光电有限公司 | Supplementary bearing structure of pressure sensing paper and pressure head pressure test device |
CN205439499U (en) * | 2015-12-31 | 2016-08-10 | 东莞市捷创机械设备有限公司 | Hot pressure head mechanism |
CN106370131A (en) * | 2016-10-21 | 2017-02-01 | 芜湖赋兴光电有限公司 | Detection method for parallelism of hot-pressing head in AFC hot-pressing process |
-
2017
- 2017-02-09 CN CN201710070435.7A patent/CN106827614A/en active Pending
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2779442Y (en) * | 2005-03-11 | 2006-05-10 | 陈栋栋 | Compression head apparatus |
JP2008018447A (en) * | 2006-07-12 | 2008-01-31 | Komatsu Sanki Kk | Apparatus and method for press forming |
CN101011870A (en) * | 2007-02-03 | 2007-08-08 | 中国电子科技集团公司第二研究所 | Mechanism for regulating pressure head parallelism |
CN101140363A (en) * | 2007-09-28 | 2008-03-12 | 友达光电(苏州)有限公司 | Press mark testing apparatus |
CN101339019A (en) * | 2008-07-30 | 2009-01-07 | 友达光电(厦门)有限公司 | Press mark detection device and press mark test method |
CN101556923A (en) * | 2008-12-04 | 2009-10-14 | 上海微松半导体设备有限公司 | Pressure control mechanism of semiconductor packaging device loading head |
CN101728142A (en) * | 2008-12-30 | 2010-06-09 | 四川虹欧显示器件有限公司 | Method for adjusting hot-pressing apparatus |
CN101515076A (en) * | 2009-02-16 | 2009-08-26 | 太原风华信息装备股份有限公司 | Main pressure mechanism used for a liquid crystal display (LCD) module binding process |
CN201437284U (en) * | 2009-07-14 | 2010-04-14 | 深圳才纳半导体设备有限公司 | Electronic tag solidification pressure transmitting device |
CN101973011A (en) * | 2010-09-08 | 2011-02-16 | 中国科学院长春光学精密机械与物理研究所 | Crystal curing press head applied to electronic tag back-off encapsulation equipment |
CN102749044A (en) * | 2012-06-26 | 2012-10-24 | 深圳市华星光电技术有限公司 | Parallel detection system and method |
CN203267209U (en) * | 2013-04-03 | 2013-11-06 | 深圳市深科达气动设备有限公司 | Constant temperature type large-size touch screen hot press |
CN204773753U (en) * | 2015-06-24 | 2015-11-18 | 苏州光宝康电子有限公司 | FPC pressurize pressure head mechanism |
CN204882062U (en) * | 2015-08-19 | 2015-12-16 | 昆山龙腾光电有限公司 | Indentation detecting system |
CN204964075U (en) * | 2015-09-07 | 2016-01-13 | 昆山龙腾光电有限公司 | Supplementary bearing structure of pressure sensing paper and pressure head pressure test device |
CN205439499U (en) * | 2015-12-31 | 2016-08-10 | 东莞市捷创机械设备有限公司 | Hot pressure head mechanism |
CN106370131A (en) * | 2016-10-21 | 2017-02-01 | 芜湖赋兴光电有限公司 | Detection method for parallelism of hot-pressing head in AFC hot-pressing process |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108356503A (en) * | 2018-02-28 | 2018-08-03 | 业成科技(成都)有限公司 | Pressing device |
CN108356503B (en) * | 2018-02-28 | 2019-09-10 | 业成科技(成都)有限公司 | Pressing device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106873198B (en) | The accurate main pressure indenter device of thermostatic type | |
CN106556941B (en) | A kind of main indenter device of light-duty thermostatic type | |
JP4325784B2 (en) | Cutting method of LCD panel | |
CN107601824B (en) | Liquid crystal glass bending shape regulating and controlling device and system | |
CN107968148A (en) | A kind of semiconductor refrigerating welding device and welding procedure | |
CN106827614A (en) | Pressure head stability Design mechanism long | |
JP4632037B2 (en) | Thermocompression bonding apparatus and semiconductor device mounting apparatus | |
CN202669187U (en) | An arranging and adjusting device of multiple nozzles | |
JP5121055B2 (en) | Scribing equipment | |
CN202878864U (en) | Lengthened type adjustable constant-temperature pressure head | |
CN110328765A (en) | Wafer sliver apparatus | |
CN203448878U (en) | Clamping and position adjusting mechanism | |
CN108996893A (en) | A kind of control device and method of plate glass warpage quality | |
CN101708951A (en) | Adjustable guide rail device for glass-cutting machine | |
CN102826764B (en) | Clamping device for large glass substrate | |
KR101653179B1 (en) | A scribing apparaus | |
CN201768661U (en) | Coating gap adjusting device of coating machine | |
JP7274760B2 (en) | board breaking device | |
CN108356503A (en) | Pressing device | |
CN204843439U (en) | Level adjustment mechanism and contain this pressure nation setting device of this level adjustment mechanism | |
CN208377812U (en) | A kind of guide wheel system of adjustable position | |
KR100776634B1 (en) | Substrate stage | |
CN201083958Y (en) | Jet printing apparatus for mask process | |
CN219291876U (en) | Automatic packaging device for double-station IC | |
CN102495487B (en) | Main bonding unit for full-automatic chip on glass (COG) bonder |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170613 |
|
RJ01 | Rejection of invention patent application after publication |