CN110328765A - Wafer sliver apparatus - Google Patents
Wafer sliver apparatus Download PDFInfo
- Publication number
- CN110328765A CN110328765A CN201910605206.XA CN201910605206A CN110328765A CN 110328765 A CN110328765 A CN 110328765A CN 201910605206 A CN201910605206 A CN 201910605206A CN 110328765 A CN110328765 A CN 110328765A
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- China
- Prior art keywords
- cutter head
- axis
- mounting base
- linear motion
- motion unit
- Prior art date
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- 229910000831 Steel Inorganic materials 0.000 claims abstract description 19
- 239000010959 steel Substances 0.000 claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims description 31
- 239000000919 ceramic Substances 0.000 claims description 6
- 210000003734 kidney Anatomy 0.000 claims description 6
- 239000002184 metal Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000009434 installation Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000004801 process automation Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention relates to wafer sliver apparatus, cutter head setting in lower part is installed in the cutter head mounting base of lower part, lower part cutter head mounting base is installed on workbench, top mounting base is located above the cutter head mounting base of lower part, mounting base underrun the first X-axis linear motion unit in top connects top cutter head movable plate, driving top cutter head movable plate is moved left and right along X axis, top cutter head movable plate underrun the second X-axis linear motion unit connects the right cutter head mounting plate in top, the bottom surface of the right cutter head mounting plate in top is installed by the right cutter head in top, the driving right cutter head in top is moved left and right along X axis, downward one boss of projection in top cutter head movable plate bottom surface left part, the left cutter head in top is installed on boss, the left cutter head in top and the right cutter head in top are in same level height and opposite, load product steel loop be located at lower part cutter head and the right cutter head of the left cutter head in top and top it Between.It is supported using lower part cutter head, the principle that two cutter head of top pushes makes wafer split completely along slight crack, chipping is small, yield is high.
Description
Technical field
The present invention relates to a kind of wafer sliver apparatus, belong to wafer process automation equipment technical field.
Background technique
Currently, Silicon Wafer, sic wafer are not completely cut through after being cut by laser, it is longitudinal in crystal column surface or internal generation
With lateral slight crack, need mating sliver apparatus that wafer splits, existing sliver apparatus, which cannot split surface or the back side, protrusion
Product, the wafer of back side plating metal existed using existing sliver apparatus sliver split not open, chipping, metal fault rupture it is bad
The defects of, cause product yield low.
Summary of the invention
The purpose of the present invention is overcoming the shortcomings of the prior art, a kind of wafer sliver apparatus is provided.
The purpose of the present invention is achieved through the following technical solutions:
Wafer sliver apparatus, feature are: including top mounting base, lower part cutter head mounting base, lower part cutter head, the left cutter head in top
And the right cutter head in top, the setting of lower part cutter head are installed in the cutter head mounting base of lower part, lower part cutter head mounting base is installed on workbench
On, top mounting base is located above the cutter head mounting base of lower part, and underrun the first X-axis linear motion unit of top mounting base connects
Portion's cutter head movable plate is connected, top cutter head movable plate can be driven to move left and right along X axis, the underrun of top cutter head movable plate
Second X-axis linear motion unit connects the right cutter head mounting plate in top, and the right cutter head in top is installed in the bottom surface of the right cutter head mounting plate in top,
The right cutter head in top can be driven to move left and right along X axis, downward one boss of projection in the bottom surface left part of top cutter head movable plate, boss
The left cutter head in upper installation top, the left cutter head in top and the right cutter head in top are in same level height and opposite, produce for loading wait split
The steel loop of product is located between the right cutter head of the left cutter head of lower part cutter head and top and top.
Further, above-mentioned wafer sliver apparatus, wherein install one in the lower part cutter head mounting base of lower part cutter head side
The adjusting rod of height adjuster, height adjuster is connect with lower part cutter head, and lower part cutter head is adjusted in the cutter head mounting base of lower part
It moves up and down, the connecting portion on the cutter head of lower part with lower part cutter head mounting base offers kidney slot, by fastening bolt by lower part
Cutter head is locked in the cutter head mounting base of lower part.
Further, above-mentioned wafer sliver apparatus, wherein the height adjuster is differential head adjuster.
Further, above-mentioned wafer sliver apparatus, wherein install one on the workbench of lower part cutter head mounting base side and adjust
Device is saved, the adjusting rod of adjuster is connect with lower part cutter head mounting base, and lower part cutter head mounting base is adjusted on the table along X axis
It moves left and right, offers kidney slot with the connecting portion of workbench in the cutter head mounting base of lower part, by fastening bolt by lower part knife
Head mounting base is locked on workbench.
Further, above-mentioned wafer sliver apparatus, wherein the steel loop is installed in X- θ axis movement mould group, can be driven
Steel loop moves left and right and θ axis rotary motion along X axis.
Further, above-mentioned wafer sliver apparatus, wherein the X- θ axis movement mould group includes X-axis moving cell and θ
Axis moving cell, the X-axis moving cell include X-axis chassis, X-axis linear guide, X-axis connecting plate and control X-axis connecting plate fortune
Dynamic X-axis movement mechanism, X-axis linear guide and X-axis movement mechanism are installed on X-axis chassis, and X-axis connecting plate is placed in X-axis straight line
On guide rail, X-axis movement mechanism and X-axis connecting plate are drivingly connected, and are moved in the X-axis direction to control X-axis connecting plate；The θ axis
Moving cell (17) includes rotating mechanism and luggage carrier, and luggage carrier is installed on rotating mechanism, and rotating mechanism is installed on X-axis connection
On plate.
Further, above-mentioned wafer sliver apparatus, wherein the top mounting base is installed on Z-axis lifting mechanism, can
Drive top mounting base along Z axis to up and down motion.
Further, above-mentioned wafer sliver apparatus, wherein the Z-axis lifting mechanism is that screw rod driving linear motion is single
Member or gear-rack drive linear motion unit.
Further, above-mentioned wafer sliver apparatus, wherein the first X-axis linear motion unit is that can move along a straight line
Piezoelectric ceramic actuator, screw rod driving linear motion unit, gear-rack drive linear motion unit or rodless cylinder driving
Linear motion unit.
Further, above-mentioned wafer sliver apparatus, wherein the second X-axis linear motion unit is that can move along a straight line
Piezoelectric ceramic actuator, screw rod driving linear motion unit, gear-rack drive linear motion unit or rodless cylinder driving
Linear motion unit.
The present invention has significant advantages and beneficial effects compared with prior art, embodies in the following areas:
1. the present invention is directed to the sliver requirement of Silicon Wafer, sic wafer after being cut by laser, automation sliver dress is provided
It sets, design uniqueness, structure novel are supported using lower part cutter head, and the principle that two cutter heads in top or so push makes Silicon Wafer, carbon
SiClx wafer and the wafer for carrying on the back plating metal split completely along slight crack, and chipping is small, yield is high；
2. driving product to be split to be overlapped its slight crack and the blade cutting edge alignment of lower part cutter head by X- θ axis movement mould group, lower part knife
The blade of head withstands fracture position；Second X-axis linear motion unit separates the right cutter head in top mutually with the left cutter head in top；First X
Axis linear motion singly makes the right cutter head in top after separating and the center line between the left cutter head in top parallel with the blade of lower part cutter head
Face；Z-axis lifting mechanism makes the right cutter head in top and the left cutter head in top simultaneously declines down and is pressed in product upper surface to be split, and makes to produce wait split
Product split along slight crack, then drive product to be split to move to next slight crack along X-axis by X- θ axis movement mould group, repeat sliver movement, directly
It all splits to slight crack；It drives product to be split to be rotated by 90 ° along θ axis by X- θ axis movement mould group again, repeats sliver movement until splitting
Trace all splits；
3. it is undesirable effectively to solve the wafer sliver that existing sliver apparatus cannot split the product for having protrusion and carry on the back plating metal
Problem avoids the phenomenon that splitting not open, and improves chipping, the undesirable defect of metal fault rupture, promotes the yield of product, simple to be applicable in,
For a practical new design.
Other features and advantages of the present invention will be illustrated in subsequent specification, also, partly be become from specification
It is clear that by implementing specific embodiment of the invention understanding.The objectives and other advantages of the invention can be by institute
Specifically noted structure is achieved and obtained in specification, claims and the attached drawing write.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1: the principle schematic diagram of apparatus of the present invention；
Fig. 2: the axonometric schematic diagram of apparatus of the present invention；
Fig. 3: the scheme of installation of lower part cutter head and lower part cutter head mounting base；
Fig. 4: the scheme of installation of steel loop and X- θ axis movement mould group；
Fig. 5: the scheme of installation of top mounting base and Z-axis lifting mechanism；
Fig. 6: the preceding axonometric schematic diagram of top mounting base；
Fig. 7: Fig. 6 schematic front view；
Fig. 8: Fig. 6 schematic side view；
Fig. 9: the bottom axonometric schematic diagram of top mounting base.
Specific embodiment
Below in conjunction with attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Usually exist
The component of the embodiment of the present invention described and illustrated in attached drawing can be arranged and be designed with a variety of different configurations herein.Cause
This, is not intended to limit claimed invention to the detailed description of the embodiment of the present invention provided in the accompanying drawings below
Range, but it is merely representative of selected embodiment of the invention.Based on the embodiment of the present invention, those skilled in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.Meanwhile of the invention
In description, directional terminology and ordinal term etc. are only used for distinguishing description, are not understood to indicate or imply relative importance.
As shown in Figure 1 and Figure 2, wafer sliver apparatus, comprising top mounting base 4, lower part cutter head mounting base 7, lower part cutter head 1,
The right cutter head 11 of the left cutter head 2 in top and top, the setting of lower part cutter head 1 are installed in lower part cutter head mounting base 7, the installation of lower part cutter head
Seat 7 is installed on workbench 13, and top mounting base 4 is located at 7 top of lower part cutter head mounting base；As shown in Fig. 6~9, top installation
The first X-axis of underrun linear motion unit 10 of seat 4 connects top cutter head movable plate 5, can drive 5 edge of top cutter head movable plate
X axis moves left and right, and the second X-axis of underrun linear motion unit 12 of top cutter head movable plate 5 connects the right cutter head peace in top
The right cutter head 11 in top is installed in the bottom surface of loading board 6, the right cutter head mounting plate 6 in top, can drive the right cutter head mounting plate 6 in top and be located at it
On the right cutter head 11 in top moved left and right along X axis, downward one boss of projection in the bottom surface left part of top cutter head movable plate 5 is convex
The left cutter head 2 in top is installed, the left cutter head 2 in top and the right cutter head 11 in top are in same level height and opposite on platform；For loading
The steel loop 3 of product to be split is located between the right cutter head 11 of the left cutter head 2 of lower part cutter head 1 and top and top.
As shown in figure 3, installing a height adjuster 9, height adjustment in the lower part cutter head mounting base 7 of 1 side of lower part cutter head
Device 9 is differential head adjuster, and the adjusting rod of height adjuster 9 is connect with lower part cutter head 1, and lower part cutter head 1 is adjusted in lower part knife
It is moved up and down in head mounting base 7, the connecting portion on lower part cutter head 1 with lower part cutter head mounting base 7 offers kidney slot, by tight
Lower part cutter head 1 is locked in lower part cutter head mounting base 7 by fixing bolt.1 blade of lower part cutter head can be adjusted by height adjuster 9
Upper and lower position.
Such as Fig. 3, an adjuster 8 is installed on the workbench 13 of 7 side of lower part cutter head mounting base, adjuster 8 is differential head tune
Device is saved, the adjusting rod of adjuster 8 is connect with lower part cutter head mounting base 7, and the edge on workbench 13 of lower part cutter head mounting base 7 is adjusted
X axis moves left and right, and offers kidney slot with the connecting portion of workbench 13 in lower part cutter head mounting base 7, passes through fastening bolt
Lower part cutter head mounting base 7 is locked on workbench 13.The upper bottom of 1 blade of lower part cutter head can be adjusted by height adjuster 9
It sets.
As shown in figure 4, steel loop 3 is installed in X- θ axis movement mould group, steel loop 3 can be driven to move left and right and θ axis along X axis
Rotary motion.It includes X-axis moving cell 16 and θ axis moving cell 17 that X- θ axis, which moves mould group, and X-axis moving cell 16 includes X-axis bottom
The X-axis movement mechanism that frame, X-axis linear guide, X-axis connecting plate and control X-axis connecting plate move, X-axis linear guide and X-axis movement
Mechanism is installed on X-axis chassis, and X-axis connecting plate is placed in X-axis linear guide, and X-axis movement mechanism and the driving of X-axis connecting plate connect
It connects, is moved in the X-axis direction to control X-axis connecting plate；θ axis moving cell 17 includes rotating mechanism and luggage carrier, luggage carrier peace
Loaded on rotating mechanism, rotating mechanism is installed on X-axis connecting plate.
As shown in figure 4, top mounting base 4 is installed on Z-axis lifting mechanism 15, top mounting base 4 can be driven upward along Z axis
Lower movement.Z-axis lifting mechanism 15 is that screw rod drives linear motion unit or gear-rack drive linear motion unit.
First X-axis linear motion unit 10 is the piezoelectric ceramic actuator that can be moved along a straight line, screw rod driving linear motion list
Member, gear-rack drive linear motion unit or rodless cylinder drive linear motion unit.
Second X-axis linear motion unit 12 is the piezoelectric ceramic actuator that can be moved along a straight line, screw rod driving linear motion list
Member, gear-rack drive linear motion unit or rodless cylinder drive linear motion unit.
When concrete application, product to be split (wafer) is placed on steel loop 3, and X- θ axis movement mould group driving steel loop 3 is fed to down
Cutter head 1 station in portion's first rotates steel loop 3, and product surface to be split or internal slight crack are parallel with the blade of lower part cutter head 1,3 edge of steel loop
X axis moves left and right, and is overlapped product surface to be split or the slight crack of inside with the blade cutting edge alignment of lower part cutter head 1, lower part cutter head 1
Blade withstands fracture position.Second X-axis linear motion unit 12 drives the right cutter head mounting plate 6 in top and top disposed thereon right
Cutter head 11 is moved left and right along X axis, separates the right cutter head 11 in top with left 2 phase of cutter head in top, and the right cutter head 11 in top and top are left
Separated spacing between cutter head 2 is adjustable in 0~10mm.First X-axis linear motion unit 10 drives cutter head movable plate 5 in top along X
It axially moves left and right, drives the left cutter head of the right cutter head 11 in top disposed thereon and top 2 is whole to move left and right along X axis, make point
The center line face parallel with the blade of lower part cutter head 1 between the right cutter head 11 in top and the left cutter head 2 in top after opening.Z axis lifting
Mechanism 15 drives top mounting base 4 to decline, and then simultaneously declines the right cutter head 11 in top with the left cutter head 2 in top and be pressed in product to be split
Upper surface, continuing decline makes product to be split split along slight crack, and then Z-axis lifting mechanism 15 drives top mounting base 4 to rise, and completes
One sliver movement.The loading product of steel loop 3 is moved along X axis shifts to next fracture position, and the right cutter head 11 in top and top are left
Cutter head 2 declines pressure break product again, repeats above-mentioned sliver movement until the slight crack of product surface or inside all splits.
Steel loop 3 loads product to be split and is rotated by 90 ° along θ axis, makes the slight crack of product surface or inside and the knife of lower part cutter head 1
Sword is parallel, and steel loop 3 moves left and right, and is overlapped product surface to be split or the slight crack of inside with the blade cutting edge alignment of lower part cutter head 1, lower part
The blade of cutter head 1 withstands fracture position.Second X-axis linear motion unit 12 drives the right cutter head mounting plate 6 in top and disposed thereon
The right cutter head 11 in top moved left and right along X axis, separate the right cutter head 11 in top with left 2 phase of cutter head in top.First X-axis straight line fortune
Moving cell 10 drives top cutter head movable plate 5 to move left and right along X axis, drives the right cutter head 11 in top disposed thereon and top left
Cutter head 2 is whole to be moved left and right along X axis, makes the center line between the left cutter head 2 of the right cutter head 11 in top and top after separating under
The parallel face of the blade of portion's cutter head 1.Z-axis lifting mechanism 15 drive top mounting base 4 decline, and then make the right cutter head 11 in top with it is upper
The left cutter head 2 in portion, which simultaneously declines, is pressed in product upper surface to be split, and continuing decline makes product to be split split along slight crack, and then Z axis is gone up and down
Mechanism 15 drives top mounting base 4 to rise, and completes a sliver movement.Steel loop 3 loads product movement and shifts to next slight crack position
It sets, the right cutter head 11 in top declines pressure break product with the left cutter head 2 in top again, repeats above-mentioned sliver movement until product surface or inside
Slight crack all split.
The lateral slight crack and longitudinal crack of product surface to be split or inside all split, and complete the sliver operation of product.
In conclusion the present invention is directed to the sliver requirement of Silicon Wafer, sic wafer after being cut by laser, automation is provided
Sliver apparatus, design uniqueness, structure novel, is supported using lower part cutter head, and the principle that two cutter heads in top or so push makes silicon wafer
The wafer of circle, sic wafer and back plating metal splits completely along slight crack.
Product to be split is driven to be overlapped its slight crack and the blade cutting edge alignment of lower part cutter head by X- θ axis movement mould group, lower part cutter head
Blade withstand fracture position；Second X-axis linear motion unit separates the right cutter head in top mutually with the left cutter head in top；First X-axis
Linear motion singly makes the center line between the right cutter head in top and the left cutter head in top after separating parallel with the blade of lower part cutter head just
It is right；Z-axis lifting mechanism makes the right cutter head in top and the left cutter head in top simultaneously declines down and is pressed in product upper surface to be split, and makes product to be split
It splits along slight crack, until slight crack all splits；Product to be split is driven to be rotated by 90 ° along θ axis by X- θ axis movement mould group again, repetition is split
Piece movement is all split until slight crack.Chipping is small, yield is high.
The wafer sliver that the product for having protrusion cannot be split and carry on the back plating metal by effectively solving existing sliver apparatus undesirable is asked
Topic avoids the phenomenon that splitting not open, and improves chipping, the undesirable defect of metal fault rupture, promotes the yield of product.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.It should also be noted that similar label and letter exist
Similar terms are indicated in following attached drawing, therefore, once being defined in a certain Xiang Yi attached drawing, are then not required in subsequent attached drawing
It is further defined and explained.
The above is only a specific embodiment of the present invention, but scope of protection of the present invention is not limited thereto, any to be familiar with
Those skilled in the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all cover
Within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to protection scope described in claim.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
Claims (10)
1. wafer sliver apparatus, it is characterised in that: include top mounting base (4), lower part cutter head mounting base (7), lower part cutter head
(1), the right cutter head of the left cutter head in top (2) and top (11), lower part cutter head (1) setting are installed in lower part cutter head mounting base (7),
Lower part cutter head mounting base (7) is installed on workbench (13), and top mounting base (4) is located above lower part cutter head mounting base (7), on
Underrun the first X-axis linear motion unit (10) of portion's mounting base (4) connects top cutter head movable plate (5), can drive top
Cutter head movable plate (5) is moved left and right along X axis, underrun the second X-axis linear motion unit of top cutter head movable plate (5)
(12) the right cutter head mounting plate (6) in top is connected, the bottom surface of the right cutter head mounting plate (6) in top is installed the right cutter head in top (11), can be driven
The dynamic right cutter head in top (11) is moved left and right along X axis, downward one boss of projection in the bottom surface left part of top cutter head movable plate (5),
The left cutter head in top (2) are installed on boss, the left cutter head in top (2) and the right cutter head in top (11) are in same level height and opposite,
Steel loop (3) for loading product to be split is located between the right cutter head of the left cutter head of lower part cutter head (1) and top (2) and top (11).
2. wafer sliver apparatus according to claim 1, it is characterised in that: the lower part cutter head of lower part cutter head (1) side is pacified
It is installed a height adjuster (9) on dress seat (7), the adjusting rod of height adjuster (9) is connect with lower part cutter head (1), under being adjusted
Portion's cutter head (1) moves up and down in lower part cutter head mounting base (7), on lower part cutter head (1) with the connection of lower part cutter head mounting base (7)
Position offers kidney slot, and lower part cutter head (1) is locked in lower part cutter head mounting base (7) by fastening bolt.
3. wafer sliver apparatus according to claim 2, it is characterised in that: the height adjuster (9) is differential head tune
Save device.
4. wafer sliver apparatus according to claim 1, it is characterised in that: the work of lower part cutter head mounting base (7) side
It is installed on platform (13) adjuster (8), the adjusting rod of adjuster (8) is connect with lower part cutter head mounting base (7), and lower part knife is adjusted
Head mounting base (7) moved left and right on workbench (13) along X axis, in lower part cutter head mounting base (7) with the company of workbench (13)
Socket part position offers kidney slot, and lower part cutter head mounting base (7) is locked on workbench (13) by fastening bolt.
5. wafer sliver apparatus according to claim 1, it is characterised in that: the steel loop (3) is installed on X- θ axis movement mould
In group, steel loop (3) can be driven to move left and right and θ axis rotary motion along X axis.
6. wafer sliver apparatus according to claim 5, it is characterised in that: the X- θ axis movement mould group is moved comprising X-axis
Unit (16) and θ axis moving cell (17), the X-axis moving cell (16) include X-axis chassis, X-axis linear guide, X-axis connection
The X-axis movement mechanism of plate and control X-axis connecting plate movement, X-axis linear guide and X-axis movement mechanism are installed on X-axis chassis, X
Axis connection plate is placed in X-axis linear guide, and X-axis movement mechanism and X-axis connecting plate are drivingly connected, to control X-axis connecting plate along X
Axis direction movement；The θ axis moving cell (17) includes rotating mechanism and luggage carrier, and luggage carrier is installed on rotating mechanism, is revolved
Rotation mechanism is installed on X-axis connecting plate.
7. wafer sliver apparatus according to claim 1, it is characterised in that: the top mounting base (4) is installed on Z axis liter
On descending mechanism (15), top mounting base (4) can be driven along Z axis to up and down motion.
8. wafer sliver apparatus according to claim 7, it is characterised in that: the Z-axis lifting mechanism (15) is screw rod drive
Dynamic linear motion unit or gear-rack drive linear motion unit.
9. wafer sliver apparatus according to claim 1, it is characterised in that: the first X-axis linear motion unit (10)
For can move along a straight line piezoelectric ceramic actuator, screw rod drive linear motion unit, gear-rack drive linear motion unit or
Rodless cylinder drives linear motion unit.
10. wafer sliver apparatus according to claim 1, it is characterised in that: the second X-axis linear motion unit (12)
For can move along a straight line piezoelectric ceramic actuator, screw rod drive linear motion unit, gear-rack drive linear motion unit or
Rodless cylinder drives linear motion unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910605206.XA CN110328765A (en) | 2019-07-05 | 2019-07-05 | Wafer sliver apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910605206.XA CN110328765A (en) | 2019-07-05 | 2019-07-05 | Wafer sliver apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110328765A true CN110328765A (en) | 2019-10-15 |
Family
ID=68143876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910605206.XA Pending CN110328765A (en) | 2019-07-05 | 2019-07-05 | Wafer sliver apparatus |
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| Country | Link |
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| CN (1) | CN110328765A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112201600A (en) * | 2020-10-14 | 2021-01-08 | 北京中科镭特电子有限公司 | Wafer splitting and expanding device and wafer splitting and expanding method |
| CN112259476A (en) * | 2020-10-21 | 2021-01-22 | 河北圣昊光电科技有限公司 | Compound semiconductor wafer splitting machine |
| CN114803452A (en) * | 2022-04-29 | 2022-07-29 | 河北圣昊光电科技有限公司 | Synchronous transmission assembly and splitting machine with same |
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| CN112201600A (en) * | 2020-10-14 | 2021-01-08 | 北京中科镭特电子有限公司 | Wafer splitting and expanding device and wafer splitting and expanding method |
| CN112201600B (en) * | 2020-10-14 | 2024-03-08 | 北京中科镭特电子有限公司 | Wafer splitting and expanding device and wafer splitting and expanding method |
| CN112259476A (en) * | 2020-10-21 | 2021-01-22 | 河北圣昊光电科技有限公司 | Compound semiconductor wafer splitting machine |
| CN114803452A (en) * | 2022-04-29 | 2022-07-29 | 河北圣昊光电科技有限公司 | Synchronous transmission assembly and splitting machine with same |
| CN114803452B (en) * | 2022-04-29 | 2024-04-09 | 河北圣昊光电科技有限公司 | Synchronous transmission assembly and splitting machine with same |
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