TW202108522A - Scribing head and scribing device - Google Patents
Scribing head and scribing device Download PDFInfo
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- TW202108522A TW202108522A TW109107701A TW109107701A TW202108522A TW 202108522 A TW202108522 A TW 202108522A TW 109107701 A TW109107701 A TW 109107701A TW 109107701 A TW109107701 A TW 109107701A TW 202108522 A TW202108522 A TW 202108522A
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- scribing
- cylinder mechanism
- knife holder
- load
- brittle material
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
Description
本發明係關於一種刻劃頭及刻劃裝置,尤其是關於一種用以刻劃脆性材料基板之刻劃頭及刻劃裝置。The present invention relates to a scribing head and a scribing device, in particular to a scribing head and a scribing device for scribing a brittle material substrate.
用作FPD用面板基板之脆性材料基板通常藉由利用刻劃裝置刻劃大張之母基板,其後分斷為既定之大小而製造。例如專利文獻1中揭示有一種用以刻劃玻璃基板之刻劃裝置。
刻劃裝置具備:以水平狀態保持欲形成劃線槽之玻璃基板之平台、刻劃保持於該平台上之玻璃基板之刻劃頭、及具有安裝有可供各刻劃頭滑動之導軌之橋件。The brittle material substrate used as the panel substrate for FPD is usually manufactured by scribing a large mother substrate with a scribing device, and then dividing it into a predetermined size. For example,
於刻劃頭之下部設置有刀輪安裝機構。刀輪安裝機構具有保持器、及安裝於保持器之刀輪片。刀輪片具有片本體、及安裝於其上之刀輪。 刀輪安裝機構藉由刻劃頭之升降機構而可相對於刻劃頭本體沿上下方向移動,加壓熔接於保持於平台上之玻璃基板,藉由相對於玻璃基板相對移動而刻劃玻璃基板。藉此,於玻璃基板形成劃線槽。 [現有技術文獻] [專利文獻]A cutter wheel installation mechanism is arranged at the lower part of the scoring head. The cutter wheel installation mechanism has a holder and a cutter wheel piece mounted on the holder. The knife wheel piece has a piece body and a knife wheel installed on it. The cutter wheel mounting mechanism can move up and down with respect to the scoring head body by the lifting mechanism of the scoring head, press-weld to the glass substrate held on the platform, and scribing the glass substrate by moving relative to the glass substrate . Thereby, a scribe groove is formed in the glass substrate. [Prior Art Literature] [Patent Literature]
[專利文獻1]日本專利第4948837號公報[Patent Document 1] Japanese Patent No. 4948837
[發明所欲解決之問題][The problem to be solved by the invention]
用作FPD用之玻璃基板之厚度有自先前作為主流之0.7 mm厚向用於便攜終端之用途等主流之0.4 mm~0.3 mm厚、或該厚度以下逐漸變薄之傾向。於刻畫此種薄之玻璃基板時,必須於將對玻璃基板之刻劃荷重(負載)設定為小於習知之荷重範圍內精度良好地控制。其原因在於:若未實現上述要求,則刀輪片對玻璃基板施加較大之刻劃荷重,於刻劃時玻璃基板會破損,或以偏離既定之預定劃線槽之狀態形成劃線槽。 然而,將對玻璃基板之刻劃荷重調整為比刀機構整體之自身重量小之荷重並不容易。其原因在於:由於沿上下方向滑動刀機構整體,因而會對玻璃基板施加刀機構整體之自身重量。The thickness of glass substrates used for FPDs tends to gradually become thinner from 0.7 mm, which was the mainstream thickness, to 0.4 mm to 0.3 mm, which is the mainstream thickness for portable terminal applications, or below this thickness. When scribing such a thin glass substrate, it is necessary to accurately control the scribing load (load) of the glass substrate to be less than the conventional load range. The reason is that if the above requirements are not fulfilled, the cutter wheel will apply a larger scribing load to the glass substrate, and the glass substrate will be damaged during scribing, or the scribing groove may be formed in a state deviating from the predetermined scribing groove. However, it is not easy to adjust the scribing load on the glass substrate to a load smaller than the weight of the knife mechanism as a whole. The reason is that since the entire knife mechanism is slid in the up and down direction, the weight of the entire knife mechanism is applied to the glass substrate.
本發明之目的在於藉由將刻劃荷重設為充分小,而使刻劃頭可安全且精度良好地刻劃薄之基板。 [解決問題之手段]The object of the present invention is to make the scribing head scribe a thin substrate safely and accurately by setting the scribing load to be sufficiently small. [Means to Solve the Problem]
以下,作為用以解決課題之手段,對多個態樣進行說明。該等態樣可視需要任意地組合。Hereinafter, a number of aspects will be described as means to solve the problem. These aspects can be combined arbitrarily as needed.
本發明之一方面之刻劃頭係用以刻劃脆性材料基板之表面者,其具備基部、刀機構、刀保持器、第1氣缸機構、及第2氣缸機構。 刀保持器係以可相對於基部沿上下方向滑動之方式被支承,且保持刀機構。 第1氣缸機構對刀保持器施加朝向脆性材料基板側之荷重。 第2氣缸機構對刀保持器施加朝向與脆性材料基板相反側之荷重。 將第1氣缸機構之荷重設定為大於第2氣缸機構之荷重,藉此利用第1氣缸機構與第2氣缸機構之差壓推力使刀保持器往脆性材料基板側移動。 於該刻劃頭中,利用第1氣缸機構與第2氣缸機構之差壓推力使刀保持器往脆性材料基板側移動。因此,可使自刀機構施加至基板之荷重極小。其結果為,可避免使薄板之脆性材料基板破損,並且精度良好地進行刻劃動作。The scoring head of one aspect of the present invention is used for scribing the surface of a brittle material substrate, and includes a base, a knife mechanism, a knife holder, a first cylinder mechanism, and a second cylinder mechanism. The knife holder is supported so as to be slidable in the vertical direction with respect to the base, and holds the knife mechanism. The first cylinder mechanism applies a load toward the brittle material substrate side to the knife holder. The second cylinder mechanism applies a load to the knife holder facing the side opposite to the brittle material substrate. The load of the first cylinder mechanism is set to be greater than the load of the second cylinder mechanism, thereby using the differential thrust between the first cylinder mechanism and the second cylinder mechanism to move the knife holder toward the brittle material substrate. In this scoring head, the knife holder is moved to the brittle material substrate side by the differential pressure between the first cylinder mechanism and the second cylinder mechanism. Therefore, the load applied by the knife mechanism to the substrate can be extremely small. As a result, damage to the brittle material substrate of the thin plate can be avoided, and the scribing operation can be performed accurately.
刻劃頭可進而具備進行刀保持器之上下方向之定位之定位機構。 定位機構可具有以可使刀保持器自脆性材料基板側脫離之方式支承刀保持器之支承構件。 於該刻劃頭中,若定位機構定位刀保持器而使刀機構抵接於脆性材料基板,則繼而定位機構之支承構件自刀保持器脫離至脆性材料基板側。由此,之後僅可藉由第1氣缸機構與第2氣缸機構之差壓推力將刀機構壓抵於脆性材料基板。該狀態係可藉由刀機構切斷脆性材料基板之狀態,即,於利用刀機構切斷基板之過程中,定位機構與切斷加壓系統分開。其結果為,於基板切斷過程中定位機構之各部分之摩擦阻力不會影響到切斷加壓系統。The scoring head can be further equipped with a positioning mechanism for positioning the knife holder in the up and down direction. The positioning mechanism may have a supporting member that supports the knife holder so that the knife holder can be detached from the brittle material substrate side. In this scoring head, if the positioning mechanism positions the knife holder so that the knife mechanism abuts against the brittle material substrate, then the support member of the positioning mechanism is separated from the knife holder to the brittle material substrate side. As a result, the knife mechanism can only be pressed against the brittle material substrate by the differential thrust between the first cylinder mechanism and the second cylinder mechanism. This state is a state in which the brittle material substrate can be cut by the knife mechanism, that is, in the process of cutting the substrate by the knife mechanism, the positioning mechanism is separated from the cutting pressure system. As a result, the frictional resistance of each part of the positioning mechanism does not affect the cutting pressure system during the substrate cutting process.
刀保持器可進而具有第1活塞構件、第2活塞構件、及荷重計。第1活塞構件可由第1氣缸機構驅動。第2活塞構件可設置於第1活塞構件之脆性材料基板側而由第2氣缸機構驅動。荷重計可配置於第1活塞構件與第2活塞構件之間。 於該刻劃單元中,可藉由荷重計測定基板切斷過程中之動壓。The knife holder may further have a first piston member, a second piston member, and a load meter. The first piston member can be driven by the first cylinder mechanism. The second piston member may be provided on the side of the brittle material substrate of the first piston member and driven by the second cylinder mechanism. The load cell may be arranged between the first piston member and the second piston member. In the scribing unit, the dynamic pressure during the cutting process of the substrate can be measured by a load meter.
刀保持器可具有設置於第2活塞構件之第1活塞構件側之承受構件、及設置於第1活塞構件之第2活塞構件側且可抵接於承受構件之抵接構件。 於該刻劃單元中,藉由利用承受構件與抵接構件使第1活塞構件與第2活塞構件相抵,而可實現兩構件間之荷重傳遞。The knife holder may have a receiving member provided on the first piston member side of the second piston member, and an abutting member provided on the second piston member side of the first piston member and capable of contacting the receiving member. In the scoring unit, by using the receiving member and the abutting member to make the first piston member and the second piston member abut, the load can be transmitted between the two members.
承受構件可具有球面,抵接構件可具有抵接於球面之平坦面。 於該刻劃單元中,即便第1活塞構件與第2活塞構件之中心位置有偏差亦可吸收。The receiving member may have a spherical surface, and the abutting member may have a flat surface that abuts against the spherical surface. In this scoring unit, even if the center position of the first piston member and the second piston member are deviated, it can be absorbed.
刻劃頭可進而具備以可使刀保持器相對於基部滑動之方式支承刀保持器之空氣軸承。 於該刻劃頭中,於刀保持器上下移動時,摩擦阻力大幅減小。The scoring head may further be provided with an air bearing that supports the knife holder in such a way that the knife holder can slide with respect to the base. In this scoring head, when the knife holder moves up and down, the frictional resistance is greatly reduced.
本發明之其他方面之刻劃裝置具備基板載置部、用以刻劃脆性材料基板之表面之刻劃頭、及驅動刻劃頭之驅動部。 刻劃頭具備基部、刀機構、刀保持器、第1氣缸機構、及第2氣缸機構。 刀保持器係以可相對於基部沿上下方向滑動之方式被支承,且保持刀機構。 第1氣缸機構對刀保持器施加朝向脆性材料基板側之荷重。 第2氣缸機構對刀保持器施加朝向與脆性材料基板相反側之荷重。 將第1氣缸機構之荷重設定為大於第2氣缸機構之荷重,藉此利用第1氣缸機構與第2氣缸機構之差壓推力使刀保持器往脆性材料基板側移動。 於該刻劃裝置中,利用第1氣缸機構與第2氣缸機構之差壓推力使刀保持器往脆性材料基板側移動。因此,可使自刀機構施加至基板之荷重極小。其結果為,可避免使薄板之脆性材料基板破損,並且精度良好地進行刻劃動作。 [發明之效果]A scribing device according to another aspect of the present invention includes a substrate placement part, a scribing head for scribing the surface of a brittle material substrate, and a driving part for driving the scribing head. The scoring head includes a base, a knife mechanism, a knife holder, a first cylinder mechanism, and a second cylinder mechanism. The knife holder is supported so as to be slidable in the vertical direction with respect to the base, and holds the knife mechanism. The first cylinder mechanism applies a load toward the brittle material substrate side to the knife holder. The second cylinder mechanism applies a load to the knife holder facing the side opposite to the brittle material substrate. The load of the first cylinder mechanism is set to be greater than the load of the second cylinder mechanism, thereby using the differential thrust between the first cylinder mechanism and the second cylinder mechanism to move the knife holder toward the brittle material substrate. In this scribing device, the knife holder is moved toward the brittle material substrate by the differential pressure between the first cylinder mechanism and the second cylinder mechanism. Therefore, the load applied by the knife mechanism to the substrate can be extremely small. As a result, damage to the brittle material substrate of the thin plate can be avoided, and the scribing operation can be performed accurately. [Effects of Invention]
於本發明之刻劃頭中,藉由使刻劃荷重充分地小,可安全且精度良好地刻劃薄之基板。In the scribing head of the present invention, by making the scribing load sufficiently small, thin substrates can be scribed safely and accurately.
1.第1實施形態
(1)刻劃裝置
使用圖1對刻劃裝置101進行說明。圖1係刻劃裝置之概略立體圖。刻劃裝置101係對脆性材料基板W(以下稱為「基板W」)進行刻劃加工之裝置。基板W例如為玻璃基板、陶瓷基板、藍寶石基板、矽基板等。
刻劃裝置101之加壓範圍例如為0.1~20 N,加壓最小單位例如為0.1 N。刻劃裝置101適於薄板玻璃基板(例如,0.1~0.3 mm之厚度)之刻劃形成。
刻劃裝置101具備載置基板W之平台102(基板載置部之一例)。平台102係載置於移動台103,移動台103可沿水平之軌道105a、105b移動,由利用馬達106而旋轉之滾珠螺桿107所驅動。1. The first embodiment
(1) Scribing device
The
再者,於以下之說明中,將軌道105a、105b之延伸之水平方向設為Y方向,將與其正交之水平方向稱為X方向。
平台102以將基板W保持於固定位置之方式具備保持手段(未圖示)。保持手段例如為利用來自於平台102開口之多個較小之吸附孔(未圖示)之空氣進行吸附。In addition, in the following description, the horizontal direction in which the
於刻劃裝置101上,以橫跨移動台103與平台102之方式,沿X方向藉由支柱112a、112b架設有橋件111。
於橋件111安裝有導件113,沿導件113以可沿X方向移動之方式設置有刻劃頭1。設置有驅動刻劃頭1之馬達(未圖示,驅動部之一例)。
如上所述,使安裝於刻劃裝置101之刻劃頭1之刀輪23b(下文所述)下降至載置於平台102上之基板W之表面,將其壓抵於基板W之表面並且使其相對地直線移動,藉此於基板W之表面加工分斷用之劃線槽。On the
(2)刻劃頭之概要
使用圖2~圖7對刻劃頭1進行說明。圖2係刻劃頭之立體圖。圖3係刻劃頭之截面圖。圖4係刻劃頭之內部之側視圖。圖5係刻劃頭之內部之立體圖。圖6係刻劃頭之內部之部分立體圖。圖7係表示刻劃頭之空氣供給之流程之示意圖。
刻劃頭1藉由刻劃基板W之表面而形成劃線槽。刻劃頭1主要具有框架構件13、加壓機構15、及定位機構17。加壓機構15與定位機構17示於圖3及圖4。(2) Outline of marking head
The
框架構件13(基部之一例)係由板構件構成之長方體形狀之構件,於內部收容下文所述之各種構件。再者,於以下之說明中,有時為了簡化說明,而將固定於框架構件13維持靜止狀態之構造稱為框架構件13。
加壓機構15係於刻劃動作中產生對基板施加之刻劃荷重之機構。
定位機構17(定位機構之一例)係使加壓機構15移動至相對於基板W之既定位置之機構。再者,於刻劃動作中,避免定位機構17所產生之摩擦阻力作用於加壓機構15(下文所述)。The frame member 13 (an example of the base) is a rectangular parallelepiped member composed of a plate member, and various members described below are housed inside. In addition, in the following description, in order to simplify the description, the structure fixed to the
(3)刻劃頭之詳細
(3-1)加壓機構
加壓機構15設置主壓缸與差壓產生用缸,進行產生微小壓作為主壓缸與差壓產生用缸之差量之差壓控制。例如,若主壓缸產生5.1 N,差壓產生用缸產生5.0 N,則獲得0.1 N之微小壓。(3) Details of the marking head
(3-1) Pressure mechanism
The
加壓機構15具有刀保持器21(刀保持器之一例)。刀保持器21以可相對於框架構件13沿上下方向滑動之方式被支承,且保持刀機構23(下文所述)。
加壓機構15具有第1氣缸機構25(第1氣缸機構之一例)作為主壓缸。第1氣缸機構25對刀保持器21施加朝向基板W側之荷重。具體而言,第1氣缸機構25具有對刀保持器21施加朝向下方之荷重之作為空氣供給源之泵(未圖示)或調節器(未圖示)、空氣供給埠25a。The
加壓機構15具有第2氣缸機構27(第2氣缸機構之一例)作為差壓產生用缸。第2氣缸機構27對刀保持器21施加朝向與基板W相反側之荷重。具體而言,第2氣缸機構27具有對刀保持器21施加朝向上方之荷重之作為空氣供給源之泵(未圖示)或調節器(未圖示)、空氣供給埠27a。
於加壓機構15中,藉由利用第1氣缸機構25與第2氣缸機構27之差壓推力,使刀保持器21往基板W側移動。因此,可使自刀機構23施加至基板W之荷重極小。其結果為,可避免使薄之基板W破損,並且精度良好地進行刻劃動作。The
刀保持器21具有由第1氣缸機構25驅動之第1活塞桿21A(第1活塞構件之一例)。刀保持器21進而具有設置於第1活塞桿21A之基板W側且由第2氣缸機構27驅動之第2活塞桿21B(第2活塞構件之一例)。
上文所述之空氣供給埠25a係連接於由框架構件13形成之第1活塞桿21A之上側之空間。上文所述之空氣供給埠27a係連接於由框架構件13形成之第2活塞桿21B之周圍之空間。The
刀保持器21具有設置於第2活塞桿21B之第1活塞桿21A側之承受構件51(承受構件之一例)、及設置於第1活塞桿21A之第2活塞桿21B側且可抵接於承受構件之抵接構件53(抵接構件之一例)。承受構件51係由球構成,具有球面。抵接構件53係固定於第1活塞桿21A側之構件(具體而言,下文所述之荷重元(load cell)75及板構件77)之螺栓,具有抵接於球面之平坦之頭部頂面。由此,藉由利用承受構件51與抵接構件53使第1活塞桿21A與第2活塞桿21B相抵,而可實現兩構件間之荷重傳遞。又,即便第1活塞桿21A與第2活塞桿21B之中心位置(負荷點)有偏差亦可吸收。
再者,由於抵接構件53為磁石,承受構件51為磁性體,故而可一直維持與承受構件51抵接之狀態。又,藉由採用磁性連接,第1活塞桿21A與第2活塞桿21B之組裝及解體較容易。The
刀保持器21係以可相對於框架構件13沿上下方向自由移動之方式被引導。具體而言,第1活塞桿21A經由第1空氣軸承61而以可相對於框架構件13沿上下方向滑動之方式被支承。第2活塞桿21B之上部經由第2空氣軸承63、下部經由第3空氣軸承65而以可相對於框架構件13沿上下方向自由移動之方式被引導。因此,對刀保持器21之摩擦阻力大幅減小。
第1空氣軸承61經由空氣供給埠61a(圖7)而連接於泵(未圖示)或調節器(未圖示)。第2空氣軸承63經由空氣供給埠63a(圖7)而連接於泵(未圖示)或調節器(未圖示)。第3空氣軸承65經由空氣供給埠65a(圖7)而連接於泵(未圖示)或調節器(未圖示)。The
於第1活塞桿21A與第2活塞桿21B之間配置有荷重元75(荷重計之一例)。藉由荷重元75可測定基板W之切斷過程中之動壓。由此,藉由內藏荷重元75,可監控刻劃中之荷重。再者,於荷重元75之基板W側配置有板構件77。A load cell 75 (an example of a load meter) is arranged between the
加壓機構15具有刀機構23。刀機構23係由第2活塞桿21B之下端部所保持。具體而言,第2活塞桿21B具有滑塊21a、及以自該滑塊21a向下方延伸之方式設置之圓筒狀之連結部21b,刀機構23係由連結部21b所保持。刀機構23具有保持於連結部21b內之片保持器23a、及於其下端部以可藉由水平軸旋轉之方式設置之刀輪23b。The
(3-2)定位機構
定位機構17係定位加壓機構15、具體而言為刀保持器21之上下方向之位置之機構。切入量之設定亦由定位機構17進行。
定位機構17具有伺服馬達31。伺服馬達31係固定於框架構件13之上表面。伺服馬達31具有以垂直狀態配置之馬達本體部31a、及自該本體部向下方延伸之旋轉軸31b。經由聯軸器33於旋轉軸31b連結有滾珠螺桿35。滾珠螺桿35係與伺服馬達31之旋轉軸31b同軸之狀態,與旋轉軸31b一體地旋轉。(3-2) Positioning mechanism
The
定位機構17具有螺母構件37。螺母構件37以螺紋結合於滾珠螺桿35。因此,若伺服馬達31之旋轉軸31b之旋轉使得滾珠螺桿35旋轉,則螺母構件37被螺紋沿上下方向傳送,而沿上下方向滑動。
定位機構17如圖4~圖6所示,具有支承構件39(支承構件之一例)。支承構件39以可使刀保持器21自基板W側脫離之方式支承刀保持器21。具體而言,支承構件39係由固定於螺母構件37且延伸至加壓機構15側之定位板39a、及固定於其上之螺栓39b構成。螺栓39b可相對於板構件77自下方抵接或接近。The
具體而言,螺栓39b有3根,即,支承構件39係於3點自下方支承板構件77。
於滾珠螺桿35與框架構件13之一部分之間配置有螺旋彈簧79。螺旋彈簧79於刀保持器21已下降之狀態下被壓縮。因此,於產生異常而電源斷開時,可藉由螺旋彈簧79提起刀尖。再者,於該實施形態中,如圖5所示,配置有2根螺旋彈簧(coil spring)79。Specifically, there are three
(4)刻劃動作
首先,搬送基板W,將其載置於平台102上。然後,使刻劃頭1沿X方向移動,定位於既定之位置。(4) Scribing action
First, the substrate W is transported and placed on the
繼而,對使刻劃頭1之模具保持器下降之動作進行說明。
如圖3所示,於初始狀態下,為來自第1氣缸機構25之壓力作用於第1活塞桿21A之狀態。並且,第1活塞桿21A係由支承構件39所支承,因此刀保持器21不會往下方移動。此時,於刀輪23b與基板W之間確保距離S1(例如,10 mm)。
其次,如圖8所示,於刻劃頭1中,伺服馬達31被正轉驅動。藉此,連結於伺服馬達31之旋轉軸31b之滾珠螺桿35與旋轉軸31b一體地向同一方向旋轉。並且利用螺紋將螺母構件37傳送至下方。因此,第1活塞桿21A與第2活塞桿21B於互壓之狀態下與支承構件39之移動一起向下方移動。最後,刀輪23b抵接於基板W。Next, the operation of lowering the mold holder of the
繼而,如圖9所示,使支承構件39向下方移動距離S2(例如2 mm),成為自刀輪23b對基板W施加所需之刻劃荷重之狀態。其結果為,刀輪23b之下端下降至距基板W之表面既定距離之位置。此時,支承構件39離開至下方距板構件77距離S2之位置,因此,刻劃荷重係僅由加壓機構15產生。Then, as shown in FIG. 9, the
如以上所述,於該刻劃裝置101中,利用第1氣缸機構25與第2氣缸機構27之差壓推力使刀保持器21往基板W側移動。因此,可使自刀機構23施加至基板W之荷重極小。其結果為,可避免使薄板之基板W破損,並且精度良好地進行刻劃動作。As described above, in the
如以上所述,於該刻劃頭1中,若定位機構17定位刀保持器21而使刀機構23抵接於基板W,則繼而定位機構17之支承構件39自刀保持器21脫離至基板W側。由此,之後僅可藉由第1氣缸機構25與第2氣缸機構27之差壓推力將刀機構23壓抵於基板W。該狀態係可利用刀機構23切斷基板W之狀態,即,於利用刀機構23切斷基板W之過程中,定位機構17與加壓機構15分開。其結果為,於基板W之切斷過程中,定位機構17之各部分之摩擦阻力不會影響到加壓機構15。As described above, in the
最後,藉由刻劃頭1沿X方向移動,刀輪23b以藉由預先設定之既定之刻劃荷重加壓熔接於基板W之狀態於基板W之表面移動。藉此,於基板W形成劃線槽。Finally, as the
2.其他實施形態 以上,已對本發明之一實施形態進行了說明,但本發明並不限定於上述實施形態,可於不脫離發明之要旨之範圍內進行各種變更。尤其可視需要將本說明書中所記載之多個實施形態及變化例任意組合。2. Other implementation forms As mentioned above, one embodiment of the present invention has been described, but the present invention is not limited to the above-mentioned embodiment, and various changes can be made without departing from the gist of the invention. In particular, the multiple embodiments and modification examples described in this specification can be arbitrarily combined as needed.
第1活塞桿與第2活塞桿之連結可為浮接,亦可為機械固結。 支承構件亦可以平面形狀支承刀機構。 刀保持器亦可為一體構件。 [產業上之可利用性]The connection between the first piston rod and the second piston rod can be a floating connection or a mechanical consolidation. The supporting member may also support the knife mechanism in a planar shape. The knife holder can also be an integral component. [Industrial availability]
本發明可廣泛地應用於刻劃脆性材料基板所使用之刻劃頭及刻劃裝置。The invention can be widely applied to scribing heads and scribing devices used for scribing brittle material substrates.
1:刻劃頭
13:框架構件
15:加壓機構
17:定位機構
21:刀保持器
21A:第1活塞桿
21B:第2活塞桿
21a:滑塊
21b:連結部
23:刀機構
23a:片保持器
23b:刀輪
25:第1氣缸機構
25a:空氣供給路
27:第2氣缸機構
27a:空氣供給路
31:伺服馬達
31a:馬達本體部
31b:旋轉軸
33:聯軸器
35:滾珠螺桿
37:螺母構件
39:支承構件
39a:定位板
39b:螺栓
51:承受構件
53:抵接構件
61:第1空氣軸承
61a:空氣供給埠
63:第2空氣軸承
63a:空氣供給埠
65:第3空氣軸承
65a:空氣供給埠
75:荷重計
77:板構件
79:螺旋彈簧
101:刻劃裝置
102:平台
103:移動台
105a:軌道
105b:軌道
106:馬達
107:滾珠螺桿
111:橋件
112a:支柱
112b:支柱
113:導件
W:脆性材料基板1: Scribe head
13: Frame member
15: Pressure mechanism
17: positioning mechanism
21:
[圖1]係刻劃裝置之概略立體圖。 [圖2]係刻劃頭之立體圖。 [圖3]係刻劃頭之剖面圖。 [圖4]係刻劃頭之內部之側視圖。 [圖5]係刻劃頭之內部之立體圖。 [圖6]係刻劃頭之內部之部分立體圖。 [圖7]係表示刻劃頭之空氣供給之流程之示意圖。 [圖8]係刻劃頭之剖面圖。 [圖9]係刻劃頭之剖面圖。[Figure 1] A schematic perspective view of the scribing device. [Figure 2] is a three-dimensional view of the scribing head. [Figure 3] is a cross-sectional view of the scoring head. [Figure 4] is a side view of the inside of the scoring head. [Figure 5] A three-dimensional view of the inside of the scoring head. [Figure 6] A partial three-dimensional view of the inside of the scoring head. [Figure 7] is a schematic diagram showing the flow of air supply to the scribing head. [Figure 8] is a cross-sectional view of the scribing head. [Figure 9] is a cross-sectional view of the scoring head.
1:刻劃頭 1: Scribe head
15:加壓機構 15: Pressure mechanism
17:定位機構 17: positioning mechanism
21:刀保持器 21: Knife holder
21A:第1活塞桿 21A: 1st piston rod
21B:第2活塞桿 21B: 2nd piston rod
21a:滑塊 21a: Slider
21b:連結部 21b: connecting part
23:刀機構 23: Knife mechanism
23a:片保持器 23a: slice holder
23b:刀輪 23b: knife wheel
25:第1氣缸機構 25: The first cylinder mechanism
25a:空氣供給路 25a: Air supply path
27:第2氣缸機構 27: 2nd cylinder mechanism
27a:空氣供給路 27a: Air supply path
31:伺服馬達 31: Servo motor
31a:馬達本體部 31a: Motor body
31b:旋轉軸 31b: Rotation axis
33:聯軸器 33: Coupling
35:滾珠螺桿 35: Ball screw
37:螺母構件 37: Nut member
39:支承構件 39: supporting member
39a:定位板 39a: positioning plate
39b:螺栓 39b: Bolt
51:承受構件 51: Bearing component
53:抵接構件 53: abutment member
61:第1空氣軸承 61: The first air bearing
63:第2空氣軸承 63: 2nd air bearing
65:第3空氣軸承 65: 3rd air bearing
75:荷重計 75: Load meter
77:板構件 77: plate member
79:螺旋彈簧 79: Coil spring
W:脆性材料基板 W: brittle material substrate
Claims (7)
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JPJP2019-081950 | 2019-04-23 | ||
JP2019081950A JP7218908B2 (en) | 2019-04-23 | 2019-04-23 | Scribing head and scribing device |
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TW202108522A true TW202108522A (en) | 2021-03-01 |
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TW109107701A TW202108522A (en) | 2019-04-23 | 2020-03-09 | Scribing head and scribing device |
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JP (1) | JP7218908B2 (en) |
KR (1) | KR20200124164A (en) |
CN (1) | CN111825326A (en) |
TW (1) | TW202108522A (en) |
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JP2515905B2 (en) * | 1990-03-14 | 1996-07-10 | オリンパス光学工業株式会社 | Mold driving device for glass lens molding machine |
JP2954566B2 (en) * | 1997-09-25 | 1999-09-27 | 株式会社ベルデックス | Scribe apparatus and method |
JP2001139337A (en) * | 1999-11-11 | 2001-05-22 | Toshiba Corp | Working device, glass scribing device and glass cutting method |
JP3737059B2 (en) * | 2002-03-14 | 2006-01-18 | 芝浦メカトロニクス株式会社 | Substrate bonding apparatus and substrate bonding method |
CN101146657B (en) * | 2005-03-23 | 2011-12-07 | Thk英特克斯股份有限公司 | Scribe device |
JP2009091178A (en) * | 2007-10-05 | 2009-04-30 | Citizen Seimitsu Co Ltd | Scribing device |
JP5121055B2 (en) * | 2008-02-21 | 2013-01-16 | AvanStrate株式会社 | Scribing equipment |
JP5616829B2 (en) * | 2011-03-23 | 2014-10-29 | Ckd株式会社 | Actuator and manufacturing method of actuator |
JP6254876B2 (en) * | 2014-03-14 | 2017-12-27 | 三星ダイヤモンド工業株式会社 | Scribe head and scribing device |
JP6722917B2 (en) * | 2016-04-26 | 2020-07-15 | 三星ダイヤモンド工業株式会社 | Scribe head unit |
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