CN215849006U - Wafer splitting device and splitting machine - Google Patents
Wafer splitting device and splitting machine Download PDFInfo
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- CN215849006U CN215849006U CN202121353990.9U CN202121353990U CN215849006U CN 215849006 U CN215849006 U CN 215849006U CN 202121353990 U CN202121353990 U CN 202121353990U CN 215849006 U CN215849006 U CN 215849006U
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Abstract
The utility model belongs to the technical field of wafer splitting, and particularly relates to a wafer splitting device and a splitting machine, wherein the wafer splitting device comprises a carrying platform, a transverse moving support, a transverse moving driving mechanism, a first riving knife mechanism and a second riving knife mechanism; the wafer splitting device comprises a carrying platform, a transverse moving support, a transverse moving driving mechanism, a first chopper mechanism, a second chopper mechanism and a transverse moving driving mechanism, wherein the carrying platform is used for placing a wafer, the transverse moving support is arranged on the carrying platform, the transverse moving driving mechanism is arranged on the transverse moving support, the first chopper mechanism and the second chopper mechanism are both connected to the transverse moving support in a sliding mode, and the transverse moving driving mechanism can drive the first chopper mechanism and the second chopper mechanism to move so as to split different positions of the wafer. The splitting operation of the wafer is carried out by using the first chopper mechanism and the second chopper mechanism, the splitting range is expanded, the first chopper mechanism and the second chopper mechanism respectively split different positions of the wafer, the size of a carrying platform does not need to be enlarged when the wafers with the sizes of 8 inches and larger are split, the size of a relevant module of the splitting machine can be reduced, and the production cost of switching products is reduced.
Description
Technical Field
The utility model belongs to the technical field of wafer cracking, and particularly relates to a wafer cracking device and a wafer cracking machine.
Background
Two common wafer dicing approaches in the LED and semiconductor industry are:
(1) the traditional knife wheel mechanical cutting method has the advantages that the wafer cutting quality is poor, the speed is low, the loss of cutting materials is large, the cutting crystal grains cannot be too small, the length and the width are generally larger than 100 mu m, and cutting liquid is needed.
(2) By using laser cutting, the cutting quality is good, the cutting speed is high, almost zero loss of cutting materials is caused, the size of cut crystal grains is smaller, the length and the width can be less than 100um, cutting liquid is not needed, and more crystal grains are produced by the same wafer.
The laser cutting process needs to be completed by matching an invisible laser scribing machine and a full-automatic splitting machine. Most of the wafers are 4-inch wafers and 6-inch wafers, and the adopted splitting machines are single-blade single-movement-axis splitting. With the development of technology and market, in order to pursue economic benefits, the production requirement of 8-inch wafers or wafers with larger sizes gradually exists, and in order to reduce cost and improve the compatibility of the splitting machine, 8-inch wafers are compatibly produced by using 8-inch iron rings for producing 6-inch wafers according to the market requirement, so that the compatibility of the original equipment for rear-section film expanding and sorting and the like can be ensured, and the equipment is kept unchanged. However, current wafer splitting machines cannot produce 8 inch wafers using 8 inch iron rings of 6 inch wafers.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is as follows: the problem that an existing wafer splitting machine cannot use 8-inch iron rings with 6-inch wafers to produce 8-inch wafers is solved.
In order to solve the above technical problem, in one aspect, an embodiment of the present invention provides a wafer splitting apparatus, including a carrier, a traverse support, a traverse driving mechanism, a first riving knife mechanism, and a second riving knife mechanism; the wafer splitting device comprises a carrying platform, a transverse moving support, a transverse moving driving mechanism and a transverse moving mechanism, wherein the carrying platform is used for placing wafers, the transverse moving support is installed on the carrying platform, the transverse moving driving mechanism is installed on the transverse moving support, the first chopper mechanism and the second chopper mechanism are both connected to the transverse moving support in a sliding mode, and the transverse moving driving mechanism can drive the first chopper mechanism and the second chopper mechanism to move so as to split different positions of the wafers.
Optionally, the first riving knife mechanism is configured to split a first splitting area on the wafer, the second riving knife mechanism is configured to split a second splitting area on the wafer, and a dividing line between the first splitting area and the second splitting area of the wafer is a splitting dividing line.
Optionally, the first riving knife mechanism and the second riving knife mechanism all include base plate, riving knife drive assembly and riving knife mounting panel, the first riving knife mechanism still includes first riving knife, the second riving knife mechanism still includes second riving knife, the base plate is connected on the sideslip drive mechanism, riving knife mounting panel sliding connection be in on the base plate, riving knife drive assembly can drive the riving knife mounting panel slides, first riving knife is installed on the riving knife mounting panel of first riving knife mechanism, the second riving knife is installed on the riving knife mounting panel of second riving knife mechanism.
Optionally, the first and second riving knives are different lengths.
Optionally, the carrier includes a base, a carrier, a rotating carrier, a moving carrier, and a moving driving assembly, the rotating carrier is rotatably connected to the moving carrier, the carrier is mounted on the rotating carrier and can rotate along with the rotating carrier, the moving carrier is slidably connected to the base, the moving driving assembly can drive the moving carrier to move, and the traversing support is mounted on the base.
Optionally, the carrier includes an iron ring and a blue adhesive film, the blue adhesive film covers a central hole of the iron ring, and the blue adhesive film is used for fixing the wafer.
Optionally, the rotating carrier includes a turntable, a crossed roller bearing, a gearwheel, a pinion, and a driving motor, the carrier is mounted on the turntable, the crossed roller bearing is disposed between the turntable and the moving carrier, the gearwheel is disposed on the periphery of the crossed roller bearing, the driving motor is mounted on the moving carrier, the pinion is connected to an output end of the driving motor, and the gearwheel is engaged with the pinion.
Optionally, the carrier further includes a plurality of clamping jaws and a plurality of clamping jaw cylinders installed on the movable carrier, a plurality of clamping grooves are formed in the turntable, the clamping jaws are connected to the clamping grooves in a one-to-one correspondence manner, and the clamping jaw cylinders can drive the clamping jaws to move in the clamping grooves so as to unlock the carrier from the clamping jaws.
Optionally, the traverse driving mechanism includes a traverse motor, a traverse screw and a first arbor mounting plate, the first riving knife mechanism and the second riving knife mechanism are both mounted on the first arbor mounting plate, the traverse motor is connected to the traverse screw, and the first arbor mounting plate is connected to the traverse screw.
In another aspect, an embodiment of the utility model provides a wafer breaking machine, which includes the wafer breaking apparatus as described above.
According to the wafer splitting device provided by the embodiment of the utility model, the splitting operation of the wafer is carried out by using the first chopper mechanism and the second chopper mechanism, the splitting range is expanded, the first chopper mechanism and the second chopper mechanism respectively split different positions of the wafer, the size of a carrying platform is not required to be enlarged when the wafer with the size of 8 inches and larger size is split, an effective splitting area larger than that of a single-blade splitting machine can be provided under the size of an iron ring with the same specification, the wafer with the size of 8 inches is produced on matched equipment for producing the wafer with the size of 6 inches, equipment for splitting a later stage process is hardly required to be changed, and the production switching cost is greatly saved.
Drawings
Fig. 1 is a schematic view of a wafer breaking apparatus according to an embodiment of the present invention;
FIG. 2 is an assembly view of a first riving knife mechanism and a second riving knife mechanism provided in accordance with one embodiment of the present invention;
FIG. 3 is a schematic view of a traverse drive mechanism according to an embodiment of the present invention;
FIG. 4 is a schematic structural view of a first riving knife mechanism or a second riving knife mechanism provided in accordance with one embodiment of the present invention;
fig. 5 is a schematic structural diagram of a carrier according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a rotary stage according to an embodiment of the present invention;
FIG. 7 is a schematic view of a clamping jaw and clamping jaw cylinder according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a carrier according to an embodiment of the present invention;
FIG. 9 is a schematic structural diagram of a motion driving assembly according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a mobile carrier according to an embodiment of the present invention.
The reference numerals in the specification are as follows:
1. a stage; 11. a base; 111. a motor avoidance slot; 12. a carrier; 121. an iron ring; 122. a viscous blue film; 13. rotating the carrying platform; 131. a turntable; 1311. a card slot; 132. a crossed roller bearing; 133. a bull gear; 134. a pinion gear; 135. a drive motor; 14. moving the carrier; 15. a movement drive assembly; 151. a second motor; 152. a second coupling; 153. a second lead screw supporting seat; 154. a second lead screw; 155. a platform connection; 16. a second guide rail; 17. a clamping jaw; 171. a bending section; 18. a clamping jaw cylinder; 181. a horizontal push ring block;
2. transversely moving the support;
3. a traverse driving mechanism; 31. a traversing motor; 32. transversely moving the lead screw; 33. transversely moving the lead screw supporting seat; 34. traversing the shaft coupler; 35. a first cutter shaft mounting plate; 36. a third guide rail; 37. a fourth guide rail; 38. a second cutter shaft mounting plate;
4. a first riving knife mechanism; 41. a substrate; 42. a riving knife drive assembly; 421. a first motor; 422. a first coupling; 423. a first lead screw supporting seat; 424. a first lead screw; 43. a riving knife mounting plate; 44. a first riving knife; 45. a first guide rail;
5. a second riving knife mechanism; 51. a second riving knife;
6. a wafer; 61. a first splitting area; 62. a second splitting region; 63. and splitting the boundary.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
As shown in fig. 1 to 10, in one aspect, an embodiment of the present invention provides a wafer splitting apparatus, which includes a carrier 1, a traverse support 2, a traverse driving mechanism 3, a first riving knife mechanism 4, and a second riving knife mechanism 5. The wafer splitting device comprises a carrier 1, a transverse moving support 2, a transverse moving driving mechanism 3, a first chopper mechanism 4, a second chopper mechanism 5 and a transverse moving driving mechanism 3, wherein the carrier 1 is used for placing a wafer 6, the transverse moving support 2 is arranged on the carrier 1, the transverse moving driving mechanism 3 is arranged on the transverse moving support 2, the first chopper mechanism 4 and the second chopper mechanism 5 are both connected to the transverse moving support 2 in a sliding mode, and the transverse moving driving mechanism 3 can drive the first chopper mechanism 4 and the second chopper mechanism 5 to move on the transverse moving support 2 so as to split different positions of the wafer 6.
By using the first chopper mechanism 4 and the second chopper mechanism 5 to perform the splitting operation of the wafer 6, the splitting range is expanded, the first chopper mechanism 4 and the second chopper mechanism 5 respectively split different positions of the wafer 6, the size of the carrying platform 1 is not required to be enlarged when the wafers with 8 inches and larger sizes are split, the effective splitting area larger than that of a single-blade splitting machine can be possessed under the size of an iron ring with the same specification, 8 inches of wafers are produced on the matched equipment for producing 6 inches of wafers, equipment for splitting the back-stage process is not required to be changed, and the production switching cost is greatly saved.
As shown in fig. 8, in an embodiment, the wafer 6 is divided into a first splitting area 61 and a second splitting area 62, the first chopper mechanism 4 is configured to split the first splitting area 61 on the wafer, the second chopper mechanism 5 is configured to split the second splitting area 62 on the wafer, and a splitting dividing line 63 is formed by dividing lines of the first splitting area 61 and the second splitting area 62.
The wafer 6 is provided with a virtual splitting dividing line 63, the wafer is provided with a cutting channel to divide the wafer into a plurality of chip areas, the wafer is cut along the cutting channel to form a plurality of chips, the wafer is positioned on the carrier 1, the traverse driving mechanism 3 drives the first riving mechanism 4 and the second riving mechanism 5 to move, the cutting channel of the wafer 6 is moved to a position right below the first riving mechanism 4, the first riving mechanism 4 is split in the first splitting area 61, after the first splitting area 61 is split, the traverse driving mechanism 3 continues to drive the first riving mechanism 4 and the second riving mechanism 5 to move, so that the wafer is positioned right below the second riving mechanism 5, and the second riving mechanism 5 splits the second splitting area 62.
Preferably, the first splitting area 61 is located in a middle area of the wafer 6, the second splitting area 62 is located in an edge area of the wafer 6, and in the radial direction, the length of the first splitting area 61 is greater than that of the second splitting area 62.
As shown in fig. 4, in an embodiment, each of the first riving knife mechanism 4 and the second riving knife mechanism 5 includes a base plate 41, a riving knife driving component 42 and a riving knife mounting plate 43, the first riving knife mechanism 4 further includes a first riving knife 44, the second riving knife mechanism 5 further includes a second riving knife 51, the base plate 41 is connected to the traverse driving mechanism 3, the first riving knife mechanism 4 or the second riving knife mechanism 5 is mounted on the traverse driving mechanism 3 through the base plate 41, the riving knife mounting plate 43 is slidably connected to the base plate 41, the riving knife driving component 42 can drive the riving knife mounting plate 43 to slide up and down along the base plate 41, the first riving knife 44 is mounted on the riving knife mounting plate 43 of the first riving knife mechanism 4, the second riving knife 51 is mounted on the riving knife mounting plate 43 of the second riving knife mechanism 5, when the riving knife driving component 42 drives the riving knife mounting plate 43 to move, the first riving knife 44 or the second riving knife 51 moves up and down along with the riving knife mounting plate 43, so that the splitting action of the first riving knife 44 and the second riving knife 51 on the wafer 6 is realized.
In one embodiment, the first riving knife 44 and the second riving knife 51 are different lengths. If an existing splitting device for producing 6-inch wafers is used to produce 8-inch wafers, when the chopper is split at the edge position of the wafer, the chopper collides with the carrier below the wafer and interferes with the carrier, so that the edge position of the wafer cannot be split.
As shown in fig. 4, in one embodiment, the riving knife drive assembly 42 includes a first motor 421, a first coupling 422, a first lead screw support block 423 and a first lead screw 424, the first motor 421 and the first lead screw supporting seat 423 are both installed on the base plate 41, the number of the first lead screw supporting seats 423 is two, one end of the first lead screw 424 is installed in one first lead screw supporting seat 423, the other end of the first lead screw 424 passes through the other first lead screw supporting seat 423 to be connected with the output shaft of the first motor 421, the first coupling 422 is connected between the first lead screw 424 and the output shaft of the first motor 421, the riving knife mounting plate 43 is connected to the first lead screw 424, and the first motor 421 drives the first lead screw 424 to rotate through the first coupling 422, so as to drive the riving knife mounting plate 43 to move up and down.
A first guide rail 45 can be further connected between the riving knife mounting plate 43 and the base plate 41, a sliding block on the first guide rail 45 is mounted on the riving knife mounting plate 43, through the sliding fit between the sliding block and the first guide rail 45, the riving knife mounting plate 43 can slide on the base plate 41 along the first guide rail 45, the riving knife mounting plate 43 in the first riving knife mechanism 4 slides to drive the first riving knife 44 to move, and the riving knife mounting plate 43 in the second riving knife mechanism 5 slides to drive the second riving knife 51 to move.
In an embodiment, a buffer assembly may be further installed between the first riving knife 44 and the riving knife installation plate 43, and when the first riving knife 44 contacts the wafer 6 and performs the splitting action, a vibration gap is provided for the first riving knife 44 through the buffer assembly, so as to reduce the damage to the first riving knife 44. The second riving knife 51 and the riving knife mounting plate 43 are also provided with the buffer component, when the second riving knife 51 contacts the wafer 6 and carries out the splitting action, the buffer component provides a vibration gap for the second riving knife 51, and the damage of the second riving knife 51 is reduced.
As shown in fig. 5, in an embodiment, the stage 1 includes a base 11, a carrier 12, a rotation stage 13, a movement stage 14, and a movement driving assembly 15, the rotation stage 13 is rotatably connected to the movement stage 14, the carrier 12 is mounted on the rotation stage 13 and can rotate along with the rotation stage 13, the rotation stage 13 drives the carrier 12 to rotate the wafer 6, the movement stage 14 is slidably connected to the base 11, the movement driving assembly 15 can drive the movement stage 14 to move, and the lateral support 2 is mounted on the base 11.
The wafer 6 needs to be split into a plurality of independent crystal grains, the wafer 6 is placed on the carrier 12, the rotating carrying platform 13 rotates under the control of the visual detection system and the upper computer, the cutting streets of the wafer 6 are aligned to be parallel to the cleaver, then the moving driving component 15 drives the moving carrying platform 14 and the rotating carrying platform 13 fixed on the moving carrying platform 14 to move, the cutting streets of the wafer 6 are moved to be right below the cleaver, and at the moment, the wafer 6 moves to the splitting position.
The transverse moving driving mechanism 3 drives the first riving knife mechanism 4 and the second riving knife mechanism 5 to move left and right, the first riving knife mechanism 4 is moved right above the wafer 6, the riving knife driving component 42 drives the first riving knife 44 to move up and down, the length of a cutting channel of the wafer 6 is larger than that of a virtual first splitting area 61 of a splitting dividing line 63 for splitting processing, then the transverse moving driving mechanism 3 drives the first riving knife mechanism 4 and the second riving knife mechanism 5 to move left and right, the second riving knife mechanism 5 is moved right above the wafer 6, the second riving knife 51 moves up and down, the length of the cutting channel of the two ends of the wafer 6 is smaller than that of the virtual dividing line 63, and the second splitting area 62 of the dividing line 63 for splitting processing.
After the first surface is cleaved, the second surface is cleaved by rotating 90 degrees, the carrier 12 is driven by the rotating carrying platform 13 to rotate 90 degrees, and the cleaving action of the first cleaver mechanism 4 and the second cleaver mechanism 5 is repeatedly carried out on the second surface which is vertically intersected with the wafer 6, so that the crystal grains of the whole wafer 6 are cleaved and separated.
As shown in fig. 9, in an embodiment, the moving driving assembly 15 includes a second motor 151, a second coupling 152, a second lead screw supporting seat 153, a second lead screw 154 and a platform connecting member 155, the second motor 151 is fixed on the base 11, two second lead screw supporting seats 153 are installed on the base 11, one end of the second lead screw 154 is installed on one of the second lead screw supporting seats 153, the other end of the second lead screw 154 passes through the other second lead screw supporting seat 153 and is connected to an output shaft of the second motor 151, and the second coupling 152 is connected between the second lead screw 154 and the output shaft of the second motor 151. The platform connecting part 155 is connected to the second lead screw 154, the platform connecting part 155 is installed at the bottom of the mobile carrier 14, and the second motor 151 drives the second lead screw 154 to rotate, so as to drive the platform connecting part 155 to move back and forth along the second lead screw 154, thereby driving the mobile carrier 14 to move.
A second guide rail 16 is connected between the moving stage 14 and the base 11, a slider on the second guide rail 16 is mounted on the moving stage 14, and when the second motor 151 drives the moving stage 14 to move, the slider mounted on the moving stage 14 slides along the second guide rail 16.
As shown in fig. 8, in an embodiment, the carrier 12 includes an iron ring 121 and a blue adhesive film 122, the iron ring 121 is a ring-shaped structure, the iron ring 121 is mainly a carrier of the wafer 6, the blue adhesive film 122 is tightly adhered to the iron ring 121, the blue adhesive film 122 covers a hole in the center of the iron ring 121, the blue adhesive film 122 is used for fixing the wafer 6, the blue adhesive film 122 has an adhesive property, and the wafer 6 adheres to the blue adhesive film 122 to prevent the wafer 6 from moving during the cleaving process.
When an 8-inch iron ring 121 is used for splitting an 8-inch wafer, when the first splitting area 61 in the middle area is split, the first chopper 44(210mm) of the first chopper mechanism 4 with a larger length must be used, because the inside of the iron ring 121 is circular, when the second splitting area 62 at the edge of the wafer 6 is split, the long chopper (210mm) is longer than the chord length which is gradually shortened on the iron ring 121, so that the first chopper 44 interferes with the iron ring 121, and a product cannot be split, at this time, the second chopper 51(158mm) of the second chopper mechanism 5 with a smaller length must be switched to continue splitting, and the boundary between the two splittable areas, namely the first splitting area 61 and the second splitting area 62, of the long chopper has to split is the splitting boundary 63. The splitting dividing line 63 is not fixed and is determined according to the lengths of the first and second cleavers 44 and 51 and the size of the iron ring 121.
By the aid of the split of the first chopper mechanism 4 and the second chopper mechanism 5 in the different areas, the splitting range of the iron ring 121 of the splitting machine is expanded, the technical problem that the splitting machine cannot produce 8-inch wafers by using 8-inch iron rings is solved, compared with the situation that a space larger than 8-inch iron rings is needed when 6-inch wafers are switched to 8-inch wafers for operation in the prior art, the double-knife switched wafer splitting device can reduce the size of related modules of a full-automatic splitting machine, avoid the problem that more viscous blue film 122 consumables are needed when larger iron rings 121 are used, reduce the investment of matched equipment in post-process, avoid interference of a splitting knife and the iron ring 121 during splitting, can realize 8-inch wafers produced by 8-inch iron rings, perfectly avoid the problem that larger iron rings 121 are needed when 8-inch wafers are processed, and reduce the production cost of switched products, creating great economic value. The scheme can be used for splitting wafers of 10 inches and 12 inches under the expansion of a limited iron ring space.
As shown in fig. 6 to 7, in one embodiment, the rotating stage 13 includes a rotating plate 131, a cross roller bearing 132, a gearwheel 133, a pinion 134, and a driving motor 135, the carrier 12 is mounted on the rotating plate 131, the cross roller bearing 132 is disposed between the rotating plate 131 and the moving stage 14, the gearwheel 133 is disposed on the periphery of the cross roller bearing 132, the driving motor 135 is mounted on the moving stage 14, the pinion 134 is connected to an output end of the driving motor 135, and the gearwheel 133 is engaged with the pinion 134.
The cross roller bearing 132 is a bearing in which an inner ring is divided and an outer ring rotates, the inner ring of the cross roller bearing 132 is connected to the movable stage 14, the outer ring of the cross roller bearing 132 is connected to the turntable 131, as shown in fig. 10, the large gear 133 is provided on the outer periphery of the outer ring of the cross roller bearing 132, the driving motor 135 rotates to rotate the small gear 134, and the large gear 133 is rotated by the meshing action between the small gear 134 and the large gear 133, so that the outer ring of the cross roller bearing 132 rotates, and the rotating operation of the rotary stage 13 is realized.
As shown in fig. 9, in an embodiment, the base 11 is provided with a motor avoiding groove 111, the driving motor 135 is mounted on a surface of the moving stage 14 facing the base 11, and the driving motor 135 moves in the motor avoiding groove 111 when the moving stage 14 moves on the base 11.
In an embodiment, the carrier 1 further includes a plurality of clamping jaws 17 and a plurality of clamping jaw air cylinders 18 installed on the movable carrier 14, the turntable 131 is provided with a plurality of clamping slots 1311, the clamping jaws 17 are connected to the clamping slots 1311 in a one-to-one correspondence manner, and the clamping jaw air cylinders 18 can drive the clamping jaws 17 to move in the clamping slots 1311 to unlock the carrier 12 from the clamping jaws 17. Preferably, a small slide rail may be connected between the jaw 17 and the slot 1311 in order to reduce friction when the jaw 17 moves in the slot 1311.
As shown in fig. 7, a flat push ring block 181 is disposed at an extending end of the clamping jaw cylinder 18, a bent portion 171 is disposed at an end of the clamping jaw 17 close to the clamping jaw cylinder 18, the bent portion 171 is located between the clamping jaw cylinder 18 and the flat push ring block 181, and when the rotary table 131 drives the plurality of clamping jaws 17 to rotate together, the bent portion 171 passes through the clamping jaw cylinder 18 and the flat push ring block 181.
When the carrier 12 is taken and placed, the extending end of the clamping jaw cylinder 18 retracts to drive the flat push ring block 181 to move, then the clamping jaw 17 is driven to slide in the clamping groove 1311 and move towards the direction far away from the turntable 131, the locking of the clamping jaw 17 on the iron ring 121 is released, after the carrier 12 is placed, the extending end of the clamping jaw cylinder 18 extends to release the clamping jaw 17, preferably, a spring is connected between the clamping jaw 17 and the turntable 131, and after the clamping jaw cylinder 18 releases the clamping jaw 17, the clamping jaw 17 can be tensioned under the action force of the spring, so that the clamping jaw 17 abuts against the edge of the iron ring 121, and the iron ring 121 is clamped and fixed.
As shown in fig. 2 to 3, in an embodiment, the traverse driving mechanism 3 includes a traverse motor 31, a traverse screw 32, and a first arbor mounting plate 35, the first riving knife mechanism 4 and the second riving knife mechanism 5 are both mounted on the first arbor mounting plate 35, the traverse motor 31 is connected to the traverse screw 32, and the first arbor mounting plate 35 is connected to the traverse screw 32.
The transverse moving driving mechanism 3 further comprises transverse moving lead screw supporting seats 33 and transverse moving couplers 34, two transverse moving lead screw supporting seats 33 are mounted on the transverse moving support 2, one end of each transverse moving lead screw 32 is mounted on one transverse moving lead screw supporting seat 33, the other end of each transverse moving lead screw 32 penetrates through the other transverse moving lead screw supporting seat 33 and is connected with an output shaft of the transverse moving motor 31, the transverse moving lead screws 32 are connected with the transverse moving motors 31 through the transverse moving couplers 34, the first spindle mounting plates 35 are connected onto the second lead screws 154, the transverse moving motors 31 drive the transverse moving lead screws 32 to rotate, and then the first spindle mounting plates 35 are driven to move back and forth along the transverse moving lead screws 32, so that the first riving knife mechanisms 4 and the second riving knife mechanisms 5 are driven to move back and forth.
A third guide rail 36 is arranged between the first cutter shaft mounting plate 35 and the traverse support 2, a slider on the third guide rail 36 is mounted on the first cutter shaft mounting plate 35, and when the traverse motor 31 drives the first cutter shaft mounting plate 35 to move, the slider slides on the third guide rail 36.
In an embodiment, a fourth guide rail 37 and a second knife shaft mounting plate 38 slidably connected to the fourth guide rail 37 are disposed above the traverse support 2, and the second knife shaft mounting plate 38 connects the first riving knife mechanism 4 and the second riving knife mechanism 5, so that the weight of the first riving knife mechanism 4 and the second riving knife mechanism 5 on the first knife shaft mounting plate 35 can be dispersed. The first arbor mounting plate 35 can slide the second arbor mounting plate 38 along the fourth guide rail 37.
In another aspect, an embodiment of the utility model provides a wafer breaking machine, which includes the wafer breaking apparatus as described above.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A wafer splitting device is characterized by comprising a carrying platform, a transverse moving support, a transverse moving driving mechanism, a first riving knife mechanism and a second riving knife mechanism; the wafer splitting device comprises a carrying platform, a transverse moving support, a transverse moving driving mechanism, a first chopper mechanism, a second chopper mechanism and a transverse moving driving mechanism, wherein the carrying platform is used for placing wafers, the transverse moving support is arranged on the carrying platform, the transverse moving driving mechanism is arranged on the transverse moving support, the first chopper mechanism and the second chopper mechanism are connected to the transverse moving support in a sliding mode, and the transverse moving driving mechanism can drive the first chopper mechanism and the second chopper mechanism to move so as to split different positions of the wafers.
2. The wafer cleaving device of claim 1, wherein the first cleaving mechanism is configured to cleave a first cleaving region of the wafer, the second cleaving mechanism is configured to cleave a second cleaving region of the wafer, and a dividing line between the first cleaving region and the second cleaving region of the wafer is a cleaving dividing line.
3. The wafer splitting apparatus of claim 1, wherein the first riving knife mechanism and the second riving knife mechanism each comprise a base plate, a riving knife driving assembly and a riving knife mounting plate, the first riving knife mechanism further comprises a first riving knife, the second riving knife mechanism further comprises a second riving knife, the base plate is connected to the traverse driving mechanism, the riving knife mounting plate is slidably connected to the base plate, the riving knife driving assembly can drive the riving knife mounting plate to slide, the first riving knife is mounted on the riving knife mounting plate of the first riving knife mechanism, and the second riving knife is mounted on the riving knife mounting plate of the second riving knife mechanism.
4. The wafer cleaving apparatus of claim 3, wherein the first riving knife and the second riving knife are different lengths.
5. The wafer breaking apparatus of claim 1, wherein the stage comprises a base, a carrier, a rotary stage, a movable stage, and a movement driving assembly, the rotary stage is rotatably connected to the movable stage, the carrier is mounted on the rotary stage and can rotate along with the rotary stage, the movable stage is slidably connected to the base, the movement driving assembly can drive the movable stage to move, and the traverse support is mounted on the base.
6. The wafer breaking apparatus of claim 5, wherein the carrier comprises a ferrous ring and a blue adhesive film covering a center hole of the ferrous ring, the blue adhesive film being used for fixing a wafer.
7. The wafer splitting apparatus of claim 5, wherein the rotary stage comprises a turntable, a cross roller bearing, a gearwheel, a pinion, and a driving motor, the carrier is mounted on the turntable, the cross roller bearing is disposed between the turntable and the movable stage, the gearwheel is disposed on the periphery of the cross roller bearing, the driving motor is mounted on the movable stage, the pinion is connected to an output end of the driving motor, and the gearwheel is engaged with the pinion.
8. The wafer splitting apparatus of claim 7, wherein the carrier further comprises a plurality of clamping jaws and a plurality of clamping jaw air cylinders mounted on the movable carrier, a plurality of clamping slots are formed in the turntable, the clamping jaws are connected to the clamping slots in a one-to-one correspondence, and the clamping jaw air cylinders can drive the clamping jaws to move in the clamping slots to unlock the carrier from the clamping jaws.
9. The wafer cleaving apparatus of claim 1, wherein the traverse drive mechanism includes a traverse motor, a traverse screw, and a first arbor mounting plate, the first riving knife mechanism and the second riving knife mechanism are both mounted on the first arbor mounting plate, the traverse motor is coupled to the traverse screw, and the first arbor mounting plate is coupled to the traverse screw.
10. A splitting machine, characterized in that, comprises the wafer splitting device of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121353990.9U CN215849006U (en) | 2021-06-17 | 2021-06-17 | Wafer splitting device and splitting machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121353990.9U CN215849006U (en) | 2021-06-17 | 2021-06-17 | Wafer splitting device and splitting machine |
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| CN215849006U true CN215849006U (en) | 2022-02-18 |
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| CN202121353990.9U Active CN215849006U (en) | 2021-06-17 | 2021-06-17 | Wafer splitting device and splitting machine |
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| CN (1) | CN215849006U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114619580A (en) * | 2022-05-11 | 2022-06-14 | 河北圣昊光电科技有限公司 | Gram weight adjusting structure, cutter adjusting component and splitting machine with cutter adjusting component |
| CN114803452A (en) * | 2022-04-29 | 2022-07-29 | 河北圣昊光电科技有限公司 | Synchronous transmission assembly and splitting machine with same |
| CN114953226A (en) * | 2022-05-25 | 2022-08-30 | 河北圣昊光电科技有限公司 | Scribing machine |
-
2021
- 2021-06-17 CN CN202121353990.9U patent/CN215849006U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114803452A (en) * | 2022-04-29 | 2022-07-29 | 河北圣昊光电科技有限公司 | Synchronous transmission assembly and splitting machine with same |
| CN114803452B (en) * | 2022-04-29 | 2024-04-09 | 河北圣昊光电科技有限公司 | Synchronous transmission assembly and splitting machine with same |
| CN114619580A (en) * | 2022-05-11 | 2022-06-14 | 河北圣昊光电科技有限公司 | Gram weight adjusting structure, cutter adjusting component and splitting machine with cutter adjusting component |
| CN114953226A (en) * | 2022-05-25 | 2022-08-30 | 河北圣昊光电科技有限公司 | Scribing machine |
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Effective date of registration: 20220729 Address after: 518000 101, building 6, Wanyan Industrial Zone, Qiaotou community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's Semiconductor Equipment Technology Co.,Ltd. Address before: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |