CN210705411U - Wafer splitting device - Google Patents
Wafer splitting device Download PDFInfo
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- CN210705411U CN210705411U CN201921045594.2U CN201921045594U CN210705411U CN 210705411 U CN210705411 U CN 210705411U CN 201921045594 U CN201921045594 U CN 201921045594U CN 210705411 U CN210705411 U CN 210705411U
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Abstract
The utility model relates to a wafer lobe of a leaf device, the lower part tool bit is erect and is installed on lower part tool bit mount pad, lower part tool bit mount pad is installed on the workstation, the upper portion mount pad is located lower part tool bit mount pad top, upper portion mount pad bottom surface is through first X axle linear motion unit connection upper portion tool bit movable plate, drive upper portion tool bit movable plate moves about along the X axial, upper portion tool bit movable plate underrun second X axle linear motion unit connection upper portion right side tool bit mounting panel, the bottom surface installation upper portion right side tool bit of upper portion right side tool bit mounting panel, drive upper portion right side tool bit moves about along the X axial, upper portion tool bit movable plate bottom surface left end portion is the protruding boss of establishing downwards, install upper portion left side tool bit on the boss, upper portion left side tool bit is in same level and relative with upper portion right tool bit, the steel ring of loading. By utilizing the principle that the lower tool bit supports and the two upper tool bits press down, the wafer is completely cracked along the crack, the edge breakage is small, and the yield is high.
Description
Technical Field
The utility model relates to a wafer lobe of a leaf device belongs to wafer processing automation equipment technical field.
Background
At present, a silicon wafer and a silicon carbide wafer are not completely cut after laser cutting, longitudinal and transverse cracks are generated on the surface or inside of the wafer, the wafer needs to be cracked by a matched cracking device, the existing cracking device cannot crack a product with a bulge on the surface or the back, and the wafer with metal plated on the back has the defects of no cracking, edge breakage, poor metal layer fracture and the like by adopting the existing cracking device, so that the product yield is low.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the not enough of prior art existence, provide a wafer lobe of a leaf device.
The purpose of the utility model is realized through the following technical scheme:
the wafer splitting device is characterized in that: comprises an upper mounting seat, a lower tool bit, an upper left tool bit and an upper right tool bit, wherein the lower tool bit is vertically mounted on the lower tool bit mounting seat, the lower tool bit mounting seat is mounted on a workbench, the upper mounting seat is positioned above the lower tool bit mounting seat, the bottom surface of the upper mounting seat is connected with an upper tool bit moving plate through a first X-axis linear motion unit and can drive the upper tool bit moving plate to move left and right along the X-axis direction, the bottom surface of the upper tool bit moving plate is connected with an upper right tool bit mounting plate through a second X-axis linear motion unit, the bottom surface of the upper right tool bit mounting plate is provided with the upper right tool bit and can drive the upper right tool bit to move left and right along the X-axis direction, the left end part of the bottom surface of the upper tool bit moving, the steel ring for loading the product to be cracked is positioned between the lower cutter head and the upper left cutter head and the upper right cutter head.
Further, in the wafer splitting apparatus, a height adjuster is mounted on the lower tool bit mounting seat on one side of the lower tool bit, an adjusting rod of the height adjuster is connected with the lower tool bit, the lower tool bit can be adjusted to move up and down on the lower tool bit mounting seat, a waist-shaped hole is formed in a connecting part of the lower tool bit and the lower tool bit mounting seat, and the lower tool bit is locked on the lower tool bit mounting seat through a fastening bolt.
Further, in the wafer breaking apparatus, the height adjuster is a differential head adjuster.
Further, in the wafer splitting device, an adjuster is mounted on the workbench on one side of the lower tool bit mounting seat, an adjusting rod of the adjuster is connected with the lower tool bit mounting seat, the lower tool bit mounting seat can be adjusted to move left and right on the workbench along the X-axis direction, a waist-shaped hole is formed in a connecting part of the lower tool bit mounting seat and the workbench, and the lower tool bit mounting seat is locked on the workbench through a fastening bolt.
Further, in the wafer splitting device, the steel ring is mounted on the X-theta axis movement module and can be driven to move left and right along the X axis and rotate around the theta axis.
Further, in the wafer splitting device, the X- θ axis movement module includes an X axis movement unit and a θ axis movement unit, the X axis movement unit includes an X axis underframe, an X axis linear guide rail, an X axis connection plate and an X axis movement mechanism for controlling the movement of the X axis connection plate, the X axis linear guide rail and the X axis movement mechanism are mounted on the X axis underframe, the X axis connection plate is disposed on the X axis linear guide rail, and the X axis movement mechanism is in driving connection with the X axis connection plate, so as to control the X axis connection plate to move along the X axis direction; the theta axis movement unit (17) comprises a rotating mechanism and a carrier, the carrier is arranged on the rotating mechanism, and the rotating mechanism is arranged on the X axis connecting plate.
Further, in the wafer splitting apparatus, the upper mounting base is mounted on the Z-axis lifting mechanism, and the upper mounting base can be driven to move up and down along the Z-axis.
Further, in the wafer splitting apparatus, the Z-axis lifting mechanism is a screw rod driven linear motion unit or a rack and pinion driven linear motion unit.
Further, in the wafer splitting apparatus, the first X-axis linear motion unit is a piezoelectric ceramic driver capable of linear motion, a lead screw driven linear motion unit, a rack and pinion driven linear motion unit, or a rodless cylinder driven linear motion unit.
Further, in the wafer splitting apparatus, the second X-axis linear motion unit is a piezoelectric ceramic driver capable of linear motion, a lead screw driving linear motion unit, a rack and pinion driving linear motion unit, or a rodless cylinder driving linear motion unit.
Compared with the prior art, the utility model have apparent advantage and beneficial effect, the concrete aspect that embodies is in following:
① the utility model provides an automatic splinter device for the splinter requirement of silicon wafer and silicon carbide wafer after laser cutting, with unique design and novel structure, and the principle that the lower tool bit supports and the upper left and right tool bits press down is utilized to lead the silicon wafer, silicon carbide wafer and back-plated metal wafer to crack completely along the crack, with small edge breakage and high yield;
② the product to be cracked is driven by the X-theta axis motion module to align and coincide with the edge of the lower cutter head, the edge of the lower cutter head props against the position of the crack, the upper right cutter head is separated from the upper left cutter head by the second X-axis linear motion unit, the first X-axis linear motion unit enables the center line between the separated upper right cutter head and the upper left cutter head to be parallel and opposite to the edge of the lower cutter head, the Z-axis lifting mechanism enables the upper right cutter head and the upper left cutter head to simultaneously descend and press on the upper surface of the product to be cracked, the product to be cracked is cracked along the crack, the product to be cracked is driven by the X-theta axis motion module to move to the next crack along the X-axis, the cracking action is repeated until the crack is completely cracked, the product to be cracked is driven by the X-theta axis motion module to rotate 90 degrees along the theta axis, and the cracking action is repeated until the crack is completely cracked;
③ the problem that the existing splinter device can not crack the protruding product and the wafer with back plated metal is bad, the phenomenon of cracking can be avoided, the defects of edge breakage and bad metal layer fracture are improved, the yield of the product is improved, and the device is simple and easy to use and is a practical new design.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1: the structure principle of the device of the utility model is shown schematically;
FIG. 2: the utility model discloses the axle of the device surveys the intention;
FIG. 3: the installation schematic diagram of the lower tool bit and the lower tool bit installation seat;
FIG. 4: the installation schematic diagram of the steel ring and the X-theta axis motion module;
FIG. 5: the installation schematic diagram of the upper installation base and the Z-axis lifting mechanism;
FIG. 6: a front axle measuring and indicating view of the upper mounting seat;
FIG. 7: FIG. 6 is a schematic front view;
FIG. 8: FIG. 6 is a schematic side view;
FIG. 9: the bottom axis of the upper mount indicates the intention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiment of the present invention, all other embodiments obtained by the person skilled in the art without creative work belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present invention, the directional terms and the sequence terms and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
As shown in fig. 1 and 2, the wafer breaking device comprises an upper mounting base 4, a lower tool bit mounting base 7, a lower tool bit 1, an upper left tool bit 2 and an upper right tool bit 11, wherein the lower tool bit 1 is vertically mounted on the lower tool bit mounting base 7, the lower tool bit mounting base 7 is mounted on a workbench 13, and the upper mounting base 4 is positioned above the lower tool bit mounting base 7; as shown in fig. 6 to 9, the bottom surface of the upper mounting seat 4 is connected to the upper tool bit moving plate 5 through a first X-axis linear motion unit 10, and can drive the upper tool bit moving plate 5 to move left and right along the X-axis direction, the bottom surface of the upper tool bit moving plate 5 is connected to the upper right tool bit mounting plate 6 through a second X-axis linear motion unit 12, the bottom surface of the upper right tool bit mounting plate 6 is provided with an upper right tool bit 11, and can drive the upper right tool bit mounting plate 6 and the upper right tool bit 11 located thereon to move left and right along the X-axis direction, the left end of the bottom surface of the upper tool bit moving plate 5 is provided with a boss protruding downwards, the boss is provided with an upper left tool bit 2; the steel ring 3 for loading the product to be split is located between the lower cutter head 1 and the upper left cutter head 2 and the upper right cutter head 11.
As shown in fig. 3, a height adjuster 9 is installed on the lower tool bit mounting seat 7 on one side of the lower tool bit 1, the height adjuster 9 is a differential head adjuster, an adjusting rod of the height adjuster 9 is connected with the lower tool bit 1, the lower tool bit 1 can be adjusted to move up and down on the lower tool bit mounting seat 7, a waist-shaped hole is formed in a connecting part of the lower tool bit 1 and the lower tool bit mounting seat 7, and the lower tool bit 1 is locked on the lower tool bit mounting seat 7 through a fastening bolt. The up-down position of the cutting edge of the lower cutter head 1 can be adjusted by the height adjuster 9.
As shown in fig. 3, an adjuster 8 is installed on a workbench 13 on one side of a lower tool bit mounting seat 7, the adjuster 8 is a differential head adjuster, an adjusting rod of the adjuster 8 is connected with the lower tool bit mounting seat 7, the lower tool bit mounting seat 7 can be adjusted to move left and right on the workbench 13 along the X-axis direction, a waist-shaped hole is formed in a connecting part of the lower tool bit mounting seat 7 and the workbench 13, and the lower tool bit mounting seat 7 is locked on the workbench 13 through a fastening bolt. The up-down position of the cutting edge of the lower cutter head 1 can be adjusted by the height adjuster 9.
As shown in fig. 4, the steel ring 3 is mounted on the X-theta axis movement module, and can drive the steel ring 3 to move left and right along the X axis and rotate around the theta axis. The X-theta axis movement module comprises an X axis movement unit 16 and a theta axis movement unit 17, the X axis movement unit 16 comprises an X axis underframe, an X axis linear guide rail, an X axis connecting plate and an X axis movement mechanism for controlling the movement of the X axis connecting plate, the X axis linear guide rail and the X axis movement mechanism are arranged on the X axis underframe, the X axis connecting plate is arranged on the X axis linear guide rail, and the X axis movement mechanism is in driving connection with the X axis connecting plate so as to control the X axis connecting plate to move along the X axis direction; the θ -axis moving unit 17 includes a rotating mechanism and a carrier, the carrier being mounted on the rotating mechanism, the rotating mechanism being mounted on the X-axis connecting plate.
As shown in fig. 4, the upper mount 4 is mounted on the Z-axis lifting mechanism 15, and the upper mount 4 can be driven to move up and down along the Z-axis. The Z-axis lifting mechanism 15 is a screw rod driving linear motion unit or a gear rack driving linear motion unit.
The first X-axis linear motion unit 10 is a piezoelectric ceramic driver, a lead screw driving linear motion unit, a rack and pinion driving linear motion unit, or a rodless cylinder driving linear motion unit, which can perform linear motion.
The second X-axis linear motion unit 12 is a piezoelectric ceramic driver, a lead screw driving linear motion unit, a rack and pinion driving linear motion unit, or a rodless cylinder driving linear motion unit capable of linear motion.
When the device is applied specifically, a product (wafer) to be cracked is placed on the steel ring 3, the X-theta axis movement module drives the steel ring 3 to feed to a station of the lower tool bit 1, the steel ring 3 is rotated firstly, a crack on the surface or inside of the product to be cracked is parallel to a blade of the lower tool bit 1, the steel ring 3 moves left and right along the X axis, the crack on the surface or inside of the product to be cracked is aligned and superposed with the blade of the lower tool bit 1, and the blade of the lower tool bit 1 props against the position of the crack. The second X-axis linear motion unit 12 drives the upper right tool bit mounting plate 6 and the upper right tool bit 11 positioned on the upper right tool bit mounting plate to move left and right along the X-axis direction, so that the upper right tool bit 11 is separated from the upper left tool bit 2, and the separation distance between the upper right tool bit 11 and the upper left tool bit 2 is adjustable within 0-10 mm. The first X-axis linear motion unit 10 drives the upper cutter head moving plate 5 to move left and right along the X-axis direction, drives the upper right cutter head 11 and the upper left cutter head 2 which are positioned on the upper cutter head moving plate to move left and right along the X-axis direction integrally, and enables the central line between the separated upper right cutter head 11 and the upper left cutter head 2 to be parallel to and right opposite to the cutting edge of the lower cutter head 1. The Z-axis lifting mechanism 15 drives the upper mounting seat 4 to descend, so that the upper right tool bit 11 and the upper left tool bit 2 simultaneously descend and press the upper surface of the product to be cracked, the product to be cracked is cracked along cracks by continuing descending, and then the Z-axis lifting mechanism 15 drives the upper mounting seat 4 to ascend to complete a cracking action. The steel ring 3 is loaded with the product and moves along the X axis to the next fracture position, the upper right cutter head 11 and the upper left cutter head 2 descend again to fracture the product, and the fracture action is repeated until the surface or the inner fracture of the product is completely cracked.
The steel ring 3 is loaded with a product to be cracked and rotates 90 degrees along the theta axis, so that the surface or inner crack of the product is parallel to the cutting edge of the lower tool bit 1, the steel ring 3 moves left and right, the surface or inner crack of the product to be cracked is aligned and superposed with the cutting edge of the lower tool bit 1, and the cutting edge of the lower tool bit 1 props against the position of the crack. The second X-axis linear motion unit 12 drives the upper right tool bit mounting plate 6 and the upper right tool bit 11 thereon to move left and right along the X-axis direction, so that the upper right tool bit 11 is separated from the upper left tool bit 2. The first X-axis linear motion unit 10 drives the upper cutter head moving plate 5 to move left and right along the X-axis direction, drives the upper right cutter head 11 and the upper left cutter head 2 which are positioned on the upper cutter head moving plate to move left and right along the X-axis direction integrally, and enables the central line between the separated upper right cutter head 11 and the upper left cutter head 2 to be parallel to and right opposite to the cutting edge of the lower cutter head 1. The Z-axis lifting mechanism 15 drives the upper mounting seat 4 to descend, so that the upper right tool bit 11 and the upper left tool bit 2 simultaneously descend and press the upper surface of the product to be cracked, the product to be cracked is cracked along cracks by continuing descending, and then the Z-axis lifting mechanism 15 drives the upper mounting seat 4 to ascend to complete a cracking action. And the steel ring 3 is loaded with the product and moves to the next fracture position, the upper right cutter head 11 and the upper left cutter head 2 are descended to fracture the product, and the fracture action is repeated until all the fractures on the surface or in the product are cracked.
And (4) completely cracking the transverse cracks and the longitudinal cracks on the surface or inside of the product to be cracked, and finishing the splitting operation of the product.
To sum up, the utility model discloses to the lobe of a leaf requirement after silicon wafer, carborundum wafer laser cutting, provide automatic lobe of a leaf device, the design is unique, novel structure, utilizes the lower part tool bit to support, and the principle that two tool bits pushed down is controlled on upper portion, makes silicon wafer, carborundum wafer and back of the body metallisation crack completely along the lobe of a leaf.
The X-theta axis movement module drives a product to be cracked to enable a crack of the product to be cracked to be aligned and superposed with the cutting edge of the lower cutter head, and the cutting edge of the lower cutter head props against the position of the crack; the second X-axis linear motion unit enables the upper right cutter head to be separated from the upper left cutter head; the first X-axis linear motion unit enables the center line between the separated upper right cutter head and the upper left cutter head to be parallel to and opposite to the cutting edge of the lower cutter head; the Z-axis lifting mechanism enables the upper right tool bit and the upper left tool bit to simultaneously descend and press the upper surface of the product to be cracked, so that the product to be cracked cracks along the cracks until all cracks crack; and then the X-theta axis movement module drives the product to be cracked to rotate 90 degrees along the theta axis, and the cracking action is repeated until the crack is completely cracked. Small edge breakage and high yield.
The problem that the existing splitting device cannot split a protruding product and a wafer with metal on the back is poor is effectively solved, the phenomenon of non-splitting is avoided, the defects of edge breakage and poor metal layer fracture are overcome, and the yield of the product is improved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (10)
1. The wafer splitting device is characterized in that: comprises an upper part mounting seat (4), a lower part tool bit mounting seat (7), a lower part tool bit (1), an upper part left tool bit (2) and an upper part right tool bit (11), wherein the lower part tool bit (1) is vertically mounted on the lower part tool bit mounting seat (7), the lower part tool bit mounting seat (7) is mounted on a workbench (13), the upper part mounting seat (4) is positioned above the lower part tool bit mounting seat (7), the bottom surface of the upper part mounting seat (4) is connected with an upper part tool bit moving plate (5) through a first X-axis linear motion unit (10), the upper part tool bit moving plate (5) can be driven to move left and right along the X-axis direction, the bottom surface of the upper part right tool bit mounting plate (6) is provided with the upper part right tool bit (11), the upper part right tool bit (11) can be driven to move left and right along the X-axis direction, a boss is arranged at the left end part of the bottom surface of the upper tool bit moving plate (5) in a downward protruding mode, an upper left tool bit (2) is installed on the boss, the upper left tool bit (2) and the upper right tool bit (11) are located at the same horizontal height and are opposite to each other, and a steel ring (3) used for loading a product to be cracked is located between the lower tool bit (1) and the upper left tool bit (2) and between the upper right tool bit (11).
2. The wafer breaking apparatus of claim 1, wherein: install a altitude controller (9) on lower part tool bit mount pad (7) of lower part tool bit (1) one side, the regulation pole and the lower part tool bit (1) of altitude controller (9) are connected, and adjustable lower part tool bit (1) reciprocates on lower part tool bit mount pad (7), and waist shape hole has been seted up with the junction site of lower part tool bit mount pad (7) on lower part tool bit (1), locks lower part tool bit (1) on lower part tool bit mount pad (7) through fastening bolt.
3. The wafer breaking apparatus of claim 2, wherein: the height adjuster (9) is a differential head adjuster.
4. The wafer breaking apparatus of claim 1, wherein: an adjuster (8) is installed on a workbench (13) on one side of a lower tool bit installation seat (7), an adjusting rod of the adjuster (8) is connected with the lower tool bit installation seat (7), the lower tool bit installation seat (7) can be adjusted to move left and right on the workbench (13) along the X-axis direction, a waist-shaped hole is formed in the connection part of the lower tool bit installation seat (7) and the workbench (13), and the lower tool bit installation seat (7) is locked on the workbench (13) through a fastening bolt.
5. The wafer breaking apparatus of claim 1, wherein: the steel ring (3) is arranged on the X-theta axis movement module and can drive the steel ring (3) to move left and right along the X axis and to rotate around the theta axis.
6. The wafer breaking apparatus of claim 5, wherein: the X-theta axis movement module comprises an X axis movement unit (16) and a theta axis movement unit (17), the X axis movement unit (16) comprises an X axis underframe, an X axis linear guide rail, an X axis connecting plate and an X axis movement mechanism for controlling the movement of the X axis connecting plate, the X axis linear guide rail and the X axis movement mechanism are installed on the X axis underframe, the X axis connecting plate is arranged on the X axis linear guide rail, and the X axis movement mechanism is in driving connection with the X axis connecting plate so as to control the X axis connecting plate to move along the X axis direction; the theta axis movement unit (17) comprises a rotating mechanism and a carrier, the carrier is arranged on the rotating mechanism, and the rotating mechanism is arranged on the X axis connecting plate.
7. The wafer breaking apparatus of claim 1, wherein: the upper mounting seat (4) is mounted on the Z-axis lifting mechanism (15) and can drive the upper mounting seat (4) to move up and down along the Z axis.
8. The wafer breaking apparatus of claim 7, wherein: the Z-axis lifting mechanism (15) is a screw rod driving linear motion unit or a gear rack driving linear motion unit.
9. The wafer breaking apparatus of claim 1, wherein: the first X-axis linear motion unit (10) is a piezoelectric ceramic driver capable of linearly moving, a lead screw driving linear motion unit, a gear and rack driving linear motion unit or a rodless cylinder driving linear motion unit.
10. The wafer breaking apparatus of claim 1, wherein: the second X-axis linear motion unit (12) is a piezoelectric ceramic driver capable of linearly moving, a lead screw driving linear motion unit, a gear and rack driving linear motion unit or a rodless cylinder driving linear motion unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921045594.2U CN210705411U (en) | 2019-07-05 | 2019-07-05 | Wafer splitting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921045594.2U CN210705411U (en) | 2019-07-05 | 2019-07-05 | Wafer splitting device |
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| CN210705411U true CN210705411U (en) | 2020-06-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110328765A (en) * | 2019-07-05 | 2019-10-15 | 苏州德龙激光股份有限公司 | Wafer sliver apparatus |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110328765A (en) * | 2019-07-05 | 2019-10-15 | 苏州德龙激光股份有限公司 | Wafer sliver apparatus |
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