CN101973011A - Crystal curing press head applied to electronic tag back-off encapsulation equipment - Google Patents
Crystal curing press head applied to electronic tag back-off encapsulation equipment Download PDFInfo
- Publication number
- CN101973011A CN101973011A CN 201010275842 CN201010275842A CN101973011A CN 101973011 A CN101973011 A CN 101973011A CN 201010275842 CN201010275842 CN 201010275842 CN 201010275842 A CN201010275842 A CN 201010275842A CN 101973011 A CN101973011 A CN 101973011A
- Authority
- CN
- China
- Prior art keywords
- heat insulation
- block
- heat
- cylinder
- cylinder body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention relates to a crystal curing press head applied to electronic tag back-off encapsulation equipment, which comprises a low-friction cylinder, a connection assembly, a spring, an adjusting ring and a heating block, wherein a cylinder body of the low-friction cylinder is connected with an upper hot-press head template through the connection assembly; the spring is arranged on the adjusting ring; the adjusting ring and the spring are sleeved on a piston rod, and the upper end of the adjusting ring is in threaded connection with the lower end of the cylinder body; and the heating block is connected with the lower end of the piston rod. In the crystal curing press head, the spring thrust is changed by rotating the adjusting ring to perform fine adjustment according the required pressure, and the fine adjustment pressure is detected by a high-precision push-pull force gauge, so that the pressure of a plurality of press heads is uniform, good hot-press crystal curing effect is achieved, and chips can be fixed effectively.
Description
Technical field
The present invention relates to a kind of electronic tag back-off sealed in unit, particularly a kind of good heat bonding of realizing chip and antenna be applied in solid brilliant pressure head on the electronic tag back-off sealed in unit.
Background technology
Gu brilliant pressure head is applied on the electronic tag equipment, the chip heating pressurization realization chip of upper track bonding die operation is effectively fixed and realized conducting.
The solid brilliant pressure head that uses comprises low friction cylinder, the heat block that is connected with cylinder piston at present.The cylinder body of described low friction cylinder is fixedlyed connected with last thermal head template by coupling assembling, and last thermal head template is fixed on the seaming chuck connecting plate.The gas pressure of cylinder block inside passes to heat block by piston rod with pressure on piston, by heat block thermal pressure is applied on the chip again.The adjusting of pressure realizes by the air feed air pressure of the low friction of Pneumatic control proportioning valve regulation cylinder.
Through consulting interrelated data and we recognize to the investigation of multiple electronic tag back-off packaging machine equipment, may produce small crackle in multiple working procedure chips such as making wafer coupons, bonding die.The inefficacy of chip is mainly that the chip crackle causes, thermal pressure too large chip easily cracks, and thermal pressure is too for a short time not to reach the solid brilliant effect of hot pressing, so the size adjustment of thermal pressure, and pressure uniformity control is adjusted and seemed very important.Because the welding pressure that requires is in 0.49N～12.5N scope, sensitivity 10g.Meet this requirement and must use can produce slight pressure, highly sensitive low friction cylinder.The characteristics of low friction cylinder are low frictions, even slightly pressure changes, and also can sensitive replying.
Because the die size thin and thick that label uses differs, and at different kinds of chips, requires the pressure of pressure head also different, therefore need carry out small adjustment to pressure.But because the cylinder individual difference difference of a plurality of pressure heads, cause each ram pressures inhomogeneous, thereby when causing a plurality of chip of hot pressing, excessive the causing of the chip pressure that has chip pressure not enough, that have lost efficacy or crackle, and the pressure that therefore needs to regulate each pressure head makes its uniformity.
Owing to need chip is heated the high temperature of nearly 250 degree in the time of pressurization,, be necessary to the heat insulation of heater that is installed on the cylinder piston for the protection cylinder.
Most of electronic tag equipment often adopt a plurality of solid brilliant pressure heads simultaneously the chip heating pressurization of upper track bonding die operation to be realized that chip is effectively fixing in order to increase work efficiency.Nearly 40 of the pressure head of the equipment that has, and, cause often wanting the position of conversion pressure head on the seaming chuck connecting plate because the chip layout position of antenna carrier band often changes, therefore require pressure head to adjust rapidly by the position of chip on the antenna carrier band.
Summary of the invention
The technical problem to be solved in the present invention provides that a kind of pressure can adjust flexibly is applied in solid brilliant pressure head on the electronic tag back-off sealed in unit.
In order to solve the problems of the technologies described above, the solid brilliant pressure head that is applied on the electronic tag back-off sealed in unit of the present invention comprises low friction cylinder, coupling assembling, and spring is adjusted ring, heat block; The cylinder body of described low friction cylinder is connected with last thermal head template by coupling assembling, and heat block is connected with the lower end of the piston rod of low friction cylinder; Spring is installed in to adjust and encircles, and adjust ring and spring housing and be contained on the piston rod that hangs down the friction cylinder, and the upper end of adjustment ring is threaded with the lower end of cylinder body.
The gas pressure of cylinder block inside passes to heat block by piston rod with pressure on piston, by heat block thermal pressure is applied on the chip again.With the initial pressure of the low friction of accurate voltage regulating valve regulation cylinder, the air feed air pressure of the low friction of passing ratio valve regulation cylinder is to adapt to the input pressure of variety classes chip.Rotation is adjusted ring and is made telescopic spring, can realize being applied to the fine setting of the thermal pressure on the chip, and trimming precision is 5-10g.
During heat pressure adhesive antenna chip of the same race, require a plurality of ram pressures uniformities, thereby guarantee antenna chip heat pressure adhesive quality.The present invention adjusts ring by rotation and changes spring thrust, can finely tune according to the size of required pressure, and by the high accuracy pull and push dynamometer to the fine setting pressure detect, make the pressure of a plurality of pressure heads reach uniformity, reached the solid brilliant effect of good hot pressing, thus fixed chip effectively.
Be also to comprise lower locking nut, connector, heat insulation and dissipation device as a further improvement on the present invention; The cylinder body of described low friction cylinder is two parts up and down from interstation punishment, and the lower part is processed with external screw thread; Coupling assembling comprises Connection Block, joint pin; Connection Block is fixedlyed connected with the upper end of joint pin; The shrinkage pool of Connection Block upper end is embedded with magnetic patch, and Connection Block embeds in the corresponding opening of going up the thermal head template; The lower end of joint pin has projection, and this projection is stuck in the interstation place of cylinder body; Upper locking nut is tightened on the cylinder body screw thread, the projection of joint pin lower end is pressed on the interstation place of cylinder body; Lower locking nut is locked on the screw thread of inferior part of the cylinder block branch, compresses to adjust ring; Connector is fixed on the lower end of piston rod; Described heat insulation and dissipation device comprises first heat insulation, heat insulation column, radiating block, second heat insulation, sleeve; Be placed with heat insulation column between first heat insulation and the radiating block; Position corresponding with heat insulation column above second heat insulation has boss; Fixedly connected between connector, first heat insulation, heat insulation column, radiating block and second heat insulation by heat insulation screw; Radiating block is fixedlyed connected with sleeve, is processed with a plurality of louvres on the sleeve; Have projection above the heat block, the position that the following and projection of second heat insulation staggers is processed with groove; Be connected by clamp-screw with second heat insulation at projection place heat block; First heat insulation and second heat insulation adopt HIPAL, and heat insulation column adopts NPPS, and radiating block, heat block, sleeve adopt 2AL2.
Select for use magnetic material to make the seaming chuck connecting plate, press antenna carrier band chip position processing dimension opening consistent on last thermal head template with Connection Block.To go up the thermal head template and attach and to be connected on seaming chuck wins in succession, the Connection Block that will have magnetic patch again embeds in the opening of going up the thermal head template, and Connection Block promptly is adsorbed onto on seaming chuck wins in succession, has reached the purpose of Fast Installation.The relative position of thermal head template and seaming chuck connecting plate in the conversion can be adjusted the position of brilliant pressure head admittedly rapidly by the position of chip on the antenna carrier band.
Heat block is connected on the cylinder piston by the heat insulation and dissipation device, for guaranteeing that cylinder piston is not subjected to the influence of high temperature, the principle good according to the air heat-proof quality is with the second heat insulation recessing and increase projection on heat block, reduce the contact area between two parts, strengthened effect of heat insulation.Between the connector and second heat insulation, increase by first heat insulation and radiating block, adopt the low attachment screw of thermal conductivity factor to connect; Radiating block is connected with sleeve, thereby and on sleeve a plurality of louvres of processing help heat and distribute, pass to cylinder piston to prevent heat, further strengthened effect of heat insulation.Open equipment fan in the time of heating, guarantee radiating effect to strengthen cross-ventilation.In addition, it is the heat-barrier material of HIPAL that first heat insulation and second heat insulation all adopt the thermal conductivity factor trade mark low, that have certain intensity and good heat-insulation effect, it is the NPPS engineering plastics that heat insulation column adopts the trade mark that thermal conductivity factor is low and intensity is higher, thereby promptly can guarantee the bulk strength of heat insulation and dissipation device, have good effect of heat insulation again; Radiating block, heat block, sleeve all adopt the high 2AL2 of thermal conductivity factor, and good heat dissipation effect and heat radiation are evenly.
Because bulk restriction and the needs that connect, the thermal insulation barriers volume of need selecting will be very little and bonding strength and dimensional stability are fine, and good effect of heat insulation is arranged, and the present invention structurally adopts multilayer insulation material according to mechanism of heat insulation, has strengthened effect of heat insulation.
Description of drawings
Below in conjunction with the drawings and specific embodiments the present invention is described in further detail.
Fig. 1 is the front view that is applied in the solid brilliant pressure head on the electronic tag back-off sealed in unit of the present invention.
Fig. 2 is the partial sectional view that is applied in the solid brilliant pressure head on the electronic tag back-off sealed in unit of the present invention.
Fig. 3 is solid brilliant pressure head and the seaming chuck connecting plate syndeton schematic diagram that is applied on the electronic tag back-off sealed in unit of the present invention.
Fig. 4 is the solid brilliant pressure head stereogram that removes sleeve.
Fig. 5 is a seaming chuck template stereogram.
The specific embodiment
As shown in Figure 1, 2, the solid brilliant pressure head that is applied on the electronic tag back-off sealed in unit of the present invention comprises low friction cylinder 21, coupling assembling, and spring 34 is adjusted ring 33, heat block 45; The cylinder body of described low friction cylinder 21 is connected with last thermal head template 2 by coupling assembling, and last thermal head template 2 is fixed on the seaming chuck connecting plate 3; Spring 34 is installed in to be adjusted on the ring 33, adjust ring 33 and spring 34 and be sleeved on the piston rod 24, and the upper end of adjustment ring 33 is threaded with the lower end of cylinder body; Heat block 45 is connected with the lower end of piston rod 24.
The present invention also comprises lower locking nut 32, connector 30, heat insulation and dissipation device.The cylinder body of described low friction cylinder 21 is two parts up and down from interstation 28 punishment, and the lower part is processed with external screw thread; The air inlet of low friction cylinder is connected with outside air supply pipe by cylinder connection piece 23 and joint 22.Coupling assembling comprises Connection Block 11, joint pin 12; Connection Block 11 is fixedlyed connected by screw 14 with the upper end of joint pin 12; The shrinkage pool of Connection Block 11 upper ends is embedded with magnetic patch 13, and Connection Block 11 embeds in the corresponding opening 4 of going up thermal head template 2; The lower end of joint pin 12 has projection 15, and this projection 15 is stuck in interstation 28 places of cylinder body; Upper locking nut 31 is tightened on the cylinder body screw thread, the projection 15 of joint pin 12 lower ends is pressed on interstation 28 places of cylinder body; Lower locking nut 32 is locked on the screw thread of inferior part of the cylinder block branch, compresses to adjust ring 33; Connector 30 is fixed on the lower end of piston rod 24 by holding screw 29; Described heat insulation and dissipation device comprises first heat insulation 41, heat insulation column 42, radiating block 43, the second heat insulations 44, sleeve 49; Be placed with heat insulation column 42 between first heat insulation 41 and the radiating block 43; Second heat insulation, 44 top and heat insulation columns, 42 corresponding positions have boss 441; Fixedly connected between connector 30, first heat insulation 41, heat insulation column 42, radiating block 43 and second heat insulation 44 by heat insulation screw 46; Radiating block 43 is fixedlyed connected with sleeve 49, is processed with a plurality of louvres 50 on the sleeve 49; Have the position that the following and projection 451 of projection 451, the second heat insulations 44 staggers above the heat block 45 and be processed with groove 442; Be connected by clamp-screw 48 with second heat insulation 44 at projection 451 place's heat blocks 45; First heat insulation 41 and second heat insulation 44 adopt HIPAL, and heat insulation column 42 adopts NPPS, and radiating block 43, heat block 45, sleeve 49 adopt 2AL2.
Provide preferred implementation of the present invention above, but be not limited thereto embodiment.Should be understood that every any simple deformation of making all the invention is intended within the protection domain on claim 1 technical scheme of the present invention basis.
Claims (2)
1. a solid brilliant pressure head that is applied on the electronic tag back-off sealed in unit comprises low friction cylinder (21), coupling assembling, heat block (45); The cylinder body of described low friction cylinder (21) is connected with last thermal head template by coupling assembling, and heat block (45) is connected with the lower end of the piston rod (24) of low friction cylinder (21); It is characterized in that also comprising spring (34), adjust ring (33); Spring (34) is installed in to adjust and encircles on (33), adjust ring (33) and spring (34) and be sleeved on the piston rod (24) that hangs down friction cylinder (21), and the upper end of adjustment ring (33) is threaded with the lower end of cylinder body.
2. the solid brilliant pressure head that is applied on the electronic tag back-off sealed in unit according to claim 1 is characterized in that also comprising lower locking nut (32), connector (30), heat insulation and dissipation device; The cylinder body of described low friction cylinder (21) is two parts up and down from interstation (28) punishment, and the lower part is processed with external screw thread; Coupling assembling comprises Connection Block (11), joint pin (12); Connection Block (11) is fixedlyed connected with the upper end of joint pin (12); The shrinkage pool of Connection Block (11) upper end is embedded with magnetic patch (13), in Connection Block (11) embedding in the corresponding opening of thermal head template; The lower end of joint pin (12) has projection (15), and this projection (15) is stuck in the interstation (28) of cylinder body and locates; Upper locking nut (31) is tightened on the cylinder body screw thread, and the interstation (28) that the projection (15) of joint pin (12) lower end is pressed on cylinder body is located; Lower locking nut (32) is locked on the screw thread of inferior part of the cylinder block branch, compresses to adjust ring (33); Connector (30) is fixed on the lower end of piston rod (24); Described heat insulation and dissipation device comprises first heat insulation (41), heat insulation column (42), radiating block (43), second heat insulation (44), sleeve (49); Be placed with heat insulation column (42) between first heat insulation (41) and the radiating block (43); The position corresponding with heat insulation column (42) has boss (441) above second heat insulation (44); Fixedly connected between connector (30), first heat insulation (41), heat insulation column (42), radiating block (43) and second heat insulation (44) by heat insulation screw (46); Radiating block (43) is fixedlyed connected with sleeve (49), is processed with a plurality of louvres (50) on the sleeve (49); Have projection (451) above the heat block (45), the position that the following and projection (451) of second heat insulation (44) staggers is processed with groove (442); Locating heat block (45) at projection (451) is connected by clamp-screw (48) with second heat insulation (44); First heat insulation (41) and second heat insulation (44) adopt HIPAL, and heat insulation column (42) adopts NPPS, and radiating block (43), heat block (45), sleeve (49) adopt 2AL2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010275842XA CN101973011B (en) | 2010-09-08 | 2010-09-08 | Crystal curing press head applied to electronic tag back-off encapsulation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010275842XA CN101973011B (en) | 2010-09-08 | 2010-09-08 | Crystal curing press head applied to electronic tag back-off encapsulation equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101973011A true CN101973011A (en) | 2011-02-16 |
| CN101973011B CN101973011B (en) | 2012-07-18 |
Family
ID=43572935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010275842XA Expired - Fee Related CN101973011B (en) | 2010-09-08 | 2010-09-08 | Crystal curing press head applied to electronic tag back-off encapsulation equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101973011B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102632676A (en) * | 2012-03-23 | 2012-08-15 | 南京理工大学常熟研究院有限公司 | Hot pressing head with adjustable parallelism |
| CN102636890A (en) * | 2012-04-11 | 2012-08-15 | 南京理工大学常熟研究院有限公司 | Structure with adjustable parallelism |
| CN102903648A (en) * | 2012-08-28 | 2013-01-30 | 长春光华微电子设备工程中心有限公司 | Crystal curing press head of radio frequency identification back-off packaging device |
| CN104476896A (en) * | 2014-10-24 | 2015-04-01 | 湖北华威科智能技术有限公司 | Hot-pressing head device for inverted encapsulation of RFID label |
| CN104681468A (en) * | 2015-02-11 | 2015-06-03 | 上海博应信息技术有限公司 | Inverted package hot pressing device of RFID (Radio Frequency Identification) electronic tag |
| CN105742217A (en) * | 2016-04-19 | 2016-07-06 | 刘宁 | Electronic tag packaging and hot-pressing mechanism |
| CN106827614A (en) * | 2017-02-09 | 2017-06-13 | 深圳市诚亿自动化科技有限公司 | Pressure head stability Design mechanism long |
| CN110528078A (en) * | 2019-08-20 | 2019-12-03 | 山东天岳先进材料科技有限公司 | A kind of crystal withdrawing device |
| CN114664701A (en) * | 2022-03-12 | 2022-06-24 | 上海潞淼物联网信息科技有限公司 | Metal-attached RFID electronic tag packaging equipment and application method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004273688A (en) * | 2003-03-07 | 2004-09-30 | Seiko Epson Corp | Compression method, compression device, and process and system for manufacturing electrooptic device |
| US6829541B2 (en) * | 2003-03-27 | 2004-12-07 | Autocraft Industries, Inc. | Multi-fixture pneumatic press |
| CN101556923A (en) * | 2008-12-04 | 2009-10-14 | 上海微松半导体设备有限公司 | Pressure control mechanism of semiconductor packaging device loading head |
| CN101826474A (en) * | 2009-03-04 | 2010-09-08 | Abb研究有限公司 | The permanent plant that is used for low-temperature and low-pressure sintering |
-
2010
- 2010-09-08 CN CN201010275842XA patent/CN101973011B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004273688A (en) * | 2003-03-07 | 2004-09-30 | Seiko Epson Corp | Compression method, compression device, and process and system for manufacturing electrooptic device |
| US6829541B2 (en) * | 2003-03-27 | 2004-12-07 | Autocraft Industries, Inc. | Multi-fixture pneumatic press |
| CN101556923A (en) * | 2008-12-04 | 2009-10-14 | 上海微松半导体设备有限公司 | Pressure control mechanism of semiconductor packaging device loading head |
| CN101826474A (en) * | 2009-03-04 | 2010-09-08 | Abb研究有限公司 | The permanent plant that is used for low-temperature and low-pressure sintering |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102632676A (en) * | 2012-03-23 | 2012-08-15 | 南京理工大学常熟研究院有限公司 | Hot pressing head with adjustable parallelism |
| CN102636890A (en) * | 2012-04-11 | 2012-08-15 | 南京理工大学常熟研究院有限公司 | Structure with adjustable parallelism |
| CN102903648A (en) * | 2012-08-28 | 2013-01-30 | 长春光华微电子设备工程中心有限公司 | Crystal curing press head of radio frequency identification back-off packaging device |
| CN104476896A (en) * | 2014-10-24 | 2015-04-01 | 湖北华威科智能技术有限公司 | Hot-pressing head device for inverted encapsulation of RFID label |
| CN104476896B (en) * | 2014-10-24 | 2016-06-29 | 湖北华威科智能技术有限公司 | A kind of thermal head device for RFID tag encapsulation |
| CN104681468B (en) * | 2015-02-11 | 2017-07-18 | 上海博应信息技术有限公司 | A kind of RFID falls to encapsulate hot-press arrangement |
| CN104681468A (en) * | 2015-02-11 | 2015-06-03 | 上海博应信息技术有限公司 | Inverted package hot pressing device of RFID (Radio Frequency Identification) electronic tag |
| CN105742217A (en) * | 2016-04-19 | 2016-07-06 | 刘宁 | Electronic tag packaging and hot-pressing mechanism |
| CN106827614A (en) * | 2017-02-09 | 2017-06-13 | 深圳市诚亿自动化科技有限公司 | Pressure head stability Design mechanism long |
| CN110528078A (en) * | 2019-08-20 | 2019-12-03 | 山东天岳先进材料科技有限公司 | A kind of crystal withdrawing device |
| CN110528078B (en) * | 2019-08-20 | 2020-10-02 | 山东天岳先进材料科技有限公司 | Crystal taking-out device |
| CN114664701A (en) * | 2022-03-12 | 2022-06-24 | 上海潞淼物联网信息科技有限公司 | Metal-attached RFID electronic tag packaging equipment and application method thereof |
| CN114664701B (en) * | 2022-03-12 | 2023-04-18 | 上海潞淼物联网信息科技有限公司 | Metal-attached RFID electronic tag packaging equipment and application method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101973011B (en) | 2012-07-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101973011B (en) | Crystal curing press head applied to electronic tag back-off encapsulation equipment | |
| US10041658B2 (en) | Illuminating device | |
| CN1985351A (en) | High density bonding of electrical devices | |
| CN105140170A (en) | Multi-ceramic-tube-case sealing cap clamping tool capable of achieving fine alignment | |
| US11820095B2 (en) | Sintering press for sintering electronic components on a substrate | |
| CN1964850A (en) | Device for applying at least one surface section of a transfer layer of a transfer film to a web of material and the use thereof | |
| CN103434134B (en) | A kind of thermal head for RFID label tag encapsulation | |
| CN105365251B (en) | A hot press device for high temperature adhesive curing | |
| CN207731042U (en) | A kind of ACF sticking machines of automatic positioning | |
| US20070023478A1 (en) | Thermocompression bonding module and method of using the same | |
| KR101959215B1 (en) | Low thrust bonding device of display panel or touchpanel | |
| CN106356435A (en) | Flip-chip pressing machine and flip-chip light-emitting diode packaging method | |
| CN102903648A (en) | Crystal curing press head of radio frequency identification back-off packaging device | |
| TW201421005A (en) | Testing device for LED | |
| CN106231696A (en) | A kind of heater and heating means | |
| CN102192228A (en) | Fixed element and fixed device and electric device using fixed element | |
| CN101973159B (en) | Net structure is transferred to photovoltaic solar energy printing machine steel mesh | |
| CN108045685A (en) | A kind of width adjusting structure and labelling machine | |
| US20220020710A1 (en) | Sintering press for sintering electronic components on a substrate | |
| CN207964699U (en) | A kind of extruding type radiating fin thermal performance test jig | |
| CN207096821U (en) | A kind of high-precision microscope carrier micro-adjusting mechanism | |
| CN208827165U (en) | A kind of FPC antenna flexibility hot-press arrangement | |
| CN111244251B (en) | LED packaging system | |
| CN102130028B (en) | Lower hot-pressing device on RFID (radio frequency identification) flip packaging device | |
| CN104883033B (en) | Housing heat abstractor and the frequency converter with housing heat abstractor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20110216 Assignee: ChangChun GuangHua Micro-electronics Eguipment Engineering Center Co., Ltd. Assignor: Changchun Inst. of Optics and Fine Mechanics and Physics, Chinese Academy of Sci Contract record no.: 2014220000012 Denomination of invention: Crystal curing press head applied to electronic tag back-off encapsulation equipment Granted publication date: 20120718 License type: Exclusive License Record date: 20140226 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120718 Termination date: 20170908 |