CN104681468B - A kind of RFID falls to encapsulate hot-press arrangement - Google Patents
A kind of RFID falls to encapsulate hot-press arrangement Download PDFInfo
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- CN104681468B CN104681468B CN201510072751.9A CN201510072751A CN104681468B CN 104681468 B CN104681468 B CN 104681468B CN 201510072751 A CN201510072751 A CN 201510072751A CN 104681468 B CN104681468 B CN 104681468B
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- hot pressing
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- rfid
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- 238000007731 hot pressing Methods 0.000 claims abstract description 36
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000007667 floating Methods 0.000 claims abstract description 4
- 230000007246 mechanism Effects 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510072751.9A CN104681468B (en) | 2015-02-11 | 2015-02-11 | A kind of RFID falls to encapsulate hot-press arrangement |
Applications Claiming Priority (1)
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CN201510072751.9A CN104681468B (en) | 2015-02-11 | 2015-02-11 | A kind of RFID falls to encapsulate hot-press arrangement |
Publications (2)
Publication Number | Publication Date |
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CN104681468A CN104681468A (en) | 2015-06-03 |
CN104681468B true CN104681468B (en) | 2017-07-18 |
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Family Applications (1)
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CN201510072751.9A Active CN104681468B (en) | 2015-02-11 | 2015-02-11 | A kind of RFID falls to encapsulate hot-press arrangement |
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CN (1) | CN104681468B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105428257B (en) * | 2015-12-11 | 2017-10-20 | 湖北华威科智能技术有限公司 | One kind is directed to large scale RFID tag reverse packaging process |
CN105742217A (en) * | 2016-04-19 | 2016-07-06 | 刘宁 | Electronic tag packaging and hot-pressing mechanism |
CN108107163B (en) * | 2018-02-02 | 2024-04-16 | 巨心物联网实验室(深圳)有限公司 | INLAY electronic tag chip packaging experiment machine |
CN110010529A (en) * | 2019-04-16 | 2019-07-12 | 深圳市先进连接科技有限公司 | A kind of pressing sintering for large power semiconductor device encapsulation |
CN110931396A (en) * | 2019-12-12 | 2020-03-27 | 东信和平科技股份有限公司 | Multi-chip smart card pressure head and packaged chip equipment |
CN112786523B (en) * | 2021-01-11 | 2022-06-03 | 北京航空航天大学 | Hot-pressing sintering clamp for chip packaging and chip packaging method |
CN112884112B (en) * | 2021-03-19 | 2024-08-23 | 德龙信息技术(苏州)有限公司 | Hot pressing structure for RFID label reverse packaging |
CN117936435B (en) * | 2024-03-22 | 2024-06-25 | 泰姆瑞(北京)精密技术有限公司 | Detachable crimping device and hot pressing equipment |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101973011A (en) * | 2010-09-08 | 2011-02-16 | 中国科学院长春光学精密机械与物理研究所 | Crystal curing press head applied to electronic tag back-off encapsulation equipment |
CN202225442U (en) * | 2011-09-19 | 2012-05-23 | 广东宝丽华服装有限公司 | Thermal head for thermofixation of RFID (radio frequency identification) tags |
CN202695395U (en) * | 2011-04-22 | 2013-01-23 | 深圳才纳半导体设备有限公司 | RFID tag packaging hot-pressing device |
CN203141861U (en) * | 2013-01-29 | 2013-08-21 | 广东宝丽华服装有限公司 | Hot pressing device for heat curing of RFID (Radio Frequency IDentification) tags |
CN103434134A (en) * | 2013-08-12 | 2013-12-11 | 华中科技大学 | Hot pressure head for encapsulation of RFID (Radio Frequency Identification) tag |
CN204516728U (en) * | 2015-02-11 | 2015-07-29 | 上海博应信息技术有限公司 | A kind of RFID encapsulates hot-press arrangement |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5519823A (en) * | 1978-07-27 | 1980-02-12 | Nec Corp | Semoconductor element mounting device |
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2015
- 2015-02-11 CN CN201510072751.9A patent/CN104681468B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101973011A (en) * | 2010-09-08 | 2011-02-16 | 中国科学院长春光学精密机械与物理研究所 | Crystal curing press head applied to electronic tag back-off encapsulation equipment |
CN202695395U (en) * | 2011-04-22 | 2013-01-23 | 深圳才纳半导体设备有限公司 | RFID tag packaging hot-pressing device |
CN202225442U (en) * | 2011-09-19 | 2012-05-23 | 广东宝丽华服装有限公司 | Thermal head for thermofixation of RFID (radio frequency identification) tags |
CN203141861U (en) * | 2013-01-29 | 2013-08-21 | 广东宝丽华服装有限公司 | Hot pressing device for heat curing of RFID (Radio Frequency IDentification) tags |
CN103434134A (en) * | 2013-08-12 | 2013-12-11 | 华中科技大学 | Hot pressure head for encapsulation of RFID (Radio Frequency Identification) tag |
CN204516728U (en) * | 2015-02-11 | 2015-07-29 | 上海博应信息技术有限公司 | A kind of RFID encapsulates hot-press arrangement |
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CN104681468A (en) | 2015-06-03 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Inverted package hot pressing device of RFID (Radio Frequency Identification) electronic tag Effective date of registration: 20200608 Granted publication date: 20170718 Pledgee: New Area Branch of Shanghai pilot free trade zone of Bank of Communications Co., Ltd Pledgor: SHANGHAI BOYING INFORMATION TECHNOLOGY Co.,Ltd. Registration number: Y2020310000025 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210621 Granted publication date: 20170718 Pledgee: New Area Branch of Shanghai pilot free trade zone of Bank of Communications Co., Ltd Pledgor: SHANGHAI BOYING INFORMATION TECHNOLOGY Co.,Ltd. Registration number: Y2020310000025 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A reverse packaging hot pressing device for RFID tag Effective date of registration: 20210624 Granted publication date: 20170718 Pledgee: Bank of Communications Limited Shanghai pilot Free Trade Zone Branch Pledgor: SHANGHAI BOYING INFORMATION TECHNOLOGY Co.,Ltd. Registration number: Y2021310000041 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220616 Granted publication date: 20170718 Pledgee: Bank of Communications Limited Shanghai pilot Free Trade Zone Branch Pledgor: SHANGHAI BOYING INFORMATION TECHNOLOGY Co.,Ltd. Registration number: Y2021310000041 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |