CN202225442U - Thermal head for thermofixation of RFID (radio frequency identification) tags - Google Patents
Thermal head for thermofixation of RFID (radio frequency identification) tags Download PDFInfo
- Publication number
- CN202225442U CN202225442U CN2011203518086U CN201120351808U CN202225442U CN 202225442 U CN202225442 U CN 202225442U CN 2011203518086 U CN2011203518086 U CN 2011203518086U CN 201120351808 U CN201120351808 U CN 201120351808U CN 202225442 U CN202225442 U CN 202225442U
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- China
- Prior art keywords
- thermal head
- spring
- hot pressing
- pressing base
- thermofixation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a thermal head for thermofixation of RFID (radio frequency identification) tags and belongs to the technical field of RFID tag thermofixation. The thermal head is characterized by comprising a hot-press base, wherein a magnet is arranged at the upper end of the hot-press base; a thermal head body is connected to the lower part of the hot-press base through a ball slide rail; and a spring is vertically arranged between the rear end of the thermal head body and the hot-press base. The utility model aims to provide the thermal head for thermofixation of the RFID tags, which has a reasonable structure and a good using effect and is used for thermofixation of the RFID tags.
Description
Technical field
The utility model relates to a kind of heat cure and uses thermal head, more particularly, relates in particular to the heat cure of a kind of RFID label and uses thermal head.
Background technology
Existing thermal-curable system, the general direct connection cylinder of its thermal head is through moving of air cylinder driven thermal head; There is following shortcoming in this structure: the stroke of cylinder can only be regulated according to air pressure; The position can't accurately be controlled, if air pressure is not enough, then thermal head can't be with the heat cure of RFID chip to the RFID antenna up and down; If air pressure is excessive, then might the RFID chip be damaged by pressure.No matter air pressure is not enough or excessive, all can directly have influence on the quality of product, thus the effect that influence is used.
The utility model content
The purpose of the utility model is the deficiency to above-mentioned prior art, provides a kind of RFID label heat cure rational in infrastructure, that result of use is good to use thermal head.
The technical scheme of the utility model is achieved in that the heat cure of a kind of RFID label uses thermal head; Comprise the hot pressing base; Wherein said hot pressing base upper end is provided with magnet; Be connected with thermal head in hot pressing base bottom through ball slide rail, between thermal head rear end and hot pressing base, vertically be provided with spring.
Above-mentioned RFID label heat cure is with in the thermal head; Vertically be provided with through hole on the described hot pressing base, described spring is arranged in the through hole, in the through hole of spring upper end, is provided with the adjusting jacking block; Regulate jacking block and be connected with through hole whorl, spring clip is located to be regulated between jacking block and the thermal head.
Above-mentioned RFID label heat cure is with in the thermal head, and described thermal head top is provided with contiguous block, between contiguous block and thermal head, is provided with heat insulation; Contiguous block is connected with ball slide rail; Described spring is fixed on to be regulated between jacking block and the contiguous block.
Above-mentioned RFID label heat cure is with in the thermal head, and described thermal head is by cylindrical outer casing, and the heating bar and the thermocouple that are arranged in the cylindrical outer casing are formed; Heating bar is connected with external temperature control module circuit respectively with thermocouple.
After the utility model adopts said structure; Through being set at the thermal head rear portion, the hot pressing base is used for being connected with external equipment; Simultaneously between hot pressing base and thermal head, ball slide rail and the spring that arrive cooperation mutually is set; Through spring the position of thermal head can be automatically adjusted according to actual conditions, under the situation that guarantees the hot pressing fixed mass, make thermal head can not damage the RFID chip.The utlity model has rational in infrastructurely, compact, result of use is good, the advantage of high efficiency.
Description of drawings
Below in conjunction with the embodiment in the accompanying drawing the utility model is done further to specify, but do not constitute any restriction the utility model.
Fig. 1 is the structural representation of the utility model.
Among the figure: hot pressing base 1, through hole 1a, magnet 2, ball slide rail 3, thermal head 4, cylindrical outer casing 4a, heating bar 4b, thermocouple 4c, spring 5, adjusting jacking block 6, contiguous block 7, heat insulation 8.
The specific embodiment
Consult shown in Figure 1ly, thermal head is used in a kind of RFID label heat cure of the utility model, comprises hot pressing base 1; Be provided with magnet 2 in hot pressing base 1 upper end, magnet 2 is used for thermal head is fixed on thermal-curable system, on hot pressing base 1, vertically is provided with through hole 1a; In through hole 1a, be provided with bullet 5, in the through hole 1a of spring 5 upper ends, be provided with and regulate jacking block 6, through regulating the amount of elastic deformation that jacking block 6 can regulating spring 5; Thereby the elastic force of regulating spring 5 in Moving Unit length; Thereby spring 5 is cooperated with ball slide rail 3 play certain cushioning effect, prevent in hot pressing, wafer to be damaged by pressure, regulate jacking block 6 and be threaded with through hole 1a; Be connected with thermal head 4 in hot pressing base 1 bottom through ball slide rail 3, spring 5 is folded in to be regulated between jacking block 6 and the thermal head 4; Further, be provided with contiguous block 7 at thermal head 4 tops, between contiguous block 7 and thermal head 4, be provided with heat insulation 8, heat insulation 8 is used to prevent that the high temperature of thermal head 4 from damaging other attaching parts; Contiguous block 7 is connected with ball slide rail 3; Described spring 5 is fixed on to be regulated between jacking block 6 and the contiguous block 7.The thermal head 4 of the utility model is by cylindrical outer casing 4a, and the heating bar 4b and the thermocouple 4c that are arranged in the cylindrical outer casing 4a form; Heating bar 4b is connected with external temperature control module circuit respectively with thermocouple 4c; Fever rod 4b is used for heating, and thermocouple 4c is used to control the temperature of thermal head 4.
During concrete the use, under original state, spring 5 withstands the displacement that contiguous block 7 makes ball slide rail 3 and reaches maximum; When carrying out heat cure when operation, cooperatively interact when pushing heat cure at thermal head up and down, under the cooperation of spring 5 and ball slide rail 3; Can play cushioning effect effectively; Force value about making between the thermal head had both been protected the quality of heat cure in normal range (NR), can prevent that again wafer from being damaged by pressure.
Claims (4)
1. thermal head is used in RFID label heat cure; Comprise hot pressing base (1); It is characterized in that; Described hot pressing base (1) upper end is provided with magnet (2), is connected with thermal head (4) in hot pressing base (1) bottom through ball slide rail (3), between thermal head (4) rear end and hot pressing base (1), vertically is provided with spring (5).
2. thermal head is used in RFID label according to claim 1 heat cure; It is characterized in that; Vertically be provided with through hole (1a) on the described hot pressing base (1), described spring (5) is arranged in the through hole (1a), in the through hole (1a) of spring (5) upper end, is provided with to regulate jacking block (6); Regulate jacking block (6) and be threaded with through hole (1a), spring (5) is folded in to be regulated between jacking block (6) and the thermal head (4).
3. thermal head is used in RFID label according to claim 2 heat cure, it is characterized in that, described thermal head (4) top is provided with contiguous block (7), between contiguous block (7) and thermal head (4), is provided with heat insulation (8); Contiguous block (7) is connected with ball slide rail (3); Described spring (5) is fixed on to be regulated between jacking block (6) and the contiguous block (7).
4. thermal head is used in heat cure according to the arbitrary described RFID label of claim 1 to 3, it is characterized in that, described thermal head (4) is by cylindrical outer casing (4a), and the heating bar (4b) and the thermocouple (4c) that are arranged in the cylindrical outer casing (4a) are formed; Heating bar (4b) is connected with external temperature control module circuit respectively with thermocouple (4c).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203518086U CN202225442U (en) | 2011-09-19 | 2011-09-19 | Thermal head for thermofixation of RFID (radio frequency identification) tags |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203518086U CN202225442U (en) | 2011-09-19 | 2011-09-19 | Thermal head for thermofixation of RFID (radio frequency identification) tags |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202225442U true CN202225442U (en) | 2012-05-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203518086U Expired - Fee Related CN202225442U (en) | 2011-09-19 | 2011-09-19 | Thermal head for thermofixation of RFID (radio frequency identification) tags |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202225442U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103057102A (en) * | 2012-12-03 | 2013-04-24 | 华中科技大学 | Hot-press heads and hot-press device |
| CN103434134A (en) * | 2013-08-12 | 2013-12-11 | 华中科技大学 | Hot pressure head for encapsulation of RFID (Radio Frequency Identification) tag |
| CN104476896A (en) * | 2014-10-24 | 2015-04-01 | 湖北华威科智能技术有限公司 | Hot-pressing head device for inverted encapsulation of RFID label |
| CN104681468A (en) * | 2015-02-11 | 2015-06-03 | 上海博应信息技术有限公司 | Inverted package hot pressing device of RFID (Radio Frequency Identification) electronic tag |
-
2011
- 2011-09-19 CN CN2011203518086U patent/CN202225442U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103057102A (en) * | 2012-12-03 | 2013-04-24 | 华中科技大学 | Hot-press heads and hot-press device |
| CN103434134A (en) * | 2013-08-12 | 2013-12-11 | 华中科技大学 | Hot pressure head for encapsulation of RFID (Radio Frequency Identification) tag |
| CN103434134B (en) * | 2013-08-12 | 2015-11-11 | 华中科技大学 | A kind of thermal head for RFID label tag encapsulation |
| CN104476896A (en) * | 2014-10-24 | 2015-04-01 | 湖北华威科智能技术有限公司 | Hot-pressing head device for inverted encapsulation of RFID label |
| CN104476896B (en) * | 2014-10-24 | 2016-06-29 | 湖北华威科智能技术有限公司 | A kind of thermal head device for RFID tag encapsulation |
| CN104681468A (en) * | 2015-02-11 | 2015-06-03 | 上海博应信息技术有限公司 | Inverted package hot pressing device of RFID (Radio Frequency Identification) electronic tag |
| CN104681468B (en) * | 2015-02-11 | 2017-07-18 | 上海博应信息技术有限公司 | A kind of RFID falls to encapsulate hot-press arrangement |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120523 Termination date: 20170919 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |