CN202695395U - RFID tag packaging hot-pressing device - Google Patents

RFID tag packaging hot-pressing device Download PDF

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Publication number
CN202695395U
CN202695395U CN 201220031846 CN201220031846U CN202695395U CN 202695395 U CN202695395 U CN 202695395U CN 201220031846 CN201220031846 CN 201220031846 CN 201220031846 U CN201220031846 U CN 201220031846U CN 202695395 U CN202695395 U CN 202695395U
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CN
China
Prior art keywords
thermal head
head support
rfid tag
upper thermal
regulating block
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220031846
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Chinese (zh)
Inventor
岳学明
肖汉军
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SHENZHEN CAINA SEMICONDUCTOR EQUIPMENT CO Ltd
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SHENZHEN CAINA SEMICONDUCTOR EQUIPMENT CO Ltd
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Priority to CN 201220031846 priority Critical patent/CN202695395U/en
Application granted granted Critical
Publication of CN202695395U publication Critical patent/CN202695395U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model is suitable for the RFID tag packaging hot-pressing technology field and discloses an RFID tag packaging hot-pressing device. Constant-pressure cylinders which allow a heating unit to move are arranged between upper hot-pressing head bodies and the heating unit. Due to the arrangement of the constant-pressure cylinders between the upper hot-pressing head bodies and the heating unit, the pressure of each constant-pressure cylinder is equal when a chip and an antenna are solidified by means of the match between the upper hot-pressing heads and lower hot-pressing heads. Even if the distances between the one or more upper hot-pressing heads and the lower hot-pressing heads are different, the pressure on the chip by the upper hot-pressing heads and the pressure on the chip by the lower hot-pressing heads are equal. In this way, avoided is the error which may be caused by the inconsistent pressure between the multiple upper hot-pressing heads and the multiple lower hot-pressing heads.

Description

RFID Tag Packaging hot-press arrangement
Technical field
The utility model relates to RFID Tag Packaging technical field, particularly a kind of RFID Tag Packaging hot-press arrangement.
Background technology
Existing RFID Tag Packaging hot-press arrangement is typically provided with a plurality of thermal heads, and each thermal head is that independent Electric Machine Control is arranged, and its manufacturing cost is high on the one hand; Easily generation is asynchronous when hot pressing for each thermal head of independently controlling on the other hand, thus the little difference of pressure when making each chip hot pressing, and then affect chip and the curing precision that bursts at the seams.When each thermal head occurred not at same level, each motor did not cushion surplus, and the chip that can cause is stressed greatly, and some chips are stressed little, thereby the precision of chip with the curing of bursting at the seams was exerted an influence yet.Existing RFID Tag Packaging hot-press arrangement is when needs are changed the RFID label antenna simultaneously, and the hot pressing equipment is difficult to deacclimatize, and the width of two heat extraction pressure heads also is inconvenient to adjust.
The utility model content
The technical problem that the utility model mainly solves provides a kind of RFID Tag Packaging hot-press arrangement, and what produce when this RFID Tag Packaging hot-press arrangement can avoid the Electric Machine Control thermal head to move is asynchronous, causes the different errors that produce of each chip pressure; Simultaneously can reduce cost.
In order to address the above problem, the utility model provides a kind of RFID Tag Packaging hot-press arrangement, this RFID Tag Packaging hot-press arrangement comprises frame and the upper thermal head support and the lower thermal head support that are slidingly connected with this frame respectively, the thermal head support is provided with upper thermal head corresponding to lower thermal head on a plurality of and lower thermal head support on described, wherein said upper thermal head comprises the upper thermal head body and the constant voltage cylinder that with this on thermal head body be connected fixing with upper thermal head support, and the output of this constant voltage cylinder is connected with electro-heat equipment.
Preferably, be provided with level(l)ing device and upper thermal head fixture between described upper thermal head body and the upper thermal head support, this level(l)ing device comprises the first regulating block and the second regulating block that is bolted and regulates in mutually perpendicular direction, described the first regulating block is connected with upper thermal head body, and described the second regulating block is connected with upper thermal head support by upper thermal head fixture.
Preferably, described lower thermal head comprises electro-heat equipment, between this electro-heat equipment and lower thermal head support, be provided with level(l)ing device, this level(l)ing device comprises the first regulating block and the second regulating block that is bolted and regulates in mutually perpendicular direction, described the first regulating block is connected with electro-heat equipment, and described the second regulating block is connected with lower thermal head support by lower thermal head fixture.
Preferably, be provided with between described upper thermal head support and the frame and drive this upper thermal head support along the first motor of machine frame movement, be provided with this time of driving thermal head support between lower thermal head support and the frame along the second motor of machine frame movement.
Preferably, thermal head support both sides are respectively equipped with rotating paper tape blowing rod and paper tape rewinding rod on described, and wherein said paper tape rewinding rod is by the 3rd motor-driven that is arranged on the upper thermal head support.
Preferably, described upper thermal head support is or/and be provided with the guider that cooperatively interacts between lower thermal head support and the frame.
Preferably, described electro-heat equipment comprises pressure head and the electrically heated rod that cooperates with this pressure head, between this electrically heated rod and the level(l)ing device or on be provided with heat insulation between the thermal head body, wherein this heat insulation and the second regulating block or the first regulating block are fixed.
Preferably, described heat insulation is U-shaped.
Preferably, between described upper thermal head and the upper thermal head support or/and be provided with magnet between lower thermal head and the lower thermal head support.
The utility model RFID Tag Packaging hot-press arrangement is by being provided with the constant voltage cylinder that electro-heat equipment is moved between upper thermal head body and electro-heat equipment.Owing to being provided with the constant voltage cylinder between thermal head body and the electro-heat equipment on described, when thermal head cooperates chip and antenna curing with lower thermal head on described, the pressure of each constant voltage cylinder is identical, even when thermal head is not identical with spacing between the lower thermal head on one or more, also can so that upper thermal head is identical to the pressure of chip with lower thermal head, avoid the error of the generation of the inconsistent generation of pressure between a plurality of upper thermal heads and a plurality of lower thermal head.Adopt simultaneously its cost of constant voltage cylinder lower.
Description of drawings
Fig. 1 is the utility model RFID Tag Packaging hot-press arrangement example structure schematic diagram;
Fig. 2 is lower thermal head and lower thermal head example structure decomposition texture schematic diagram.Below in conjunction with embodiment, and with reference to accompanying drawing, realization, functional characteristics and the advantage of the utility model purpose is described further.
Embodiment
As depicted in figs. 1 and 2, the utility model provides a kind of RFID Tag Packaging hot-press arrangement embodiment.
This RFID Tag Packaging hot-press arrangement comprises frame 1 and the upper thermal head support 3 and the lower thermal head support 2 that are slidingly connected with this frame 1 respectively, thermal head support 3 is provided with upper thermal head 31 corresponding to lower thermal head 21 on a plurality of and lower thermal head support 2 on described, the quantity that is described lower thermal head 21 is identical with the quantity of upper thermal head 31, and lower thermal head 21 is relative with upper thermal head 31 positions, wherein said upper thermal head 31 comprises the upper thermal head body 30 and the constant voltage cylinder 32 that is connected with thermal head body 30 on this of fixing with upper thermal head support 3, and the output of this constant voltage cylinder 32 is connected with electro-heat equipment 33.
Specifically, be sequentially with level(l)ing device 36 and upper thermal head fixture 35 between described upper thermal head body 30 and the upper thermal head support 3, this level(l)ing device 36 comprises the first regulating block 361 and the second regulating block 362 that is bolted and regulates in mutually perpendicular direction, described the first regulating block 361 is connected with upper thermal head body 30, and described the second regulating block 362 is connected with upper thermal head support 3 by upper thermal head fixture 35.Described upper thermal head support 3 is connected with the first motor 4 on being fixed on frame 1, the second motor 5 that is fixed on the lower thermal head support 2 is connected with frame 1, be to be provided with between described upper thermal head support 3 and the frame 1 to drive the first motor 4 that thermal head support 3 moves along frame 1 on this, be provided with between lower thermal head support 2 and the frame 1 and drive the second motor 5 that this time thermal head support 2 moves along frame 1.
Described constant voltage cylinder 32 is connected with cylinder holder 34, and this cylinder holder 34 is connected with guide rail 301 on the upper thermal head body 30, and this guide rail 301 is connected with electro-heat equipment 33.
Described lower thermal head 21 comprises electro-heat equipment 33, between this electro-heat equipment 33 and lower thermal head support 2, be sequentially with level(l)ing device 36 and upper thermal head fixture 35, this level(l)ing device 36 comprises the first regulating block 361 and the second regulating block 362 that is bolted on the mutually perpendicular direction adjusting, described the first regulating block 361 is connected with electro-heat equipment 33, described the second regulating block 362 is connected with lower thermal head support 2 by lower thermal head fixture 39, this level(l)ing device 36 can be regulated in mutually perpendicular direction, more easily make the pressure head end face on the electro-heat equipment and be parallel to each other better curing chip.
During work, after chip point glue is had good positioning, on under the driving of the first motor 4 and the second motor 5 thermal head support 3 and lower on thermal head support 2 relatively move along frame 1 respectively, after upper thermal head 31 and lower upper thermal head 21 move to the upper and lower surface of chip, promote electro-heat equipment 33 by the constant voltage cylinder 32 on the upper thermal head 31 again and move, make the pressure on each chip identical.Be arranged so that by adaptation the temperature of electro-heat equipment will chip just be pressed onto on the antenna and its is solidified.
Owing to being provided with constant voltage cylinder 32 between thermal head body 30 and the electro-heat equipment 33 on described, when thermal head 31 cooperates chip and antenna curing with lower thermal head 21 on described, the pressure of each constant voltage cylinder 32 is identical, even when thermal head is not identical with spacing between the lower thermal head on one or more, also can so that upper thermal head is identical to the pressure of chip with lower thermal head, avoid the error of the generation of the inconsistent generation of pressure between a plurality of upper thermal heads and a plurality of lower thermal head.
Thermal head support 3 both sides are respectively equipped with rotating paper tape blowing rod 8 and paper tape rewinding rod 7 on described, and wherein said paper tape rewinding rod 7 is driven by the 3rd motor 9, and under the 3rd motor 9 drove, paper tape rewinding rod 7 drove blowing rod 8 by paper tape and rotates.
Described upper thermal head support 3 is or/and be provided with the guider (accompanying drawing does not indicate) that cooperatively interacts between lower thermal head support 2 and the frame 1, this guider can better make thermal head support 3 and lower thermal head support 2 slide steadily with frame 1, and moving direction is stable.
Described electro-heat equipment 33 comprises pressure head and the electrically heated rod that cooperates with this pressure head, is being provided with heat insulation 37 between this electrically heated rod and the level(l)ing device 36 or between electrically heated rod and the upper thermal head body 30, and this heat insulation 37 is U-shaped.This heat insulation 37 can separate electro-heat equipment 33 and level(l)ing device 36 or upper thermal head body 30, reduces heat transmission, and then reduces thermal loss, reduces energy consumption.
Be respectively equipped with the magnet 38 for fixing upper thermal head 31 and lower thermal head 21 between described upper thermal head 31 and the upper thermal head support 3 and between lower thermal head 21 and the lower thermal head support 2.
The above only is preferred embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.

Claims (9)

1.RFID Tag Packaging hot-press arrangement, comprise frame and the upper thermal head support and the lower thermal head support that are slidingly connected with this frame respectively, the thermal head support is provided with upper thermal head corresponding to lower thermal head on a plurality of and lower thermal head support on described, it is characterized in that:
Described upper thermal head comprises the upper thermal head body and the constant voltage cylinder that with this on thermal head body be connected fixing with upper thermal head support, and the output of this constant voltage cylinder is connected with electro-heat equipment.
2. RFID Tag Packaging hot-press arrangement according to claim 1 is characterized in that:
Be provided with level(l)ing device and upper thermal head fixture between described upper thermal head body and the upper thermal head support, this level(l)ing device comprises the first regulating block and the second regulating block that is bolted and regulates in mutually perpendicular direction, described the first regulating block is connected with upper thermal head body, and described the second regulating block is connected with upper thermal head support by upper thermal head fixture.
3. RFID Tag Packaging hot-press arrangement according to claim 1 is characterized in that:
Described lower thermal head comprises electro-heat equipment, between this electro-heat equipment and lower thermal head support, be provided with level(l)ing device, this level(l)ing device comprises and being bolted, and the first regulating block and the second regulating block in the mutually perpendicular direction adjusting, described the first regulating block is connected with electro-heat equipment, and described the second regulating block is connected with lower thermal head support by lower thermal head fixture.
4. it is characterized in that according to claim 1 or 3 described RFID Tag Packaging hot-press arrangements:
Be provided with between described upper thermal head support and the frame and drive this upper thermal head support along the first motor of machine frame movement, be provided with this time of driving thermal head support between lower thermal head support and the frame along the second motor of machine frame movement.
5. RFID Tag Packaging hot-press arrangement according to claim 1 and 2 is characterized in that:
Thermal head support both sides are respectively equipped with rotating paper tape blowing rod and paper tape rewinding rod on described, and wherein said paper tape rewinding rod is by the 3rd motor-driven that is arranged on the upper thermal head support.
6. RFID Tag Packaging hot-press arrangement according to claim 1 and 2 is characterized in that:
Described upper thermal head support is or/and be provided with the guider that cooperatively interacts between lower thermal head support and the frame.
7. RFID Tag Packaging hot-press arrangement according to claim 1 and 2 is characterized in that:
Described electro-heat equipment comprises pressure head and the electrically heated rod that cooperates with this pressure head, between this electrically heated rod and the level(l)ing device or on be provided with heat insulation between the thermal head body, wherein this heat insulation and the second regulating block or the first regulating block are fixed.
8. RFID Tag Packaging hot-press arrangement according to claim 7 is characterized in that:
Described heat insulation is U-shaped.
9. according to claim 1,2 or 3 described RFID Tag Packaging hot-press arrangements, it is characterized in that:
Between described upper thermal head and the upper thermal head support or/and be provided with magnet between lower thermal head and the lower thermal head support.
CN 201220031846 2011-04-22 2012-01-12 RFID tag packaging hot-pressing device Expired - Fee Related CN202695395U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220031846 CN202695395U (en) 2011-04-22 2012-01-12 RFID tag packaging hot-pressing device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201120124369.5 2011-04-22
CN201120124369 2011-04-22
CN 201220031846 CN202695395U (en) 2011-04-22 2012-01-12 RFID tag packaging hot-pressing device

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CN202695395U true CN202695395U (en) 2013-01-23

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104369408A (en) * 2014-10-13 2015-02-25 华中科技大学 Hot-pressing curing device for manufacturing ultrahigh-frequency RFID label
CN104681468A (en) * 2015-02-11 2015-06-03 上海博应信息技术有限公司 Inverted package hot pressing device of RFID (Radio Frequency Identification) electronic tag
CN105428257A (en) * 2015-12-11 2016-03-23 湖北华威科智能技术有限公司 Large-size RFID tag inverted packaging technology
CN112884112A (en) * 2021-03-19 2021-06-01 德龙信息技术(苏州)有限公司 Hot-pressing structure for inverted packaging of RFID (radio frequency identification) tag
CN113257719A (en) * 2021-06-15 2021-08-13 中科长光精拓智能装备(苏州)有限公司 Packaging device and packaging method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104369408A (en) * 2014-10-13 2015-02-25 华中科技大学 Hot-pressing curing device for manufacturing ultrahigh-frequency RFID label
CN104681468A (en) * 2015-02-11 2015-06-03 上海博应信息技术有限公司 Inverted package hot pressing device of RFID (Radio Frequency Identification) electronic tag
CN104681468B (en) * 2015-02-11 2017-07-18 上海博应信息技术有限公司 A kind of RFID falls to encapsulate hot-press arrangement
CN105428257A (en) * 2015-12-11 2016-03-23 湖北华威科智能技术有限公司 Large-size RFID tag inverted packaging technology
CN112884112A (en) * 2021-03-19 2021-06-01 德龙信息技术(苏州)有限公司 Hot-pressing structure for inverted packaging of RFID (radio frequency identification) tag
CN113257719A (en) * 2021-06-15 2021-08-13 中科长光精拓智能装备(苏州)有限公司 Packaging device and packaging method thereof
CN113257719B (en) * 2021-06-15 2021-09-28 中科长光精拓智能装备(苏州)有限公司 Packaging device and packaging method thereof

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Addressee: SHENZHEN CAINA SEMICONDUCTOR EQUIPMENT Co.,Ltd.

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130123

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CF01 Termination of patent right due to non-payment of annual fee