CN112884112A - Hot-pressing structure for inverted packaging of RFID (radio frequency identification) tag - Google Patents
Hot-pressing structure for inverted packaging of RFID (radio frequency identification) tag Download PDFInfo
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- CN112884112A CN112884112A CN202110294834.8A CN202110294834A CN112884112A CN 112884112 A CN112884112 A CN 112884112A CN 202110294834 A CN202110294834 A CN 202110294834A CN 112884112 A CN112884112 A CN 112884112A
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- 238000007731 hot pressing Methods 0.000 title claims abstract description 107
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 70
- 238000009413 insulation Methods 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000009434 installation Methods 0.000 claims description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000000034 method Methods 0.000 description 7
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/065—Press rams
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a hot-pressing structure for reverse packaging of an RFID (radio frequency identification) tag, which comprises an upper-layer hot-pressing head main body and a lower-layer hot-pressing head main body, wherein the upper-layer hot-pressing head main body comprises a cylinder module, a guide rod module and a pressure head module, the cylinder module consists of an upper-layer magnet, a cylinder seat, an external thread cylinder and a pipe joint, the guide rod module consists of a guide rod seat, a guide rod and a guide sleeve, the pressure head module consists of an adjusting base plate, a heat insulation connecting block, an upper-layer heating rod, an upper-layer temperature sensor and an upper-layer heating block, a wire binding seat is arranged on the outer side of the cylinder seat, the upper-layer magnet is positioned at the upper end of the cylinder seat. According to the hot-pressing structure for the reverse packaging of the RFID tag, the upper-layer hot-pressing head main body and the lower-layer hot-pressing head main body are arranged up and down, the material belt is positioned between the upper-layer hot-pressing head main body and the lower-layer hot-pressing head main body, and the chip is positioned in the center of the hot-pressing head.
Description
Technical Field
The invention relates to the field of label reverse packaging, in particular to a hot-pressing structure for reverse packaging of an RFID label.
Background
The hot-pressing structure of the RFID label inverted packaging is a supporting device for packaging and pressing, the hot-pressing head assembly is a key component in the hot-pressing and laminating process of the RFID label inverted packaging device, and the effective combination of the RFID antenna substrate and the chip is completed through the hot pressing of the RFID chip. In recent years, with the rapid expansion of the demand of RFID electronic tags, the requirement of hot-pressing die bonding is higher and higher, so that not only can the chip be attached to the RFID antenna substrate at a high speed, but also the reliability and consistency of the produced RFID tags can be ensured, and the reading sensitivity is high.
There is certain drawback in current RFID label hot pressing structure of falling encapsulation when using, present equipment adopts the hot pressing head subassembly of cylinder type to carry out the paster hot pressing more, this kind of cylinder type hot pressing head often can have the life-span weak point, leak gas easily, pressure is unstable, sometimes still can have the jamming phenomenon, the hot pressing head pushes down the plane and leads to the pressurized inequality with the label plane nonparallel, the condition that the chip damaged appears in serious time, be unfavorable for people's use, certain adverse effect has been brought to people's use, for this reason, we provide a hot pressing structure that is used for the RFID label to fall the encapsulation.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a hot-pressing structure for inverted packaging of an RFID (radio frequency identification) tag, which is characterized in that an upper-layer hot-pressing head main body and a lower-layer hot-pressing head main body are arranged up and down, a material belt is positioned between the upper-layer hot-pressing head main body and the lower-layer hot-pressing head main body, and a chip is positioned in the center of the hot-pressing head.
(II) technical scheme
In order to achieve the purpose, the invention adopts the technical scheme that: a hot-pressing structure for reverse packaging of RFID labels comprises an upper-layer hot-pressing head main body and a lower-layer hot-pressing head main body, wherein the upper-layer hot-pressing head main body comprises a cylinder module, a guide rod module and a pressure head module, the cylinder module comprises an upper-layer magnet, a cylinder seat, an external thread cylinder and a pipe joint, the guide rod module comprises a guide rod seat, a guide rod and a guide sleeve, the pressure head module comprises an adjusting base plate, a heat insulation connecting block, an upper-layer heating rod, an upper-layer temperature sensor and an upper-layer heating block, a binding seat is arranged on the outer side of the cylinder seat, the upper-layer magnet is positioned at the upper end of the cylinder seat, the external thread cylinder is positioned on the inner side of the cylinder seat, the guide rod is positioned at the lower end of the external thread cylinder, the guide sleeve is positioned on the outer side of the guide rod, the adjusting base plate is positioned at the upper end of the upper-layer heating rod, the, the upper heating block is located the lower extreme of upper heating rod, lower floor's hot pressing head main part includes lower floor's heating block, lower floor's temperature sensor, apron, lower floor's magnet, base, lower floor's magnet is located the lower extreme of base, lower floor's temperature sensor is located the outside of lower floor's heating rod, be provided with chip and material area between upper hot pressing head main part and the lower floor's hot pressing head main part, the chip is located the upper end in material area.
As a preferred technical scheme, the upper layer hot pressing head main body is adsorbed on equipment through an upper layer magnet, and the external thread air cylinder is made to stretch out and draw back for 5mm of stroke through the pipe joint.
As a preferable technical scheme, the guide rod and the guide sleeve slide relatively, and when the external thread cylinder extends out, the guide rod is pressed down under certain pressure.
As a preferred technical scheme, a first thread is arranged between the guide rod and the heat insulation connecting block, the lower end of the guide rod is connected with the inner side of the heat insulation connecting block through the first thread, a second thread is arranged between the heat insulation connecting block and the upper heating block, the outer side of the heat insulation connecting block is connected with the inner side of the upper heating block through the second thread, and the lead parts of the upper heating rod and one end of the upper temperature sensor are led out to the lead base from the position of the heat insulation connecting block.
As a preferred technical scheme, a sliding-in fixture block and a jackscrew are arranged between the air cylinder seat and the guide rod seat, the lower end of the air cylinder seat is connected with the upper end of the guide rod seat in a clamping manner through the sliding-in fixture block, and the air cylinder seat is fixed through the jackscrew.
As an optimal technical scheme, the upper-layer hot-pressing head main body and the lower-layer hot-pressing head main body are arranged up and down, the upper-layer hot-pressing head main body and the lower-layer hot-pressing head main body are connected through a material belt, a positioning block is arranged between a chip and the material belt, and the upper end of the material belt is connected with the lower end of the chip through the positioning block.
As a preferred technical scheme, be provided with the mounting bracket between lower floor's heating rod and the lower floor temperature sensor, the outside of lower floor's heating rod is passed through the inboard location of mounting bracket and lower floor temperature sensor and is connected, be provided with the installation piece between lower floor's hot pressing head main part and the lower floor heating piece, the outside of lower floor's hot pressing head main part is passed through the inboard location of installation piece and lower floor heating piece and is connected.
As a preferred technical scheme, an upper mounting rod is arranged between the air cylinder module and the guide rod module, the upper end of the guide rod module is movably connected with the upper mounting rod, a lower mounting rod is arranged between the guide rod module and the pressure head module, and the lower end of the guide rod module is movably connected with the upper end of the pressure head module through the lower mounting rod.
(III) advantageous effects
Compared with the prior art, the invention provides a hot-pressing structure for reverse packaging of an RFID (radio frequency identification) tag, which has the following beneficial effects: the upper-layer hot-pressing head main body and the lower-layer hot-pressing head main body are arranged up and down, a material belt is positioned between the upper-layer hot-pressing head main body and the lower-layer hot-pressing head main body, and a chip is positioned at the center of the hot-pressing head, so that the RFID tag hot-pressing structure has the characteristics of compact structure, convenience in installation, simplicity in maintenance and the like, the upper-layer hot-pressing head main body is divided into three modules, namely an air cylinder module, a guide rod module and a pressure head module, the air cylinder module consists of an upper-layer magnet, an air cylinder seat, an external thread air cylinder and a pipe joint, the guide rod module consists of a guide rod seat, a guide rod and a guide sleeve, the pressure head module consists of an adjusting backing plate, a heat insulation connecting block, an upper-layer heating block, the air cylinder module is adsorbed on equipment through the magnet, the external thread air cylinder can stretch by 5mm of stroke, the heating rod, temperature sensor arranges in the heating block, the heating rod, temperature sensor lead part is drawn forth to the lead wire seat from thermal-insulated connecting block, it is diameter 15mm to go up the circular size of hot pressing head, square length of side is 15mm, hot pressing head cylinder block and guide arm seat block are blocked through sliding in, it is fixed with it through 4 jackscrews, lower floor's hot pressing head main part is by lower floor's heating rod, the apron, lower floor's magnet, lower floor's heating block, lower floor's temperature sensor, the base is constituteed, the circular size of lower floor's hot pressing head main part is diameter 15mm, square length of side is 15mm, upper strata hot pressing head main part and lower floor's hot pressing head main part are overall arrangement from top to bottom, the material area is located between the two, the chip is located hot pressing head center, whole RFID.
Drawings
Fig. 1 is a schematic structural diagram of an overall hot-pressing structure for RFID tag flip-chip packaging according to the present invention.
Fig. 2 is a schematic structural diagram of a cross-sectional view of an upper layer pressure head in a hot-pressing structure for RFID tag flip-chip packaging according to the present invention.
Fig. 3 is a schematic structural diagram of a lower layer of a hot-pressing head in the hot-pressing structure for flip-chip packaging of RFID tags according to the present invention.
Fig. 4 is a schematic structural diagram of an upper layer of pressing head in a hot pressing structure for RFID tag flip-chip packaging according to the present invention.
Fig. 5 is a schematic structural diagram of connection of an upper press head and a lower press head in a hot-pressing structure for upside-down packaging of an RFID tag according to the present invention.
In the figure: 1. an upper layer hot pressing head main body; 2. a cylinder module; 3. a guide bar module; 4. a pressure head module; 5. an upper layer magnet; 6. a cylinder block; 7. an externally threaded cylinder; 8. a guide rod seat; 9. adjusting the base plate; 10. an upper heating rod; 11. an upper heating block; 12. a pipe joint; 13. a wire binding seat; 14. a guide bar; 15. a guide sleeve; 16. a heat insulation connecting block; 17. an upper layer temperature sensor; 18. a lower-layer hot-pressing head main body; 19. a lower layer heating rod; 20. a cover plate; 21. a lower layer magnet; 22. a lower heating block; 23. a lower layer temperature sensor; 24. a base; 25. a chip; 26. a material belt.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1-5, a hot-pressing structure for RFID tag flip-chip packaging comprises an upper hot-pressing head body 1 and a lower hot-pressing head body 18, wherein the upper hot-pressing head body 1 comprises a cylinder module 2, a guide rod module 3 and a pressure head module 4, the cylinder module 2 comprises an upper magnet 5, a cylinder base 6, an external thread cylinder 7 and a pipe joint 12, the guide rod module 3 comprises a guide rod base 8, a guide rod 14 and a guide sleeve 15, the pressure head module 4 comprises an adjusting shim plate 9, a heat insulation connecting block 16, an upper heating rod 10, an upper temperature sensor 17 and an upper heating block 11, a wire binding base 13 is arranged on the outer side of the cylinder base 6, the upper magnet 5 is arranged on the upper end of the cylinder base 6, the external thread cylinder 7 is arranged on the inner side of the cylinder base 6, the guide rod 14 is arranged on the lower end of the external thread cylinder 7, the guide sleeve 15 is arranged on the outer side of the guide rod 14, the adjusting, the thermal-insulated connecting block 16 is located the outside of upper heating rod 10, upper temperature sensor 17 is located the outside of upper heating rod 10, upper heating block 11 is located the lower extreme of upper heating rod 10, lower floor's hot pressing head main part 18 includes lower floor's heating block 22, lower floor's temperature sensor 23, apron 20, lower floor's magnet 21, base 24, lower floor's magnet 21 is located the lower extreme of base 24, lower floor's temperature sensor 23 is located the outside of lower floor's heating rod 19, be provided with chip 25 and material area 26 between upper hot pressing head main part 1 and the lower floor's hot pressing head main part 18, chip 25 is located the upper end in material area 26.
Further, upper strata hot pressing head main part 1 adsorbs on equipment through upper magnet 5, makes the flexible 5mm stroke of external screw thread cylinder 7 through coupling 12, conveniently fixes a position.
Furthermore, the guide rod 14 and the guide sleeve 15 slide relatively, and when the external thread cylinder 7 extends out, the guide rod 14 is pressed down at a certain pressure, so that the pressing is more convenient.
Furthermore, a first thread is arranged between the guide rod 14 and the heat insulation connecting block 16, the lower end of the guide rod 14 is connected with the inner side of the heat insulation connecting block 16 through the first thread, a second thread is arranged between the heat insulation connecting block 16 and the upper heating block 11, the outer side of the heat insulation connecting block 16 is connected with the inner side of the upper heating block 11 through the second thread, and the lead parts of the upper heating rod 10 and one end of the upper temperature sensor 17 are led out to the lead base from the position of the heat insulation connecting block 16, so that the heating operation is facilitated.
Further, be provided with between cylinder block 6 and the guide arm seat 8 and slide in fixture block and jackscrew, the lower extreme of cylinder block 6 is connected through the upper end block that slides in fixture block and guide arm seat 8, and fixes it through 4 jackscrews, and the activity is adjusted more smoothly.
Further, upper hot pressing head main part 1 and lower floor's hot pressing head main part 18 are overall arrangement from top to bottom, and are connected through material area 26 between upper hot pressing head main part 1 and the lower floor's hot pressing head main part 18, are provided with the locating piece between chip 25 and the material area 26, and the lower extreme positioning connection of locating piece and chip 25 is passed through to the upper end of material area 26, is convenient for carry out upper positioning operation.
Further, be provided with the mounting bracket between lower floor's heating rod 19 and lower floor temperature sensor 23, the inboard location of mounting bracket and lower floor temperature sensor 23 is passed through in the outside of lower floor's heating rod 19 and is connected, is provided with the installation piece between lower floor's hot pressing head main part 18 and the lower floor heating piece 22, and the inboard location of installation piece and lower floor heating piece 22 is passed through in the outside of lower floor's hot pressing head main part 18 is connected, increases the pressure head result of use.
Further, an upper mounting rod is arranged between the cylinder module 2 and the guide rod module 3, the upper end of the guide rod module 3 is movably connected with the upper mounting rod, a lower mounting rod is arranged between the guide rod module 3 and the pressure head module 4, and the lower end of the guide rod module 3 is movably connected with the upper end of the pressure head module 4 through the lower mounting rod, so that the support and the movement are facilitated.
The working principle is as follows: the invention comprises an upper layer hot-pressing head main body 1, a cylinder module 2, a guide rod module 3, a pressure head module 4, an upper layer magnet 5, a cylinder seat 6, an external thread cylinder 7, a guide rod seat 8, an adjusting shim plate 9, an upper layer heating rod 10, an upper layer heating block 11, a pipe joint 12, a binding wire seat 13, a guide rod 14, a guide sleeve 15, a heat insulation connecting block 16, an upper layer temperature sensor 17, a lower layer hot-pressing head main body 18, a lower layer heating rod 19, a cover plate 20, a lower layer magnet 21, a lower layer heating block 22, a lower layer temperature sensor 23, a base 24, a chip 25 and a material belt 26, wherein the upper layer hot-pressing head main body 1 is divided into three modules of the cylinder module 2, the guide rod module 3 and the pressure head module 4, the cylinder module 2 consists of the upper layer magnet 5, the cylinder seat 6, the external thread cylinder 7 and the pipe joint 12, the guide rod module 3 consists of the, The heat insulation connecting block 16, the upper heating rod 10, the upper temperature sensor 17 and the upper heating block 11 are arranged on equipment through magnets, the external thread cylinder 7 is made to stretch and retract by 5mm of stroke through the pipe joint 12, the guide pillar and the guide sleeve 15 slide relatively, when the cylinder extends out, the guide rod 14 is pressed down under certain pressure, the heat insulation connecting block 16 is in threaded connection with the guide rod 14, the heat insulation connecting block 16 is in threaded connection with the heating block, the heating rod and the temperature sensor are arranged in the heating block, the heating rod and the lead part of the temperature sensor are led out from the heat insulation connecting block 16 to a lead seat, the circular size of the upper hot-pressing head is 15mm, the side length of a square is 15mm, the hot-pressing head cylinder seat 6 and the guide rod seat 8 are clamped through sliding in and are fixed through 4 jackscrews, and the lower hot-pressing head main body 18 is composed of a lower heating rod 19, a cover plate, The base 24 is formed, the circular size of the lower-layer hot-pressing head main body 18 is 15mm in diameter, the side length of a square is 15mm, the upper-layer hot-pressing head main body 1 and the lower-layer hot-pressing head main body 18 are in up-and-down layout, the material belt 26 is located between the upper-layer hot-pressing head main body and the lower-layer hot-pressing head main body, and the chip 25 is located at the center of the hot-pressing head.
It is noted that, herein, relational terms such as first and second (a, b, etc.) and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. The utility model provides a hot pressing structure for RFID label is turned over and is capsulated, includes upper hot pressing head main part (1) and lower floor hot pressing head main part (18), its characterized in that: the upper-layer hot-pressing head main body (1) comprises an air cylinder module (2), a guide rod module (3) and a pressure head module (4), wherein the air cylinder module (2) consists of an upper-layer magnet (5), an air cylinder seat (6), an external thread air cylinder (7) and a pipe joint (12), the guide rod module (3) consists of a guide rod seat (8), a guide rod (14) and a guide sleeve (15), the pressure head module (4) consists of an adjusting backing plate (9), a heat insulation connecting block (16), an upper-layer heating rod (10), an upper-layer temperature sensor (17) and an upper-layer heating block (11), a wire binding seat (13) is arranged on the outer side of the air cylinder seat (6), the upper-layer magnet (5) is positioned at the upper end of the air cylinder seat (6), the external thread air cylinder (7) is positioned on the inner side of the air cylinder seat (6), the guide rod (14) is positioned at the lower end of the external thread air cylinder (7), and the guide, adjusting plate (9) are located the upper end of upper heating rod (10), thermal-insulated connecting block (16) are located the outside of upper heating rod (10), upper temperature sensor (17) are located the outside of upper heating rod (10), upper heating block (11) are located the lower extreme of upper heating rod (10), lower floor's hot pressing head main part (18) are including lower floor's heating block (22), lower floor's temperature sensor (23), apron (20), lower floor's magnet (21), base (24), lower floor's magnet (21) are located the lower extreme of base (24), lower floor's temperature sensor (23) are located the outside of lower floor's heating rod (19), be provided with chip (25) and material area (26) between upper hot pressing head main part (1) and lower floor's hot pressing head main part (18), chip (25) are located the upper end of lower floor's heating rod (26).
2. The hot-press structure for RFID tag flip-chip packaging according to claim 1, wherein: the upper-layer hot-pressing head main body (1) is adsorbed on equipment through an upper-layer magnet (5), and the external thread cylinder (7) is made to stretch out and draw back by 5mm of stroke through a pipe joint (12).
3. The hot-press structure for RFID tag flip-chip packaging according to claim 1, wherein: the guide rod (14) and the guide sleeve (15) slide relatively, and when the external thread cylinder (7) extends out, the guide rod (14) is pressed down with certain pressure.
4. The hot-press structure for RFID tag flip-chip packaging according to claim 1, wherein: be provided with a screw thread between guide arm (14) and thermal-insulated connecting block (16), the lower extreme of guide arm (14) is connected through a screw thread and the inboard of thermal-insulated connecting block (16), be provided with No. two screw threads between thermal-insulated connecting block (16) and upper heating piece (11), the outside of thermal-insulated connecting block (16) is connected through No. two screw threads and the inboard of upper heating piece (11), the lead wire part of upper heating rod (10), upper temperature sensor (17) one end is drawn forth to the base of lead wire from the position of thermal-insulated connecting block (16).
5. The hot-press structure for RFID tag flip-chip packaging according to claim 1, wherein: a sliding-in fixture block and a jackscrew are arranged between the air cylinder seat (6) and the guide rod seat (8), the lower end of the air cylinder seat (6) is connected with the upper end of the guide rod seat (8) in a clamping manner through the sliding-in fixture block, and is fixed through 4 groups of jackscrews.
6. The hot-press structure for RFID tag flip-chip packaging according to claim 1, wherein: the upper hot pressing head main body (1) and the lower hot pressing head main body (18) are arranged up and down, the upper hot pressing head main body (1) and the lower hot pressing head main body (18) are connected through a material belt (26), a positioning block is arranged between the chip (25) and the material belt (26), and the upper end of the material belt (26) is connected with the lower end of the chip (25) in a positioning mode through the positioning block.
7. The hot-press structure for RFID tag flip-chip packaging according to claim 1, wherein: be provided with the mounting bracket between lower floor's heating rod (19) and lower floor temperature sensor (23), the inboard location of mounting bracket and lower floor temperature sensor (23) is passed through in the outside of lower floor heating rod (19) is connected, be provided with the installation piece between lower floor's hot pressing head main part (18) and lower floor heating block (22), the inboard location of installation piece and lower floor heating block (22) is passed through in the outside of lower floor's hot pressing head main part (18).
8. The hot-press structure for RFID tag flip-chip packaging according to claim 1, wherein: be provided with upper installation pole between cylinder module (2) and guide arm module (3), the upper end of guide arm module (3) is through upper installation pole swing joint, be provided with lower floor's installation pole between guide arm module (3) and pressure head module (4), the lower extreme of guide arm module (3) is through the upper end swing joint of lower floor's installation pole and pressure head module (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110294834.8A CN112884112A (en) | 2021-03-19 | 2021-03-19 | Hot-pressing structure for inverted packaging of RFID (radio frequency identification) tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110294834.8A CN112884112A (en) | 2021-03-19 | 2021-03-19 | Hot-pressing structure for inverted packaging of RFID (radio frequency identification) tag |
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| Publication Number | Publication Date |
|---|---|
| CN112884112A true CN112884112A (en) | 2021-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110294834.8A Pending CN112884112A (en) | 2021-03-19 | 2021-03-19 | Hot-pressing structure for inverted packaging of RFID (radio frequency identification) tag |
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| CN (1) | CN112884112A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202695395U (en) * | 2011-04-22 | 2013-01-23 | 深圳才纳半导体设备有限公司 | RFID tag packaging hot-pressing device |
| CN104476896A (en) * | 2014-10-24 | 2015-04-01 | 湖北华威科智能技术有限公司 | Hot-pressing head device for inverted encapsulation of RFID label |
| CN104681468A (en) * | 2015-02-11 | 2015-06-03 | 上海博应信息技术有限公司 | Inverted package hot pressing device of RFID (Radio Frequency Identification) electronic tag |
-
2021
- 2021-03-19 CN CN202110294834.8A patent/CN112884112A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202695395U (en) * | 2011-04-22 | 2013-01-23 | 深圳才纳半导体设备有限公司 | RFID tag packaging hot-pressing device |
| CN104476896A (en) * | 2014-10-24 | 2015-04-01 | 湖北华威科智能技术有限公司 | Hot-pressing head device for inverted encapsulation of RFID label |
| CN104681468A (en) * | 2015-02-11 | 2015-06-03 | 上海博应信息技术有限公司 | Inverted package hot pressing device of RFID (Radio Frequency Identification) electronic tag |
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