CN107968148A - A kind of semiconductor refrigerating welding device and welding procedure - Google Patents
A kind of semiconductor refrigerating welding device and welding procedure Download PDFInfo
- Publication number
- CN107968148A CN107968148A CN201810067676.0A CN201810067676A CN107968148A CN 107968148 A CN107968148 A CN 107968148A CN 201810067676 A CN201810067676 A CN 201810067676A CN 107968148 A CN107968148 A CN 107968148A
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- block
- cooling
- turntable
- welding
- semiconductor chilling
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 62
- 238000003466 welding Methods 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims description 11
- 238000001816 cooling Methods 0.000 claims abstract description 94
- 238000010438 heat treatment Methods 0.000 claims abstract description 34
- 239000013078 crystal Substances 0.000 claims abstract description 17
- 238000006243 chemical reaction Methods 0.000 claims abstract description 8
- 239000011796 hollow space material Substances 0.000 claims abstract description 4
- 230000017105 transposition Effects 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000009414 blockwork Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Butt Welding And Welding Of Specific Article (AREA)
Abstract
The invention discloses a kind of semiconductor refrigerating welding device, it includes welding section and cooling zone, and heat block is provided with the top of the welding section, cooling block is provided with the top of cooling zone；Heat block is provided with liftable lower heating block in the face of the welding section bottom, cooling block is provided with liftable lower cooling block in the face of cooling zone bottom, conversion work platform is installed between the welding section and cooling zone, the conversion work platform includes rotating mechanism and the turntable for placing semiconductor chilling plate, the turntable is frame structure, the area of the hollow space of framework is not less than the area of lower heating block, and the location hole for fixing the preforming fixture of semiconductor chilling plate is provided with turntable.The semiconductor refrigerating welding device realized using the present invention can be carried out at the same time the welding of crystal grain and upper potsherd and lower potsherd, and turntable turns to cooling zone after the completion of welding can carry out two-sided cooling again, improve production efficiency.
Description
Technical field
The present invention relates to cooling piece manufacturing equipment field, more particularly to a kind of semiconductor refrigerating welding device.
Background technology
A kind of cooling device that semiconductor chilling plate is made of semiconductor, it is by upper potsherd, crystal grain and lower pottery
Three main element compositions of tile.Original semiconductor refrigerating welding device is as shown in Figure 1, it includes welding section 10 ' and cold
But area 20 ', welding section include the liftable workbench 1 ' being installed on linear guides 3 ', and heat block 2 ' is fixedly installed in welding
At the top of area and face workbench 1 ' is set, and the top of cooling zone 20 ' is provided with cooling block 4 '.The processing method of the equipment is single side
Welding：It is first positioned over semiconductor chilling plate to be formed on workbench 1 ', and aftertable 1 ' rises, and potsherd touches heating
Block 2 ', completes the welding of crystal grain and lower potsherd, afterwards turns over semiconductor chilling plate to be formed, then upper potsherd and crystal grain are welded
Connect, workbench 1 ', which is transferred to cooling zone 20 ', via linear guides 3 ' after the completion of welding is cooled down.During welding, due to work
There is about 200 DEG C of high temperature difference with heat block in platform, potsherd is produced thermal deformation, and stress caused by thermal deformation can be applied to
On crystal grain, it is cracked to be easy to cause portion crystal, or even rupture；Similarly, temperature difference is equally existed in single side cooling procedure, led
Portion crystal rupture is caused, causes refrigerator piece function reduction, or even failure.
The content of the invention
The purpose of the present invention one is to provide a kind of stable, efficient semiconductor refrigerating welding device.
Realizing the technical solution of the object of the invention is：A kind of semiconductor refrigerating welding device, it include welding section and
Cooling zone, the welding section top are provided with heat block, cooling block are provided with the top of cooling zone；The welding section bottom peace
Lower heating block equipped with heat block in face and the lower heating block lifting gear for driving lower heating block to lift, cooling zone bottom
Portion is provided with the lower cooling block of cooling block and the lower cooling block lifting gear for driving lower cooling block lifting in face, described
Conversion work platform is installed, the conversion work platform includes rotating mechanism and for placing half between welding section and cooling zone
The turntable of conductor cooling piece, the turntable are frame structure, and the area of the hollow space of framework is not less than the area of lower heating block,
It is provided with the location hole for fixing the preforming fixture of semiconductor chilling plate on turntable, it is the upper heat block, lower heating block, upper cold
But block and lower cooling block are electrically connected with temperature control system respectively.
Further, the lower heating lifting gear includes the first lifting platform, the lifting table plate bag of first lifting platform
Two piece of first support plate is included, the first spring is installed between two piece of first support plate, can be played when being touched heat block by weldment slow
Punching acts on, make lower heating block position can up and down adjustment, and then ensure the stability of upper and lower heat block work.
Further, the lower cooling lifting gear includes the second lifting platform, the lifting table plate bag of second lifting platform
Two piece of second support plate is included, second spring is installed between two piece of second support plate, buffering can be played when weldment touches cooling block
Effect, makes the position-adjustable of lower cooling block, and then ensures the stability of upper and lower cooling block work.
Further, the preforming fixture of the semiconductor chilling plate includes the clamping plate of two longitudinally opposed settings, two folders
Positioning pin is installed, the positioning pin bottom is nested in the location hole of the preforming fixture of semiconductor chilling plate between plate.Protect
Between two potsherds, dislocation will not be produced between upper and lower two potsherds and crystal grain up and down in welding process for card.
The second purpose of the present invention is to provide a kind of welding procedure of semiconductor chilling plate, it is used described in goal of the invention one
Semiconductor refrigerating welding device upper potsherd, crystal grain and lower potsherd are welded, comprise the following steps：
1）It is fixed：Upper potsherd, lower potsherd and crystal grain are fixed in the preforming fixture of semiconductor chilling plate, then will partly be led
The preforming fixture of body cooling piece is positioned on turntable；
2）Welding：Start lower heating block lifting gear, drive lower heating block to rise by lower heating block lifting gear, and then by turntable
On the preforming fixture of semiconductor chilling plate jack up and contacted with upper heat block, at this time, upper and lower heat block is set in temperature control system
At a temperature of start weld job；
3）Transposition：After the completion of weld job, lower heating block lifting gear drives lower heating block to decline and then drives semiconductor refrigerating
The preforming fixture of piece declines, and the preforming fixture of semiconductor chilling plate is still stayed on turntable, and then rotating mechanism is by turntable
And the preforming fixture of semiconductor chilling plate being positioned on turntable is rotated to cooling zone；
4）Cooling：After transposition, starting lower cooling block lifting gear, lower cooling block lifting gear drives lower cooling block to rise, and then
The preforming fixture of semiconductor chilling plate is jacked up and is contacted with upper cooling block, upper and lower cooling block is set in temperature control system at this time
At a temperature of begin to cool down operation；
5）Reset：After the completion of cooling operations, lower cooling block lifting gear drives lower cooling block to decline, and drives semiconductor chilling plate
Preforming fixture is dropped on turntable together, and turntable automatically resets, and is ready to weld next cooling piece.
The semiconductor refrigerating welding device that the present invention realizes can be carried out at the same time crystal grain and upper potsherd and lower potsherd
Welding, after the completion of welding turntable turn to cooling zone can carry out two-sided cooling again, the setting of welding temperature and time are by corresponding
Temperature control system controls, and the rise and fall of heat block, dial turning motion are also controlled by system, realize Automation of Welding, improve
Production efficiency；Due to welding at the same time and on the technique that cools down at the same time also causes semiconductor refrigeration sheet in welding, cooling procedure
Lower surface avoids thermal deformation caused by potsherd to destructive influences caused by crystal grain substantially without temperature difference,
Improve yield rate.
Brief description of the drawings
Fig. 1 is the structure diagram of original semiconductor refrigerating welding device；
Fig. 2 is the structure diagram of semiconductor refrigerating welding device described in the embodiment of the present invention；
Fig. 3 is the preforming fixture of semiconductor chilling plate described in the embodiment of the present invention and turntable schematic cross-sectional view.
Embodiment
Present pre-ferred embodiments are described further below in conjunction with attached drawing.
As shown in Figures 2 and 3, a kind of semiconductor refrigerating welding device, it includes welding section 10 and cooling zone 20, institute
State the top of welding section 10 and heat block 1 is installed, the top of cooling zone 20 is provided with cooling block 3；Pacify 10 bottom 1 of welding section
Lower heating block 2 equipped with heat block in face 1 and the lower heating block lifting gear for driving lower heating block to lift, cooling zone
20 bottoms are provided with the lower cooling block 4 of cooling block 3 and the lower cooling block for driving lower heating block to lift in face and lift dress
Put, conversion work platform 5 is installed between the welding section 10 and cooling zone 20, the conversion work platform 5 includes rotating mechanism
51 and for placing the turntable 52 of semiconductor chilling plate, the turntable 52 is frame structure, the face of the hollow space 521 of framework
Product is not less than the area of lower heating block, and the location hole for fixing the preforming fixture of semiconductor chilling plate is provided with turntable 52
522；The lower heating block lifting gear includes the first lifting platform 6, and the lifting table plate 61 of first lifting platform 6 includes two pieces the
One support plate 611, is provided with the first spring 612 between two piece of first support plate 611；Lower cooling block lifting gear includes second liter
Platform 7 drops, and the lifting table plate 71 of second lifting platform includes two piece of second support plate 711, pacifies between two piece of second support plate 711
Equipped with second spring 712；The preforming fixture 60 of semiconductor chilling plate includes the clamping plate 601 of two longitudinally opposed settings, and two
Positioning pin 602 is installed, 602 bottom of positioning pin is nested in location hole 522 between a clamping plate；The upper heat block 1,
Lower heating block 2, upper cooling block 3 and lower cooling block 4 respectively with temperature control system（It is not shown）It is electrically connected.
Wherein, lifting platform, rotating mechanism, heat block, cooling block structure are the prior art, and details are not described herein.
Upper potsherd, crystal grain and lower potsherd are welded using semiconductor refrigerating welding device described in the present embodiment
Connect, comprise the following steps：
1）It is fixed：First upper potsherd 30, lower potsherd 40 and crystal grain 50 are fixed in the preforming fixture 60 of semiconductor chilling plate,
Then the preforming fixture 60 of semiconductor chilling plate is positioned on turntable 52；
2）Welding：Start the first lifting platform 6, drive lower heating block 2 to rise by the first lifting platform 6, and then by half on turntable 52
The preforming fixture 60 of conductor cooling piece is jacked up and contacted with upper heat block 1, at this time upper and lower heating BOB(beginning of block) weld job；
3）Transposition：After the completion of weld job, the first lifting platform 6, which declines, drives the preforming fixture 60 of semiconductor chilling plate to decline and make
The preforming fixture of semiconductor chilling plate is still stayed on turntable 52, and then rotating mechanism 51 by turntable 52 and is positioned on turntable
The preforming fixture 60 of semiconductor chilling plate rotate to cooling zone 20；
4）Cooling：After transposition, the second lifting platform 7, which rises, drives lower cooling block 4 to rise, and then by the preforming folder of semiconductor chilling plate
Tool 60 is jacked up and contacted with upper cooling block 3, and upper and lower cooling block begins to cool down operation at this time；
5）Reset：After the completion of cooling operations, the second lifting platform 7 drives lower cooling block together with the preforming fixture 60 of semiconductor chilling plate
Drop to together on turntable 52, turntable 52 automatically resets, and is ready to weld next cooling piece.
Lifting device structure of the present invention can be the machinery field normal elevator structures such as leading screw lifting, lifting cylinder,
The lifting platform structure can be simple single-layer plate-like structure, but the spring supporting board combining structure in embodiment is touched in weldment
And cushioning effect can be played when cooling block or heat block, make the position-adjustable of lower cooling block/heat block, and then ensure upper and lower
The stability of cooling block/heat block work；The preforming fixture of semiconductor chilling plate is also not limited to shown in embodiment, but is implemented
Between the preforming clamp structure of example can ensure two potsherds up and down, between upper and lower two potsherds and crystal grain in welding process
Dislocation will not be produced.
The foregoing is merely the embodiment of the present invention, is not intended to limit the scope of the invention, every to utilize this hair
The equivalent process transformation that bright description is made, is directly or indirectly used in other related technical areas, similarly wraps
Include in the scope of patent protection of the present invention.
Claims (6)
1. a kind of semiconductor refrigerating welding device, it includes welding section and cooling zone, being provided with the top of the welding section
Heat block, cooling zone top are provided with cooling block, it is characterised in that：Heat block is provided with down in the face of the welding section bottom
Heat block and the lower heating block lifting gear for driving lower heating block to lift, cooling block is provided with the face of cooling zone bottom
Lower cooling block and the lower cooling block lifting gear for driving lower cooling block lifting, pacify between the welding section and cooling zone
Equipped with conversion work platform, the conversion work platform includes rotating mechanism and the turntable for placing semiconductor chilling plate, described
Turntable is frame structure, and the area of the hollow space of framework is not less than the area of lower heating block, is provided with turntable for fixing
The location hole of the preforming fixture of semiconductor chilling plate, the upper heat block, lower heating block, upper cooling block and lower cooling block difference
It is electrically connected with temperature control system.
2. semiconductor refrigerating welding device according to claim 1, it is characterised in that：The lower heating block lifting gear
Including the first lifting platform, the lifting table plate of first lifting platform includes two piece of first support plate, between two piece of first support plate
First spring is installed.
3. semiconductor refrigerating welding device according to claim 1 or 2, it is characterised in that：The lower cooling block lifting
Device includes the second lifting platform, and the lifting table plate of second lifting platform includes two piece of second support plate, two piece of second support plate
Between second spring is installed.
4. semiconductor refrigerating welding device according to claim 1, it is characterised in that：The semiconductor chilling plate in advance into
Type fixture includes the clamping plate of two longitudinally opposed settings, is provided with positioning pin between two clamping plates, the positioning pin bottom is embedding
It is placed in the location hole of the preforming fixture of semiconductor chilling plate.
A kind of 5. welding procedure of semiconductor chilling plate, it is characterised in that：It uses any one institute in claim 1 or 2 or 4
The semiconductor refrigerating welding device stated welds upper potsherd, crystal grain and lower potsherd, comprises the following steps：
1）It is fixed：Upper potsherd, lower potsherd and crystal grain are fixed in the preforming fixture of semiconductor chilling plate, then will partly be led
The preforming fixture of body cooling piece is positioned on turntable；
2）Welding：Start lower heating block lifting gear, drive lower heating block to rise by lower heating block lifting gear, and then by turntable
On the preforming fixture of semiconductor chilling plate jack up and contacted with upper heat block, at this time, upper and lower heat block is set in temperature control system
At a temperature of start weld job；
3）Transposition：After the completion of weld job, lower heating block lifting gear drives lower heating block to decline and then drives semiconductor refrigerating
The preforming fixture of piece declines, and the preforming fixture of semiconductor chilling plate is still stayed on turntable, and then rotating mechanism is by turntable
And the preforming fixture of semiconductor chilling plate being positioned on turntable is rotated to cooling zone；
4）Cooling：After transposition, starting lower cooling block lifting gear, lower cooling block lifting gear drives lower cooling block to rise, and then
The preforming fixture of semiconductor chilling plate is jacked up and is contacted with upper cooling block, upper and lower cooling block is set in temperature control system at this time
At a temperature of begin to cool down operation；
5）Reset：After the completion of cooling operations, lower cooling block lifting gear drives lower cooling block to decline, and drives semiconductor chilling plate
Preforming fixture is dropped on turntable together, and turntable automatically resets, and is ready to weld next cooling piece.
6. the welding procedure of semiconductor chilling plate according to claim 5, it is characterised in that：The lower cooling block lifting dress
Put including the second lifting platform, the lifting table plate of second lifting platform includes two piece of second support plate, two piece of second support plate it
Between second spring is installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810067676.0A CN107968148A (en) | 2018-01-24 | 2018-01-24 | A kind of semiconductor refrigerating welding device and welding procedure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810067676.0A CN107968148A (en) | 2018-01-24 | 2018-01-24 | A kind of semiconductor refrigerating welding device and welding procedure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107968148A true CN107968148A (en) | 2018-04-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810067676.0A Withdrawn CN107968148A (en) | 2018-01-24 | 2018-01-24 | A kind of semiconductor refrigerating welding device and welding procedure |
Country Status (1)
| Country | Link |
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| CN (1) | CN107968148A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109483001A (en) * | 2018-12-28 | 2019-03-19 | 湖北赛格瑞新能源科技有限公司 | A kind of welding equipment and welding method for micro thermoelectric device |
| CN110416400A (en) * | 2019-07-03 | 2019-11-05 | 合肥圣达电子科技实业有限公司 | A kind of assembling equipment and assemble method for semiconductor cooler |
| CN111592374A (en) * | 2020-06-11 | 2020-08-28 | 河南鸿昌电子有限公司 | Welding method and welding die for semiconductor refrigerating part |
| CN112077472A (en) * | 2020-08-17 | 2020-12-15 | 国为(南京)软件科技有限公司 | Semiconductor refrigeration piece welding set |
| CN112440044A (en) * | 2020-11-11 | 2021-03-05 | 泉州市依科达半导体致冷科技有限公司 | Automatic double-side welding equipment and method for three-station refrigerating device |
| CN112975029A (en) * | 2021-04-02 | 2021-06-18 | 河南鸿昌电子有限公司 | Welding method of semiconductor refrigeration piece |
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| CN106406477A (en) * | 2016-10-31 | 2017-02-15 | 华南理工大学 | Tandem type CPU heat dissipating and cooling device |
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| KR19980042506U (en) * | 1996-12-24 | 1998-09-25 | 김종진 | Weld Edge Defect Elimination Device |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109483001A (en) * | 2018-12-28 | 2019-03-19 | 湖北赛格瑞新能源科技有限公司 | A kind of welding equipment and welding method for micro thermoelectric device |
| CN110416400A (en) * | 2019-07-03 | 2019-11-05 | 合肥圣达电子科技实业有限公司 | A kind of assembling equipment and assemble method for semiconductor cooler |
| CN110416400B (en) * | 2019-07-03 | 2023-11-07 | 合肥圣达电子科技实业有限公司 | Assembling equipment and assembling method for semiconductor refrigerator |
| CN111592374A (en) * | 2020-06-11 | 2020-08-28 | 河南鸿昌电子有限公司 | Welding method and welding die for semiconductor refrigerating part |
| CN112077472A (en) * | 2020-08-17 | 2020-12-15 | 国为(南京)软件科技有限公司 | Semiconductor refrigeration piece welding set |
| CN112440044A (en) * | 2020-11-11 | 2021-03-05 | 泉州市依科达半导体致冷科技有限公司 | Automatic double-side welding equipment and method for three-station refrigerating device |
| CN112440044B (en) * | 2020-11-11 | 2022-11-04 | 泉州市依科达半导体致冷科技有限公司 | Automatic double-side welding equipment and method for three-station refrigerating device |
| CN112975029A (en) * | 2021-04-02 | 2021-06-18 | 河南鸿昌电子有限公司 | Welding method of semiconductor refrigeration piece |
| CN112975029B (en) * | 2021-04-02 | 2023-08-22 | 河南鸿昌电子有限公司 | Method for welding semiconductor refrigerating piece |
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Application publication date: 20180427 |
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