CN111592374A - Welding method and welding die for semiconductor refrigerating part - Google Patents
Welding method and welding die for semiconductor refrigerating part Download PDFInfo
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- CN111592374A CN111592374A CN202010525468.8A CN202010525468A CN111592374A CN 111592374 A CN111592374 A CN 111592374A CN 202010525468 A CN202010525468 A CN 202010525468A CN 111592374 A CN111592374 A CN 111592374A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
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Abstract
The invention relates to the technical field of semiconductor production processes, in particular to a welding method and a welding die for a semiconductor refrigerating piece; a welding method of semiconductor refrigeration parts is characterized in that a porcelain plate is welded under the condition that extrusion force in the left and right directions exists; a semiconductor refrigeration piece welding mould comprises a mould body, wherein a hollow structure is arranged in the middle of the mould body, a left gap reaching the hollow structure is formed in the left side of the upper surface of the mould body, a left force application baffle capable of moving to a station is arranged on the left side of the upper surface of the mould body, the left force application baffle is provided with a left downward extending piece and extends into the left gap, a left spring is connected with the left downward extending piece in the hollow structure and pulls the left force application baffle to move rightwards, a right stop strip is arranged on the right side of the station and is a component which is pressed against the right side of a semiconductor refrigeration piece; the method has the advantages of reducing the number of the refrigeration parts after welding, reducing the number of the later desoldering, improving the product quality, improving the yield and prolonging the service life.
Description
Technical Field
The invention relates to the technical field of semiconductor production processes, in particular to a welding method and a welding die for a semiconductor refrigerating piece.
Background
The semiconductor refrigeration piece is called refrigeration piece for short, and comprises two ceramic plates and a plurality of semiconductor crystal grains welded between the two ceramic plates, wherein the refrigeration piece is formed based on the Peltier principle, namely, when a circuit consisting of two different N-type semiconductors and P-type semiconductors is utilized and direct current is conducted, heat is released at one semiconductor (hot side), heat is absorbed at the other semiconductor (cold side), and when the current direction is changed, joints for releasing heat and absorbing heat are changed; and the phenomenon caused by the peltier effect is reversible, i.e. when there is a temperature difference between the two semiconductors, it can generate an electric potential (capable of generating an electric current); the semiconductor refrigerating element can be widely applied to refrigeration, heating, thermoelectric power generation and other aspects.
When the refrigeration piece is produced, crystal grains are arranged on the porcelain plates to form an upper porcelain plate and a lower porcelain plate, the crystal grains are clamped between the two porcelain plates, and the upper porcelain plate and the lower porcelain plate are welded on a refrigeration piece welding machine to form the refrigeration piece.
In the prior art, when the ceramic plate is welded, the ceramic plate is welded in a natural state on the plane, the ceramic plate and crystal grains are more in desoldering after welding, the later maintenance rate is high, the ceramic plate is durable for a long time, or the phenomenon of infirm welding exists, and the product quality and the high-quality product rate are influenced.
Disclosure of Invention
The invention aims to solve the defects and provide a welding method and a welding die for a semiconductor refrigerating piece, which can improve the product quality, improve the high-quality product rate and have long service life.
The technical scheme of the welding method of the semiconductor refrigerating element is realized as follows: a welding method for semiconductor refrigerating element features that the semiconductor crystal grains are arranged and clamped between upper and lower ceramic plates, which are welded under the action of left and right extruding forces parallel to the plane of ceramic plates.
Furthermore, the porcelain plate is welded under the condition that front and rear extrusion forces exist, and the left and right extrusion forces are parallel to the plane of the porcelain plate.
Further, the porcelain plates subjected to the pressing force include an upper porcelain plate and a lower porcelain plate.
The technical scheme of the welding die for the semiconductor refrigerating piece is realized as follows: a semiconductor refrigeration piece welding mould is characterized in that: the device comprises a die body, wherein a station for placing a porcelain plate is arranged on the die body, a hollow structure is arranged in the middle of the die body, a left gap reaching the hollow structure is formed in the left side of the die body, a left force application baffle capable of moving towards the station is arranged on the left side of the die body, the left force application baffle is provided with a left downward extending piece and extends into the left gap, a left spring is connected with the hollow structure and pulls the left force application baffle to move rightwards, a right stop bar is arranged on the right side of the station, and the right stop bar is a part for supporting the right side of a semiconductor refrigeration piece.
The front side of the upper surface of the die body is provided with a front gap, the front side of the upper surface of the die body is provided with a front force baffle which can move towards a station, the front force baffle is provided with a front downward extending piece and extends into the front gap, a front spring is connected with the front downward extending piece in a hollow structure and pulls the front force baffle to move backwards, the rear side of the station is provided with a rear stop bar, and the rear stop bar is a part which is abutted against the rear surface of the semiconductor refrigerating piece.
Furthermore, the die body is also provided with a part for mounting the electric heating tube and the electric heating tube.
Furthermore, a rubber layer is arranged in front of the left force application baffle and/or the right stop strip.
Furthermore, a rubber layer is arranged in front of the front force baffle and/or the rear stop strip.
Furthermore, the middle of the left spring and/or the front spring is also provided with a length adjusting rod.
The invention has the beneficial effects that: the welding method and the welding mould for the semiconductor refrigerating piece have the advantages of reducing the welded refrigerating piece, reducing the later desoldering, improving the product quality, improving the yield and prolonging the service life.
Drawings
Fig. 1 is a schematic top view of the present invention.
Fig. 2 is a cross-sectional view taken along the direction a-a in fig. 1 (in use).
Fig. 3 is a cross-sectional view taken along the direction B-B in fig. 1 (in use).
Wherein: 1. the mold comprises a mold body 2, a refrigerating element 21, a porcelain plate 3, a hollow structure 4, a left gap 5, a left stress baffle 51, a left lower extension element 6, a left spring 7, a right stop strip 8, a front gap 9, a front stress baffle 91, a front lower extension element 10, a front spring 11, a rear stop strip 12, an electric heating tube 13 and a rubber layer 14 adjusting rod.
Detailed Description
The invention is further illustrated by the following figures and examples.
Example 1
Arranging and clamping semiconductor crystal grains on an upper porcelain plate and a lower porcelain plate, and welding the porcelain plates in a natural state on a plane.
The high-quality product rate is 82 percent, and the repair rate is 10 percent after the product is used for three months.
Example 2
Arranging and clamping semiconductor crystal grains on an upper porcelain plate and a lower porcelain plate, wherein the porcelain plates are welded under the condition of left-right direction extrusion force, the left-right direction extrusion force applied to the upper porcelain plate and the lower porcelain plate is 100 newtons, and the left-right direction extrusion force is parallel to the planes of the porcelain plates.
The high-quality product rate is 87%, and the repair rate is 7% after the product is used for three months.
Example 3
Arranging and clamping semiconductor crystal grains on an upper porcelain plate and a lower porcelain plate, wherein the porcelain plates are welded under the conditions of left-right extrusion force and front-back extrusion force, the left-right extrusion force of the upper porcelain plate and the lower porcelain plate is 100 newtons, the front-back extrusion force of the upper porcelain plate and the lower porcelain plate is 100 newtons, and the left-right extrusion force and the front-back extrusion force are parallel to the plane of the porcelain plates.
The high-quality product rate is 92%, and the repair rate is 3% after the product is used for three months.
The right-left direction pressing force and the right-left pressing force in the above-described embodiments 2 and 3 were changed to 150 newtons, and the yield of high quality products could be improved by about 1 percentage point.
As shown in fig. 1, 2 and 3, a welding mold for a semiconductor cooling part is characterized in that: the mold comprises a mold body 1, wherein a station for placing a porcelain plate 21 is arranged on the mold body, a hollow structure 3 is arranged in the middle of the mold body, a left gap 4 reaching the hollow structure is formed in the left side of the upper surface of the mold body, a left force application baffle 5 capable of moving towards the station is arranged on the left side of the upper surface of the mold body, a left downward extending piece 51 is arranged on the left force application baffle and extends into the left gap, a left spring 6 is connected with the left downward extending piece in the hollow structure to pull the left force application baffle to move rightwards, a right stop bar 7 is arranged on the right side of the station, and the right stop bar is a part abutting against the right side of a semiconductor refrigeration piece 2.
The semiconductor refrigeration piece welding mould is used in such a way that a semiconductor refrigeration piece to be welded is placed on a station during welding, the semiconductor refrigeration piece is clamped by the left stress application baffle and the right baffle, the porcelain plate is stressed in the left-right direction, and the semiconductor refrigeration piece is taken down after welding for a period of time, so that the purpose of the invention can be achieved.
Further, the front side of the upper surface of the die body is provided with a front gap 8, the front side of the upper surface of the die body is provided with a front force baffle 9 which can move towards a station, the front force baffle is provided with a front lower extension piece 91 and extends into the front gap, a front spring 10 is connected with the front lower extension piece in a hollow structure to pull the front force baffle to move backwards, the rear side of the station is provided with a rear stop bar 11, and the rear stop bar is a component which is abutted against the rear side of the semiconductor refrigerating piece.
The semiconductor refrigeration piece welding mould is used in such a way that the front stress application baffle and the rear baffle bar clamp the semiconductor refrigeration piece, the porcelain plate is stressed by the pressure in the front-back direction, and the semiconductor refrigeration piece is taken down after welding for a period of time, so that the using effect is better.
Furthermore, the die body is also provided with a part for mounting the electric heating tube and an electric heating tube 12.
The invention can realize heating of the semiconductor refrigeration piece, and has better welding effect.
Furthermore, a rubber layer 13 is arranged in front of the left force application baffle and/or the right stop strip.
Furthermore, a rubber layer 13 is arranged in front of the front force baffle and/or the rear baffle strip.
The ceramic plate welding device is arranged in such a way, the side surface of the ceramic plate can be protected from being crushed, and downward displacement of the upper ceramic plate during welding is facilitated.
Furthermore, a length adjusting rod 14 is arranged in the middle of the left spring and/or the front spring.
The invention can adjust the action force of the spring, and is more convenient to use.
In the description of the present invention, it is to be understood that the terms "front", "rear", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience of description of the present invention, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention, and the technical solutions are all covered in the scope of the description of the present invention.
Claims (8)
1. A welding method for semiconductor refrigerating element features that the semiconductor crystal grains are arranged and clamped between upper and lower ceramic plates, which are welded under the action of left and right extruding forces parallel to the plane of ceramic plates.
2. A method of soldering a semiconductor chilling element according to claim 1, wherein: the porcelain plate is welded under the condition that front and rear extrusion forces exist, and the left and right extrusion forces are parallel to the plane of the porcelain plate.
3. A method of soldering a semiconductor chilling element according to claim 1, wherein: the porcelain plates subjected to the pressing force include an upper porcelain plate and a lower porcelain plate.
4. A semiconductor refrigeration piece welding mould is characterized in that: the device comprises a die body, wherein a station for placing a porcelain plate is arranged on the die body, a hollow structure is arranged in the middle of the die body, a left gap reaching the hollow structure is formed in the left side of the die body, a left force application baffle capable of moving towards the station is arranged on the left side of the die body, the left force application baffle is provided with a left downward extending piece and extends into the left gap, a left spring is connected with the hollow structure and pulls the left force application baffle to move rightwards, a right stop bar is arranged on the right side of the station, and the right stop bar is a part for supporting the right side of a semiconductor refrigeration piece.
5. The semiconductor chilling element welding die of claim 4, wherein: the front side of the upper surface of the die body is provided with a front gap, the front side of the upper surface of the die body is provided with a front force baffle which can move towards a station, the front force baffle is provided with a front downward extending piece and extends into the front gap, a front spring is connected with the front downward extending piece in a hollow structure to pull the front force baffle to move backwards, the rear side of the station is provided with a rear stop bar, and the rear stop bar is a part which is propped against the rear side of a semiconductor refrigerating piece.
6. The welding mold for semiconductor cooling parts as claimed in claim 4 or 5, wherein: the die body is also provided with a part for mounting the electric heating tube and the electric heating tube.
7. The semiconductor chilling element welding die of claim 6, wherein: a rubber layer is arranged in front of the left force application baffle and/or the right baffle strip.
8. The welding mold for semiconductor cooling elements as defined in claim 7, wherein: and a rubber layer is arranged in front of the front stress application baffle and/or the rear barrier strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010525468.8A CN111592374A (en) | 2020-06-11 | 2020-06-11 | Welding method and welding die for semiconductor refrigerating part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010525468.8A CN111592374A (en) | 2020-06-11 | 2020-06-11 | Welding method and welding die for semiconductor refrigerating part |
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| Publication Number | Publication Date |
|---|---|
| CN111592374A true CN111592374A (en) | 2020-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010525468.8A Pending CN111592374A (en) | 2020-06-11 | 2020-06-11 | Welding method and welding die for semiconductor refrigerating part |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113061017A (en) * | 2021-05-06 | 2021-07-02 | 许昌市森洋电子材料有限公司 | Method for manufacturing high-strength refrigeration part porcelain plate and refrigeration part |
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| CN202447831U (en) * | 2011-09-16 | 2012-09-26 | 贵州航天电子科技有限公司 | Welding localization tool for electric connector |
| CN107968148A (en) * | 2018-01-24 | 2018-04-27 | 泉州市依科达半导体致冷科技有限公司 | A kind of semiconductor refrigerating welding device and welding procedure |
| CN207719246U (en) * | 2018-01-24 | 2018-08-10 | 泉州市依科达半导体致冷科技有限公司 | A kind of semiconductor refrigerating welding device |
| KR101957395B1 (en) * | 2017-09-04 | 2019-03-12 | 울산과학기술원 | Ceramic-laminate welding apparatus for sea-water battery cell |
| CN208696590U (en) * | 2018-09-06 | 2019-04-05 | 泉州市依科达半导体致冷科技有限公司 | A kind of semiconductor refrigeration member semi-automatic arc welder |
| CN209851616U (en) * | 2019-03-25 | 2019-12-27 | 黄灵 | Ultrasonic welding mould |
| CN210287157U (en) * | 2019-07-29 | 2020-04-10 | 许昌市森洋电子材料有限公司 | Welding device for semiconductor refrigeration piece |
| CN212335044U (en) * | 2020-06-11 | 2021-01-12 | 河南鸿昌电子有限公司 | Semiconductor refrigeration piece welding mould |
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2020
- 2020-06-11 CN CN202010525468.8A patent/CN111592374A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202447831U (en) * | 2011-09-16 | 2012-09-26 | 贵州航天电子科技有限公司 | Welding localization tool for electric connector |
| KR101957395B1 (en) * | 2017-09-04 | 2019-03-12 | 울산과학기술원 | Ceramic-laminate welding apparatus for sea-water battery cell |
| CN107968148A (en) * | 2018-01-24 | 2018-04-27 | 泉州市依科达半导体致冷科技有限公司 | A kind of semiconductor refrigerating welding device and welding procedure |
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| CN208696590U (en) * | 2018-09-06 | 2019-04-05 | 泉州市依科达半导体致冷科技有限公司 | A kind of semiconductor refrigeration member semi-automatic arc welder |
| CN209851616U (en) * | 2019-03-25 | 2019-12-27 | 黄灵 | Ultrasonic welding mould |
| CN210287157U (en) * | 2019-07-29 | 2020-04-10 | 许昌市森洋电子材料有限公司 | Welding device for semiconductor refrigeration piece |
| CN212335044U (en) * | 2020-06-11 | 2021-01-12 | 河南鸿昌电子有限公司 | Semiconductor refrigeration piece welding mould |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113061017A (en) * | 2021-05-06 | 2021-07-02 | 许昌市森洋电子材料有限公司 | Method for manufacturing high-strength refrigeration part porcelain plate and refrigeration part |
| CN113061017B (en) * | 2021-05-06 | 2023-12-26 | 许昌市森洋电子材料有限公司 | Manufacturing method of high-strength refrigerating element porcelain plate and refrigerating element |
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