CN207719246U - A kind of semiconductor refrigerating welding device - Google Patents
A kind of semiconductor refrigerating welding device Download PDFInfo
- Publication number
- CN207719246U CN207719246U CN201820117231.4U CN201820117231U CN207719246U CN 207719246 U CN207719246 U CN 207719246U CN 201820117231 U CN201820117231 U CN 201820117231U CN 207719246 U CN207719246 U CN 207719246U
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- CN
- China
- Prior art keywords
- block
- cooling
- welding
- turntable
- heating block
- Prior art date
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- Expired - Fee Related
Links
- 238000003466 welding Methods 0.000 title claims abstract description 46
- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 238000001816 cooling Methods 0.000 claims abstract description 59
- 238000010438 heat treatment Methods 0.000 claims abstract description 25
- 238000006243 chemical reaction Methods 0.000 claims abstract description 8
- 239000011796 hollow space material Substances 0.000 claims abstract description 3
- 239000013078 crystal Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- 238000009414 blockwork Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- -1 by upper potsherd Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Butt Welding And Welding Of Specific Article (AREA)
Abstract
The utility model discloses a kind of semiconductor refrigerating welding devices comprising welding section and cooling zone, the welding section top are equipped with upper heating block, cooling block are equipped at the top of cooling zone；The welding section bottom face upper heating block is equipped with liftable lower heating block, cooling block is equipped with liftable lower cooling block in the face of cooling zone bottom, conversion work platform is installed between the welding section and cooling zone, the conversion work platform includes rotating mechanism and the turntable for placing semiconductor chilling plate, the turntable is frame structure, the area of the hollow space of framework is not less than the area of lower heating block, and the location hole for fixing the preforming fixture of semiconductor chilling plate is provided on turntable.
Description
Technical field
The utility model is related to cooling piece manufacturing equipment field more particularly to a kind of semiconductor refrigerating welding devices.
Background technology
A kind of cooling device that semiconductor chilling plate is made of semiconductor, by upper potsherd, crystal grain and lower pottery
Three main element compositions of tile.Existing semiconductor refrigerating welding device is as shown in Figure 1, it includes welding section 10 ' and cold
But area 20 ', welding section include the liftable workbench 1 ' being installed on linear guides 3 ', and heat block 2 ' is fixedly installed in welding
At the top of area and face workbench 1 ' is arranged, and 20 ' top of cooling zone is equipped with cooling block 4 '.The processing method of the equipment is single side
Welding：It is first positioned over semiconductor chilling plate to be formed on workbench 1 ', and aftertable 1 ' rises, and potsherd touches heating
Block 2 ' completes the welding of crystal grain and lower potsherd, afterwards turns over semiconductor chilling plate to be formed, then upper potsherd and crystal grain are welded
It connects, workbench 1 ', which is transferred to cooling zone 20 ', via linear guides 3 ' after the completion of welding is cooled down.When welding, due to work
There is about 200 DEG C of high temperature difference with heat block in platform, potsherd is made to generate thermal deformation, and stress caused by thermal deformation can be applied to
On crystal grain, it is cracked to be easy to cause portion crystal, or even rupture;Similarly, temperature difference is equally existed in single side cooling procedure, led
Portion crystal rupture is caused, refrigerator piece function reduction, or even failure are caused.
Invention content
The purpose of this utility model is to provide a kind of stabilization, efficient semiconductor refrigerating welding devices.
Realizing the technical solution of the utility model aim is：A kind of semiconductor refrigerating welding device comprising welding section
And cooling zone, the welding section top are equipped with upper heating block, cooling block are equipped at the top of cooling zone；The welding section bottom
Portion is equipped with the liftable lower heating block of face upper heating block, and cooling zone bottom is equipped with the liftable of cooling block in face
Lower cooling block is equipped with conversion work platform between the welding section and cooling zone, the conversion work platform includes rotating mechanism
And the turntable for placing semiconductor chilling plate, the turntable are frame structure, the area of the hollow space of framework is not less than
The area of lower heating block is provided with the location hole for fixing the preforming fixture of semiconductor chilling plate, the upper heating on turntable
Block, lower heating block, upper cooling block and lower cooling block are electrically connected with temperature control system respectively.
Further, the lower heating block is fixedly installed on the first lifting platform, the lifting table plate of first lifting platform
Including two piece of first support plate, the first spring is installed between two piece of first support plate, can be played when being touched heat block by weldment
Cushioning effect, make lower heating block position can up and down adjustment, and then ensure the stability of upper and lower heat block work.
Further, the lower cooling block is fixedly installed on the second lifting platform, the lifting table plate of second lifting platform
Including two piece of second support plate, second spring is installed between two piece of second support plate, can be played when weldment touches cooling block slow
Punching acts on, and makes the position-adjustable of lower cooling block, and then ensures the stability of upper and lower cooling block work.
Further, the preforming fixture of the semiconductor chilling plate includes the clamping plate of two longitudinally opposed settings, two folders
Positioning pin is installed, the positioning pin lower end is nested in the location hole of the preforming fixture of semiconductor chilling plate between plate.It protects
Card between two potsherds, not will produce dislocation in the welding process between upper and lower two potsherd and crystal grain up and down.
Semiconductor refrigerating welding device of the utility model can be carried out at the same time crystal grain and upper potsherd and lower pottery
The welding of tile, turntable turns to cooling zone after the completion of welding can carry out two-sided cooling again, and the setting of welding temperature and time are by phase
The temperature control system control answered, the rise and fall of heat block, dial turning motion are also controlled by system, realize Automation of Welding, carry
High production efficiency；Since welding simultaneously and technique cooling simultaneously also make semiconductor refrigeration sheet in welding, cooling procedure
Middle upper and lower surface avoids thermal deformation caused by potsherd to destructive shadow caused by crystal grain substantially without temperature difference
It rings, improves yield rate.
Description of the drawings
Fig. 1 is the structural schematic diagram of existing semiconductor refrigerating welding device；
Fig. 2 is the structural schematic diagram of semiconductor refrigerating welding device described in the utility model embodiment；
Fig. 3 is the preforming fixture of semiconductor chilling plate and turntable schematic cross-sectional view described in the utility model embodiment.
Specific implementation mode
The utility model preferred embodiment is described further below in conjunction with attached drawing.
As shown in Figures 2 and 3, a kind of semiconductor refrigerating welding device comprising welding section 10 and cooling zone 20, institute
It states 10 top of welding section and upper heating block 1 is installed, 20 top of cooling zone is equipped with cooling block 3；Pacify 10 bottom 1 of the welding section
Liftable lower heating block 2 equipped with face upper heating block 1,20 bottom of cooling zone are equipped with the liftable of cooling block 3 in face
Lower cooling block 4, conversion work platform 5 is installed, the conversion work platform 5 includes between the welding section 10 and cooling zone 20
Rotating mechanism 51 and turntable 52 for placing semiconductor chilling plate, the turntable 52 are frame structure, the hollow portion of framework
Points 521 area is not less than the area of lower heating block, is provided on turntable 52 for fixing the preforming fixture of semiconductor chilling plate
Location hole 522；The lower heating block 2 is fixedly installed on the first lifting platform 6, the lifting table plate 61 of first lifting platform 6
Including two piece of first support plate 611, the first spring 612 is installed between two piece of first support plate 611；Lower cooling block 4 fixes peace
Loaded on the second lifting platform 7, the lifting table plate 71 of second lifting platform includes two piece of second support plate 711, two pieces second
Second spring 712 is installed between fagging 711；The preforming fixture 60 of semiconductor chilling plate includes two longitudinally opposed settings
Clamping plate 601, positioning pin 602 is installed between two clamping plates, 602 lower end of the positioning pin is nested in location hole 522；Institute
State upper heating block 1, lower heating block 2, upper cooling block 3 and lower cooling block 4 respectively with temperature control system（It is not shown）Electrical connection.
Wherein, lifting platform, rotating mechanism, heat block, cooling block structure are the prior art, and details are not described herein.
When work, upper potsherd 30, lower potsherd 40 and crystal grain 50 are first fixed on the preforming fixture of semiconductor chilling plate
In 60, then the preforming fixture of semiconductor chilling plate 60 is positioned on turntable 52, then starts operating switch（It is not shown）The
One lifting platform 6 drives heat block 2 to rise, and then the preforming fixture 60 of semiconductor chilling plate is jacked up and is contacted with upper heating block 1,
Heat BOB(beginning of block) weld job above and below at this time.After the completion of weld job, the first lifting platform 6, which declines, drives semiconductor chilling plate pre-
Shaping jig 60, which declines, simultaneously to be stayed on turntable 52, and then rotating mechanism 51 is by turntable 52 and the semiconductor being positioned on turntable
For the preforming rotation of fixture 60 of cooling piece to cooling zone 20, the second lifting platform 7, which rises, drives lower cooling block 4 to rise, and then will partly lead
The preforming fixture 60 of body cooling piece is jacked up and is contacted with upper cooling block 3, and upper and lower cooling block begins to cool operation at this time, cooling to make
After the completion of industry, the second lifting platform 7 is dropped to together with the preforming fixture of semiconductor chilling plate 60 on turntable 52, and turntable 52 is automatic
It resets, is ready to weld next cooling piece.
Lifting table plate structure described in the utility model is not limited to shown in embodiment, can be simple slab construction, but real
The spring supporting board combining structure applied in example can play cushioning effect when weldment touches cooling block or heat block, make lower cooling
The position-adjustable of block/heat block, and then ensure the stability of upper and lower cooling block/heat block work；The semiconductor chilling plate
Preforming fixture is also not limited to shown in embodiment, but the preforming clamp structure of embodiment can ensure up and down two potsherds it
Between, it not will produce dislocation in the welding process between upper and lower two potsherd and crystal grain.
The above description is only the embodiments of the present invention, and it does not limit the scope of the patent of the present invention, every
Using equivalent process transformation made by the utility model description, it is applied directly or indirectly in other relevant technology necks
Domain is equally included in the patent within the scope of the utility model.
Claims (4)
1. a kind of semiconductor refrigerating welding device comprising welding section and cooling zone, the welding section top are equipped with
Heat block, cooling zone top are equipped with cooling block, it is characterised in that：The welding section bottom face upper heating block is equipped with can
The lower heating block of lifting, cooling block is equipped with liftable lower cooling block in the face of cooling zone bottom, the welding section and cold
Conversion work platform is but installed, the conversion work platform includes rotating mechanism and for placing semiconductor chilling plate between area
Turntable, the turntable are frame structure, and the area of the hollow space of framework is not less than the area of lower heating block, is provided on turntable
Location hole for fixing the preforming fixture of semiconductor chilling plate.
2. semiconductor refrigerating welding device according to claim 1, it is characterised in that：The lower heating block is fixedly mounted
In on the first lifting platform, the lifting table plate of first lifting platform includes two piece of first support plate, between two piece of first support plate
First spring is installed.
3. semiconductor refrigerating welding device according to claim 1 or 2, it is characterised in that：The lower cooling block is fixed
It is installed on the second lifting platform, the lifting table plate of second lifting platform includes two piece of second support plate, two piece of second support plate
Between second spring is installed.
4. semiconductor refrigerating welding device according to claim 1, it is characterised in that：The semiconductor chilling plate in advance at
Type fixture includes the clamping plate of two longitudinally opposed settings, and positioning pin is equipped between two clamping plates, and the positioning pin lower end is embedding
It is placed in the location hole of the preforming fixture of semiconductor chilling plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820117231.4U CN207719246U (en) | 2018-01-24 | 2018-01-24 | A kind of semiconductor refrigerating welding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820117231.4U CN207719246U (en) | 2018-01-24 | 2018-01-24 | A kind of semiconductor refrigerating welding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207719246U true CN207719246U (en) | 2018-08-10 |
Family
ID=63052637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820117231.4U Expired - Fee Related CN207719246U (en) | 2018-01-24 | 2018-01-24 | A kind of semiconductor refrigerating welding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207719246U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109686691A (en) * | 2019-03-08 | 2019-04-26 | 重庆市洲金电子科技有限公司 | A kind of dedicated positioning process platform of semiconductor chip processing |
| CN111592374A (en) * | 2020-06-11 | 2020-08-28 | 河南鸿昌电子有限公司 | Welding method and welding die for semiconductor refrigerating part |
| CN112077472A (en) * | 2020-08-17 | 2020-12-15 | 国为(南京)软件科技有限公司 | Semiconductor refrigeration piece welding set |
-
2018
- 2018-01-24 CN CN201820117231.4U patent/CN207719246U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109686691A (en) * | 2019-03-08 | 2019-04-26 | 重庆市洲金电子科技有限公司 | A kind of dedicated positioning process platform of semiconductor chip processing |
| CN109686691B (en) * | 2019-03-08 | 2021-01-01 | 枣庄市大河工业机械有限公司 | Special positioning processing platform for processing semiconductor wafer |
| CN111592374A (en) * | 2020-06-11 | 2020-08-28 | 河南鸿昌电子有限公司 | Welding method and welding die for semiconductor refrigerating part |
| CN112077472A (en) * | 2020-08-17 | 2020-12-15 | 国为(南京)软件科技有限公司 | Semiconductor refrigeration piece welding set |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180810 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |