CN109860073B - Heating device and heating method - Google Patents
Heating device and heating method Download PDFInfo
- Publication number
- CN109860073B CN109860073B CN201711243708.XA CN201711243708A CN109860073B CN 109860073 B CN109860073 B CN 109860073B CN 201711243708 A CN201711243708 A CN 201711243708A CN 109860073 B CN109860073 B CN 109860073B
- Authority
- CN
- China
- Prior art keywords
- heater
- heating
- sucker
- heating device
- suction cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Control Of Resistance Heating (AREA)
- Resistance Heating (AREA)
Abstract
The invention provides a heating device and a heating method, wherein a sucker is directly fixed on a heat insulation seat, a thin heater is hung on the lower surface of the sucker upside down through a flexible fixing device, and the force generated by the heater and the sucker due to thermal deformation is axially transmitted downwards, so that the influence of the self deformation of the heater on the height and the flatness of a substrate in the heating process is reduced. The temperature homogenization layer is added between the heater and the sucker, so that uniform heat transfer between the heater and the sucker is realized, the fixing layer is added on the lower surface of the heater, and the heater is prevented from warping due to local heating caused by the fact that heat cannot be rapidly transferred. Meanwhile, the invention adopts the thin heater, thereby reducing the weight of the heating device and further reducing the load requirement on the workbench.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a bonding heating device and a heating method.
Background
Wafer bonding techniques can bond wafers of different materials together. The wafer bonding technology is utilized to combine new structural materials, has great freedom degree, and is widely applied to the fields of micro-electronic circuits, sensors, micro-machining of power devices, optoelectronic devices, insulating silicon wafers and the like.
In the wafer bonding process, substrate materials such as a silicon wafer and a glass substrate are generally heated to a certain temperature in a vacuum environment, and bonding is performed by applying a certain external force for a certain time. The main heating device of the existing wafer bonding equipment is shown in fig. 1: the method comprises the steps of manufacturing a heater 13 by embedding heating wires in a high-temperature alloy metal disc through brazing, placing the heater 13 on a heat insulation seat 14, overlapping a sucker 12 on the heater 13, or combining the heater 13 and the sucker 12 into a part, adsorbing a substrate 11 through the sucker 12, conducting heat in the heating process sequentially through the heater 13 and the sucker 12, and finally heating the substrate 11 to the substrate 11. In the heating device, the heater 13 has a large weight, which greatly affects the dynamic performance of the workbench bearing the heating device, and is not suitable for the occasions with limited weight, and the overall thickness of the heater 13 and the sucker 12 is thickened due to thermal expansion in the heating process, so that the flatness of the heater is deteriorated, and the height and the flatness of the substrate 11 adsorbed on the sucker 12 are further affected. Since the position of the chip on the substrate 11 needs to be detected by the machine vision system in the wafer bonding apparatus, when the height of the substrate 11 changes or the flatness is poor, the machine vision system needs to add an automatic focusing function, but the addition of the automatic focusing function increases the complexity of the system and reduces the yield, and meanwhile, the heater used for heating is thick, has large self-heat capacity and consumes long time for heating and cooling, and is not suitable for occasions requiring frequent heating, cooling and heating.
The thin heater is adopted to replace the original thick heater, so that the weight of the heater can be greatly reduced, but in the existing heating device, the problems of the thickness increase and the flatness deterioration of the heater caused by thermal expansion in the heating process cannot be solved even if the thin heater is adopted. Since the thin heater is thinner, compared with the original thick heater, the thickness dimension accuracy is poorer and the heater presents a certain arc shape, as shown in fig. 2a (a naturally placed suction cup 21, a naturally placed thin heater 22), in the existing heating device, the suction cup is brought into an arc shape after the thin heater and the suction cup are fixed, as shown in fig. 2b (a suction cup 23 after the suction cup is fixed with the thin heater, and a heater 24 after the suction cup is fixed with the thin heater), so that the height dimension of the substrate relative to the heat insulation column and the flatness of the substrate cannot be controlled.
Disclosure of Invention
In order to solve the above problem, the present invention provides a heating apparatus, comprising: a heater, a sucker and a heat insulation seat,
the sucker is fixed on the heat insulation seat, and the heat insulation seat is positioned at the edge of the sucker;
the heater is fixed on the sucker, and the heater and the heat insulation seat are located on the same surface of the sucker.
Further, the heater is a thin heater.
Further, the weight ratio of the heater to the sucker is less than 1.
Furthermore, the heater is attached to the sucker.
Further, the heating device further comprises a flexible fixing device, and the heater is fixed on the lower surface of the sucker through the flexible fixing device.
Further, the flexible fixing device comprises a belleville spring and a step bolt, and the belleville spring is located on a step of the step bolt.
Further, the step height of the step bolt in the flexible fixing device is determined by the thickness and weight of the heater and the compression amount of the belleville spring.
Furthermore, the force required by the deformation of the belleville spring in the flexible fixing device is smaller than the force required by the thermal deformation of the sucker, and the force required by the deformation of the belleville spring is smaller than the force required by the thermal deformation of the heater.
Further, the heating device further comprises a temperature homogenization layer, and the temperature homogenization layer is positioned between the heater and the sucker.
Furthermore, the heating device also comprises a fixing layer, and the fixing layer is fixed on the lower surface of the heater through the flexible fixing device.
Further, the load of the step bolt is greater than the sum of the self weights of the heater, the temperature equalization layer, the fixing layer and the belleville spring.
Further, the material of the sucker is titanium alloy.
Further, the thickness of the sucker is controlled within 8mm in the heating process.
Correspondingly, the invention provides a heating method, which adopts the heating device for heating.
Compared with the existing heating device, the heating device has the advantages that the sucker is directly fixed on the heat insulation seat, the thin heater is hung on the lower surface of the sucker in an inverted mode, force generated by the heater and the sucker due to thermal deformation is transmitted downwards in an axial direction, and the influence of the self deformation of the heater on the height and the flatness of the substrate in the heating process is reduced.
Furthermore, a temperature homogenization layer is added between the heater and the sucker, so that uniform heat transfer between the heater and the sucker is realized, and a fixing layer is added on the lower surface of the heater, so that the heater is prevented from warping due to local heating caused by the fact that heat cannot be rapidly transferred.
Furthermore, the invention adopts the thin heater, thereby reducing the weight of the heating device and further reducing the load requirement on the workbench.
Drawings
FIG. 1 is a schematic structural diagram of a conventional heating apparatus;
FIG. 2a is a schematic diagram of a naturally placed chuck and heater configuration;
FIG. 2b is a schematic view of the structure of the chuck and heater after they are fixed;
fig. 3 is a schematic structural diagram of a heating device according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a flexible fixing device provided in the first embodiment and the second embodiment of the present invention;
fig. 5 is a schematic structural diagram of a heating device according to a second embodiment of the present invention;
fig. 6 is a schematic structural diagram of a heating device according to a third embodiment of the present invention.
Detailed Description
In order to make the contents of the present invention more clearly understood, the contents of the present invention will be further described with reference to the accompanying drawings. The invention is of course not limited to this particular embodiment, and general alternatives known to those skilled in the art are also covered by the scope of the invention.
The present invention is described in detail with reference to the drawings, and for convenience of explanation, the drawings are not enlarged partially according to the general scale, and should not be construed as limiting the present invention.
Example one
Please refer to fig. 3, which is a schematic structural diagram of a heating device according to an embodiment of the present invention. As shown in fig. 3, the heating device includes a suction cup 32, a temperature equalization layer 33, a heater 34, a heat insulation seat 35, and a flexible fixing device 36. The sucking disc 32 is used for bearing and adsorbing the substrate 31, the heater 34 is used for outputting heat of the heating device, a temperature homogenization layer 33 can be selectively added between the sucking disc 32 and the heater 34 according to the type of the heater 34, so that uniform heat transfer between the sucking disc 32 and the heater 34 is realized, the temperature homogenization layer 33 and the heater 34 are inversely hung on the lower surface of the sucking disc 32 through the flexible fixing device 36, and the sucking disc 32 is supported through the heat insulation seat 35.
Fig. 4 is a schematic structural view of the flexible fixing device. As shown in fig. 4, the flexible fixing device 36 includes a belleville spring 41 and a step bolt 42, and the belleville spring 41 is located on a step of the step bolt 42. Referring to fig. 3 and 4, the heater 34 and the temperature equalization layer 33 are hung upside down on the lower surface of the suction cup 32 by the flexible fixing device 36, that is, the step bolt 42 is fixed on the lower surface of the suction cup 32, and the belleville spring 41 bears the heater 34 and the temperature equalization layer 33 and is placed on the step of the step bolt 42. The weight ratio of the heater 34 to the suction cup 32 is less than 1, so that when the heater 34 is hung upside down on the suction cup 32, the height and the flatness of the suction cup 32 are not affected.
The step height of the step bolt 42 is selected according to the thickness and weight of the heater 34 and the compression amount of the belleville spring 41, so that the step bolt 42 provides a supporting force for the heater 34 and the temperature equalization layer 33 through the belleville spring 41 after being screwed down, and the adhesion of the heater 34 and the suction cup 32 is further ensured, wherein the supporting force is larger than the sum of the self weights of the heater 34, the temperature equalization layer 33 and the belleville spring 41, and preferably, the supporting force is one to two times of the sum of the self weights of the heater 34, the temperature equalization layer 33 and the belleville spring 41.
Meanwhile, the force required by the deformation of the belleville spring 41 is smaller than the force required by the thermal deformation of the heater 34, and similarly, the force required by the deformation of the belleville spring 41 is smaller than the force required by the thermal deformation of the suction cup 32, so that when the heater 34 outputs heat, the belleville spring 41 is compressed by the thermal deformation of the heater 34, and the influence of the thermal deformation of the heater 34 on the suction cup 32 is reduced.
In the heating device of the present embodiment, the heater 32 may be a thick heater or a thin heater, preferably a thin heater, for example, a thin heater with a thickness of about 3mm, and compared with the conventional thick heater, the weight of the thin heater is greatly reduced, thereby reducing the weight of the heating device, reducing the load requirement on the worktable, and simultaneously reducing the heat capacity of the heater 32 due to the reduction of the thickness of the heater 32, reducing the energy consumption of the heater 32 for self-heating, shortening the heating and cooling cycle of the heating device, and improving the heating efficiency.
The material of the suction cup 32 in this embodiment is preferably TA12 (titanium alloy), compared with the high temperature alloy or stainless steel material used in the suction cup in the prior art, the high temperature performance of TA12 material is better, the deformation amount of the suction cup 32 at high temperature is reduced, the thickness of the suction cup 32 is controlled below 8mm in the whole heating process, and meanwhile, because the density of TA12 material is about half of that of the steel material, the self weight of the suction cup 32 made of TA12 material is reduced, and the load requirement on the workbench is further reduced.
The invention also provides a heating method, which is to heat the substrate 31 by adopting the heating device, and comprises the following specific steps:
firstly, the suction cup 32 is placed on the heat insulation seat 35, and the temperature equalization layer 33 and the heater 34 are hung upside down on the lower surface of the suction cup 32 through the flexible fixing device 36; secondly, adjusting the height of the step bolt 42 in the flexible fixing device 36 to make the heater 34 fit with the suction cup 52 through the temperature equalization layer 53; then, the substrate 31 is fixed on the upper surface of the suction cup 32 by vacuum suction; finally, the heater 34 outputs heat to heat the substrate 51.
Example two
Please refer to fig. 5, which is a schematic structural diagram of a heating device according to a second embodiment of the present invention. As shown in fig. 5, the heating device includes a suction cup 52, a temperature equalization layer 53, a heater 54, a fixing layer 55, a flexible fixing device 56, and a heat insulating base 57. The suction cup 52 is used for bearing and adsorbing a substrate 51, the heater 54 is used for outputting heat of the heating device, a temperature equalization layer 53 can be selectively added between the suction cup 52 and the heater 54 according to the type of the heater 54, so that uniform heat transfer between the suction cup 52 and the heater 54 is realized, a fixing layer 55 can be selectively added on the lower surface of the heater 54 according to the type of the heater 54, so that the heater 54 is fixed, the heater 54 is prevented from being warped due to local heating caused by the fact that heat cannot be rapidly transferred, the temperature equalization layer 53, the heater 54 and the fixing layer 55 are hung on the lower surface of the suction cup 52 in an inverted mode through the flexible fixing device 56, and the suction cup 52 is supported through a heat insulation seat 57.
In the heating device of the present embodiment, the heater 54 may be a thin heater, preferably a heater made of a brittle material with a thickness of about 1mm, such as a ceramic heater, the ceramic heater has a high heating speed, and if the heating speed is too high and the heat cannot be rapidly transferred, the ceramic heater is locally heated and warped, in order to avoid such a phenomenon, a fixing layer 55 is added on the lower surface of the heater 54 in the present embodiment, so as to achieve timely transfer of the heat of the ceramic heater. The fixing layer 55, the temperature equalization layer 53 and the heater 54 are hung upside down on the lower surface of the suction cup 52 by the flexible fixing device 56.
In the same way as the embodiment, the weight ratio of the heater 54 and the suction cup 52 is less than 1, the material of the suction cup 52 is preferably TA12 material with good high temperature performance, the flexible fixing device 56 includes a belleville spring 41 and a step bolt 42, and the load of the step bolt 42 is greater than the sum of the self weights of the heater 54, the temperature equalization layer 53, the fixing layer 55 and the belleville spring 41.
The invention also provides a heating method, which is to heat the substrate 51 by adopting the heating device, and comprises the following specific steps:
first, the suction cup 52 is placed on the heat insulating base 57, and the temperature-uniforming layer 53, the heater 54, and the fixing layer 55 are hung upside down on the lower surface of the suction cup 52 by the flexible fixing device 56; secondly, adjusting the height of the step bolt 42 in the flexible fixing device 56 to make the heater 54 adhere to the suction cup 52 through the temperature equalization layer 53, and make the fixing layer 55 adhere to the heater 54; then, the substrate 51 is fixed on the upper surface of the suction cup 52 by vacuum suction; finally, the heater 54 outputs heat to heat the substrate 51.
EXAMPLE III
Please refer to fig. 6, which is a schematic structural diagram of a heating device according to a third embodiment of the present invention. As shown in fig. 5, the heating device includes a suction cup 62, a heater 63, and a heat insulating base 64. The sucking disc 62 realizes bearing and adsorption of the substrate 61, the heater 63 realizes heat output of the heating device, the heater 63 is fixed on the lower surface of the sucking disc 62, and the sucking disc 62 is supported by the heat insulation seat 64.
In the heating device of the present embodiment, the heater 63 may be a thin heater, preferably a flexible heater with a thickness of about 0.2mm, such as a polyimide heater. The polyimide heater is made of flexible materials, and the flatness of the sucker 62 cannot be affected by deformation generated during thermal expansion, so that the flexible fixing device is not needed for fixing.
In the present embodiment, the weight ratio of the heater 63 to the suction cup 62 is less than 1, and the material of the suction cup 62 is preferably TA12 material with good high temperature performance.
The invention also provides a heating method, which is used for heating the substrate 61 by adopting the heating device and comprises the following specific steps:
firstly, the suction cup 62 is placed on the heat insulation seat 64, and the heater 63 is fixed on the lower surface of the suction cup 62; then, the substrate 61 is fixed on the upper surface of the suction cup 62 by vacuum suction; finally, the heater 63 outputs heat to heat the substrate 61.
In conclusion, the sucker is directly fixed on the heat insulation seat, the thin heater is hung on the lower surface of the sucker in an inverted mode through the flexible fixing device, force generated by thermal deformation of the heater and the sucker is transmitted downwards in an axial direction, and the influence of self deformation of the heater on the height and the flatness of the substrate in the heating process is reduced. The temperature homogenization layer is added between the heater and the sucker, so that uniform heat transfer between the heater and the sucker is realized, the fixing layer is added on the lower surface of the heater, and the heater is prevented from warping due to local heating caused by the fact that heat cannot be rapidly transferred. Meanwhile, the invention adopts the thin heater, thereby reducing the weight of the heating device and further reducing the load requirement on the workbench.
The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (12)
1. A heating device, comprising: a heater, a sucker, a heat insulation seat and a flexible fixing device,
the sucker is fixed on the heat insulation seat, and the heat insulation seat is positioned at the edge of the sucker;
the heater is fixed on the sucker through the flexible fixing device, the heater and the heat insulation seat are located on the same surface of the sucker, the flexible fixing device comprises a belleville spring and a step bolt, and the belleville spring is located on a step of the step bolt.
2. The heating device of claim 1, wherein the heater is a low profile heater.
3. The heating device of claim 1, wherein the weight ratio of the heater to the suction cup is less than 1.
4. The heating device of claim 1, wherein the heater is attached to the chuck.
5. The heating apparatus as claimed in claim 1, wherein a step height of the step bolt is determined by a thickness and a weight of the heater and a compression amount of the belleville spring.
6. The heating device of claim 1, wherein the force required to deform the belleville spring is less than the force required to deform the suction cup by heat, and the force required to deform the belleville spring is less than the force required to deform the heater by heat.
7. The heating device of claim 1, further comprising a temperature homogenization layer located between the heater and the chuck.
8. The heating device of claim 7, further comprising a securing layer secured to the heater lower surface by the flexible securing means.
9. The heating apparatus as claimed in claim 8, wherein the load of the step bolt is greater than the sum of the self weights of the heater, the temperature uniforming layer, the fixing layer and the belleville spring.
10. A heating device according to any one of claims 1-9, characterized in that the material of the suction cup is a titanium alloy.
11. A heating device as claimed in any of claims 1 to 9, wherein the thickness of the chuck is controlled to within 8mm during heating.
12. A heating method characterized by heating with the heating apparatus according to any one of claims 1 to 11.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711243708.XA CN109860073B (en) | 2017-11-30 | 2017-11-30 | Heating device and heating method |
| PCT/CN2018/118260 WO2019105422A1 (en) | 2017-11-30 | 2018-11-29 | Heating device and heating method |
| TW107142825A TWI691008B (en) | 2017-11-30 | 2018-11-29 | Heating device and heating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711243708.XA CN109860073B (en) | 2017-11-30 | 2017-11-30 | Heating device and heating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109860073A CN109860073A (en) | 2019-06-07 |
| CN109860073B true CN109860073B (en) | 2020-10-16 |
Family
ID=66665400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711243708.XA Active CN109860073B (en) | 2017-11-30 | 2017-11-30 | Heating device and heating method |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN109860073B (en) |
| TW (1) | TWI691008B (en) |
| WO (1) | WO2019105422A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110556319B (en) * | 2019-09-10 | 2022-10-21 | 北京北方华创微电子装备有限公司 | Heater, semiconductor processing chamber and processing equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103794538A (en) * | 2012-10-31 | 2014-05-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Static chuck and plasma processing equipment |
| CN104241184A (en) * | 2013-06-19 | 2014-12-24 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Carrying device and plasma processing equipment |
| CN104253066A (en) * | 2013-06-28 | 2014-12-31 | 上海和辉光电有限公司 | Anti-electrostatic heater plate structure |
| WO2016060960A1 (en) * | 2014-10-17 | 2016-04-21 | Applied Materials, Inc. | Electrostatic chuck assembly for high temperature processes |
| CN107342241A (en) * | 2016-04-29 | 2017-11-10 | 上海微电子装备（集团）股份有限公司 | One kind solution bonding apparatus and method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007042911A (en) * | 2005-08-04 | 2007-02-15 | Sumitomo Electric Ind Ltd | Wafer holder and wafer prober mounted with the same |
| JP2007258615A (en) * | 2006-03-24 | 2007-10-04 | Ngk Insulators Ltd | Electrostatic chuck |
| CN101261283B (en) * | 2008-04-14 | 2010-08-18 | 无锡市易控系统工程有限公司 | Test bench wafer suction disc device |
| CN201196654Y (en) * | 2008-04-14 | 2009-02-18 | 无锡市易控系统工程有限公司 | Wafer suction disc apparatus for test bench |
| CN206194704U (en) * | 2016-11-01 | 2017-05-24 | 杭州长川科技股份有限公司 | Even heating device of wafer |
-
2017
- 2017-11-30 CN CN201711243708.XA patent/CN109860073B/en active Active
-
2018
- 2018-11-29 TW TW107142825A patent/TWI691008B/en active
- 2018-11-29 WO PCT/CN2018/118260 patent/WO2019105422A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103794538A (en) * | 2012-10-31 | 2014-05-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Static chuck and plasma processing equipment |
| CN104241184A (en) * | 2013-06-19 | 2014-12-24 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Carrying device and plasma processing equipment |
| CN104253066A (en) * | 2013-06-28 | 2014-12-31 | 上海和辉光电有限公司 | Anti-electrostatic heater plate structure |
| WO2016060960A1 (en) * | 2014-10-17 | 2016-04-21 | Applied Materials, Inc. | Electrostatic chuck assembly for high temperature processes |
| CN107342241A (en) * | 2016-04-29 | 2017-11-10 | 上海微电子装备（集团）股份有限公司 | One kind solution bonding apparatus and method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI691008B (en) | 2020-04-11 |
| WO2019105422A1 (en) | 2019-06-06 |
| CN109860073A (en) | 2019-06-07 |
| TW201926511A (en) | 2019-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6831307B2 (en) | Semiconductor mounting system | |
| JP5447123B2 (en) | Heater unit and apparatus provided with the same | |
| US9997383B2 (en) | Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same | |
| JP6533579B2 (en) | Heat transfer device for soldering of electrical components | |
| JP2004205487A (en) | Probe card fixing mechanism | |
| KR20110006563A (en) | Bonding head and thermocompression bonding method using the same | |
| CN104254909B (en) | The manufacture method of semiconductor device, heat-insulated loading grips and its method to set up | |
| CN109860073B (en) | Heating device and heating method | |
| KR0184688B1 (en) | Jig for manufacturing semiconductor device and manufacture of the same device | |
| CN104241147A (en) | Low-temperature bonding method based on aluminum and germanium eutectic | |
| US20030047589A1 (en) | Joined article of a supporting member for a semiconductor wafer and a method of producing the same | |
| US10141199B2 (en) | Selecting a substrate to be soldered to a carrier | |
| TW201818493A (en) | Mounting device | |
| JP2010177604A (en) | Semiconductor manufacturing method and manufacturing device | |
| JP2016122726A (en) | Chip bonding device and chip bonding method | |
| JP5259116B2 (en) | Die bonder | |
| JP2007149727A (en) | Wafer holder, heater unit mounting same, and wafer prober | |
| JP2013004810A (en) | Heater for heating wafer | |
| KR102047587B1 (en) | Method and device for permanent bonding | |
| JP4744015B2 (en) | Wafer support member | |
| JP2011081932A (en) | Heater and device mounting the same | |
| JP2010277809A (en) | Heater and device equipped with the same | |
| JPS63261723A (en) | Manufacture of semiconductor device | |
| Xu et al. | Thermal performance and reliability management for novel power electronic packaging using integrated base plate | |
| US11869797B2 (en) | Electrostatic chuck and method of manufacturing electrostatic chuck |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |