JP5447123B2 - Heater unit and apparatus provided with the same - Google Patents

Description

  The present invention relates to a heater unit mainly used for heating a glass substrate or a semiconductor substrate for a flat panel display, and a manufacturing or inspection apparatus equipped with the heater unit, and particularly heating used in a photolithography process or a prober inspection process. The present invention relates to a heat treatment apparatus used in a processing apparatus or a final inspection process of a semiconductor substrate.

  Many apparatuses have been developed that can place an object to be heated and heat-treat it, and among them, the uniformity of the temperature distribution on the surface of the object to be heated (hereinafter also referred to as heat uniformity) is required. As a thing, the heater for the heating of board | substrates, such as a semiconductor substrate and a glass substrate, used in the manufacturing process and test | inspection process of a semiconductor device or a flat panel display is mentioned. This heater is used, for example, for heating and drying a resist solution applied on a substrate in a lithography process, or used for raising a temperature for performing inspection of a substrate at a desired temperature in an inspection process.

  In the production of these semiconductor devices and flat panel displays, there is a competition for price reduction of products due to mass production by continuous operation. For this reason, shortening of tact time is demanded in manufacturing apparatuses and inspection apparatuses. In order to obtain a high throughput with one apparatus, not only shortening the processing time of the heat treatment process itself of a workpiece to be processed at a constant temperature while maintaining a predetermined temperature, a heater accompanying a change in processing conditions It is necessary to shorten the time required for changing the set temperature (heating time, cooling time).

  For this reason, the present inventors have already configured a cooling plate having a desired heat capacity and a heater plate so that they can be separated from or brought into contact with each other as a heater for manufacturing a semiconductor device, and the cooling plate is separated from the heater plate during heating. The temperature is rapidly raised by cooling, and the cooling plate is brought into contact with the heated heater plate at the time of cooling, thereby quickly cooling the mounting table provided on the heater plate and the object to be heated placed on the mounting table. The invention which can be performed was performed (patent document 1). As a result, the time required for the entire production process can be shortened.

  FIG. 8 shows a schematic sectional view of the heater 1. This heater 1 shields a heater plate 2 for placing and heating a substrate, a cooling plate 3 for quickly cooling the heater plate 2, and heat from the heater plate 2 being easily transmitted to other production apparatuses. And a container 4 made of stainless steel or the like. The heater plate 2 is supported by a support means (not shown) such as a rod provided in the container 4. The heater plate 2 is provided with a temperature sensor 5 such as a side temperature thermometer for measuring the temperature of the heater.

  The heater plate 2 can be composed of, for example, a mounting table 50 on which a semiconductor substrate is mounted, and, for example, a spiral heating element circuit 51 disposed on the lower surface thereof. The heating element circuit 51 may be formed by a tungsten metallization method. The heating element circuit 51 is insulated by coating with an electric insulating film (not shown).

  The heater plate 2 may have a structure as shown in FIG. That is, the heating element circuit 53 made of stainless steel or nickel-chrome foil is sandwiched between the insulating sheets 54 as necessary, and then placed between the mounting table 52 and the pressing plate 55. The holding plate 55 and the mounting table 52 are mechanically fixed by using coupling means 56 such as rivets and bolts and nuts. Note that wiring (not shown) is connected to the heating element circuits 51 and 53, and the heater plate 2 is heated by supplying power through the wirings (not shown).

  The cooling plate 3 is formed with a refrigerant flow path 3a, and cooling is performed by flowing a refrigerant therethrough. The cooling plate 3 and the heater plate 2 can be separated and brought into contact with each other by, for example, driving the cooling plate 3 up and down by an elevating mechanism (not shown) such as an air cylinder. That is, as shown in FIG. 10A, during heating, the cooling plate 3 is driven downward to be separated from the heater plate 2. On the other hand, as shown in FIG. 10B, during cooling, the cooling plate 3 is driven upward to contact the heater plate 2.

  Next, a procedure for performing heat treatment on an object to be heated using the heater 1 will be described with reference to FIGS. 10 (a) and 10 (b). First, the heater plate 2 is heated by energizing the heating element circuit 51 of the low-temperature heater plate 2 in the state shown in FIG. Thereafter, the object to be heated S such as a wafer (semiconductor substrate) or a glass substrate is placed on the mounting table 50, and the object to be heated S is heated. When the heat treatment for about 60 to 180 seconds is completed, the object to be heated S is taken out from the mounting table 50, and the next object to be heated S is mounted on the mounting table 50, and the heat treatment is performed in the same manner.

  After the heat treatment is repeated and the heat treatment of a predetermined amount of the object to be heated S is completed, the temperature condition is changed for a heat treatment different from the heat treatment. When the change of the temperature condition is a change to the high temperature side, it is only necessary to change the temperature by changing the energization condition with the state shown in FIG. On the other hand, in the case of the change to the low temperature side, the energization to the heating element circuit 51 of the heater plate 2 is temporarily stopped and then cooled by using an elevating mechanism (not shown) as shown in FIG. The plate 3 is brought into contact with the heater plate 2, and the heat of the heater plate 2 is released to the cooling plate 3. Thereby, the temperature of the heater plate 2 and the to-be-heated material S can be reduced rapidly.

  At this time, a coolant such as cooling water may flow through a coolant channel (not shown in FIG. 10) of the cooling plate 3. By discharging the heat transmitted to the cooling plate 3 out of the heater system through this refrigerant, it is possible to effectively exhaust heat. After the heater control temperature sensor 5 detects that the set temperature is almost reached, the cooling plate 3 is separated from the heater plate 2 and returned to the state shown in FIG. 10A, and heat is generated again to maintain the set temperature. Energization of the body circuit 51 is started. Thus, throughput can be improved by changing the temperature condition during cooling in a short time.

JP 2004-014655 A

  However, in recent years, higher accuracy and higher throughput have been demanded, and there is a demand for further increasing the heating rate and cooling rate while maintaining high heat uniformity in the mounting surface of the heater plate. To achieve this, it is desirable to reduce the heat capacity of the mounting table as much as possible, that is, to make the mounting table lighter and thinner. However, when the mounting table is formed of a metal plate, the metal has low rigidity. It was difficult to maintain good heat uniformity due to warpage during heating and cooling. On the other hand, when the mounting table is formed of a ceramic plate, ceramics can be made thin because of its relatively high rigidity.

  Attempts have also been made to improve the temperature uniformity and the temperature raising / lowering speed while ensuring rigidity, and a structure in which a heating element and an insulating sheet are interposed between a ceramic plate and a metal plate is also disclosed. However, when these opposing surfaces are joined over almost the entire surface using a large number of rivets, bolts and nuts to ensure good heat transfer, the bimetal resulting from the difference in thermal expansion between the ceramic and the metal can cause high or low temperatures. In some cases, the flatness at room temperature cannot be maintained, and soaking properties deteriorate. Thus, it was very difficult to maintain both high temperature uniformity within the mounting surface and improve the heating / cooling speed.

  The present invention has been made in view of the above-described problems, and it is possible to increase and decrease the temperature increase / decrease rate without deteriorating the temperature uniformity in the mounting surface or while maintaining higher temperature uniformity than before. The task is to increase the speed. By solving such a problem, particularly in the manufacturing process of a semiconductor device or a flat panel display, it is possible to immediately carry out a heating process under the following conditions after changing the temperature condition to the temperature rising / falling side. In addition, by achieving high thermal uniformity in the mounting surface, it is possible to reduce variations in film thickness and line width in, for example, a photoresist process in a semiconductor manufacturing process.

  That is, the semiconductor device or flat display manufactured and inspected by this heat treatment process is shortened by reducing the time required for temperature change of the temperature rise and cooling while reducing the temperature variation in the mounting surface in the heat treatment process. The purpose is to improve the productivity, performance, yield, and reliability of panel devices.

  As a result of intensive research in order to solve the above problems, the present inventors have reduced the heat capacity by reducing the thickness of the soaking plate, while increasing the heating / cooling speed, Insulating heating elements are sandwiched between two soaking plates of different materials so that the in-plane soaking property is not hindered by the thinning of the surface, and one of these two soaking plates is A ceramic or metal-ceramic composite with high rigidity and low thermal deformation by forming a metal and a ceramic or metal-ceramic composite on the other and further applying flexibility to at least one surface of the metal It is possible to keep good heat transfer by suppressing the change in flatness caused by the difference in mutual thermal expansion of the two soaking plates at the time of temperature rise and fall, which could not be avoided in the past. Found

  In particular, one of the two soaking plates is made of metal and the other is made of a ceramic or metal-ceramic composite, so that the soaking plate made of metal exhibits a highly uniform function, and the ceramic or the ceramic-ceramic composite. The soaking plate was able to exert its rigidity function. In this way, by making the two heat equalizing plates play different roles, high rigidity, high heat equalization and low heat capacity that cannot be achieved with a single material can be realized, and high-speed heating and cooling are possible. .

  In addition, the temperature raising and lowering speed can be further increased by thinning the metal heat equalizing plate, and the temperature can be remarkably increased by applying flexibility to the thin metal heat equalizing plate. Even if it changed, it became possible to always adhere to the other highly rigid soaking plate. As a result, it was possible to suppress changes in flatness at the time of raising and lowering the temperature, which is unavoidable with a thin metal plate alone, and to achieve high temperature uniformity during the raising and lowering of the temperature.

That is, the heater unit provided by the present invention includes a first soaking plate having a placement surface on which a substrate is placed, a second soaking plate that supports the first soaking plate, and the first soaking plate. And at least one insulated resistance heating element provided between the second heat equalizing plate and the first heat equalizing plate and the second heat equalizing plate facing each other. The first soaking plate and the second soaking plate are made of metal, and processing for providing flexibility on at least one side is coupled to the first soaking plate and the second soaking plate. and it is applied, it is characterized in that the other surface contacting the and the insulated resistive heating element Ri Do from ceramic or metal-ceramic composite material is a mortar shape recessed is substantially central portion.

  According to the present invention, the flatness of the mounting table does not change over time, and the generation of particles can be further generated while maintaining the thermal uniformity in the mounting surface in the same manner as before or higher than that in the past. While suppressing, it is possible to increase the temperature increasing / decreasing speed while suppressing flatness change during temperature increasing / decreasing.

  As a result, particularly in the manufacturing process of a semiconductor device or a flat display panel device, a heating process with different conditions can be promptly performed after the temperature condition is changed to the temperature increase or decrease side. In addition, by achieving high thermal uniformity within the mounting surface of the mounting table, it is possible to reduce variations in film thickness and line width in, for example, a photoresist process in the semiconductor manufacturing process. Furthermore, in the inspection process, constant temperature uniformity and probing properties can always be reproduced in the prober device without changing the flatness of the mounting surface.

  This makes it possible to provide a highly reliable heater for a semiconductor device or flat display panel device manufacturing apparatus or inspection apparatus. That is, the semiconductor device and the flat display panel device manufactured and inspected by this heat treatment process are shortened by stabilizing the temperature variation in the mounting surface in the heat treatment process and shortening the time required for the temperature change of the heating and cooling. Productivity, performance, yield, and reliability can be improved.

It is a typical sectional view showing one embodiment of a heater unit concerning the present invention. It is a schematic diagram which shows the specific example of the process for giving the flexibility given to the metal soaking plate which the heater unit which concerns on this invention has. It is typical sectional drawing which shows the other embodiment of the heater unit which concerns on this invention. It is a typical sectional view showing an example of an insulated resistance heating element which a heater unit concerning the present invention has. It is a typical sectional view showing other embodiments of a heater unit concerning the present invention. It is a typical fragmentary sectional view which shows the specific example of the member for vacuum sealing with which the heater unit which concerns on this invention is equipped suitably. It is typical sectional drawing which shows a specific example of the heater which accommodates the heater unit of one embodiment of this invention with a cooling plate in a container. It is typical sectional drawing which shows the conventional heater which consists of a heater plate and a cooling plate. It is typical sectional drawing which shows the other specific example of the conventional heater plate. It is typical sectional drawing which shows the isolation | separation and contact state of the heater plate and cooling plate which the conventional heater comprises.

  Hereinafter, an embodiment of the heater unit according to the present invention will be described. 1A to 1D schematically show sectional views of a heater unit 10 according to an embodiment of the present invention. The heater unit 10 includes a first soaking plate 11 having a placement surface 11a on which a semiconductor substrate or a glass substrate is placed, and a second soaking plate 12 that supports the first soaking plate 11 from below. Yes. Between the first soaking plate 11 and the second soaking plate 12, an insulated resistance heating element 13 having at least one layer is provided. FIGS. 1A to 1D show an example in which two layers of insulated resistance heating elements 13 are provided as an example. In these two layers of insulated resistance heating elements 13, the resistance heating elements 13a are insulated by an insulating sheet 13b.

  As for the material of the 1st soaking plate 11 and the 2nd soaking plate 12, one is a metal and the other is formed from ceramics or the metal ceramic composite material. In general, the material used for the soaking plate on which the substrate is placed is preferably a material having high thermal conductivity. This is because the higher the thermal conductivity is, the higher the temperature uniformity can be maintained even if it is processed to be thinner, so that the heat capacity of the soaking plate can be kept small and the temperature raising / lowering speed can be increased. Therefore, it is only necessary to form the soaking plate from a metal having high thermal conductivity. However, since the metal has a low Young's modulus, it tends to warp when processed thinly, and it tends to warp due to thermal history such as temperature rise and fall, making it thin. I couldn't.

  On the other hand, in this invention, the 1st soaking plate 11 and the 2nd soaking plate 12 are used for a soaking plate, and one of these is formed with a metal material, and the other is a ceramic or a metal ceramic composite material. It is formed with. Thereby, since the function which each material is good at can be exhibited, the outstanding heat equalization board which has both the advantages of those materials can be obtained.

  That is, since the metal has a characteristic of particularly high thermal conductivity, one of the soaking plates can exhibit the soaking function obtained thereby. In addition, since the ceramic or metal ceramic composite material has characteristics of high rigidity and low thermal expansion, the other soaking plate can exhibit the function of maintaining the flatness at the time of raising and lowering the temperature. And, by combining these two types of soaking plates via a resistance heating element, various features that cannot be realized by one kind of soaking plate alone, that is, high soaking properties and high resistance to change even during heating and cooling. Flatness and high-speed heating / cooling performance due to thinning can be realized simultaneously.

  For example, as shown in FIGS. 1A and 1B, the first soaking plate 11 having the mounting surface 11a is made of metal, and the second soaking plate 12 is made of ceramic or a metal ceramic composite material. Alternatively, as shown in FIGS. 1C and 1D, the first soaking plate 11 may be formed of ceramics or a metal ceramic composite material, and the second soaking plate 12 may be formed of metal. . 1 (a) to 1 (d), the processing for providing flexibility, which will be described later, is performed on the opposite surface side of the first soaking plate 11 and the second soaking plate 12, or on the opposite side. It is provided in either.

  When the first soaking plate 11 having the mounting surface 11a is formed of metal, it is applied to the first soaking plate 11 itself such as a vacuum groove processing for substrate adsorption that is usually formed on the mounting surface 11a. There is an advantage that it can be easily processed. On the other hand, when the first soaking plate 11 is formed of ceramic or a metal ceramic composite, the rigidity of the first soaking plate 11 itself is increased, so that deformation due to processing is reduced and high-precision machining is facilitated. There are advantages.

  In any case, the first soaking plate 11 and the second soaking plate 12 are preferably formed of a material having high thermal conductivity. This is because, as described above, the higher the thermal conductivity, the thinner the soaking plate. In particular, the thermal conductivity of the soaking plate is preferably 150 W / mK or more. When the soaking plate is made of metal, 200 W / mK or more is more preferable. Examples of the metal that satisfies this condition include Cu, Al, and alloys containing these.

  When the soaking plate is a ceramic or a metal ceramic composite, it is preferable that the Young's modulus is 200 GPa or more. This is because the higher the Young's modulus, the thinner the soaking plate can be made. For example, AlN, SiC, or a composite containing these for ceramics, Si / silicon carbide composites, Al / silicon carbide composites, Si / Al / silicon carbide composites, or these include metal ceramic composites It is preferred to use a complex. This is because these materials have high thermal conductivity and high Young's modulus.

  In the case of a soaking plate made of metal or a metal ceramic composite, surface treatment may be performed with a relatively hard metal such as Ni, ceramics such as alumite, or a highly corrosion-resistant material such as Teflon or polyimide resin. . By performing the surface treatment in this manner, the durability is improved and the generation of contamination and particles that are contamination sources for products such as semiconductor devices can be prevented. Of course, the same surface treatment may be applied to ceramic.

  The metal heat equalizing plate is processed to give flexibility to at least one surface thereof. Accordingly, one of the soaking plates made of metal can easily follow the other soaking plate with high rigidity such as a ceramic or a metal ceramic composite. In other words, even if a significant temperature change occurs in the metal heat equalizing plate, the metal heat equalizing plate can be elastically deformed so as to always be along the facing surface of the other facing heat equalizing plate. Thereby, it turned out that the especially preferable effect is acquired with respect to the following heater units for substrate heating.

  In other words, the metal soaking plate can be made flexible so that it can easily follow the other rigid soaking plate, thereby reducing the thickness of the metal soaking plate. Warpage can be suppressed, and flatness does not deteriorate even when the temperature is raised or lowered, and so the soaking property does not deteriorate. Further, since the metal has high thermal conductivity, the thermal uniformity is not impaired even if the thickness is reduced. Therefore, since the thickness can be reduced, the heat capacity is reduced, and high-speed heating / cooling is possible.

  As shown in FIG. 2, the metal soaking plate is processed into a concave portion having a shape such as a notch, a notch, a dent, a scratch, a cut portion, a bottomed hole portion, and a through hole portion. This is possible by providing N. The depth of the concave portion N and the width, length, shape, etc. of the concave portion N when the concave portion N is viewed from the direction perpendicular to the mounting surface of the heat equalizing plate are not particularly limited, and can be made flexible. Any processing can be used.

  In addition, the number (density) of the recesses N per unit area of the mounting surface, the density distribution, the interval between adjacent recesses, and the like are not particularly limited, and the flexibility necessary to easily follow the other heat equalizing plate. It may be optimized as appropriate to the extent that can be obtained. Of these processes, notches are particularly preferred. This is because by processing a small number of notches, sufficient flexibility can be obtained and processing can be performed at low cost. Such notch processing can be performed, for example, by mechanical cutting.

  The concave portion N for providing flexibility is shown in FIGS. 1A and 1B in which the first soaking plate 11 is made of metal, or in FIG. 1C in which the second soaking plate 12 is made of metal. As shown in Fig. 3 (d), it may be provided only on one side of the metal soaking plate, or on both sides of the metal soaking plate as shown in Fig. 3 where the first soaking plate 11 is made of metal. May be. When provided on both sides of the heat equalizing plate, the concave portion N for providing flexibility provided on the surface facing the other heat equalizing plate can be used as a vacuum suction groove to be described later. Further, if the metal soaking plate provided with the recesses N on both sides is the first soaking plate 11, the recess N provided on the mounting surface 11 a side for providing flexibility is provided on the above-described substrate adsorption. It can also be used as a groove.

  Furthermore, it is preferable that the metal soaking plate is appropriately heat-treated at a temperature higher than the temperature necessary for annealing the metal. For example, when Cu is used for a metal soaking plate, the temperature required for Cu annealing is about 380 ° C., so the Cu soaking plate is used at 400 to 450 ° C. for about 15 minutes to 8 hours. It is preferable to perform the heat processing to hold | maintain. This makes it easier for the metal soaking plate to follow the other soaking plate made of ceramics or a metal ceramic composite material.

  The thickness of the metal soaking plate is preferably equal to or less than the thickness of the ceramic or metal ceramic composite material soaking plate. This is because by making the metal soaking plate as thin as possible, it becomes easier to follow the plate surface of the soaking plate made of rigid ceramics or metal ceramic composite material. The soaking plate made of ceramics or metal ceramic composite material only needs to have a thickness to ensure rigidity.

  By making the thickness of the metal soaking plate equal to or less than the thickness of the soaking plate made of ceramics or metal ceramic composite material, the surface of the soaking plate made of rigid ceramic or metal ceramic composite material On the other hand, the metal heat equalizing plate is more easily copied. Therefore, high heat uniformity and excellent flatness can be maintained, the total thickness of the heater unit can be reduced, and the total heat capacity can be suppressed, so that the temperature can be raised and lowered at high speed.

  The resistance heating element 13a can be formed by etching stainless steel or nickel-chrome foil so as to form, for example, a spiral heating element circuit pattern. An insulation sheet is interposed between the resistance heating element 13a and the first soaking plate 11, between the resistance heating element 13a and the second soaking plate 12, and between the resistance heating elements 13a. be able to. In the case of the resistance heating element 13a and the number of layers, there are no particular restrictions on the stacking order, but by stacking a plurality of layers and allowing them to be separately energized compared to the case of a single layer, the temperature rises. You can change the speed. In addition, for example, local temperature control can be performed by combining heating element circuits having different patterns, so that it is possible to design so as to further improve the thermal uniformity.

  For example, when two layers of the resistance heating element 13a are provided, as shown in FIG. 4, the insulating sheet 13b / the resistance heating element 13a / the insulating sheet 13b / the resistance heating element 13a / the insulating sheet 13b may be used. The resistance heating element 13a may be detachably contacted with the insulating sheet 13b, or only one surface of the resistance heating element 13a may be bonded or fused to the insulating sheet 13b, or both sides of the resistance heating element 13a may be insulated. It may be bonded or fused to 13b. When at least one surface is bonded or fused to the insulating sheet 13b, setting between the first and second soaking plates 11 and 12 is easy.

  In the case of providing a plurality of layers of resistance heating elements 13a, the resistance heating elements 13a are bonded or fused together via an insulating sheet 13b, and the resistance heating element 13a and the first and second soaking plates 11, 12 are connected. The insulating sheet 13b at the coupling portion can also be bonded or fused to the resistance heating element 13a to form an integrated structure. When the multiple layers of resistance heating elements 13a are integrated in an insulated state as described above, it is easy to set between the first and second soaking plates 11 and 12. Further, the insulated resistance heating element may be separately bonded or fused to the first soaking plate 11 and / or the second soaking plate 12. In this case, setting is easy. As long as the insulating sheet 13b satisfies the thickness required for the electrical insulation design of the resistance heating element 13a, the thinner the insulating sheet 13b, the smaller the thermal resistance.

  Moreover, in order to diffuse the heat of the resistance heating element 13a well, a flexible insulating sheet may be used between the first and second soaking plates 11 and 12 and the resistance heating element 13a. In this case, it is desirable to use an insulating sheet having a high thermal conductivity as much as possible. In the case where a movable cooling plate 20 (described later) is provided below the heater unit 10 according to an embodiment of the present invention, the first rear surface of the heater unit 10, that is, the second heat equalizing plate 12, during rapid cooling. The cooling plate 20 comes into direct contact with the surface opposite to the surface facing the soaking plate 11.

  In the present invention, the first and second heat equalizing plates 11 and 12 facing each other through the insulated resistance heating element 13 are coupled so as to be relatively movable in a direction substantially parallel to the opposing surfaces. Thus, even if the temperature changes, one soaking plate made of metal can follow the other soaking plate made of ceramic or a metal ceramic composite. As a method of coupling these soaking plates so as to be relatively movable in a direction substantially parallel to the opposing surfaces, for example, a method of coupling using a vacuum suction unit, or a coupling method using a coupling unit combining a screw and a bearing Can be mentioned.

  A specific description will be given of a method of coupling using vacuum suction means. In the first soaking plate 11, a recess such as a groove is formed on the surface facing the resistance heating element 13, and a space formed by the recess. Are provided in the resistance heating element 13 and the second soaking plate 12. Then, the resistance heating element 13 and the first soaking plate 11 can be vacuum-adsorbed by evacuating the space through the through hole by a vacuum generating means such as a vacuum pump. Similarly, vacuum suction between the second heat equalizing plate 12 and the insulated resistance heating element 13 can be performed by evacuating through a concave portion such as a groove formed in the second heat equalizing plate 12 and a through hole.

  A specific description will be given of a coupling method using a coupling means that combines a screw and a bearing. For example, as shown in FIG. 5A, a screw hole 11 b is formed on the surface side facing the resistance heating element 13 in the first soaking plate 11. And a through hole is provided at a position corresponding to the screw hole 11 b of the second heat equalizing plate 12 and the resistance heating element 13. The first soaking plate 11 and the second soaking plate 12 are mechanically coupled by using screws 14 that are screwed into the screw holes 11 b of the first soaking plate 11.

  Here, a bearing groove 14a is provided on the seating surface of the head of the screw 14, and a bearing ball 15 is held in the bearing groove 14a. As a result, the head of the screw 14 can move in a plane direction parallel to the seating surface with respect to the second soaking plate 12. The bearing structure is not limited to the above structure. For example, as shown in FIG. 5 (b), a bearing groove 12a is formed in a region facing the seating surface of the head of the screw 14 in the second heat equalizing plate 12. It is provided and the bearing ball 15 may be held in the bearing groove 12a.

  In the method using the vacuum suction method or the method using a combination of screws and bearings as described above, the first soaking plate 11 and the insulated resistance heating element 13 can be slid with respect to each other at the interface. It becomes possible. In addition, the second heat equalizing plate 12 and the insulated resistance heating element 13 can be slid with respect to each other at these interfaces. Furthermore, when the resistance heating element 13 has two or more layers, these heating elements insulated from each other can be slid at these interfaces. As a result, the difference in thermal expansion between the first soaking plate 11 and the second soaking plate 12 can be absorbed. As described above, by suppressing the warpage due to the difference in thermal expansion of each member at the time of raising and lowering the temperature, it is possible to ensure good thermal uniformity within the mounting surface.

  Further, as described above, since the metal soaking plate is processed to give flexibility, the metal soaking plate is made of ceramic or a metal ceramic composite material. This makes it easier to copy. Therefore, the warp due to the difference in thermal expansion between the first soaking plate 11 and the second soaking plate 12 can be suppressed more reliably, and good soaking properties can be ensured in the mounting surface.

  After assembling the heater unit 10 by combining the first and second soaking plates 11 and 12 via the insulated resistance heating element 13, the entire temperature range of the heater unit 10 is actually used. You may heat-process so that the thermal history of the temperature range (for example, room temperature-300 degreeC) to include may be applied. The heat treatment of the heater unit 10 can be easily performed by causing the resistance heating element 13 provided in the heater unit 10 itself to generate heat.

  In this way, by applying a heat history to the heater unit 10 in advance, the metal heat equalizing plate can be made to almost completely follow the other heat equalizing plate made of ceramic or metal ceramic, In use, the flatness of the placement surface 11a of the first soaking plate 11 hardly changes. Therefore, the heater unit 10 with extremely high reliability can be manufactured.

  As described above, the heater unit 10 according to the embodiment of the present invention described above is configured so that one of the two soaking plates is a metal plate that has been processed to have flexibility, and further, if necessary, The metal plate is annealed, and the other soaking plate is made of ceramics or a metal ceramic composite material. Then, after these two kinds of soaking plates are opposed to each other via the resistance heating element 13, the two kinds of soaking plates are coupled so as to be relatively movable in a direction substantially parallel to the opposing surfaces. It is a feature.

  This provides a heater unit that combines heat uniformity and flatness stability that could not be achieved with conventional heater units made of only metal plates, or heater units made only of ceramics or metal ceramic composite materials, and high-speed heating and cooling. It became possible to do. In addition, after these two types of soaking plates are joined via a resistance heating element, heat treatment is performed as necessary in an integrated state as a heater unit, thereby further improving the stability of the soaking property and flatness. It became possible.

  That is, conventionally, when the thermal resistance between a mounting table on which a substrate such as a semiconductor wafer is mounted and a cooling plate for cooling the substrate is reduced, an adhesive or a large number of coupling means such as screws are used. Thus, a method has been used in which both members are closely fixed over almost the entire surface where they face each other. However, in these methods, the warp due to the bimetal may occur during the temperature rise / fall due to the difference in thermal expansion between the mounting table and the cooling plate. As a result, the flatness maintained at room temperature deteriorates, and the thermal uniformity of the substrate placed on the placement surface may be significantly deteriorated.

  On the other hand, in the heater unit of the present invention, as described above, by performing processing and processing that makes it easy for one of the soaking plates to follow the other of the soaking plates, not only at normal temperature but also at elevated temperature. The flatness of the mounting surface can always be kept almost constant. It should be noted that the two types of soaking plates through the resistance heating element are limited to the above-described vacuum adsorption method, the method of combining screws and bearings, or the bonding or fusion method using the flexible insulating sheet. However, any joining means can be used as long as one of the soaking plates can be deformably joined so as to follow the other soaking plate when the temperature of the heater unit is raised or lowered.

  As described above, heating and cooling are performed by the resistance heating element 13 and the movable cooling plate 20 described later in a state in which the first temperature equalizing plate 11 and the second temperature equalizing plate 12 are coupled to each other via the resistance heating element 13. When alternately repeated, the surface that contacts the resistance heating element 13 in the first soaking plate 11 is not in contact with the resistance heating element 13 in the second soaking plate 12 even though the resistance heating element 13 is interposed. It follows the shape of the abutting surface. In other words, the former surface is deformed along the shape of the latter surface.

  As a result, if the flatness of the surface in contact with the resistance heating element 13 in the second heat equalizing plate 12 is poor, the flatness of the surface in contact with the resistance heating element 13 in the first heat equalizing plate 11 is also deteriorated. As a result, the flatness of the mounting surface 11a of the first soaking plate 11 deteriorates. Thereby, there exists a possibility that the soaking | uniform-heating property in the mounting surface 11a may fall. In order to avoid such a problem, the flatness of the surface of the second soaking plate 12 that contacts the resistance heating element 13 is preferably 100 μm or less, and more preferably 50 μm or less. That is, when the flatness exceeds 100 μm, the flatness of the mounting surface 11a is gradually deteriorated, and accordingly, the heat uniformity on the mounting surface 11a may be lowered.

  Even if the flatness of the surface in contact with the resistance heating element 13 in the second soaking plate 12 is 100 μm or less, the shape of the surface is not convex upward but concave upward, that is, the substantially central portion of the surface is depressed. It preferably has a mortar shape. This is because if the surface of the second soaking plate 12 that is in contact with the resistance heating element 13 is concave upward, the deformation of the first soaking plate 11 along the shape proceeds smoothly, so that the placement surface 11a This is because it is possible to suppress the influence of a decrease in soaking property. The flatness of a surface means the distance between the two planes when assuming two planes having the shortest distance between the two parallel planes sandwiching the plane therebetween. .

  In the heater unit 10 according to one embodiment of the present invention, when the first soaking plate 11 and the second soaking plate 12 are coupled by vacuum suction as described above, a vacuum sealing member is used for stronger vacuum suction. It is preferable to provide. It is preferable that the vacuum sealing member is particularly provided on both outer peripheral portions of the first and second soaking plates 11 and 12 because adhesion can be further enhanced.

  For example, as a specific example of a structure provided with a vacuum sealing member, as shown in FIG. 6A, the vacuum sealing member is formed by an annular elastic member 16a, and the elastic member 16a is a first member. The structure provided in the part which the flange part each provided in the outer periphery of the 2nd soaking plates 11 and 12 opposes can be mentioned. Thereby, the airtightness of the space which the 1st soaking plate 11 and the 2nd soaking plate 12 oppose can be improved more.

  Or as shown in FIG.6 (b), the 1st soaking plate 11 and the 2nd soaking plate 12 are enclosed so that the outer edge part of the opposing surface side of the 1st soaking plate 11 and the 2nd soaking plate 12 may be enclosed. You may provide the cyclic | annular elastic member 16b on the outer periphery side periphery. In either case of the elastic members 16a and 16b, when no stress is generated in the annular elastic members 16a and 16b, the inner diameter thereof is the outer diameter of the first heat equalizing plate 11 and the second heat equalizing plate 12. Preferably it is smaller. Thereby, the adhesiveness between the elastic members 16a and 16b and the outer edge portions of the first and second soaking plates 11 and 12 can be enhanced before being evacuated.

  As yet another specific example, as shown in FIG. 6 (c), grooves that face each other over the entire circumference are formed on both outer peripheral portions of the opposing surfaces of the first and second soaking plates 11 and 12. It is also possible to improve the airtightness of the space formed by fitting the seal member 16c such as an O-ring and the soaking plates facing each other. In this case, airtight sealing is facilitated by tightening the vicinity of the central portions of the first and second soaking plates 11 and 12 with connecting means such as screws.

  In the heater unit 10, for example, a temperature sensor may be attached to the first soaking plate 11. Further, the heater unit 10 is provided with an avoidance hole for passing a temperature sensor cable, a through hole for a lifter pin for lifting the substrate, a hole for passing a cable for energizing the resistance heating element 13, and the like. There is. In this case, airtightness can be ensured by providing a vacuum sealing member such as an O-ring so as to surround the holes.

  A cooling plate may be provided below the heater unit 10 as necessary so that the heater unit 10 and the cooling plate can be separated from each other and brought into contact with each other. Thereby, at the time of rapid cooling, the heater unit 10 can be rapidly cooled by bringing the sufficiently cooled cooling plate into contact with the back surface (lower surface) of the second soaking plate 12 by an elevating mechanism such as an air cylinder.

  FIG. 7 is a schematic cross-sectional view showing an example of a heater including a movable cooling plate 20 below the heater unit 10 (that is, below the second soaking plate 12). The cooling plate 20 is formed with a refrigerant flow path 20a through which a refrigerant such as cooling water can be circulated. The cooling plate 20 can be driven up and down by an elevating mechanism (not shown) formed of an air cylinder or the like, and can contact / separate from the heater unit 10.

  The heater unit 10 and the cooling plate 20 are preferably housed in a container 30 made of stainless steel or the like for shielding heat from the heater unit 10 from being easily transmitted to other production apparatuses. In this case, the cooling plate 20 and the container 30 are provided with a support rod for supporting the heater unit 10, a power supply wiring, and a through hole for inserting a temperature sensor.

  The cooling plate 20 of FIG. 7 is directly cooled by the refrigerant flowing through the refrigerant flow path, but may be indirectly cooled using a cooling module without forming the refrigerant flow path in the cooling plate 20. . In this case, when the cooling plate 20 is separated from the heater unit 10 and lowered, the cooling plate 20 is cooled by coming into contact with a cooling module provided at the lower portion of the cooling plate 20. That is, a coolant channel is formed in the cooling module, and the cooling plate 20 can be indirectly cooled to a predetermined temperature by circulating the coolant therethrough.

  As described above, a structure in which a metal soaking plate and a soaking plate made of ceramics or a metal ceramic composite material are coupled to each other through a resistance heating element so as to be relatively movable in a direction substantially parallel to each other. The heater unit of the present invention has a metal soaking plate that has been processed to be flexible, and is further combined with a metal soaking plate before joining or a combined heater unit. On the other hand, heat treatment is performed as necessary. As a result, the metal soaking plate can easily follow the soaking plate made of ceramics or metal ceramic composite material, and therefore, even if the temperature rise and fall are repeated by the resistance heating element and the cooling plate, these two soaking plates can be used. The heat plate can always maintain a close contact state over almost the entire surface thereof.

  This makes it possible to heat at high speed without increasing the thermal resistance, compared to the conventional method in which a method of closely fixing two types of different materials using an adhesive or the like is used to reduce the thermal resistance. In addition to cooling, it is possible to reduce the warpage due to the bimetal due to the difference in thermal expansion between the upper and lower soaking plates even under conditions of rapid heating and rapid temperature changes during rapid cooling. As a result, the thermal uniformity of the substrate placed on the placement surface can always be maintained high.

  As mentioned above, although the heater unit of this invention and the inspection apparatus and manufacturing apparatus which comprise this were demonstrated based on embodiment, this invention is not limited to this embodiment, The range which does not deviate from the main point of this invention It should be understood that the present invention can be implemented in various ways. That is, the technical scope of the present invention covers the claims and their equivalents.

[Example 1A]
As an example according to the present invention, a heater unit 10 shown in FIG. The material of the first soaking plate 11 is selected from Cu and Al which are metals, and the material of the second soaking plate 12 is AlN, SiC, SiSiC and AlSiC which are ceramics or a metal ceramic composite. The combination of various materials was selected.

  The mounting surface 11a of the first soaking plate 11 is processed for substrate adsorption, and the opposite surface of the mounting surface 11a is subjected to notching processing for flexibility, and finished to a flatness of 50 μm. Processed and Ni-plated. A temperature sensor 40 for monitoring the temperature was embedded in the first soaking plate 11. The second soaking plate 12 was processed to avoid the temperature sensor 40 and the power supply wiring, and the flatness was finished to 50 μm. The first soaking plate 11 and the second soaking plate 12 had a diameter of 330 mm and a thickness of 3 mm, respectively.

  As the resistance heating element 13a, a SUS foil formed in a heating element circuit was used, and a plurality of polyimide sheets were prepared as the insulating sheet 13b, and these were laminated as shown in FIG. The two resistance heating elements 13a that were stacked were separately connected to a power supply wiring so that they could be energized separately. The insulated resistance heating element 13 thus obtained is sandwiched between the first soaking plate 11 and the second soaking plate 12, and the first soaking plate 11 and the second soaking plate 12 are placed in the center. Only the part was temporarily fixed with screws. A vacuum suction means for attaching a pipe connected to a vacuum pump to a vacuum suction through hole provided in advance in the second soaking plate 12 and vacuum-sucking the space between the first soaking plate 11 and the second soaking plate 12 Thus, the first soaking plate 11 and the second soaking plate 12 were joined together.

  Thus, the heater units 10 of Samples 1A to 8A shown in Table 1A below were produced. When each of these samples is heated by feeding only one of the two resistance heating elements 13a (1.25 kW) and when heated by feeding both of them (2.5 kW), from each room temperature. The change in flatness of the mounting surface 11a and the temperature increase rate when heated to 200 ° C. were measured. The measurement results and their evaluation are shown in Table 1A below.

[Example 1B]
Except that the first soaking plate 11 and the second soaking plate 12 are evenly joined at six locations by using a joining means combining screws and bearings as shown in FIG. In the same manner as in Example 1A, heater units 10 of Samples 1B to 8B shown in Table 1B below were produced. These samples were heated in the same manner as in Example 1A, and the change in flatness of the mounting surface 11a and the temperature increase rate were measured. The measurement results and their evaluation are shown in Table 1B below.

[Example 2A]
The material of the first soaking plate 11 is selected from AlN, SiC, SiSiC, and AlSiC that are ceramics or a metal ceramic composite, and the material of the second soaking plate 12 is Cu and Al that are metals. The combination of various materials was selected. The mounting surface 11a of the first soaking plate 11 was processed for substrate adsorption and finished to a flatness of 50 μm. The surface of the second soaking plate 12 on the substrate side was subjected to notch processing for flexibility and processing for avoiding the temperature sensor 40 and the power supply wiring, the flatness was finished to 50 μm, and Ni plating was performed. Except for these, Samples 9A to 16A were prepared in the same manner as in Example 1A, and the same measurement was performed. The measurement results and their evaluation are shown in Table 2A below.

[Example 2B]
Except that the first soaking plate 11 and the second soaking plate 12 are evenly joined at six locations by using a joining means combining screws and bearings as shown in FIG. In the same manner as in Example 2A, heater units 10 of Samples 9B to 16B shown in Table 2B below were produced. These samples were heated in the same manner as in Example 1A, and the change in flatness of the mounting surface 11a and the temperature increase rate were measured. The measurement results and their evaluation are shown in Table 2B below.

[Comparative Example 1A]
Samples 17A to 19A were prepared in the same manner as in Example 1A except that both the first soaking plate 11 and the second soaking plate 12 were made of Cu, both of them were made of Al, or both were made of AlN. Then, the same measurement as in Example 1A was performed. Further, for comparison, without using the second soaking plate 12 as in the past, the thickness of the first soaking plate 11 is only 6 mm, the material is Cu, Al, or AlN, and the first soaking plate 11 is placed. Samples 20 to 22 were prepared in the same manner as in Example 1A, except that a heating element insulated with a polyimide sheet was attached to the surface opposite to the surface 11a with a heat-resistant adhesive, and the samples 20 to 22 were prepared. Was measured. The measurement results and their evaluation are shown in Table 3A below.

[Comparative Example 1B]
Except that the first soaking plate 11 and the second soaking plate 12 are evenly joined at six locations by using a joining means combining screws and bearings as shown in FIG. The heater units of Samples 17B to 19B shown in Table 3B below were manufactured in the same manner as Samples 17A to 19A of Comparative Example 1A. These samples were heated in the same manner as in Comparative Example 1A, and the flatness change and the temperature increase rate of the mounting surface 11a were measured. The measurement results and their evaluation are shown in Table 3B below.

  As can be seen from the results of Tables 3A and 3B, since the rigidity of the metal soaking plate processed thinly is weak, of course, in the case of only one conventional metal plate not using the second soaking plate, Even when two sheets were stacked and vacuum-adsorbed, the warpage at the time of temperature increase was large, and sufficient temperature uniformity was not obtained. Further, in the case of Cu, the heating rate was slow due to the large heat capacity.

  On the other hand, from the results of Tables 1A, 1B, 2A, and 2B, one of the first soaking plate 11 and the second soaking plate 12 is made of metal, and the other is made of ceramic or metal ceramic composite. By joining these soaking plates with the insulating heating resistance 13 in a laminated form with a vacuum suction means or a joining means that combines a screw and a bearing, it is possible to suppress a change in flatness and ensure soaking. It was found that the temperature could be increased at a high speed. In addition, it was found that by stacking two resistance heating elements 13a, it was possible to apply power up to twice that of a normal one resistance heating element 13a, and to increase the temperature at twice as fast. .

[Comparative Example 2]
Example 1 except that the first soaking plate 11 and the second soaking plate 12 are not joined by a vacuum suction means or a joining means that combines a screw and a bearing, but a number of locations are fixed by general screwing. Samples 23 to 38 were prepared in the same manner as 1A. These were heated from room temperature to 200 ° C. as in Example 1A, and the change in flatness of the mounting surface 11a and the rate of temperature increase were measured. The measurement results and their evaluation are shown in Table 4 below.

  From Table 4 above, in the heater unit in which the first soaking plate 11 and the second soaking plate 12 are fixed by using many conventional general screwing, the flatness change at the time of temperature rise is large, and it is good at 200 ° C. It was found that it was not possible to obtain a uniform temperature.

[Comparative Example 3A]
Except that the first soaking plate 11 was not subjected to flexible processing, heater units of samples 39A to 54A were produced in the same manner as in Example 1A, and these were heated from room temperature to 200 ° C. as in Example 1A. Then, the change in flatness of the mounting surface 11a and the temperature increase rate were measured. The measurement results and their evaluation are shown in Table 5A below.

[Comparative Example 3B]
Except that the first soaking plate 11 and the second soaking plate 12 are evenly joined at six locations by using a joining means combining screws and bearings as shown in FIG. In the same manner as in Comparative Example 3A, heater units of Samples 39B to 54B shown in Table 5B below were manufactured. These samples were heated in the same manner as in Example 1A, and the change in flatness of the mounting surface 11a and the temperature increase rate were measured. The measurement results and their evaluation are shown in Table 5B below.

  From the above Tables 5A and 5B, it can be seen that when the flexible processing is not performed, the change in flatness at the time of temperature increase is large and the temperature uniformity at the time of temperature increase is not good as compared with the case of processing.

[Example 3A]
Except that the thickness of the first soaking plate 11 was 2 mm and the thickness of the second soaking plate 12 was 4 mm, heater units of samples 55A to 62A were produced in the same manner as in Example 1A, and the same measurement as in Example 1A was performed. Went. The measurement results and their evaluation are shown in Table 6A below.

[Example 3B]
Except that the first soaking plate 11 and the second soaking plate 12 are evenly joined at six locations by using a joining means combining screws and bearings as shown in FIG. In the same manner as in Example 3A, heater units 10 of samples 55B to 62B shown in Table 6B below were produced. These samples were heated in the same manner as in Example 1A, and the change in flatness of the mounting surface 11a and the temperature increase rate were measured. The measurement results and their evaluation are shown in Table 6B below.

[Example 4A]
Except that the thickness of the first soaking plate 11 was 4 mm and the thickness of the second soaking plate 12 was 2 mm, heater units of samples 63A to 70A were produced in the same manner as in Example 2A, and the same measurement as in Example 1A was performed. Went. The measurement results and their evaluation are shown in Table 7A below.

[Example 4B]
Except that the first soaking plate 11 and the second soaking plate 12 are evenly joined at six locations by using a joining means combining screws and bearings as shown in FIG. In the same manner as in Example 4A, the heater units 10 of Samples 63B to 70B shown in Table 7B below were produced. These samples were heated in the same manner as in Example 1A, and the change in flatness of the mounting surface 11a and the temperature increase rate were measured. The measurement results and their evaluation are shown in Table 7B below.

[Reference example]
For reference, the heater unit of the sample 71 was manufactured by reversing the thicknesses of the first and second soaking plates 11 and 12 of the sample 55A of Example 3A, and the same measurement was performed. The measurement results and their evaluation are shown in Table 8 below.

  Comparing the results of Tables 6A, 6B, 7A, and 7B with Tables 1A, 1B, 2A, and 2B, it can be seen that the rate of temperature increase can be increased by making the metal thickness thinner than the thickness of the ceramic or metal ceramic composite. On the other hand, as in the reference example shown in Table 8, when the metal was thicker than the ceramic, the rate of temperature increase was increased, and the flatness could not be maintained by making the ceramic too thin. That is, it can be seen that the problem of warping and the like is less likely to occur when the ceramic is made thicker and the metal is made thinner, and the reliability becomes higher.

[Example 5]
A heater unit was prepared in the same manner as in Example 1A except that the outer periphery of the first soaking plate 11 and the second soaking plate 12 was flanged as shown in FIG. The annular band is covered with the opposing portions of the flange portions of the first and second soaking plates 11 and 12 so as to cover the side surfaces of the outer periphery of the first and second soaking plates 11 and 12. And hermetically sealed. Further, the periphery of the lifter pin, the temperature sensor 40, and the power supply wiring lead-out portion was hermetically sealed with an O-ring made of heat-resistant resin. The samples 72 to 87 thus obtained were measured in the same manner as in Example 1A. The measurement results and their evaluation are shown in Table 9 below.

  From Table 9 above, the hermeticity is enhanced when the outer periphery of the first soaking plate 11 and the second soaking plate 12 is hermetically sealed, and the resistance heating element 13 insulated from the soaking plates 11, 12 It has been found that the adhesiveness of the material can be further improved, and the heating rate can be increased.

[Example 6A]
In order to produce the heater shown in FIG. 7, first, a cooling plate 20 was produced using an aluminum alloy plate. The cooling plate 20 was formed with a through hole for inserting a power supply wiring, a temperature sensor, and a rod supporting the heater unit 10 by machining. Further, machining was performed so that the flatness of the surface in contact with the heater unit was 200 μm. In addition, a soft silicon sheet having a thickness of 0.5 mm was provided on the contact surface with the heater unit so as to uniformly contact the entire surface without partial contact.

  Further, a phosphorous deoxidized copper pipe having an outer diameter of 6 mm and an inner diameter of 4 mm was formed by bending a flow path through which the refrigerant can flow. On the other hand, a counterbore portion is provided on the surface opposite to the surface in contact with the heater unit 10 in the cooling plate 20 and the copper pipe is inserted therein, and a heat conductive resin is filled in the formed gap to efficiently transfer heat. I did it. An inlet and an outlet for supplying and discharging cooling water were formed at both ends of the flow path. A stop plate supporting the flow path was fixed by screwing, and the cooling plate 20 having the flow path inside was completed. The cooling plate 20 is movable up and down by an elevating mechanism composed of an air cylinder, and can be brought into contact with and separated from the heater unit 10.

  Next, the container 30 was made from stainless steel. The side wall of the container 30 had an inner surface height of 30 mm, an inner diameter of 337 mm, a thickness of 1.5 mm, and a bottom surface of 3 mm. An opening for fastening a support rod for supporting the heater unit 10 with respect to the power supply wiring, the temperature sensor, and the container was provided on the bottom surface. The samples prepared in Example 5, Example 3A, and Example 4A described above were attached to the support rod of the container 30, and the cooling plate 20 was further assembled to the lifting mechanism to form a heater. In each of the obtained heaters, the cooling plate 20 was pressed against the heater unit 10 in a stable temperature rising state at 200 ° C. for rapid cooling, and the change in flatness at 150 ° C. and the cooling rate were measured. The measurement results and the evaluation thereof are shown in the following Tables 10, 11A, and 12A, respectively.

[Example 6B]
The heater shown in FIG. 7 is the same as that of Example 6A except that the samples prepared in Example 3B and Example 4B described above are attached in place of the samples prepared in Example 3A and Example 4A. Was made. For these heaters, the change in flatness at 150 ° C. and the cooling rate were measured in the same manner as in Example 6A. The measurement results and the evaluation thereof are shown in Tables 11B and 12B below, respectively.

[Comparative Example 4]
For comparison, a heater was completed using each sample prepared in Comparative Example 2 in the same manner as in Example 6A, and evaluated in the same manner as in Example 6A. The measurement results and their evaluation are shown in Table 13 below.

  From these Tables 10, 11A, 11B, 12A, 12B and 13, compared to the conventional general multi-point screwing method, in the present invention, the change in flatness during cooling can be kept small, and the heat uniformity can be improved. I know what I can do. It can also be seen that the thermal resistance is also reduced by the adhesion by the vacuum suction means or the coupling means combining the screw and the bearing.

DESCRIPTION OF SYMBOLS 10 Heater unit 11 1st soaking plate 12 2nd soaking plate 13 Insulated resistance heating element 14 Screw 15 Bearing ball 16a, b, c Elastic member 20 Cooling plate 30 Container 40 Temperature sensor N Concavity S Heated object

Claims (7)

A first soaking plate having a mounting surface on which the substrate is mounted;
A second soaking plate for supporting the first soaking plate;
A heater unit having at least one insulated resistance heating element provided between the first soaking plate and the second soaking plate,
The first heat equalizing plate and the second heat equalizing plate are coupled so as to be relatively movable in a direction substantially parallel to the opposing surfaces, and the first heat equalizing plate and the second heat equalizing plate are , One side is made of metal and at least one side is processed to be flexible, and the other side is made of ceramics or a metal ceramic composite material, and the surface that contacts the insulated resistance heating element is substantially central A heater unit characterized in that it has a mortar shape with a recessed portion.   The first soaking plate and the second soaking plate are characterized in that the thickness of the one made of metal is equal to or less than the thickness of the other made of ceramics or a metal ceramic composite material. Item 2. The heater unit according to Item 1.   3. The heater unit according to claim 1, wherein a flatness of a surface of the second soaking plate contacting the insulated resistance heating element is 100 μm or less.   The heater unit according to any one of claims 1 to 3, wherein the relatively movable coupling is a coupling by a vacuum suction unit or a coupling unit combining a screw and a bearing.   The heater unit according to claim 4, further comprising a vacuum sealing member provided for the vacuum suction means.   The heater unit according to claim 5, wherein the vacuum sealing member is disposed in the vicinity of an outer peripheral portion of the first soaking plate and the second soaking plate.   The heater unit according to any one of claims 1 to 6, comprising a cooling plate.

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