CN215849490U

CN215849490U - Central die assembly mechanism of injection molding machine

Info

Publication number: CN215849490U
Application number: CN202121770965.0U
Authority: CN
Inventors: 陈坚
Original assignee: Hangzhou Lianshun Machinery Co ltd
Current assignee: Hangzhou Lianshun Machinery Co ltd
Priority date: 2021-07-30
Filing date: 2021-07-30
Publication date: 2022-02-18
Anticipated expiration: 2031-07-30

Abstract

The utility model relates to the technical field of injection molding machines, and discloses a central die assembly mechanism of an injection molding machine. The other end is compounded because of electron hole pairs, the internal energy is increased, the temperature is raised, and heat is released to the environment, namely the hot end, when demoulding is needed, the cold end of the semiconductor wafer is tightly attached to the cooling part, so that quick cooling is completed, demoulding is convenient, after demoulding is completed, the semiconductor wafer can be driven by the first power source to rotate, so that the just hot end is quickly and tightly attached to the heating part, so that quick heating is completed, the first die assembly and/or the second die assembly are preheated, and injection molding plastics which are subsequently processed are prevented from being cooled in advance due to too fast heat loss.

Description

Central die assembly mechanism of injection molding machine

Technical Field

The utility model relates to the technical field of injection molding machines, in particular to a central die assembly mechanism of an injection molding machine.

Background

The injection molding machine is at the in-process of production and processing, need push up the mould mechanism and push out the mould with the work piece that the completion of moulding plastics to accomplish the production and processing to the work piece, usually speaking the production mould of plastics is in the in-process of production, need pour into the mould into with the raw materials that melts earlier, then cool off the design, current mould cooling ability is poor, and to some moulds that the structure is comparatively complicated, mould temperature after the cooling is low and cause the raw materials to solidify in advance at the in-process of moulding plastics, cause the condition that product quality does not reach standard.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model aims to provide a central mold clamping mechanism of an injection molding machine, which is used for overcoming the defects in the prior art.

In order to achieve the purpose, the utility model provides the following technical scheme: a central die assembly mechanism of an injection molding machine comprises a first die assembly and a second die assembly which are opposite in position, wherein opposite surfaces of the first die assembly and the second die assembly are provided with injection molding grooves which are matched with each other, and an injection molding port which is used for injection molding and is common to the injection molding grooves is arranged in the second die assembly;

further comprising: the temperature control components are arranged on the first die assembly and/or the second die assembly, each temperature control component comprises a temperature guide groove formed in the first die assembly and/or the second die assembly, the temperature guide groove is divided into two parts so as to form a temperature rising part and a temperature reducing part, a rotating power source and a semiconductor wafer which is electrified and can rise and reduce temperature are arranged in the temperature guide groove, the rotating power source is used for driving the semiconductor wafer to be switched between the temperature rising part and the temperature reducing part, the characteristics of the semiconductor are utilized, the semiconductor wafer in the utility model uses an N-type semiconductor and a P-type semiconductor, after the power source is switched on, an electron hole pair is generated near an upper contact, the internal energy is reduced, the temperature is reduced, and the semiconductor wafer absorbs heat to the outside and is called as a cold end. The other end is compounded due to electron hole pairs, the internal energy is increased, the temperature is raised, and heat is released to the environment and called as a hot end, so that when demoulding is needed, the cold end of the semiconductor wafer is tightly attached to the cooling part, so that rapid cooling is completed, demoulding is convenient, after demoulding is completed, the semiconductor wafer can be driven by the first power source to rotate, the just hot end is quickly and tightly attached to the heating part, rapid heating is completed, the first die assembly and/or the second die assembly are preheated, and injection molding plastics which are processed subsequently are prevented from being cooled in advance due to too fast heat loss.

As a further improvement of the present invention, the outer side of the semiconductor wafer comprises a connection board, the connection board is disposed at the output end of the rotation power source, and the connection board is disposed to facilitate the rotation and installation of the semiconductor wafer and provide a certain protection effect for the semiconductor wafer.

As a further improvement of the present invention, the rotational power source is disposed at a junction between the temperature raising portion and the temperature lowering portion, power connection slots connected to a power grid are disposed in both the temperature raising portion and the temperature lowering portion, a power connection block electrically connected to the semiconductor wafer is disposed on the connection board, when the rotational power source drives the connection board to enter the temperature lowering portion, one side surface of the semiconductor wafer abuts against a bottom of the temperature guide slot and the power connection block is engaged in the power connection slot corresponding to the position where the power connection block is engaged, when the rotational power source drives the connection board to enter the temperature raising portion, the other side surface of the semiconductor wafer abuts against the bottom of the temperature guide slot and the power connection block is engaged in the power connection slot corresponding to the position where the power connection block is engaged, with the arrangement of the power connection slot and the power connection block, a wire is not required to be directly connected to the semiconductor wafer, and the wire entanglement is prevented when the semiconductor wafer is wound, and only when the semiconductor wafer completely enters the temperature reduction part or the temperature rise part, the semiconductor wafer can be electrified, so that the energy waste is reduced, and the risk of electric leakage is not easy to occur.

As a further improvement of the utility model, the first mold closing and the second mold closing are respectively provided with a cooling component for cooling, the cooling component comprises a cooling pipeline which is arranged in the first mold closing and the second mold closing, two ends of the cooling pipeline are communicated with the outside to form an inlet and an outlet, the utility model is also provided with a cooling mode which utilizes cooling liquid to enter the cooling pipeline for cooling, two cooling modes are synchronously carried out in production and processing, and the cooling rate can be effectively improved.

As a further improvement of the present invention, the injection molding machine is provided with a cooling pump, the cooling pump is connected with the inlet and the outlet to form a cooling loop, and the cooling pump can pump the cooling liquid into the cooling pipeline.

As a further improvement of the present invention, a fixing rod is installed on a side of the second mold closing away from the first mold closing, the fixing rod is detachably connected to the injection molding machine, and some installation holes for installing the mold closing are usually opened on the injection molding machine, so as to meet the installation requirements of mold closing mechanisms of different sizes, so that the fixing rod is inserted into the corresponding installation hole, and then the fixing rod is fixed by means of bolts and the like, so that the installation of the mold closing mechanism can be completed.

As a further improvement of the utility model, a mounting assembly and a top die mechanism are arranged on one side of the first die assembly, which is far away from the second die assembly, the second die assembly is arranged on the top die mechanism, the top die mechanism is used for pushing a product out of the first die assembly, the mounting assembly comprises a first substrate, a second substrate, a mounting plate and a plurality of connecting rods, the mounting plate is arranged on one side of the top die mechanism, which is far away from the die mechanism, the connecting rods are arranged between the top die mechanism and the mounting plate, the mounting plate is detachably connected and mounted on the second substrate, the mounting plate and the connecting rods are arranged to facilitate the mounting of the top die mechanism, a plurality of first slide bars are connected between the second substrate and the first substrate, the first slide bars are connected with the first substrate in a sliding manner, and the first slide bars are fixedly connected with the second substrate, the first base plate is used for fixing the top die mechanism in the injection molding machine, one side of the first sliding rod is provided with a driving power source, the driving power source is used for driving the top die mechanism and the first die assembly to be far away from or close to the second die assembly, the push rod is detachably connected, and the top die mechanism top die distance can be completed by replacing the push rods with different lengths under the condition that the length of the first sliding rod and the movement stroke of the driving power source are not changed.

The utility model has the beneficial effects that: the semiconductor slice uses an N-type semiconductor and a P-type semiconductor, after the power supply is switched on, electron-hole pairs are generated near an upper contact, the internal energy is reduced, the temperature is reduced, and the heat is absorbed to the outside, namely the cold end. The other end is compounded because of electron hole pairs, the internal energy is increased, the temperature is raised, and heat is released to the environment, namely the hot end, when demoulding is needed, the cold end of the semiconductor wafer is tightly attached to the cooling part, so that quick cooling is completed, demoulding is convenient, after demoulding is completed, the semiconductor wafer can be driven by the first power source to rotate, so that the just hot end is quickly and tightly attached to the heating part, so that quick heating is completed, the first die assembly and/or the second die assembly are preheated, and injection molding plastics which are subsequently processed are prevented from being cooled in advance due to too fast heat loss.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a front cross-sectional view of the utility model as shown in FIG. 1;

FIG. 3 is an enlarged view of a portion of the utility model at A in FIG. 2;

FIG. 4 is a second right side elevational view of the mold of FIG. 1 in accordance with the present invention;

FIG. 5 is an enlarged view of the temperature control assembly of FIG. 5 in accordance with the present invention;

FIG. 6 is a right side view of the pusher block of FIG. 1 in accordance with the present invention;

fig. 7 is a left side view of the fixing plate of fig. 1 according to the present invention.

Reference numerals: 1. a mold ejecting mechanism; 11. a pushing block; 12. a fixing plate; 13. a threaded hole; 14. adjusting the sliding chute; 15. matching with the sliding chute; 16. a groove; 2. a mold releasing part; 21. a stripper bar; 22. a spring; 23. a slider assembly; 231. a first slider; 232. a second slider; 24. a sliding sleeve; 25. a telescopic rod; 3. a mold clamping mechanism; 31. first die assembly; 32. second mold closing; 33. an injection molding port; 34. injection molding a groove; 4. a cooling assembly; 41. an inlet port; 42. a cooling pipeline; 5. a temperature control assembly; 51. a temperature conducting groove; 52. a temperature raising unit; 53. a temperature reduction part; 54. an electric connection groove; 55. a connecting plate; 56. a source of rotational power; 57. a semiconductor wafer; 58. a power connection block; 6. fixing the rod; 7. mounting the component; 71. pile head; 72. a first slide bar; 73. a first substrate; 74. a push rod; 75. a second substrate; 76. mounting a plate; 77. a connecting rod.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. In which like parts are designated by like reference numerals. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "bottom" and "top," "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.

Referring to fig. 1-3, the central mold clamping mechanism of the injection molding machine of the present embodiment includes a first mold clamping 31 and a second mold clamping 32 which are opposite in position, opposite surfaces of the first mold clamping 31 and the second mold clamping 32 are both provided with injection molding grooves 34 which are matched with each other, and an injection molding port 33 which is communicated with the injection molding grooves 34 and used for injection molding is arranged in the second mold clamping 32;

further comprising: the temperature control assemblies 5 are arranged on the first die assembly 31 and/or the second die assembly 32, each temperature control assembly 5 comprises a temperature guide groove 51 arranged on the first die assembly 31 and/or the second die assembly 32, each temperature guide groove 51 is divided into two parts to form a temperature rising part 52 and a temperature reducing part 53, a rotary power source 56 (such as a motor) and a semiconductor wafer 57 capable of rising and reducing temperature when being electrified are arranged in each temperature guide groove 51, and the rotary power source 56 is used for driving the semiconductor wafer 57 to be switched between the temperature rising part 52 and the temperature reducing part 53. The other end is compounded because of electron hole pairs, the internal energy is increased, the temperature is raised, and heat is released to the environment, namely the hot end, when demoulding is needed, the cold end of the semiconductor wafer 57 is tightly attached to the cooling part 53, so that rapid cooling is completed, demoulding is convenient, after demoulding is finished, the semiconductor wafer 57 can be driven by the first power source to rotate, so that the just hot end is quickly tightly attached to the heating part 52, rapid heating is completed, the first die assembly 31 and/or the second die assembly 32 are preheated, and injection molding plastics which are subsequently processed are prevented from being cooled in advance due to too fast heat loss.

In one embodiment, the temperature control assembly 5 is configured with consideration that it will not collide with other components during rotation.

In one embodiment, the semiconductor wafer 57 includes a connection board 55 on the outer side, and the connection board 55 is disposed at the output end of the rotation power source 56, so that the semiconductor wafer 57 can be conveniently rotated and mounted through the connection board 55, and a certain protection effect can be provided for the semiconductor wafer 57.

In one embodiment, the connection plate 55 may be made of a metal material, which may have good thermal conductivity and rigidity.

In one embodiment, the rotational power source 56 is disposed at the connection point of the temperature raising portion 52 and the temperature lowering portion 53, the temperature raising portion 52 and the temperature lowering portion 53 are both opened with an electrical connection slot 54 connected to the power grid (usually, the electrical connection slot 54 is provided with an electrically conductive metal sheet therein to facilitate quick electrical connection when the electrical connection block 58 is contacted), the connection board 55 is provided with an electrical connection block 58 electrically connected to the semiconductor chip 57, when the rotational power source 56 drives the connection board 55 into the temperature lowering portion 53, one side surface of the semiconductor chip 57 abuts against the bottom of the temperature guiding slot 51 and the electrical connection block 58 is inserted into the electrical connection slot 54 corresponding to the insertion position, when the rotational power source 56 drives the connection board 55 into the temperature raising portion 52, the other side surface of the semiconductor chip 57 abuts against the bottom of the temperature guiding slot 51 and the electrical connection block 58 is inserted into the electrical connection slot 54 corresponding to the insertion position, by the arrangement of the electrical connection slot 54 and the electrical connection block 58, it is not necessary to directly connect wires to the semiconductor chip 57, the entanglement of the electric wire when the semiconductor chip 57 is wound is prevented, and the semiconductor chip 57 is energized only when the semiconductor chip 57 completely enters the cooling portion 53 or the heating portion 52, so that not only is the waste of energy reduced, but also the risk of electric leakage is not easy to occur.

In one embodiment, the first mold closing 31 and the second mold closing 32 are respectively provided with a cooling component 4 for cooling, the cooling component 4 comprises a cooling pipeline 42 which is arranged in the first mold closing 31 and the second mold closing 32, two ends of the cooling pipeline 42 are communicated with the outside so as to form an inlet 41 and an outlet, and a mode of cooling by utilizing cooling liquid to enter the cooling pipeline 42 is further configured in the utility model, two cooling modes are synchronously performed in production and processing, and the cooling rate can be effectively improved.

In one embodiment, the injection molding machine is provided with a cooling pump, the cooling pump is connected with the inlet 41 and the outlet to form a cooling loop, and the cooling pump can pump cooling liquid into the cooling pipeline 42.

In one embodiment, the fixing rod 6 is installed on the side of the second mold closing 32 away from the first mold closing 31, the fixing rod 6 is detachably connected with the injection molding machine, and a plurality of installation holes for installing the mold closing are usually formed in the injection molding machine, so that the installation of the mold closing mechanisms 3 with different sizes is met, and thus, the fixing rod 6 is inserted into the corresponding installation hole, and then the fixing rod 6 is fixed through bolts and the like, so that the installation of the mold closing mechanism can be completed.

In one embodiment, a mounting assembly 7 and a top mold mechanism 1 are arranged on one side of the first mold closing 31 facing away from the second mold closing 32, the second mold closing 32 is arranged on the top mold mechanism 1, the top mold mechanism 1 is used for pushing a product out of the first mold closing 31, the mounting assembly 7 comprises a first substrate 73, a second substrate 75, a mounting plate 76 and a plurality of connecting rods 77, the mounting plate 76 is located on one side of the top mold mechanism 1 facing away from the mold closing mechanism 3, the plurality of connecting rods 77 are arranged between the top mold mechanism 1 and the mounting plate 76, the mounting plate 76 is detachably connected and arranged on the second substrate 75, the mounting plate 76 and the connecting rods 77 can facilitate the mounting of the top mold mechanism 1, a plurality of first sliding rods 72 are connected between the second substrate 75 and the first substrate 73, the first sliding rods 72 are connected between the first sliding rods 72 and the first substrate 73, the first sliding rods 72 and the second substrate 75 are fixedly connected, and the first substrate 73 is used for fixing the top mold mechanism 1 in the injection molding machine (if the bottom of the injection molding machine is provided with a check device A substrate 73 is inserted), one side of the first slide bar 72 is provided with a driving power source (such as a hydraulic cylinder and an air cylinder), the driving power source is used for driving the top die mechanism 1 and the first die assembly 31 to be far away from or close to the second die assembly 32, the push rod 74 is detachably connected, and the top die mechanism 1 can be completed by replacing the push rod 74 with different lengths under the condition that the length of the first slide bar 72 and the movement stroke of the driving power source are not changed.

In one embodiment, a plurality of mold release holes are formed through the first mold clamp 31, and one end of each mold release hole is communicated with the injection groove 34, so that the top mold mechanism 1 can be conveniently released.

The mold ejecting mechanism 1 in one embodiment comprises a pushing block 11 and a fixing plate 12 which are arranged in opposite positions, wherein a plurality of adjusting sliding grooves 14 are formed in the side surface, facing the fixing plate 12, of the pushing block 11, a plurality of matching sliding grooves 15 penetrating through the fixing plate 12 are formed in the side surface, facing the pushing block 11, of the fixing plate 12, and the positions of the matching sliding grooves 15 are in one-to-one correspondence with the positions of the adjusting sliding grooves 14;

the utility model discloses a demoulding mechanism, which comprises a plurality of demoulding parts 2, wherein each demoulding part 2 comprises a demoulding rod 21 for ejecting a workpiece out of a mould, one end of each demoulding rod 21 is provided with a sliding block assembly 23, the sliding block assembly 23 is slidably arranged in an adjusting sliding groove 14, the other end of each demoulding rod 21 is sleeved with a sliding sleeve 24, the sliding sleeves 24 are slidably connected with the demoulding rods 21, and the sliding sleeves 24 are slidably arranged in a matching sliding groove 15.

In this embodiment, the bottom of the adjusting chute 14 is provided with a plurality of threaded holes 13, the sliding block assembly 23 comprises a first sliding block 231 and a second sliding block 232, the first sliding block 231 and the second sliding block 232 are slidably sleeved and connected, the first sliding block 231 is fixedly installed at one end of the demoulding rod 21, the second sliding block 232 is slidably installed in the adjusting chute 14, one end of the second sliding block 232 facing the bottom of the adjusting chute 14 is provided with a protrusion capable of being in threaded connection with the threaded holes 13, during actual use, the slider assembly 23 may become disengaged from the adjustment slide 14, and the threaded hole 13 is arranged, after the position of the demoulding rod 21 is determined, the second slide block 232 can be screwed into the threaded hole 13 corresponding to the position, thereby completing the fixing of the end of the stripper rod 21 adjacent the adjustment slide 14 and reducing the chance that the slide assembly 23 may become disengaged from the adjustment slide 14 during use.

In this embodiment, the second sliding block 232 is sleeved on the first sliding block 231, the side surface of the first sliding block 231 is recessed, and the second sliding block 232 is bent inward toward one end of the sliding sleeve 24 so as to enter the recessed portion of the first sliding block 231, so that the first sliding block 231 and the second sliding block 232 are not separated from each other.

In this embodiment, the plurality of matching chutes 15 intersect with each other, and the width of the notch at the intersection of the plurality of matching chutes 15 is larger than the diameter of the sliding sleeve 24, so that the number of the demolding rod 21 and the sliding sleeve 24 generally needs to be adjusted during the use process, and a point for putting in and taking out can be determined by this intersecting manner, so that the rapid adjustment of the number of the demolding rod 21 and the sliding sleeve 24 can be completed.

In this embodiment, the plurality of adjusting chutes 14 intersect with each other, and the width of the slot at the intersection of the plurality of adjusting chutes 14 is larger than the diameter of the second slider 232, during the use process, the number of the demolding rod 21 and the slider assembly 23 generally needs to be adjusted, and a point of putting in and taking out can be determined through this intersection manner, so that the rapid adjustment of the number of the demolding rod 21 and the slider assembly 23 can be completed.

In an embodiment, a plurality of cooperation spouts 15, a plurality of regulation spouts 14, can be latticed distribution, also can be a plurality of arrangement modes such as the rectangular form that a plurality of do not intersect distributes, only need satisfy can adjust the position regulation of stripper bar 21, a plurality of cooperation spouts 15, a plurality of regulation spouts 14 positions should be corresponded certainly, to some setting modes that do not intersect, can extend two spout one end or both ends to correspond fixed plate 12 or promote one side of piece 11 can to make things convenient for putting into of sliding sleeve 24 or second slider 232.

In this embodiment, the two sides of the sliding direction of the matching sliding groove 15 and/or the adjusting sliding groove 14 are both provided with the groove 16, the two sides of the second sliding block 232 and/or the sliding sleeve 24 extend towards the groove 16 and are slidably connected with the groove 16, in the process of sliding the sliding sleeve 24 and the sliding block assembly 23, the sliding direction of the sliding sleeve 24 and the second sliding block 232 can be limited through the arrangement of the groove 16, and the sliding sleeve 24 and the second sliding block 232 can be prevented from being separated from the corresponding sliding grooves.

In this embodiment, a plurality of telescopic rods 25 are connected between the fixed plate 12 and the pushing block 11, and by the arrangement of the telescopic rods 25, the rigid connection between the pushing block 11 and the fixed plate 12 is improved without affecting the movement of the demoulding rod 21.

In this embodiment, a spring 22 is connected between the slider assembly 23 and the sliding sleeve 24, and the spring 22 provides an elastic force for separating the sliding sleeve 24 and the slider assembly 23 from each other, so that the sliding sleeve 24 and the slider assembly 23 can be restored to the original position after demolding is performed, and demolding at the next time is facilitated.

In this embodiment, the fixing plate 12 is detachably connected to the clamping mechanism 3 for processing the workpiece on the side away from the connecting rod 77, and one end of the demolding rod 21 can extend into the clamping mechanism 3, so that the clamping mechanism 3 can be replaced conveniently by the detachable connection.

In this embodiment, the stationary platen 12 is detachably connected (e.g., bolted) to the first clamping die 31.

The working principle is as follows: when injection molding is needed, the discharge position of the injection molding machine is aligned to the injection molding opening 33, then liquid raw materials are injected into the injection molding opening 33, after the injection is finished, the connecting plate 55 is driven to rotate by the rotating power source 56, the semiconductor wafer 57 is caused to enter the temperature lowering part 53 and come into contact with the bottom of the temperature conduction groove 51, and at this time, the electric conduction block 58 enters the electric conduction groove 54 to be electrified, thereby enabling the semiconductor wafer 57 to be abutted against the bottom of the temperature guide groove 51 for cooling, simultaneously pumping cooling liquid into the cooling pipeline 42 for double cooling through the cooling pump, driving the first die assembly 31 and the second die assembly 32 to be separated through the driving power source after the cooling is finished, then jacking a product positioned on the first die assembly 31 down through the die jacking mechanism 1, in this process, the rotation of the connection plate 55 is driven by the rotation power source 56 so that the semiconductor wafer 57 enters the temperature raising section 52 and abuts against the bottom of the temperature guide groove 51, and then the temperature raising of both mold clamping is performed.

The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above-mentioned embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the utility model may occur to those skilled in the art without departing from the principle of the utility model, and are considered to be within the scope of the utility model.

Claims

1. The utility model provides an injection molding machine center clamping mechanism, includes two relative first compound dies (31) in position and second compound die (32), first compound die (31) with second compound die (32) opposite face all seted up the groove of moulding plastics (34) of mutually supporting, be provided with in the second compound die (32) with mould plastics groove (34) and communicate with each other and be used for the mouth (33) of moulding plastics, its characterized in that:

further comprising: a plurality of temperature control components (5), a plurality of temperature control components (5) set up in first compound die (31) and/or on second compound die (32), temperature control components (5) are including offering in first compound die (31) and/or lead warm groove (51) on second compound die (32), lead warm groove (51) and be divided into two so that heat up portion (52) and cooling portion (53) are formed, it has rotation power source (56) and circular telegram semiconductor chip (57) that can heat up and cool down to lead warm groove (51) built-in, rotation power source (56) are used for driving semiconductor chip (57) in heat up portion (52) with switch between cooling portion (53).

2. The central clamping mechanism of an injection molding machine according to claim 1, characterized in that: the outer side of the semiconductor wafer (57) comprises a connecting plate (55), and the connecting plate (55) is arranged at the output end of the rotating power source (56).

3. The central clamping mechanism of an injection molding machine as claimed in claim 2, wherein: the rotating power source (56) is arranged at the joint of the temperature rising part (52) and the temperature reducing part (53), the temperature rising part (52) and the temperature reducing part (53) are both internally provided with an electric connection groove (54) connected with a power grid, the connecting plate (55) is provided with a connecting block (58) which is electrically connected with the semiconductor wafer (57), when the rotary power source (56) drives the connecting plate (55) to enter the cooling part (53), one side surface of the semiconductor wafer (57) is abutted against the bottom of the heat conduction groove (51) and the electric connection block (58) is clamped into the electric connection groove (54) corresponding to the position, when the rotary power source (56) drives the connecting plate (55) into the warming section (52), the other side surface of the semiconductor wafer (57) is abutted against the bottom of the heat conducting groove (51), and the power connection block (58) is clamped into the power connection groove (54) corresponding to the position.

4. The central clamping mechanism of an injection molding machine as claimed in claim 1, wherein: the first die assembly (31) and the second die assembly (32) are respectively provided with a cooling component (4) for cooling, the cooling component (4) comprises a cooling pipeline (42) arranged in the first die assembly (31) and the second die assembly (32), and two ends of the cooling pipeline (42) are communicated with the outside so as to form an inlet (41) and an outlet.

5. The central clamping mechanism of an injection molding machine as claimed in claim 4, wherein: and a cooling pump is arranged in the injection molding machine, the cooling pump is connected with the inlet (41) and the outlet so as to form a cooling loop, and the cooling pump can pump cooling liquid into the cooling pipeline (42).

6. The central clamping mechanism of an injection molding machine as claimed in claim 1, wherein: and a fixed rod (6) is installed on one side, deviating from the first die assembly (31), of the second die assembly (32), and the fixed rod (6) is detachably connected with the injection molding machine.

7. The central clamping mechanism of an injection molding machine as claimed in claim 1, wherein: a mounting component (7) and a top die mechanism (1) are arranged on one side of the first die assembly (31) departing from the second die assembly (32), the second die assembly (32) is arranged on the top die mechanism (1), the top die mechanism (1) is used for pushing a product out of the first die assembly (31), the mounting component (7) comprises a first substrate (73), a second substrate (75), a mounting plate (76) and a plurality of connecting rods (77), the mounting plate (76) is positioned on one side of the top die mechanism (1) departing from the die mechanism (3), the plurality of connecting rods (77) are mounted between the top die mechanism (1) and the mounting plate (76), the mounting plate (76) is detachably connected and mounted on the second substrate (75), a plurality of first sliding rods (72) are connected between the second substrate (75) and the first substrate (73), and the first sliding rods (72) are connected with the first substrate (73) in a sliding manner, the first sliding rod (72) and the second base plate (75) are fixedly connected, the first base plate (73) is used for fixing the top die mechanism (1) in the injection molding machine, one side of the first sliding rod (72) is provided with a driving power source, and the driving power source is used for driving the top die mechanism (1) and the first die assembly (31) to be far away from or close to the second die assembly (32).