CN210287157U - Welding device for semiconductor refrigeration piece - Google Patents
Welding device for semiconductor refrigeration piece Download PDFInfo
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- CN210287157U CN210287157U CN201921205023.0U CN201921205023U CN210287157U CN 210287157 U CN210287157 U CN 210287157U CN 201921205023 U CN201921205023 U CN 201921205023U CN 210287157 U CN210287157 U CN 210287157U
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Abstract
The utility model relates to a semiconductor refrigeration spare production facility technical field, the name is a welding set of semiconductor refrigeration spare, it includes the welding machine body, is material feeding unit at welding machine body left side, material feeding unit send the porcelain plate of arranging the crystalline grain to the welding machine body on the part of welding station, material feeding unit include semi-manufactured goods finished material fill, finished material fill including the cartridge type structure that the side panel encloses, the cartridge type structure in be the position that holds semi-manufactured goods, the vertical setting of cartridge type structure, finished material fill lateral wall on have the electric heating pipe of connecting the power, finished material fill above be one side open-ended structure, it is "]" type structure to form the cross-section, below be the structure of enclosing on every side, it is "mouth" type structure to form the cross-section, finished material fill lateral wall on all have electric heating pipe. The welding device for the semiconductor refrigeration piece has the advantages that the crystal grains and the porcelain plate are not easy to desolder, and the welding effect is good.
Description
Technical Field
The utility model belongs to the technical field of semiconductor refrigeration production facility technique and specifically relates to a welding set who relates to semiconductor refrigeration.
Background
The semiconductor refrigeration piece comprises a porcelain plate and a plurality of crystal grains on the porcelain plate, equipment for welding the porcelain crystal grains on the porcelain plate is a welding device of the semiconductor refrigeration piece, the welding device comprises a welding machine body, a feeding device is arranged on the left side of the welding machine body, the feeding device is a part for feeding the porcelain plates (semi-finished products) with the arranged crystal grains to a welding station on the welding machine body, the feeding device comprises a forming hopper of the semi-finished products, the forming hopper comprises a cylindrical structure with side panels enclosing, and a part for containing the semi-finished products is arranged in the cylindrical structure; in the prior art, a feeding device is not provided with a part for heating a semi-finished product, so that the semi-finished product is welded at normal temperature, the welding effect is poor, and the crystal grains and the porcelain plate are easy to be desoldered, so that the product quality is influenced.
Disclosure of Invention
The purpose of the utility model is to provide a welding device of semiconductor refrigeration piece which is not easy to be desoldered between crystal grain and porcelain plate and has good welding effect aiming at the defects.
The technical scheme of the utility model is realized like this, a welding set of semiconductor refrigeration spare, it includes the welding machine body, is the material feeding unit at the welding machine body left side, material feeding unit send the porcelain plate of arranging the crystalline grain to the welding station's part on the welding machine body, material feeding unit include semi-manufactured goods finished material fill, finished material fill include the cylinder type structure that the side panel encloses, the cylinder type structure in be the position of holding semi-manufactured goods, cylinder type structure vertical setting; the method is characterized in that: the side wall of the finished hopper is provided with an electric heating pipe connected with a power supply.
Furthermore, the upper surface of the finished hopper is of a structure with an opening at one side, the cross section of the finished hopper is of a structure in the shape of a ']', the periphery of the lower surface of the finished hopper is of a structure in the shape of a 'mouth', and the side wall of the finished hopper is provided with an electric heating pipe.
Furthermore, a side door is arranged below the finished hopper.
Furthermore, a temperature detector is arranged in the bucket forming cylindrical structure, the temperature detector is connected with a display, and the temperature detector is also provided with a setting unit.
The utility model has the advantages that: the welding device for the semiconductor refrigeration piece has the advantages that the crystal grains and the porcelain plate are not easy to desolder, and the welding effect is good.
Drawings
Fig. 1 is a schematic front structural view of the present invention.
Fig. 2 is a schematic structural view of the forming hopper of the present invention.
Fig. 3 is a schematic cross-sectional view taken along line a-a in fig. 2.
Fig. 4 is a schematic cross-sectional view taken along line B-B in fig. 2.
Wherein: 1. the welding machine comprises a welding machine body 2, a feeding device 3, a forming hopper 4, a side panel 5, an electric heating pipe 6, a side door 7, an opening 8, a rotating shaft 9, a temperature detector 10 and a part for containing semi-finished products.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
As shown in fig. 1, 2, 3 and 4, the welding device for the semiconductor refrigeration piece comprises a welding machine body 1, wherein a feeding device 2 is arranged on the left surface of the welding machine body, the feeding device is a part for feeding ceramic plates with arranged crystal grains to a welding station on the welding machine body, the feeding device comprises a semi-finished product forming hopper 3, the forming hopper comprises a cylindrical structure enclosed by side panels 4, a part 10 for containing the semi-finished product is arranged in the cylindrical structure, and the cylindrical structure is vertically arranged; the method is characterized in that: the side wall of the finished hopper is provided with an electric heating pipe 5 connected with a power supply.
The utility model discloses set up like this, can preheat the semi-manufactured goods that will weld, be about to the semi-manufactured goods and place in becoming the hopper, because becoming the hopper side has the heating pipe, can realize preheating semi-manufactured goods, like this, semi-manufactured goods just welds under higher temperature, can improve product quality, reaches the utility model discloses a purpose, the welding machine body be the welding machine among the prior art.
Furthermore, the upper surface of the finished hopper is provided with a structure with an opening 7 at one side to form a structure with a cross section in a shape like the Chinese character 'ji', the periphery of the lower surface of the finished hopper is provided with a structure with a closed periphery to form a structure with a cross section in a shape like the Chinese character 'ji', and the side walls of the finished hopper are provided with electric heating pipes.
The semi-finished product is easily placed in the finished hopper through the opening on the upper side, and the surrounding closed structure is arranged below the semi-finished product, so that the temperature of each part of the semi-finished product is uniform, and the product quality is improved.
Furthermore, a side door 6 is arranged below the material forming hopper. This facilitates the placement of the semi-finished product in the finished hopper, 8 in the figure being the axis of rotation of the side doors.
Furthermore, a temperature detector 9 is arranged in the bucket forming cylindrical structure, the temperature detector is connected with a display, and the temperature detector is also provided with a setting unit. Thus changing to the control temperature.
The above description is only an embodiment of the present invention, but the structural features of the present invention are not limited thereto, and any changes or modifications within the field of the present invention by those skilled in the art are covered within the scope of the present invention.
Claims (4)
1. A welding device for semiconductor refrigeration parts comprises a welding machine body, wherein a feeding device is arranged on the left side of the welding machine body, the feeding device is a part for feeding ceramic plates with arranged crystal grains to a welding station on the welding machine body, the feeding device comprises a semi-finished product forming hopper, the forming hopper comprises a cylindrical structure enclosed by side panels, a part for containing the semi-finished product is arranged in the cylindrical structure, and the cylindrical structure is vertically arranged; the method is characterized in that: the side wall of the finished hopper is provided with an electric heating pipe connected with a power supply.
2. A semiconductor chilling element soldering apparatus according to claim 1, wherein: the upper surface of the finished hopper is of a structure with an opening at one side, the cross section of the finished hopper is of a structure in a shape like the Chinese character 'jing', the lower surface of the finished hopper is of a structure with a closed periphery, the cross section of the finished hopper is of a structure in a shape like the Chinese character 'kou', and the side wall of the finished hopper is provided with electric heating pipes.
3. A semiconductor chilling element soldering apparatus according to claim 2, wherein: the bottom of the finished material hopper is provided with a side door.
4. A semiconductor cold solder bonding apparatus according to claim 1, 2 or 3, wherein: the hopper forming barrel type structure is internally provided with a temperature detector, the temperature detector is connected with a display, and the temperature detector is also provided with a setting unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201921205023.0U CN210287157U (en) | 2019-07-29 | 2019-07-29 | Welding device for semiconductor refrigeration piece |
Applications Claiming Priority (1)
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CN201921205023.0U CN210287157U (en) | 2019-07-29 | 2019-07-29 | Welding device for semiconductor refrigeration piece |
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CN210287157U true CN210287157U (en) | 2020-04-10 |
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CN201921205023.0U Active CN210287157U (en) | 2019-07-29 | 2019-07-29 | Welding device for semiconductor refrigeration piece |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111592374A (en) * | 2020-06-11 | 2020-08-28 | 河南鸿昌电子有限公司 | Welding method and welding die for semiconductor refrigerating part |
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2019
- 2019-07-29 CN CN201921205023.0U patent/CN210287157U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111592374A (en) * | 2020-06-11 | 2020-08-28 | 河南鸿昌电子有限公司 | Welding method and welding die for semiconductor refrigerating part |
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