CN101515076A - Main pressure mechanism used for a liquid crystal display (LCD) module binding process - Google Patents
Main pressure mechanism used for a liquid crystal display (LCD) module binding process Download PDFInfo
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- CN101515076A CN101515076A CNA2009100737962A CN200910073796A CN101515076A CN 101515076 A CN101515076 A CN 101515076A CN A2009100737962 A CNA2009100737962 A CN A2009100737962A CN 200910073796 A CN200910073796 A CN 200910073796A CN 101515076 A CN101515076 A CN 101515076A
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Abstract
The invention discloses a main pressure mechanism used for a liquid crystal display (LCD) module binding process, which solves the technical problems of uneven pressure and deviation of FPC (flexible printed circuit) pins relative to LCD pins when an FPC and an LCD are in compression joint by the existing device. The main pressure mechanism comprises an inverted L-shaped support frame body (1), a low-friction cylinder (3) and a pressure head (13), wherein, the low-friction cylinder (3) is arranged on the top plate of the inverted L-shaped support frame body (1); the low-friction cylinder (3) is connected together with a rectangular cylinder connecting block (6); the lower end of the rectangular cylinder connecting block (6) is fixedly connected with a main pressure leveling device (8), a second pin board (9), a thermal baffle and the pressure head (13); the pressure head (13) is a rectangular block with the longitudinal section being in an inverted convex shape; and a heating pipe mounting hole (16), a thermocouple mounting hole (17) and a rectangular pressure head cutting edge (18) are formed in the pressure head (13) respectively. The invention realizes the accurate compression joint of the FPC and the LCD, and has the advantages of simple structure and convenient maintenance.
Description
Technical field
The present invention relates to a kind of crimping apparatus, particularly a kind of flexible circuit printed panel (FPC) and LCDs (LCD) are crimped onto together equipment.
Background technology
Pressure is irregular, the technical matters of the not enough relative LCD pin off normal with the FPC pin of pressure in that flexible circuit printed panel (FPC) is existed during with LCDs (LCD) crimping for existing equipment.
Summary of the invention
The main pressure mechanism that is used for the LCD MODULE technological process provided by the invention has solved existing equipment, and pressure is irregular, the technical matters of the not enough relative LCD pin off normal with the FPC pin of pressure in that flexible circuit printed panel (FPC) is existed during with LCDs (LCD) crimping.
The present invention overcomes the above problems by following scheme:
Liquid crystal display (LCD) module binding process is meant in making the LCD MODULE process anisotropic conductive film is attached to technological process on the liquid-crystalline glasses by technological requirement.
A kind of main pressure mechanism that is used for liquid crystal display (LCD) module binding process, the supporting frame 1 that comprises down L shaped main pressure mechanism, low friction cylinder 3 and pressure head 13, described low friction cylinder 3 is arranged on down on the top board of supporting frame 1 of L shaped main pressure mechanism, the output shaft of low friction cylinder 3 is fixed together by the upper end of floating junction 4 with the rectangle cylinder contiguous block 6 of the top board below that is positioned at supporting frame 1, the lower end of rectangle cylinder contiguous block 6 is fixed with first card extender 7, the lower end of first card extender 7 is fixed with the main levelling device 8 of pressing, the main lower end of levelling device 8 of pressing is fixedly connected with second card extender 9, the lower end of second card extender 9 is fixed with thermal insulation board, be fixedly connected with described pressure head 13 in the lower end of thermal insulation board, this pressure head 13 is the rectangle block of reversed convex type for the longitudinal section, in this pressure head 13, be respectively arranged with heating tube mounting hole 16 and thermocouple mounting hole 17, also be provided with the pressure head cutting edge 18 of cuboid in the bottom of this pressure head; In the side plate of the described supporting frame 1 that falls L shaped main pressure mechanism, be provided with the guide rail slide block and pay 2, the guide rail that this guide rail slide block is paid in 2 is fixedly installed on the side plate of supporting frame 1 along the direction vertical with surface level, this guide rail slide block is paid slide block in 2 and the one side of slide block web joint 5 is fixed together, the rear end face of the another side of slide block web joint 5 and cylinder web joint 6 is fixed together, and the guide rail of pressure head 13 on the side plate of the driving lower edge supporting frame 1 of low friction cylinder 3 moved up and down.
Described main press levelling device 8 by T shape first regulating block that sets gradually from top to bottom, I-shaped second regulating block, rectangle the 3rd regulating block and lateral adjustments differential head 14, vertically regulate the differential head and form, and T shape first regulating block, I-shaped second regulating block, rectangle the 3rd regulating block are movably connected by rotating shaft 22.
Described thermal insulation board has three layers, and ground floor thermal insulation board 10, the second layer that promptly sets gradually from top to bottom put hot plate 11 and the 3rd layer of thermal insulation board 12.
The present invention has realized the accurate crimping of FPC and LCD, and the device structure simple-to-maintain is convenient.
Description of drawings:
Fig. 1 structural representation of the present invention
Fig. 2 main structural representation of pressing levelling device of the present invention
The structural representation of Fig. 3 pressure head of the present invention
Embodiment
A kind of main pressure mechanism that is used for liquid crystal display (LCD) module binding process, the supporting frame 1 that comprises down L shaped main pressure mechanism, low friction cylinder 3 and pressure head 13, described low friction cylinder 3 is arranged on down on the top board of supporting frame 1 of L shaped main pressure mechanism, the output shaft of low friction cylinder 3 is fixed together by the upper end of floating junction 4 with the rectangle cylinder contiguous block 6 of the top board below that is positioned at supporting frame 1, the lower end of rectangle cylinder contiguous block 6 is fixed with first card extender 7, the lower end of first card extender 7 is fixed with the main levelling device 8 of pressing, the main lower end of levelling device 8 of pressing is fixedly connected with second card extender 9, the lower end of second card extender 9 is fixed with thermal insulation board, be fixedly connected with described pressure head 13 in the lower end of thermal insulation board, this pressure head 13 is the rectangle block of reversed convex type for the longitudinal section, in this pressure head 13, be respectively arranged with heating tube mounting hole 16 and thermocouple mounting hole 17, also be provided with the pressure head cutting edge 18 of cuboid in the bottom of this pressure head; In the side plate of the described supporting frame 1 that falls L shaped main pressure mechanism, be provided with the guide rail slide block and pay 2, the guide rail that this guide rail slide block is paid in 2 is fixedly installed on the side plate of supporting frame 1 along the direction vertical with surface level, this guide rail slide block is paid slide block in 2 and the one side of slide block web joint 5 is fixed together, the rear end face of the another side of slide block web joint 5 and cylinder web joint 6 is fixed together, and the guide rail of pressure head 13 on the side plate of the driving lower edge supporting frame 1 of low friction cylinder 3 moved up and down.
Described main press levelling device 8 by T shape first regulating block that sets gradually from top to bottom, I-shaped second regulating block, rectangle the 3rd regulating block and lateral adjustments differential head 14, vertically regulate the differential head and form, and T shape first regulating block, I-shaped second regulating block, rectangle the 3rd regulating block are movably connected by rotating shaft 22.
Described thermal insulation board has three layers, and ground floor thermal insulation board 10, the second layer that promptly sets gradually from top to bottom put hot plate 11 and the 3rd layer of thermal insulation board 12.
Claims (3)
1, a kind of main pressure mechanism that is used for liquid crystal display (LCD) module binding process, the supporting frame (1) that comprises down L shaped main pressure mechanism, low friction cylinder (3) and pressure head (13), it is characterized in that: described low friction cylinder (3) is arranged on down on the top board of supporting frame (1) of L shaped main pressure mechanism, the output shaft of low friction cylinder (3) is fixed together by the upper end of floating junction (4) with the rectangle cylinder contiguous block (6) of the top board below that is positioned at supporting frame (1), the lower end of rectangle cylinder contiguous block (6) is fixed with first card extender (7), the lower end of first card extender (7) is fixed with the main levelling device (8) of pressing, the main lower end of levelling device (8) of pressing is fixedly connected with second card extender (9), the lower end of second card extender (9) is fixed with thermal insulation board, be fixedly connected with described pressure head (13) in the lower end of thermal insulation board, this pressure head (13) is the rectangle block of reversed convex type for the longitudinal section, in this pressure head (13), be respectively arranged with heating tube mounting hole (16) and thermocouple mounting hole (17), also be provided with the pressure head cutting edge (18) of cuboid in the bottom of this pressure head; In the side plate of the described supporting frame (1) that falls L shaped main pressure mechanism, be provided with the guide rail slide block and pay (2), the guide rail that this guide rail slide block is paid in (2) is fixedly installed on the side plate of supporting frame (1) along the direction vertical with surface level, this guide rail slide block is paid slide block in (2) and the one side of slide block web joint (5) is fixed together, the rear end face of the another side of slide block web joint (5) and cylinder web joint (6) is fixed together, and the guide rail of pressure head (13) on the side plate of the driving lower edge supporting frame (1) of low friction cylinder (3) moved up and down.
2, a kind of main pressure mechanism that is used for liquid crystal display (LCD) module binding process according to claim 1, it is characterized in that: described main press levelling device (8) by T shape first regulating block that sets gradually from top to bottom, I-shaped second regulating block, rectangle the 3rd regulating block and lateral adjustments differential head (14), vertically regulate the differential head and form, and T shape first regulating block, I-shaped second regulating block, rectangle the 3rd regulating block are movably connected by rotating shaft (22).
3, a kind of main pressure mechanism that is used for liquid crystal display (LCD) module binding process according to claim 1 and 2, it is characterized in that: described thermal insulation board has three layers, and ground floor thermal insulation board (10), the second layer that promptly sets gradually from top to bottom put hot plate (11) and the 3rd layer of thermal insulation board (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100737962A CN101515076B (en) | 2009-02-16 | 2009-02-16 | Main pressure mechanism used for a liquid crystal display (LCD) module binding process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100737962A CN101515076B (en) | 2009-02-16 | 2009-02-16 | Main pressure mechanism used for a liquid crystal display (LCD) module binding process |
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| CN101515076A true CN101515076A (en) | 2009-08-26 |
| CN101515076B CN101515076B (en) | 2011-06-15 |
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| CN2009100737962A Active CN101515076B (en) | 2009-02-16 | 2009-02-16 | Main pressure mechanism used for a liquid crystal display (LCD) module binding process |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102402030A (en) * | 2011-12-07 | 2012-04-04 | 苏州华兴源创电子科技有限公司 | Liquid crystal panel detection jig |
| CN102540518A (en) * | 2012-02-06 | 2012-07-04 | 苏州光宝康电子有限公司 | Adjustment device for flatness of pressing head of different directional conductive film |
| CN102956846A (en) * | 2012-10-15 | 2013-03-06 | 彩虹（佛山）平板显示有限公司 | Pressing head of pressing machine |
| CN103633103A (en) * | 2012-08-27 | 2014-03-12 | 鸿富锦精密工业（深圳）有限公司 | Pressing head for image sensor packaging |
| CN105643982A (en) * | 2016-03-10 | 2016-06-08 | 深圳市鑫三力自动化设备有限公司 | Full-closed-loop force control pressure head |
| CN106827614A (en) * | 2017-02-09 | 2017-06-13 | 深圳市诚亿自动化科技有限公司 | Pressure head stability Design mechanism long |
| CN106990569A (en) * | 2017-05-25 | 2017-07-28 | 东莞合安机电有限公司 | A kind of FPC pressurizes pressure head |
| CN108196589A (en) * | 2017-12-26 | 2018-06-22 | 深圳市诺峰光电设备有限公司 | A kind of novel adjusting depth of parallelism mechanism arrangement |
| CN108581125A (en) * | 2018-06-15 | 2018-09-28 | 快克智能装备股份有限公司 | The plane fine-tuning device of Film rolling mechanism wound membrane thermal head |
| CN110650621A (en) * | 2019-09-25 | 2020-01-03 | 业成科技（成都）有限公司 | Jig, prepressing device and binding equipment |
| CN112433396A (en) * | 2019-08-26 | 2021-03-02 | 中电科风华信息装备股份有限公司 | Short pressure head adjustment mechanism of bonding machine |
| CN112485933A (en) * | 2019-09-11 | 2021-03-12 | 东莞市华慧智能装备有限公司 | Water-cooling pressure head on mobile phone display screen bonding equipment |
| CN115877604A (en) * | 2023-02-22 | 2023-03-31 | 中电科风华信息装备股份有限公司 | Bonding machine and pressure head mechanism with leveling structure for bonding machine |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2001196422A (en) * | 2000-01-14 | 2001-07-19 | Matsushita Electric Ind Co Ltd | Thermocompression bonding device |
| JP2004273688A (en) * | 2003-03-07 | 2004-09-30 | Seiko Epson Corp | Compression method, compression device, and process and system for manufacturing electrooptic device |
| JP2007086111A (en) * | 2005-09-20 | 2007-04-05 | Sanyo Epson Imaging Devices Corp | Apparatus for manufacturing electrooptical device, adhesive sticking device, and method for manufacturing electrooptical device |
| CN201352285Y (en) * | 2009-02-16 | 2009-11-25 | 太原风华信息装备股份有限公司 | Main pressing mechanism for bonding process of liquid crystal display module |
-
2009
- 2009-02-16 CN CN2009100737962A patent/CN101515076B/en active Active
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102402030B (en) * | 2011-12-07 | 2013-11-13 | 苏州华兴源创电子科技有限公司 | Liquid crystal panel detection jig |
| CN102402030A (en) * | 2011-12-07 | 2012-04-04 | 苏州华兴源创电子科技有限公司 | Liquid crystal panel detection jig |
| CN102540518A (en) * | 2012-02-06 | 2012-07-04 | 苏州光宝康电子有限公司 | Adjustment device for flatness of pressing head of different directional conductive film |
| CN102540518B (en) * | 2012-02-06 | 2014-09-10 | 苏州光宝康电子有限公司 | Adjustment device for flatness of pressing head of different directional conductive film |
| CN103633103B (en) * | 2012-08-27 | 2018-06-01 | 秦皇岛柏泰六淳自动化设备有限公司 | The pressure head of Image Sensor encapsulation |
| CN103633103A (en) * | 2012-08-27 | 2014-03-12 | 鸿富锦精密工业（深圳）有限公司 | Pressing head for image sensor packaging |
| CN102956846A (en) * | 2012-10-15 | 2013-03-06 | 彩虹（佛山）平板显示有限公司 | Pressing head of pressing machine |
| CN105643982A (en) * | 2016-03-10 | 2016-06-08 | 深圳市鑫三力自动化设备有限公司 | Full-closed-loop force control pressure head |
| CN106827614A (en) * | 2017-02-09 | 2017-06-13 | 深圳市诚亿自动化科技有限公司 | Pressure head stability Design mechanism long |
| CN106990569A (en) * | 2017-05-25 | 2017-07-28 | 东莞合安机电有限公司 | A kind of FPC pressurizes pressure head |
| CN108196589A (en) * | 2017-12-26 | 2018-06-22 | 深圳市诺峰光电设备有限公司 | A kind of novel adjusting depth of parallelism mechanism arrangement |
| CN108581125A (en) * | 2018-06-15 | 2018-09-28 | 快克智能装备股份有限公司 | The plane fine-tuning device of Film rolling mechanism wound membrane thermal head |
| CN112433396A (en) * | 2019-08-26 | 2021-03-02 | 中电科风华信息装备股份有限公司 | Short pressure head adjustment mechanism of bonding machine |
| CN112433396B (en) * | 2019-08-26 | 2022-09-20 | 中电科风华信息装备股份有限公司 | Short pressure head adjusting mechanism of bonding machine |
| CN112485933A (en) * | 2019-09-11 | 2021-03-12 | 东莞市华慧智能装备有限公司 | Water-cooling pressure head on mobile phone display screen bonding equipment |
| CN110650621A (en) * | 2019-09-25 | 2020-01-03 | 业成科技（成都）有限公司 | Jig, prepressing device and binding equipment |
| CN115877604A (en) * | 2023-02-22 | 2023-03-31 | 中电科风华信息装备股份有限公司 | Bonding machine and pressure head mechanism with leveling structure for bonding machine |
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| CN101515076B (en) | 2011-06-15 |
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Address after: 030024 Taiyuan, Shanxi Province, Berlin District, Heping Road, No. 115 Patentee after: CETC Fenghua information equipment Limited by Share Ltd Address before: 030024 Taiyuan Heping Road, Shanxi, No. 159 Patentee before: Taiyuan Fenghua Information Equipment Co., Ltd. |
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