JP2020157762A - Manufacturing apparatus of thin plate-like laminate having film-like resin layer - Google Patents

Abstract

To provide a manufacturing apparatus of a thin plate-like laminate having a film-like resin layer, which can form a high precision and stable irregular shape on the film-like resin layer laminated on a thin plate-like base material.SOLUTION: A manufacturing apparatus of the present invention comprises: a set device 31 for preparing a metal mold holding structure 100 provided with a metal mold 110 on both surface sides of a work material 85; a heater 41 for heating the metal mold to a thermal deformation temperature of a film-like resin composition 84; a pinching roll device 51 for forming into a thin plate-laminate 80 having a film-like resin layer 82 by thermal compression bonding integrally the film-like resin composition and a base material 81 by pinching from a metal mold outer surface by rolling of two pressure rolls 52,54 by introducing the metal mold holding structure after heating the metal mold between the pressure rolls; and an extractor 61 for extracting the metal mold from the pinched metal mold holding structure.SELECTED DRAWING: Figure 1

Description

The present invention relates to an apparatus for producing a thin plate-like laminate having a film-like resin layer.

Resin films have excellent mechanical properties such as moldability and corrosion resistance, are lightweight and easy to process, and are easily fused with other resin materials. Therefore, decorative materials, packaging materials, adhesive films, optical members, etc. , It is used for a very wide range of purposes.

For example, in the case of producing a thin plate-like laminate such as a semiconductor substrate, a film-like resin layer is laminated on the surface of a base material. In this thin plate-shaped laminate, a predetermined uneven shape is transferred to the resin layer on the thin plate-shaped base material, and by etching, a concave-convex structure corresponding to the uneven shape of the resin layer is formed on the surface of the base material (for example, See Patent Document 1). In the transfer of the thin plate-shaped laminate to the resin layer, for example, as shown in FIG. 16, the work material 220 in which the resin layer 222 is laminated on the base material 221 has a mold surface 211 having an uneven surface shape. By arranging the mold 210 on the resin layer 222 side and applying pressure through the mold 210, the uneven shape 223 is formed on the resin layer 222. Reference numeral 200 in the figure represents a pressurizing means such as a pressing device, and 201 represents a machine base of the pressurizing means 200.

Since such a concave-convex structure on the surface of the substrate exhibits predetermined functionality, high precision is required. However, since the film-like resin layer of the thin plate-like laminate is extremely thin, it is difficult to stably form the uneven shape on the resin layer with high accuracy. In particular, when the unevenness on the surface of the substrate is fine, the quality of the processing accuracy has a great influence on the functionality, so that the processing accuracy is required to be improved.

JP-A-2018-200931

The present invention has been proposed in view of the above circumstances, and is a thin plate having a film-like resin layer capable of stably forming an uneven shape on a film-like resin layer laminated on a thin plate-like base material with high accuracy. Provided is a laminate manufacturing apparatus.

That is, the invention of claim 1 is a thin plate in which a work material in which a film-like resin composition is laminated on at least one surface side of a thin plate-like base material is pressed by a mold to integrally form a film-like resin layer on the base material. A device for obtaining a state-like laminate, which is a set device for creating a mold holding structure in which the mold is arranged on both side surfaces of the work material, and a thermal deformation temperature of the mold for the film-like resin composition. A heating device for heating the mold and a mold holding structure after the mold is heated are introduced between two pressure rolls, and the film-like resin is sandwiched from the outer surface of the mold by the rotation of the pressure rolls. A pinching roll device that integrally heat-bonds the composition and the base material to form a thin plate-like laminate having a film-like resin layer, and a take-out that removes the mold from the mold holding structure after the pinching. The present invention relates to an apparatus for producing a thin plate-like laminate having a film-like resin layer, which comprises an apparatus.

The invention of claim 2 relates to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to claim 1, wherein the heating apparatus heats a mold sandwiching the material to be processed.

The invention of claim 3 relates to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to claim 1, wherein the heating apparatus heats a mold that does not sandwich the material to be processed.

The invention of claim 4 is a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 3, further comprising a cooling device for cooling the mold sandwiched by the pinching roll device. It relates to the manufacturing equipment of.

The invention of claim 5 relates to an apparatus for producing a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 4, which is an apparatus common to the set apparatus and the take-out apparatus.

The invention according to claim 6 is the film-like resin layer according to any one of claims 1 to 5, wherein the base material is a thin plate-like material having a thickness of 1 mm or less and the film-like resin composition has a thickness of 500 μm or less. The present invention relates to a thin plate-shaped laminate manufacturing apparatus having the above.

The invention of claim 7 is an apparatus for producing a thin plate-like laminate having the film-like resin layer according to any one of claims 1 to 6, wherein the film-like resin composition is laminated on both sides of the base material. Related.

The invention according to claim 8 has the film-like resin layer according to any one of claims 1 to 7, wherein a plurality of the materials to be processed are arranged and dies are arranged on both side surfaces of the respective materials to be processed. It relates to the manufacturing apparatus of a thin plate-like laminate.

The invention according to claim 9 is a thin plate having the film-like resin layer according to any one of claims 1 to 8, wherein the film-like resin composition comprises a decorative, adhesive or conductive functional resin composition. It relates to the manufacturing apparatus of a plastic laminate.

The invention of claim 10 is an apparatus for producing a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 9, wherein the mold surface of the mold has a fine uneven surface shape. Related.

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention of claim 1, a work material in which a film-like resin composition is laminated on at least one surface side of the thin plate-like base material is pressed by a mold. A device for obtaining a thin plate-like laminate in which a film-like resin layer is integrally formed on the base material, and a set device for creating a mold holding structure in which the molds are arranged on both side surfaces of the work material. A heating device that heats the mold to the thermal deformation temperature of the film-like resin composition and a mold holding structure after the mold is heated are introduced between the two pressure rolls to form the pressure roll. A pinching roll device that pinches the film-like resin composition from the outer surface of the mold by rotation and heat-bonds the film-like resin composition and the base material integrally to form a thin plate-like laminate having a film-like resin layer, and the pinching pressure. Since it has a film-like resin layer having a take-out device for removing the mold from the subsequent mold holding structure, pressure is uniformly applied to the mold to cause uneven pressure. It is suppressed and the uneven shape can be stably formed on the film-like resin layer laminated on the thin plate-like base material with high accuracy.

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention of claim 2, in the invention of claim 1, the heating apparatus heats a mold sandwiching the material to be processed. It is economically advantageous because it does not require excessive heating.

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention of claim 3, in the invention of claim 1, the heating apparatus heats a mold that does not sandwich the work piece. It is possible to heat to a high temperature in a short time and shorten the working time, and at the same time, oxidation of the film-like resin composition of the work material due to heating is suppressed, and high-quality molding becomes possible.

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention of claim 4, in the inventions of claims 1 to 3, a cooling apparatus for cooling the mold sandwiched by the clamping roll apparatus. Therefore, the shape of the uneven surface of the thin plate-shaped laminate can be stabilized.

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention of claim 5, in the inventions of claims 1 to 4, the setting apparatus and the taking-out apparatus are common to the apparatus. The space of the device can be saved, and the equipment to be used can be omitted to reduce the cost.

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention of claim 6, in the inventions of claims 1 to 5, the base material is a thin plate-like material having a thickness of 1 mm or less and the film-like resin composition. Since the thickness of the object is 500 μm or less, a lightweight and precise product can be obtained.

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention of claim 7, in the inventions of claims 1 to 6, the film-like resin compositions are laminated on both sides of the base material, so that they are diverse. It is possible to easily manufacture a product having various functions.

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention of claim 8, in the inventions of claims 1 to 7, a plurality of the workpieces are arranged and gold is provided on both sides of each of the workpieces. Since the molds are arranged, it is possible to simultaneously mold a plurality of thin plate-like laminates of the same type or different types, and it is possible to improve work efficiency and production efficiency.

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention of claim 9, in the inventions of claims 1 to 8, the film-like resin composition has decorative, adhesive or conductive functionality. Since it is composed of a resin composition, it is possible to provide a product that can be used for an extremely wide range of applications.

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention of claim 10, in the inventions of claims 1 to 9, the mold surface of the mold has a fine uneven surface shape, so that the film It is possible to stably form a fine uneven shape on the resin layer with high accuracy.

It is a schematic diagram of the whole manufacturing apparatus of the thin plate-like laminate which concerns on one Example of this invention. It is the schematic sectional drawing of the thin plate-like laminate. It is the schematic sectional drawing which shows the molding state of the work material. It is a perspective view of the mold holding structure. It is a schematic plan view which shows the variation of the mold holding structure. It is a schematic diagram of the side view of a pressurizing part. It is a schematic diagram of the side view at the time of processing of a pressurizing part. It is the first schematic diagram which shows the combination of the arrangement of each part of the manufacturing apparatus of a thin plate-like laminate. It is the 2nd schematic which shows the combination of the arrangement of each part of the manufacturing apparatus of a thin plate-like laminate. It is a schematic diagram of the mold holding structure manufacturing process. It is a 1st schematic diagram which shows the process of pinching process of the material to be processed. It is a 2nd schematic diagram which shows the process of pinching process of the work material. It is a 1st schematic cross-sectional view which shows the variation of the relationship between the laminated structure of a work material and a die. It is a 2nd schematic cross-sectional view which shows the variation of the relationship between the laminated structure of a work material and a die. It is a 3rd schematic cross-sectional view which shows the variation of the relationship between the laminated structure of a work material and a die. It is the schematic sectional drawing which shows the processing process of the conventional thin plate-like laminate.

The thin plate-shaped laminate manufacturing apparatus 10 according to the embodiment of the present invention shown in FIG. 1 is a work material (85) in which a film-like resin composition (84) is laminated on at least one surface side of a thin plate-shaped base material (81). ) Is sandwiched by a mold (110) to obtain a thin plate-like laminate (80) in which a film-like resin layer (82) is integrally formed on a base material (81). The manufacturing apparatus 10 has a set unit 30 having a set device 31, a heating unit 40 having a heating device 41, a pressurizing unit 50 having a pinching roll device 51, and an extraction unit 60 having an extraction device 61. ..

The illustrated manufacturing apparatus 10 includes a machine base 11 that connects a set unit 30, a heating unit 40, a pressurizing unit 50, and a take-out unit 60 by a rail unit 20. The rail portion 20 has a rail main body 21 composed of a pair of rod-shaped members arranged between the set portion 30, the heating portion 40, the pressurizing portion 50, and the take-out portion 60, and the set portion 30, the heating portion 40, and the pressurizing portion 20. The unit 50 and the take-out unit 60 are connected in series. A mold holding structure 100 is movably installed on the rail body 21 between the setting portion 30, the heating portion 40, the pressurizing portion 50, and the take-out portion 60. Reference numeral 12 in the figure is a leg portion of the machine base 11 that supports the rail portion 20.

As shown in FIG. 2, the thin plate-shaped laminate 80 is a laminate in which a film-like resin layer 82 is laminated on at least one surface of the thin plate-like base material 81, and a predetermined uneven shape 83 is formed on the film-like resin layer 82. Have. FIG. 2A shows a thin plate-like laminate 80A in which a film-like resin layer 82 is formed on one side of the thin plate-like base material 81, and FIG. 2B shows a film-like resin on both sides of the thin plate-like base material 81. It is a thin plate-like laminate 80B in which a layer 82 is formed. The thin plate-shaped laminate 80 has a semiconductor substrate, optical members such as an optical lens and an optical film, a fuel cell separator, a wearable electrode, a sensor, and an electrostatic adsorbent by forming a predetermined uneven shape 83 on the surface thereof. Manufactured as various products such as resistance heating elements, electromagnetic wave shielding materials, connectors, solar cell members, and separators for water electrolyzers.

As shown in FIG. 3, the thin plate-shaped laminate 80 is formed into a film by a predetermined mold 110 on a work piece 85 in which a film-like resin composition 84 is laminated on at least one surface of a thin plate-like base material 81. It is obtained by forming a predetermined uneven shape 83 on the surface of the resin composition 84. In the thin plate-shaped laminate 80, the shape, thickness, and the like of the thin plate-shaped base material 81 and the film-like resin composition 84 are determined according to the type of the target product and the like. The thickness of the film-like resin composition 84 is 500 μm or less, more preferably the thickness of the thin plate-like base material 81 is 100 μm or less, and the thickness of the film-like resin composition 84 is 50 to 150 μm. By setting the thin plate-shaped base material 81 and the film-shaped resin composition 84 to the above thicknesses, a lightweight and precise product can be obtained. In particular, when the conductive function described later is imparted, appropriate conductivity can be provided.

The thin plate-shaped base material 81 is a thin plate member made of a material having corrosion resistance and heat resistance such as titanium, aluminum, and stainless steel (SUS).

The film-shaped resin composition 84 is laminated on one or both sides of the thin plate-shaped base material 81, and a predetermined uneven shape 83 is formed on the surface thereof to form a film-shaped resin layer 82. The shape, size, and the like of the uneven shape 83 of the film-shaped resin layer 82 are determined according to the use and the like of the thin plate-shaped laminate 80, but fine unevenness is also possible. As the fine irregularities, for example, the groove depth (H) is 50 to 300 μm, the groove upper surface width (W1) is 50 to 400 μm, and the groove inner surface width (W2) is 100 to 400 μm.

Examples of the material constituting the film-like resin composition 84 include ethylene homopolymer, propylene homopolymer (homopolypropylene), ethylene and propylene, 1-butene, 1-pentene, 1-hexene, and 4-methyl-1. -Random copolymers with one or more α-olefins such as penten, block copolymers having the above composition, and the like can be mentioned. Further, it is a polyolefin resin such as a mixture of these polymers, a polyolefin elastomer, an acid-modified polypropylene, an acid-modified polyethylene, an ethylene / vinyl alcohol copolymer resin, or a hydrocarbon resin. Fluororesin, fluororubber, etc. can also be mentioned. Further, at least one kind of conductive material such as carbon material or conductive ceramics may be added to these materials. Examples of the carbon material include carbon nanotubes, granular graphite, and carbon fibers.

The film-shaped resin composition 84 is configured as a decorative, adhesive, or conductive functional resin composition, depending on the product to be manufactured. The decorative functional resin composition is a resin layer in which fine irregularities are surface-treated such as wrinkled (wrinkled pattern), embossed (embossed pattern), and reflective (matte). The adhesive functional resin composition is a resin layer having high adhesive strength composed of a polyethylene-based resin or the like. The conductive functional resin composition is an energizable resin layer in which a carbon material is added to the resin material. The thin plate-shaped laminate 80 can be used in an extremely wide range of applications by providing these functional resin compositions.

The mold 110 is a member arranged on both sides of the base material 81 of the work material 85 and sandwiching the work material 85, and is a lower mold 120 on which the work material 85 is placed and the work material 85. It has an upper mold 125 arranged on the upper surface side of the above. In the mold 110, predetermined uneven surface shapes 122 and 127 are formed on the mold surfaces 121 and 126 of either or both of the lower mold 120 and the upper mold 125. In the illustrated example, uneven surface shapes 122 and 127 are formed on both mold surfaces 121 and 126. By making the uneven surface shape 122 (127) of the mold surface 121 (126) particularly fine uneven surface shape, it is possible to stably form the fine uneven surface shape on the film-like resin layer with high accuracy. The uneven surface shapes 122 and 127 of the lower mold 120 and the upper mold 125 may be the same or different shapes. Further, as shown in FIG. 3A, the material to be processed (thin plate-like laminate 80) after molding is formed between the mold surfaces 121 and 126 of the mold 110 and the material 85 to be processed, if necessary. A slip sheet (release paper) 115 may be interposed to facilitate the release of the mold. Note that the interleaving paper is omitted in FIG. 3B.

The mold 110 is configured to be movable between the set portion 30, the heating portion 40, the pressurizing portion 50, and the take-out portion 60 by the mold holding structure 100. The mold holding structure 100 is not particularly limited as long as the mold 110 has a structure in which each portion 30, 40, 50, 60 can be moved while sandwiching the work material 85. For example, an appropriate structure such as a structure having a clip member or the like that sandwiches the lower mold 120 and the upper mold 125 can be used.

The mold holding structure 100 shown in FIG. 4 is an example of a frame structure for holding a mold 110 that sandwiches the work material 85, and is a set portion 30, a heating portion 40, and a pressurizing portion along the rail body 21. Move between 50 and 60 withdrawals. The mold holding structure 100 is a pair of mold holding portions 105 that have a lower opening 104 and are mounted on a rail main body 21 and slidable, and a lower mold 120 of the mold 110. , 105. Further, in the mold 110 held by the mold holding structure 100, the coalescing convex portions 123 are provided at a plurality of positions of the lower mold 120, and the upper mold 125 corresponds to the coalescing convex portions 123 of the lower mold 120. A plurality of bonding hole portions 128 are provided, and by engaging each bonding convex portion 123 of the lower mold 120 with each bonding hole portion 128 of the upper mold 125, the upper mold 125 is provided with respect to the lower mold 120. Overlay in the proper position.

FIG. 5 is a schematic plan view showing variations of the mold holding structure 100 and the mold 110. FIG. 5A is an example of a mold holding structure 100A in which a mold 110A for processing a single work piece 85 is held. The mold holding structure 100A includes a pair of side edge portions 102, 102 slidably mounted on the rail body 21, and end edge portions 103, 103 erected at both ends of the side edge portions 102, 102, respectively. It has a frame-shaped holding body 101A composed of, and a pair of mold holding portions 105A and 105A erected between the end edge portions 103 and 103, and a mold 110A (lower) between the mold holding portions 105A and 105A. The mold 120) is fixed by a fixing member (not shown) such as a screw member.

FIG. 5B is an example of a mold holding structure 100B in which a mold 110B for processing a plurality of workpieces 85 on the same mold surface is held. In the mold holding structure 100B, the rectangular mold 110B in a plan view is arranged between the edge portions 103 and 103 of the holding body 101A, and the edge portions 103 and 103 are used as the mold holding portions 105 and 105. It is fixed by a fixing member (not shown) such as a screw member.

FIG. 5C is an example of a mold holding structure 100C in which a mold 110C for processing a relatively large work piece 85 is held. In the mold holding structure 100C, the mold 110C corresponding to the size of the entire lower opening 104 is arranged in the lower opening 104 of the holding body 101A, and the side edges 102, 102 and each end of the holding body 101A are arranged. The edge portions 103, 103 are fixed as mold holding portions 105, 105, 105, 105 by a fixing member (not shown) such as a screw member.

The frame structure of the mold holding structure is not limited to the above structures 100A to 100C, and may be an appropriate structure depending on the number and size of the workpiece 85, the shape of the mold, and the like. For example, the mold holding portion of the mold holding structure is provided with a recess that can be fitted with the mold so that the mold can be held at a predetermined position, or an appropriate mold positioning member is provided. .. Further, a moving device that can move on the rail body 21 may be separately prepared, and the mold holding structure may be installed in the moving device to be movable.

The set unit 30 includes a set device 31 that creates a mold holding structure 100 in which the mold 110 is set. As the set device 31, a transport means such as a known robot arm on which the holding body 101, the mold 110, and the work material 85 can be appropriately installed is preferably used. In the set device 31 of the embodiment, the holding body 101, the mold 110, and the work material 85 are conveyed between the workbench and the rail portion 20, and the mold holding structure 100 is created.

The heating unit 40 includes a heating device 41 that heats the mold 110 to the thermal deformation temperature of the film-shaped resin composition 84. The heating device 41 is not particularly limited as long as it can efficiently heat the mold 110. The heating device 41 of the embodiment has hot plates 42 and 43 that can be raised and lowered arranged above and below the rail main body 21, and the mold 110 is sandwiched between the upper hot plate 42 and the lower hot plate 43. It is configured to heat.

The thermal deformation temperature is a sufficient temperature at which the film-shaped resin composition 84 of the work material 85 sandwiched between the molds 110 can be thermally deformed and appropriately processed, and is classified into the types of the film-shaped resin composition 84. It is set appropriately according to it. For example, the mold 110 is heated to a temperature higher than the melting point of the film-like resin composition 84 by 50 ° C. or more. Although the upper limit is not particularly limited, the film-shaped resin composition 84 of the work material 85 may react with oxygen in the atmosphere to oxidize and deteriorate due to excessive heating. The temperature may be such that oxidative deterioration due to heat is unlikely to occur.

The heating of the mold 110 by the heating device 41 may be performed on the mold 110 in a state where the work material 85 is sandwiched, or on the mold 110 in a state where the work material 85 is not sandwiched. You may. When the die 110 sandwiching the work material 85 is heated, it is not necessary to excessively heat the die 110, which is economically advantageous. Further, when the mold 110 that does not sandwich the work material 85 is heated, only the mold 110 is heated, so that the mold 110 can be heated to a high temperature in a short time, and the working time can be shortened. Oxidation of the film-like resin composition 84 of the work piece 85 due to heating is suppressed, and high-quality molding becomes possible.

As shown in FIGS. 6 and 7, the pressurizing unit 50 includes a pressing roll device 51 that presses the heated mold 110 from the outer surface to form the thin plate-shaped laminate 80. The pinching roll device 51 has a lower pressure roll 52 rotatably arranged at a position where it abuts on the lower surface side of the mold 111, and a mold holding structure 100 which is directly above the lower pressure roll 52. It has an upper pressurizing roll 54 rotatably arranged on the upper side of the above, and a pressurizing unit elevating means 56 including a pressurizing cylinder device for raising and lowering the upper pressurizing roll 54. Further, although not shown, the pinching roll device 51 has a temperature adjusting means for adjusting the temperature of either one or both of the lower pressure roll 52 and the upper pressure roll 54. In the figure, reference numeral 53 is a lower rotary drive device for rotationally driving the lower pressurizing roll 52, 55 is an upper rotary drive device for rotationally driving the upper pressurizing roll 54, and 57 is a rod portion of the pressurizing section elevating means 56. is there.

In this pressing roll device 51, as shown in FIG. 7, the mold holding structure 100 after the mold 110 is heated is introduced between the two pressure rolls, and the outer surface of the mold 110 is rotated by the rotation of the pressure rolls. The film-like resin composition 84 and the base material 81 are integrally thermocompression-bonded to form a thin plate-like laminate 80 having a film-like resin layer 82. The pinching roll device 51 of the embodiment has a drive control device (not shown) that controls the rotation of the lower pressurizing roll 52 and the upper pressurizing roll 54, and pressurizes two when pinching the mold 111. The rotation of the rolls 52 and 54 and the movement of the mold holding structure 100 are controlled to be synchronized.

The take-out unit 60 includes a take-out device 61 that takes out the die 110 and the work piece 85 from the die holding structure 100 after pressing. As the take-out device 61, a known conveying means such as a robot arm is preferably used, and the mold holding structure 100 or the mold is placed between the workbench on which the processed mold or the like is placed and the rail portion 20. The 110 and the work material 85 are conveyed, and the mold 110 and the work material 85 are taken out from the mold holding structure 100.

In the thin plate-shaped laminate manufacturing apparatus 10 of the present invention, a cooling unit 70 is arranged as needed. The cooling unit 70 includes a cooling device 71 that cools the mold 110 pinched by the pinching roll device 51. The cooling device 71 is not particularly limited as long as the thin plate-shaped laminate 80 can be cooled via the mold 110. For example, the cooling device 71 shown in FIG. 1 has cooling plates 72, 73 that can be raised and lowered arranged above and below the rail body 21, and has a mold holding structure by the upper cooling plate 72 and the lower cooling plate 73. The mold 110 held by the body 100 is sandwiched and cooled. By cooling the mold after pinching in the cooling unit 70, the shape of the uneven surface of the thin plate-shaped laminate 80 can be stabilized.

Here, the combination of the arrangement of the set portion 30, the heating portion 40, the pressurizing portion 50, the taking-out portion 60, and the cooling portion 70 in the thin plate-shaped laminate manufacturing apparatus 10 of the present invention will be described. FIG. 8 shows a thin plate-like laminate in which the work material is sandwiched between the molds in the set portion 30 to create a mold holding structure, and then the mold holding the work material is heated in the heating unit 40. Represents variations of manufacturing equipment (10A-10D). Further, FIG. 9 shows a thin plate in which the work material is sandwiched between the molds in the set portion 30 after the mold that does not sandwich the work material is heated in the heating unit 40, and the mold holding structure is created. It represents a variation (10E to 10H) of a manufacturing apparatus for a state-like laminate.

The thin plate-shaped laminate manufacturing apparatus 10A shown in FIG. 8A is an example in which the setting portion 30, the heating portion 40, the pressurizing portion 50, and the take-out portion 60 are arranged in series on the rail portion 20. In the thin plate-shaped laminate manufacturing apparatus 10A, the material to be processed is conveyed from the downstream side (set portion 30 side) of the rail portion 20 and processed, and the processed thin plate-shaped laminate is taken out from the upstream side (take-out) of the rail portion 20. It is conveyed to the unit 60 side). Therefore, the device 10A can be incorporated into the line process of the production line of various products using the thin plate-shaped laminate, and the thin plate-shaped laminate taken out by the take-out unit 60 is continuously transferred to another processing process. be able to.

In the thin plate-shaped laminate manufacturing apparatus 10B shown in FIG. 8B, a cooling unit 70 is provided between the pressurizing unit 50 and the take-out unit 60, and the rail unit 20, the setting unit 30, the heating unit 40, and the pressurizing unit 20 are provided. This is an example in which the unit 50, the cooling unit 70, and the take-out unit 60 are arranged in series in this order. In the thin plate-shaped laminate manufacturing apparatus 10B, the shape of the uneven surface of the thin plate-shaped laminate can be stabilized by the cooling unit 70, and can be incorporated into the line process of the production line in the same manner as the manufacturing apparatus 10A. ..

The thin plate-shaped laminate manufacturing apparatus 10C shown in FIG. 8C has the set portion 30 and the take-out portion 60 in common and the set portion 31 and the take-out device 61 in common, and the rail portion 20 has an take-out portion. This is an example in which the set unit 30, the heating unit 40, the pressurizing unit 50, and the cooling unit 70, which also serve as 60, are arranged in series in this order. In the thin plate-shaped laminate manufacturing apparatus 10C, since the set portion 30 and the take-out portion 60 are commonly configured, the space saving of the manufacturing apparatus 10C can be achieved, and the equipment to be used is omitted. Cost reduction can be achieved. Further, since the work material conveyed from the set portion 30 is processed by the pressurizing portion 50 and then returned to the set portion 30 (which also serves as the take-out portion 60) and taken out, the man-hours for batch work can be reduced. This makes it possible to improve work efficiency.

The thin plate-shaped laminate manufacturing apparatus 10D shown in FIG. 8D has the set portion 30 and the take-out portion 60 in common and the set portion 31 and the take-out device 61 in common, and the rail portion 20 has an take-out portion. This is an example in which the set unit 30, the cooling unit 70, the heating unit 40, and the pressurizing unit 50, which also serve as 60, are arranged in series in this order. In the thin plate-shaped laminate manufacturing apparatus 10D, since the pressurizing section 50 is arranged on the outermost side of the manufacturing apparatus 10D, maintenance work such as preparation of the pressurizing roll device of the pressurizing section 50 becomes easy. Further, as in the case of the manufacturing apparatus 10C, it is possible to reduce the cost by saving space and improve the work efficiency in batch work.

The thin plate-shaped laminate manufacturing apparatus 10E shown in FIG. 9A is an example in which the heating portion 40, the setting portion 30, the pressurizing portion 50, and the take-out portion 60 are arranged in series on the rail portion 20 in this order. .. That is, the thin plate-shaped laminate manufacturing apparatus 10E is configured by replacing the set portion 30 and the heating portion 40 with respect to the thin plate-shaped laminate manufacturing apparatus 10A. Therefore, the material to be processed is processed while being conveyed from the downstream side (heating portion 40 side) to the upstream side (take-out portion 60 side) of the rail portion 20. Therefore, similarly to the thin plate-shaped laminate manufacturing apparatus 10A, it can be incorporated into the line process of the production line of various products, and the manufactured thin plate-shaped laminate can be continuously transferred to another processing process.

The thin plate-shaped laminate manufacturing apparatus 10F shown in FIG. 9B is configured by replacing the set portion 30 and the heating portion 40 with respect to the thin plate-shaped laminate manufacturing apparatus 10B, and is configured by replacing the rail portion 20. In this example, the heating unit 40, the setting unit 30, the pressurizing unit 50, the cooling unit 70, and the taking-out unit 60 are arranged in series in this order. In the thin plate-shaped laminate manufacturing apparatus 10F, as in the thin plate-shaped laminate manufacturing apparatus 10B, the cooling unit 70 stabilizes the shape of the uneven surface of the thin plate-shaped laminate and incorporates it into the line process of the production line. be able to.

The thin plate-shaped laminate manufacturing apparatus 10G shown in FIG. 9C is configured by replacing the set portion 30 and the heating portion 40 with respect to the thin plate-shaped laminate manufacturing apparatus 10C, and is configured by replacing the set portion 30 and the heating portion 40. In this example, the heating unit 40, the set unit 30 that also serves as the take-out unit 60, the pressurizing unit 50, and the cooling unit 70 are arranged in series in this order. In the thin plate-shaped laminate manufacturing apparatus 10G, as in the thin plate-shaped laminate manufacturing apparatus 10C, the space saving of the manufacturing apparatus 10G, cost reduction by omitting the equipment to be used, and man-hours for batch work are reduced. It is possible to improve the efficiency of.

The thin plate-shaped laminate manufacturing apparatus 10H shown in FIG. 9D is arranged in series on the rail portion 20 in the order of the heating portion 40, the set portion 30 that also serves as the take-out portion 60, the cooling portion 70, and the pressurizing portion 50. This is an example. In the thin plate-shaped laminate manufacturing apparatus 10H, maintenance work such as preparation of the pressurizing roll apparatus of the pressurizing portion 50 becomes easy. Further, as in the case of the manufacturing apparatus 10G, it is possible to reduce the cost by saving space and improve the work efficiency in batch work.

Next, a method of manufacturing the thin plate-shaped laminate 80 by the manufacturing apparatus 10 of the present invention will be described. In the method for producing the thin plate-shaped laminate 80, the mold 110 is arranged on both sides of the work piece 85 on which the film-shaped resin composition 84 is laminated on at least one surface of the base material 81, and the mold 110 is sandwiched from the outer surface of the mold 110. It is a method of integrally forming the base material 81 and the film-like resin composition 84 by pressing, and includes a mold holding structure creating step, a pressurizing step, and a taking out step.

The mold holding structure making step is a step of making a mold holding structure in which the mold 110 heated to the thermal deformation temperature of the film-like resin composition 84 is arranged on both side surfaces of the work material 85. As shown in FIG. 10A, for example, the mold holding structure creating step is configured such that the heating step is performed in the heating section 40 after the setting step performed in the setting section 30.

In the setting process shown in FIG. 10A, in the setting unit 30, a set device 31 (not shown) is used to create a mold holding structure 100 in which dies 110 are arranged on both sides of the work piece 85. This is a process (setting process before heating). In this setting process, the mold holding structure 100 is conveyed onto the rail body 21 of the rail portion 20 by a setting device 31 such as a robot arm, and the lower mold 120 and the upper mold 125 of the mold 110 are transferred to the mold holding structure. Processing such as transporting to the body 100 and holding it, transporting the work material 85 to the mold, and the like is performed. In the embodiment, the lower mold 120 of the mold 110 is held in advance by the holding main body 101 of the mold holding structure 100, the work material 85 is placed on the lower mold 120, and then the lower mold 120 is held. A set process is performed in which the structure 100 is transported onto the rail body 21 and the upper die 125 is superposed on the lower die 120.

In the heating step shown in FIG. 10A, the heating unit 40 heats the entire mold 110 to the thermal deformation temperature of the film-like resin composition 84 after the mold holding structure 100 is created by using the heating device 41. This is a process (heating process after setting). In this heating step, the lower mold 120 and the upper mold 125 of the mold 110 are heated by the heating device 41 with respect to the mold holding structure 100 moved from the set portion 30 to the heating portion 40, and the mold 110 is heated. A process of heating the sandwiched work piece 85 to a thermal deformation temperature is performed. As a result, the work material 85 can be appropriately processed in the pressurizing step described later. In the embodiment, the upper and lower hot plates 42 and 43 of the heating device 41 are raised and lowered, respectively, and the mold 110 held by the mold holding structure 100 on the rail body 21 is sandwiched between the hot plates 42 and 43 to heat the mold 110. Is done. The heating temperature is determined according to the material of the film-like resin composition of the work material.

As described above, in the mold holding structure making step of heating the mold 110 after the work material 85 is sandwiched between the molds 110 and the mold holding structure 100 is set, the mold 110 is excessively heated. Is unnecessary and is economically advantageous.

Further, in the mold holding structure making step, instead of performing the heating step after the setting step, as shown in FIG. 10B, after the heating step performed in the heating section 40, the set section 30 is used. It may be configured to perform the setting process.

The heating step shown in FIG. 10B is a step (pre-setting heating step) of heating the mold to the thermal deformation temperature of the film-shaped resin composition 84 by using the heating device 41 in the heating unit 40. In this heating step, the lower mold 120 and the upper mold 125 of the mold 110 are heated by the heating device 41 with respect to the mold 110 held by the holding main body 101 and not sandwiching the work material 85. .. As a result, the mold 110 can be heated to a high temperature in a short time, oxidation of the film-shaped resin composition 84 of the work piece 85 due to heating is suppressed, and high-quality molding becomes possible.

In the setting process shown in FIG. 10B, in the setting unit 30, the set device 31 (not shown) is used to sandwich the work material 85 between the heated dies 110 to create the die holding structure 100. This is the process of setting (setting process after heating). In this setting process, the upper mold 125 of the mold 110 held by the holding main body 101 is temporarily removed by a setting device 31 such as a robot arm, the work material 85 is placed on the lower mold 120, and then the upper mold 125 is placed. A set process of superimposing on the lower mold 120 is performed.

As described above, in the mold holding structure creating step of setting the mold holding structure 100 by sandwiching the work material 85 in the mold 110 after heating the mold 110, only the mold 110 is heated. The work time can be shortened by heating to a high temperature in a short time, and the oxidation of the film-like resin composition 84 of the work piece 85 due to heating is suppressed, so that high-quality molding becomes possible. ..

In the pressurizing step, as shown in FIGS. 6, 7, 11 and 12, in the pressurizing section 50, the mold holding structure 100 in which the heated die 110 is arranged is pressed by the pressing roll device 51. A thin plate having a film-like resin layer 82, which is introduced between the pressure rolls 52 and 54, sandwiched from the outer surface of the mold 111 by rotation of the pressure rolls 52 and 54, and the film-like resin composition is integrally heat-bonded to the base material. This is a step of forming the shape laminate 80. In the pressurizing step, the mold 111 is moved from the set portion 30 or the heating portion 40 to the pressurizing portion 50 while the mold holding structure 100 is swung against the heated mold 111 of the mold holding structure 100. A process of roll-pressing the entire work material 85 sandwiched between the dies is performed.

In the embodiment, in the mold 111 of the mold holding structure 100 moved to the pressurizing portion 50, as shown in FIG. 11A, the upper end portion of the lower pressurizing roll 52 is the lower surface of the mold 111. Since they are located at the same height, the lower pressure roll 52 and the lower surface of the mold 111 are in contact with each other (contact position P1). Next, the upper pressurizing roll 54 above the mold holding structure 100 is lowered by the pressurizing portion elevating means 56, and upper pressurizing is applied to the upper surface side of the heated mold 111 held by the mold holding structure 100. The roll 54 is pressure-welded, and the mold 111 is pressed by the two pressure rolls 52 and 54 (see FIG. 7). In the pinching pressure by the two pressure rolls 52 and 54, as shown in FIG. 11B, the upper pressure roll 54 is located directly above the contact position P1 between the lower pressure roll 52 and the mold 111. It comes into contact with the mold 111 (P2) and is pressed. Therefore, the pressing force from the two pressure rolls 52 and 54 acts on the mold 111 between the contact position P1 with the lower pressure roll 52 and the contact position P2 with the upper pressure roll 54.

Here, in the conventional processing method such as transfer molding as shown in FIG. 16, since the entire mold 210 is pressed by the pressurizing means 200 such as a press device, it is two-dimensional (planar) with respect to the mold 210. ) Is affected by the pressing force. When pressurizing in a planar manner, the pressure is dispersed so as to act on the entire mold 210, and the pressing force does not always act uniformly on the entire mold 210, which may cause uneven pressurization. On the other hand, in the pinching pressure by the two pressure rolls 52 and 54 shown in FIG. 11B, the contact positions P1 and P2 are one-dimensional with respect to the mold 111 held by the mold holding structure 100. A (linear) pressing force acts. Therefore, as compared with the conventional method that acts two-dimensionally (plane), the pressure is concentrated and it becomes easier to apply a large pressing force, and the pressurized portion of the mold 111 is between the contact positions P1 and P2. Since it is limited, the pressing force acts relatively uniformly and the occurrence of uneven pressurization is suppressed.

Then, when the pinching pressure is performed by the two pressurizing rolls 52 and 54, as shown in FIG. 12, the pressurizing portion of the mold 111 (between the contact positions P1 and P2) while the pinching pressure is held. The mold holding structure 100 acts on at least the entire work material 85 (between the positions 86 and 86 of each end of the work material 85) sandwiched between the molds 111 of the mold holding structure 100. Is swayed. In the swing of the mold holding structure 100, the two pressure rolls 52 and 54 are in a pinched state as the mold holding structure 100 is moved in one direction (for example, in the receding direction in FIG. 12A). The lower pressurizing roll 52 in FIG. 12A is rotated in the same direction (for example, the lower pressurizing roll 52 is rotated in the counterclockwise direction and the upper pressurizing roll 54 is in the clockwise direction), and the mold holding structure 100 is further rotated in the other direction (for example, FIG. As the two pressurizing rolls 52 and 54 are moved in the forward direction of b), the two pressurizing rolls 52 and 54 are pressed in the same direction (for example, the lower pressurizing roll 52 in FIG. 12B is applied clockwise and upward). The compression roll 54 is rotated counterclockwise).

At this time, the drive control device (not shown) of the pressurizing unit 50 controls the swing of the mold holding structure 100 and the rotational drive of the pressurizing rolls 52 and 54 in synchronization with each other. That is, the timing of movement of the mold holding structure 100 (timing of swaying) and the timing of rotation of each of the pressure rolls 52 and 54, the direction of movement of the mold holding structure 100 (direction of sway) and each pressure roll 52, Control is performed to match the rotation direction of the 54, the moving distance (swing range) of the mold holding structure 100, the rotation amount of each of the pressure rolls 52 and 54, and the like. Therefore, the mold holding structure 100 can move smoothly while the predetermined pressure applied to the mold 111 from the two pressure rolls 52 and 54 is held. By swinging the mold holding structure 100 in the sandwiched state in this way, the pressurizing position (between P1 and P2) by the two pressurizing rolls 52 and 54 extends over the entire surface of the die 111, so that the die 111 It is possible to pressurize the entire surface of the surface substantially uniformly. The motion of the mold holding structure 100 is performed a necessary number of times including once (one reciprocation) depending on the type of the resin layer, the fineness of the uneven shape, the target product, and the like. Further, the start position and end position of the pinching pressure by the two pressure rolls 52 and 54 are appropriate depending on the size of the work material 85, the type of uneven shape, and the like. When the swing of the mold holding structure 100 is stopped, the pressurization is completed and the upper pressurizing roll 54 is raised to release the pinching state with respect to the mold 111.

In this pressurizing step, if necessary, the temperature of either one or both of the lower pressurizing roll 52 and the upper pressurizing roll 54 is used by a temperature controlling means (not shown) when the pressurizing roll device 51 is pinched. May be configured to adjust. Temperature adjustment by the temperature adjusting means is appropriate such as heating, cooling, and heat retention. For example, in the case of continuously processing a large number of products, if there is a difference in temperature between the mold 110 and the pressure rolls 52 and 54, the temperature of the mold 110 changes during pinching, and appropriate processing can be performed. It can be difficult. Therefore, in this temperature adjustment, the temperature of the mold 110 at the time of pinching is adjusted by heating or keeping the temperature when the temperature of the mold 110 is low, or by cooling when the temperature is excessively high. Can be held properly.

The take-out step is a step of taking out the mold 110 after being pinched from the mold holding structure 100 by using the take-out device 61 in the take-out unit 60. In this take-out step, with respect to the mold holding structure 100 moved from the pressurizing part 50 to the taking-out part 60, the mold holding structure 100 is moved from the rail body 21 of the rail part 20 by the taking-out device 61 such as a robot arm. Processing such as transporting, removing the lower mold 120 and the upper mold 125 of the mold 110 from the mold holding structure 100, and taking out the work material 85 from the mold 110 is performed. In the embodiment, the upper mold 125 of the mold 110 held by the mold holding structure 100 is removed from the lower mold 120, and the mold holding structure 100 holding the lower mold 120 is removed from the rail body 21 to a workbench or the like. The thin plate-shaped laminate 80 (processed material) placed on the lower die 120 is taken out by being transported to the place where the workbench is placed. The manufacturing method is completed when the thin plate-shaped laminate 80 is taken out from the mold 110.

When the above-mentioned extraction step is performed, the thin plate-shaped laminate 80 immediately after processing is in a state of being easily deformed by heating in the heating unit 40. Therefore, before the take-out step is performed, the temperature of the thin plate-shaped laminate 80 is lowered to such that careless deformation does not occur. At that time, it is possible to perform slow cooling such as leaving the thin plate-shaped laminate 80 for a predetermined time without taking it out from the mold 110, but a cooling step 70 is provided in the thin plate-shaped laminate manufacturing apparatus 10. It is preferable to do.

The cooling step is a step of cooling the entire mold 110 after pinching held in the mold holding structure 100 by using the cooling device 71 in the cooling unit 70. In this cooling step, the lower mold 120 and the upper mold 125 of the mold 110 are cooled by the cooling device 71 with respect to the mold holding structure 100 moved from the pressurizing unit 50 to the cooling unit 70, and the mold 110 The processed thin plate-shaped laminate 80 sandwiched between the two is cooled to a temperature at which inadvertent deformation does not occur. As a result, the shape of the uneven surface of the thin plate-shaped laminate 80 is stabilized, and the molding of the thin plate-shaped laminate 80 is completed in the mold 110. In the embodiment, the upper and lower cooling plates 72 and 73 of the cooling device 71 are moved up and down, respectively, and the mold 110 held by the mold holding structure 100 on the rail body 21 is sandwiched between the cooling plates 72 and 73 to cool the mold 110. Is done. After performing the cooling step, the mold holding structure 100 is moved from the cooling section 70 to the take-out section 60, and the take-out step is performed. The cooling temperature is 20 ° C. or more lower than the thermal deformation temperature of the film-shaped resin composition 84.

Next, variations in the relationship between the laminated structure of the work material and its mold will be described with reference to FIGS. 13 to 15. FIG. 13A shows a mold in which a die 112A for single-sided processing is arranged on a work piece 85A in which a film-like resin composition 84A is laminated on one surface side (upper surface side in the example of the drawing) of the base material 81. This is an example of the mold structure 150A. The mold 112A includes a lower mold 120A having a mold surface 121A which is a smooth surface, and an upper mold 125A having a mold surface 126A on which the uneven surface shape 127 is formed. In this mold structure 150A, the smooth lower mold 120A is in contact with the other side (lower surface side) of the base material 81 of the work material 85A with respect to the resin composition 84A on one side (upper surface side) of the base material 81. The upper mold 125A on which the uneven surface shape 127 is formed is brought into contact with the resin composition 84A on one surface side (upper surface side) of the base material 81, and the uneven surface shape can be formed only on the resin composition 84A.

FIG. 13B is an example of a mold structure 150B in which a mold 112A for single-sided processing is arranged on a work material 85B in which film-like resin compositions 84A and 84B are laminated on both sides of a base material 81. .. In this mold structure 150B, the smooth lower mold 120A is in contact with the resin composition 84B on the other side (lower surface side) of the base material 81 of the work material 85A, and the resin on one side (upper surface side) of the base material 81. The upper mold 125A on which the uneven surface shape 127 is formed is brought into contact with the composition 84A. Then, the resin composition 84B on the other side (lower surface side) of the base material 81 can be made into a smooth resin layer by the lower mold 120A, and the uneven shape can be formed only on the resin composition 84A on one side (upper surface side).

FIG. 13C is an example of a mold structure 150C in which a mold 112B for double-sided processing is arranged on a work material 85B in which film-like resin compositions 84A and 84B are laminated on both sides of a base material 81. .. The mold 112B includes a lower mold 120B having a mold surface 121B on which the uneven surface shape 122 is formed, and an upper mold 125A having a mold surface 126A on which the uneven surface shape 127 is formed. In this mold structure 150C, the lower mold 120B on which the uneven surface shape 122 is formed is brought into contact with the resin composition 84B on the other side (lower surface side) of the base material 81, and one side (upper surface side) of the base material 81 is brought into contact with the resin composition 84B. ), The upper mold 125A on which the uneven surface shape 127 is formed is brought into contact with the resin composition 84A. Then, the lower mold 120B and the upper mold 125A can form a concave-convex shape with respect to the resin compositions 84B and 84A on both sides of the base material 81.

According to the mold structure 150A shown in FIG. 13A, a single resin layer having an uneven shape can be appropriately formed on the base material 81. On the other hand, the mold structures 150B and 150C shown in FIGS. 13 (b) and 13 (c) are processed into a work material 85B in which the film-like resin compositions 84A and 84B are laminated on both surfaces of the base material 81. This is an example. In the mold structure 150B, a resin layer having a concave-convex shape and having a predetermined functionality can be formed on one side of the base material 81, and a resin layer such as a smooth adhesive layer can be formed on the other side. Further, in the mold structure 150C, it is possible to form a resin layer having a concave-convex shape on both sides of the base material 81 and having a predetermined functionality. In particular, in the mold structure 150C, by making the uneven shapes of the lower mold 120B and the upper mold 125A different, it is possible to form different patterns of uneven shapes on each surface of the base material 81. By laminating the resin compositions 84A and 84B on both sides of the base material 81 in this way, products having various functionalities can be easily manufactured.

14 and 15 are examples of mold structures 150D and 150E for simultaneously processing a plurality of (two in each of the examples in each figure) work materials. In the mold structure 150D shown in FIG. 14, a film-like resin composition 84A is laminated on one surface side (upper surface side in the example of the figure) of the base material 81, and a film is formed on both sides of the base material 81. A mold 112C capable of processing a plurality of workpieces is arranged with respect to another workpiece 85D on which the resin compositions 84A and 84B are laminated. The mold 112C includes a lower mold 120B having a mold surface 121B on which the uneven surface shape 122 is formed, an upper mold 125A having a mold surface 126A on which the uneven surface shape 127 is formed, and a mold having smooth surfaces on both sides. It includes a medium-sized 130A having surfaces 131A and 136A.

In this mold structure 150D, the lower mold 120B having the concave-convex surface shape 122 is brought into contact with the resin composition 84B on the other side (lower surface side) of the base material 81 of the other work material 85D. The upper die 125A on which the uneven surface shape 127 is formed is brought into contact with the resin composition 84A on one side (upper surface side) of the base material 81 of the work material 85C, and one work material 85C and another work material 85C are further abutted. A medium-sized 130A is interposed between the processed material 85D, and the smooth upper mold surface 131A of the medium-sized 130A is brought into contact with the other side (lower surface side) of the base material 81 of one work material 85C. The smooth lower mold surface 136A of the medium mold 130A is brought into contact with the resin composition 84A on one side (upper surface side) of the base material 81 of the other work material 85D. Then, for one work material 85C, the upper mold 125A forms an uneven shape only on the resin composition 84A on one side (upper surface side), and for the other work material 85D, the lower mold is formed. With 120A, the concave-convex shape can be formed only on the resin composition 84B on the other side (lower surface side) of the base material 81, and the resin composition 84A on one side (upper surface side) can be formed as a smooth resin layer.

In the mold structure 150E shown in FIG. 15, one work material 85E in which the film-like resin compositions 84A and 84B are laminated on both sides of the base material 81, and the film-like resin composition 84A and 84A on both sides of the base material 81 as well. A mold 112D capable of processing a plurality of workpieces is arranged with respect to another workpiece 85F on which 84B is laminated. The mold 112D includes a lower mold 120B having a mold surface 121B on which the uneven surface shape 122 is formed, an upper mold 125A having a mold surface 126A on which the uneven surface shape 127 is formed, and an uneven surface shape 132 on both sides. It includes a medium-sized 130B having mold surfaces 131B and 136B on which 137 is formed.

In this mold structure 150E, the lower mold 120B having the concave-convex surface shape 122 is brought into contact with the resin composition 84B on the other side (lower surface side) of the base material 81 of the other work material 85F. The upper die 125A on which the uneven surface shape 127 is formed is brought into contact with the resin composition 84A on one side (upper surface side) of the base material 81 of the work material 85E, and one work material 85E and another work material 85E are further abutted. An upper mold in which a medium mold 130B is interposed between the processed material 85F and an uneven surface shape 132 on the upper side of the medium mold 130B is formed with respect to the other side (lower surface side) of the base material 81 of one work material 85E. The lower surface 131B is brought into contact with the resin composition 84A on one side (upper surface side) of the base material 81 of the other work material 85F, and the lower concave-convex surface shape 137 of the medium-sized 130B is formed. The mold surface 136B is brought into contact with the mold surface 136B. Then, with respect to one workpiece 85E, the upper mold 125A forms a concave-convex shape on the resin composition 84A on one side (upper surface side), and the upper mold surface 131B of the medium mold 130B forms the other side (lower surface side). ) Is formed on the resin composition 84B, and the lower die 120B is used to form an uneven shape on the resin composition 84B on the other side (lower surface side) of the base material 81 with respect to the other work material 85F. A concave-convex shape can be formed on the resin composition 84A on one side (upper surface side) by the mold surface 136B on the lower side of the medium mold 130B.

According to the mold structure 150D shown in FIG. 14, a plurality of different types of thin plate-shaped laminates can be formed by interposing a medium mold 130A between different workpieces. On the other hand, in the mold structure 150E shown in FIG. 15, a plurality of the same thin plate-like laminates can be formed by interposing the medium mold 130B between the same workpieces. In this way, by arranging a plurality of workpieces and arranging upper, medium, and lower dies on both sides of each workpiece, a plurality of thin plate-like laminates of the same type or different types are simultaneously formed. This makes it possible to improve work efficiency and production efficiency. The medium molds 130A and 130B of the mold structures 150D and 150E are configured with the same mold surface on both sides, but are different, for example, one is a smooth mold surface and the other is a mold surface having an uneven shape. It is also possible to form a plurality of different types of thin plate-like laminates by forming the mold surface. The number of materials to be processed at the same time is not particularly limited, but is preferably about 2 to 3 from the viewpoint of processing accuracy and the like.

[Preparation of thin plate-shaped laminate]
A prototype example of a work material using a carbon-coated stainless steel (SUS316L) as a base material and a mixture of a polypropylene resin, carbon nanotubes (CNT), and graphite as a film-like resin composition under the following conditions. A thin plate-like laminate of 1 to 3 was prepared.

[Prototype example 1]
A mold holding structure is created by sandwiching the work material in a mold at the set part of the thin plate-like laminate manufacturing apparatus (working time is about 10 seconds), and the heating temperature is 200 ° C. and the heating time is at the heating part. Heating is performed in 120 seconds, thermocompression bonding is performed by a pressing roll at a pressing force of 40 kN, a pressurizing time of 20 seconds, and a pressurizing temperature of 200 ° C., and then slowly cooled to form a thin plate of Prototype Example 1. A laminate was obtained.

[Prototype example 2]
A mold holding structure is created by sandwiching the work material in a mold at the set part of the thin plate-shaped laminate manufacturing apparatus (working time is about 10 seconds), and the heating temperature is 300 ° C. and the heating time is at the heating part. Heating is performed in 30 seconds, thermocompression bonding is performed by a pressing roll at a pressing force of 40 kN, a pressing time of 20 seconds, and a pressing temperature of 200 ° C., and then slowly cooled to form a thin plate of Prototype Example 2. A laminate was obtained.

[Prototype example 3]
The mold is heated at a heating temperature of 300 ° C. and a heating time of 30 seconds in the heating part of the thin plate-shaped laminate manufacturing apparatus, and the work material is sandwiched between the heated molds in the set part. A holding structure is prepared (working time is about 10 seconds), thermocompression bonding is performed with a pressing roll at a pressing force of 40 kN, a pressurizing time of 20 seconds, and a pressurizing temperature of 200 ° C., and then slowly cooled. A thin plate-like laminate of Prototype Example 3 was obtained.

The quality of the molded state of the thin plate-shaped laminates of Prototype Examples 1 to 3 was visually evaluated. The evaluation criteria were "○ (good)" when the molded part (film-like resin layer) was acceptable as a product, and "◎ (excellent)" when it was in a better state. The results are shown in Table 1.

[Results and discussion]
In Prototype Example 1, a die sandwiching a work material is gently heated for processing. In Prototype Example 2, a mold sandwiching a work material is heated at a higher temperature and in a shorter time than in Prototype Example 1 to perform processing. In the trial example 3, the mold without the work material is heated at a higher temperature and in a shorter time than the trial example 1, and immediately after that, the unheated work material is sandwiched between the heated molds for processing. I went there. As a result, as shown in Table 1, the thin plate-shaped laminate of Prototype Example 2 could be molded with a quality that does not cause any problem as a product. On the other hand, in the thin plate-shaped laminates of Prototype Examples 1 and 3, the molded portion was in an extremely good state as compared with Prototype Example 2.

As can be understood from the comparison between Prototype 1 and Prototype 2, when heating a mold sandwiching a work material, slow heating at a relatively low temperature is higher than heating at a high temperature for a short time. It turns out that a quality product is obtained. This is because in Prototype Example 2, the work material is heated at a higher temperature together with the mold than in Prototype Example 1, so that the film-like resin composition of the work material is more easily oxidized than in Prototype Example 1. This is thought to be because it is difficult to improve the quality.

On the other hand, in Prototype Example 3, a high-quality product was obtained as in Prototype Example 1 by heating the mold that does not sandwich the work material and then sandwiching the work material. This is because in Prototype Example 3, the material to be processed was not exposed to a high temperature when the mold was heated, so that oxidation of the film-like resin composition of the material to be processed was suppressed as compared with Prototype 2, and high-quality molding was possible. It is thought that it became. Further, in the prototype example 3, since the mold can be heated in a shorter time than in the prototype example 1, the working time can be shortened as compared with the prototype example 1.

As described above, the apparatus for producing a thin plate-shaped laminate having a film-like resin layer of the present invention includes a set apparatus for creating a mold holding structure in which dies are arranged on both sides of a work material. A heating device that heats the mold to the thermal deformation temperature of the film-like resin composition and a mold holding structure after the mold is heated are introduced between the two pressure rolls, and the mold is rotated by the rotation of the pressure rolls. From the pinching roll device that pinches from the outer surface and integrally heat-bonds the film-shaped resin composition and the base material to form a thin plate-like laminate having a film-shaped resin layer, and the mold holding structure after pinching. Since it has a take-out device for removing the mold, the pressing force acts uniformly on the mold to suppress the occurrence of uneven pressure, and the film-like resin layer laminated on the thin plate-like base material is highly accurate and stable. It is possible to form an uneven shape. In particular, it is possible to accurately and stably form fine uneven shapes on the film-like resin layer laminated on the thin plate-like base material.

The apparatus for producing a thin plate-like laminate having a film-like resin layer of the present invention is not limited to the above-described embodiment, and a part of the configuration is appropriately modified without departing from the spirit of the invention. Can be carried out. For example, the combination of the arrangement of the setting unit, the heating unit, the pressurizing unit, and the taking-out unit is not limited to each of the above-described embodiments, and can be appropriately configured according to the application, installation location, and the like.

Further, in the above-described embodiment, the set portion, the heating portion, the pressurizing portion, and the take-out portion are connected in series by the rail portion provided on the machine base, and the mold holding structure can be moved on the rail portion. However, the mold holding structure may be moved by a known transfer device or the like without providing the rail portion.

Further, regarding the step of creating the mold holding structure between the setting portion and the heating portion, in the above-described embodiment, after creating the mold holding structure in which the mold sandwiching the work material is arranged, the mold is formed into a film. The process of heating to the thermal deformation temperature of the resin composition, or after heating the mold without sandwiching the work material to the thermal deformation temperature of the film resin composition, the work material is sandwiched between the heated molds. The process was set to create a mold holding structure, but the process is not limited to these. For example, a step of creating a mold holding structure after heating a mold that is not held by the holding body and holds the work material, or a metal that is not held by the holding body and does not hold the work material. After heating the mold, the heated mold that finally sandwiched the work material was placed between the set part and the heating part, such as the process of creating a mold holding structure by sandwiching the work material in the mold. If it is a step of producing a mold holding structure, it can be performed by an appropriate procedure.

The apparatus for producing a thin plate-shaped laminate of the present invention can uniformly pressurize a mold and can stably form an uneven shape on a film-like resin layer laminated on a thin plate-shaped base material with high accuracy. it can. Therefore, it is promising as an alternative to the conventional manufacturing equipment for thin plate-shaped laminates.

10, 10A-10H Thin plate-like laminate manufacturing equipment 11 Machine base 12 Machine base leg 20 Rail part 21 Rail body 30 Set part 31 Set device 40 Heating part 41 Heating device 42 Upper hot plate 43 Lower hot plate 50 Pressurizing part 51 Pinching roll device 52 Lower pressurizing roll 53 Lower rotary drive device 54 Upper pressurizing roll 55 Upper rotary drive device 56 Pressurizing part elevating means 57 Rod portion 60 of the pressurizing part elevating means Extraction device 70 Cooling unit 71 Cooling device 72 Upper cooling plate 73 Lower cooling plate 80 Thin plate-like laminate 81 Thin plate-like base material 82 Film-like resin layer 83 Concavo-convex shape of film-like resin layer 84, 84A, 84B Film-like resin Composition 85, 85A, 85B, 85C, 85D, 85E, 85F Work Material 86 Position of Edge of Work Material 100, 100A, 100B, 100C Mold Holding Structure 101 Holding Body 102 Side Edge 103 End Edge 104 Lower opening 105 Mold holding part 110, 110A, 110B, 110C Mold 111 Heated mold 112A, 112B, 112C, 112D Mold 115 Insertion paper 120, 120A, 120B Lower mold 121, 121A, 121B Lower mold Mold surface 122 Lower mold uneven surface shape 123 Coupling convex part 125, 125A Upper mold 126, 126A Upper mold surface 127 Upper mold uneven surface shape 128 Fitting hole part 130A, 130B Medium size 131A, 131B Medium size Upper mold surface 132 Middle upper concave surface shape 136A, 136B Medium mold lower mold surface 137 Medium lower concave surface shape 150A, 105B, 150C, 150D, 150E Mold structure H Concavo-convex groove Depth P1 Contact position between the lower pressure roll and the mold P2 Contact position between the upper pressure roll and the mold W1 Concavo-convex groove top width W2 Concavo-convex groove inner surface width

Claims (10)

A device for obtaining a thin plate-like laminate in which a film-like resin layer is integrally formed on the base material by sandwiching a work material in which a film-like resin composition is laminated on at least one surface side of the thin plate-like base material with a mold. ,
A set device for creating a mold holding structure in which the mold is arranged on both sides of the work material, and
A heating device that heats the mold to the thermal deformation temperature of the film-like resin composition, and
The mold holding structure after the mold is heated is introduced between the two pressure rolls, and the film-like resin composition and the base material are pressed from the outer surface of the mold by the rotation of the pressure rolls. To form a thin plate-like laminate having a film-like resin layer by thermocompression bonding integrally
An apparatus for producing a thin plate-like laminate having a film-like resin layer, which comprises an extraction device for removing the mold from the mold holding structure after pinching. The apparatus for producing a thin plate-like laminate having a film-like resin layer according to claim 1, wherein the heating apparatus heats a mold sandwiching the material to be processed. The apparatus for producing a thin plate-like laminate having a film-like resin layer according to claim 1, wherein the heating apparatus heats a mold that does not sandwich the material to be processed. The apparatus for producing a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 3, further comprising a cooling device for cooling the mold sandwiched by the pinching roll device. The apparatus for producing a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 4, which is an apparatus common to the setting apparatus and the taking-out apparatus. The thin plate-like laminate having the film-like resin layer according to any one of claims 1 to 5, wherein the base material is a thin plate-like material having a thickness of 1 mm or less and the film-like resin composition has a thickness of 500 μm or less. Manufacturing equipment. The apparatus for producing a thin plate-like laminate having the film-like resin layer according to any one of claims 1 to 6, wherein the film-like resin composition is laminated on both sides of the base material. The apparatus for producing a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 7, wherein a plurality of the workpieces are arranged and dies are arranged on both side surfaces of the workpieces. .. The apparatus for producing a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 8, wherein the film-like resin composition comprises a decorative, adhesive, or conductive functional resin composition. The apparatus for producing a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 9, wherein the mold surface of the mold has a fine uneven surface shape.

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