JP2000114291A - Semiconductor manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the yield in manufacturing a semiconductor device, for a semiconductor manufacturing device wherein a resin package is formed only on the one side surface of a lead frame. SOLUTION: For a semiconductor manufacturing device comprising a gate break mechanism 80 where a resin mold 20 (a configuration body where a plurality of resin sealing bodies 20A, where a resin 22 which is to be a resin package is formed on a lead frame 21 are connected by a gate 24 and a cull 23) is clamped by a lead frame clamper 83 before a gate-break process with the gate 24, and then separated into individual resin-sealing body 20A, the laed frame clamper 83 is so configured as to clamp only a position near the gate of the lead frame 21 at gate breaking while being separated from the resin 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a semiconductor manufacturing apparatus in which a resin package is formed only on one side of a lead frame. In recent years, with the diversification of electronic devices in which a semiconductor device is incorporated, the package structure of the semiconductor device has also diversified. Therefore, a semiconductor device manufacturing apparatus that manufactures such diversified semiconductor devices efficiently and with high reliability is required.

[0002]

2. Description of the Related Art FIG. 1 shows a semiconductor device 10 manufactured by a semiconductor manufacturing apparatus. The semiconductor device 10 has a very simple configuration including a semiconductor element 11, a resin package 12, and a metal film 13 when roughly described.
The semiconductor device 10 shown in FIG. 1 has been previously proposed by the present applicant in Japanese Patent Application No. 9-315323.

[0005] The semiconductor element 11 has a plurality of electrode pads 14 formed on the upper surface thereof, and is mounted on an element fixing resin 15. Also, the resin package 12
Is formed, for example, by transfer molding an epoxy resin using a mold, and a resin projection 17 is integrally formed at a predetermined position on the mounting surface 16. The resin protrusion 17 is formed to protrude downward from the mounting surface 16 of the resin package 12.

Further, the metal film 13 is formed on the resin package 12.
It is formed so as to cover the resin protrusion 17 formed on the substrate. A wire 18 is provided between the metal film 13 and the above-mentioned electrode pad 14 so that the metal film 13
And the semiconductor element 11 are electrically connected. The semiconductor device 10 having the above configuration is a conventional SSO
The inner lead and the outer lead such as P become unnecessary, and the area for routing from the inner lead to the outer lead and the area of the outer lead itself become unnecessary.
Therefore, the size of the semiconductor device 10 can be reduced.

Further, since it is not necessary to use a substrate for forming a solder ball such as a conventional BGA, the cost of the semiconductor device 10 can be reduced. In addition, the resin protrusion 17 and the metal film 13 cooperate to perform the same function as the solder bump of the BGA type semiconductor device, so that the mountability can be improved. The semiconductor device 10 having the above configuration is manufactured by performing the steps shown in FIG. The semiconductor device 10 shown in FIG. 1 is manufactured using a lead frame 21 (see FIG. 3), and a detailed manufacturing method of the semiconductor device 10 is disclosed in Japanese Patent Application No. 9-315323 described above. Therefore, each step will be briefly described here.

In order to manufacture the semiconductor device 10, first, an element mounting step (Step 10, which is abbreviated as “Step” in FIG. 1) is carried out to obtain the lead frame 2.
The element fixing resin 15 is applied to the first predetermined element mounting position, and the semiconductor element 11 is mounted on the element fixing resin 15. In the subsequent connection step (step 12), the lead frame 21 is mounted on a wire bonding apparatus, and the wire 18 is placed between the electrode pad 14 of the semiconductor element 11 and the metal film 13 (stud bump 19) formed on the lead frame in advance. Is provided, and the semiconductor element 11 and the metal film 13C are electrically connected.

[0007] When the above-mentioned connecting step is completed,
Plural semiconductor elements 1 formed on lead frame 21
A sealing step (step 14) of forming the resin sealing body 20A so as to seal 1 is performed. This sealing step further includes a preheating step (step 14-1), a resin molding step (step 14-2), a removal step (step 14-3), a gate break step (step 14-4), and a transport step (step 14-4). 14-5).

In the preheating step (step 14-1), a metal lead frame is preliminarily heated (preheated) in order to smoothly perform a resin molding process in a resin molding step described later. In this preheating process,
The preheating process is performed after the lead frame 21 is mounted on the lead frame pre-heater. However, the conventional lead frame pre-heater has a simple plate shape. Therefore, when the lead frame 21 is mounted on the lead frame pre-heater, the entire back surface of the lead frame 21 is configured to contact the lead frame pre-heater.

In the subsequent resin molding step (step 14-2), the preheated lead frame 21 is mounted on a metal mold, transfer molding is performed, and the resin 22 is formed on the lead frame 21. Form. FIG. 3 shows the resin-formed product 20. As shown in the figure, a resin 22 is formed on a lead frame 21, and a plurality of semiconductor elements 11 arranged on the lead frame 21 in an element mounting step and a connection step.
The wire 18 and the like are protected by the resin 22.
At the same time, at a position facing the metal film 13,
The resin protrusion 17 is formed.

In this resin molding step, instead of forming an individual resin package for each semiconductor element 11, a resin 22 is formed.
, The plurality of semiconductor elements 11 are collectively sealed. As a result, it is not necessary to form a cavity corresponding to the resin package in the mold as in the related art, and the configuration of the mold can be simplified. In addition, even if the size of the resin package 12 changes, the structure of the mold does not need to be changed, and it can be dealt with only by changing the dividing position of the resin 22 performed in the dividing step (step 18) described later. Can,
It is possible to flexibly respond to a change in the size of the resin package 12.

In the following description, the lead frame 21 will be described.
The resin 22 is formed thereon, and the structure is referred to as a resin sealing body 20A. Therefore, the resin-formed product 20 shown in FIG.
Two resin sealing bodies 20A are connected by a cull 23 and a gate 24. After the above-mentioned resin molded product 20 is formed in the resin molding process, in the next taking-out process (Step 14-3), the resin molded product 20 is taken out of the mold and is subjected to the gate break process (Step 14). -4) gate break mechanism 3
2 is carried out.

FIG. 4 shows a chucking mechanism 25 used in the take-out process. The removal process of the resin-formed product 20 from the mold is performed using the chucking mechanism 25. The chucking mechanism 25 is roughly similar to the main body 2.
6, suction pads 27 to 29, a chuck arm 30, and the like. Conventional chucking mechanism 25
The three suction pads 27 to
The suction pads 27 to 29 are connected to a suction device (not shown). The suction pad 27 is provided at a position corresponding to the formation position of the cull 23 of the resin molded product 20, and the suction pads 28 and 29 are provided at a position corresponding to the formation position of the resin 22 of the resin molded product 20. I was Further, the chuck arm 30 is attached to the body 2.
6 are formed to extend downward from both sides,
A chuck claw 30a was formed at the lower end.

In order to remove the resin-formed product 20 from the mold by the chucking mechanism 25 having the above-described structure, first, the cull 23 and the resin 22 are sucked by the suction pads 27 to 29 so that the resin molded product 20 is removed from the mold. The chuck arm 30 is operated so that the chuck claw 30a engages with the lower part of the lead frame 21 on the lead frame 21. Thereby, as shown in FIG. 4, the resin molded product 20 is chucked by the chucking mechanism 25 and taken out from the mold. Conventionally, in this chucking state, the outer peripheral portion of the lead frame 21 is in a state of contact with the chuck arm 30, and is thus configured to be firmly held. Then, the chucking mechanism 25 is moved while maintaining the chucking, and the resin molded product 20 is transported to the gate break mechanism 32.

When the above-mentioned take-out step is completed, a gate break step (step 14-4) is subsequently performed. As described above, the resin molded article 20 formed in the resin molding step is, as shown in FIG.
A is configured to be connected by a cull 23 and a gate 24. In the gate break step, the resin sealing body 20A is made independent (individualized) by cutting the gate 24.

FIG. 7 shows a conventional gate break mechanism 32 used in the gate break step. As shown in the figure, the gate break mechanism 32 roughly includes a carrier pallet 33 and a lead frame clamper 34.
It is composed of The carrier pallet 33 has a resin sealing body 20A mounted thereon, and has a pair of left and right bases 35 and a pallet arm 36. The pallet arm 36 is configured to be rotatable around a base 35 in a direction indicated by an arrow A in the figure.

On the other hand, the lead frame clamper 34
The resin sealing body 20A is provided at a position facing the lead frame 21, and is configured to be movable in the directions of arrows Z1 and Z2 in the figure by a driving mechanism (not shown). Also,
Each lead frame clamper 34 has an inner clamp claw 3
It is configured to be rotatable in the direction of arrow A in FIG.

The gate break mechanism 32 constructed as described above.
In order to perform the gate break processing using the method, first, after mounting the resin sealing body 20A on the carrier pallet 33,
The lead frame clamper 34 is moved downward in the direction of arrow Z1. Thereby, the inner clamp pawl 37 and the outer clamp pawl 3 formed on the lead frame clamper 34 are formed.
8 presses the lead frame 21 exposed on the outer peripheral portion of the resin 22 toward the carrier pallet 33, so that the resin sealing body 20A is clamped by the gate break mechanism 32.

Conventionally, as described above, the lead frame clamper 34 has inner and outer clamp claws 37, respectively.
The pair of clamp claws 37, 38 clamp the lead frame 21 by pressing the separated two places toward the carrier pallet 33. In this clamped state, the resin 22 of the resin sealing body 20 </ b> A is configured to contact the lower surface 34 a of the lead frame clamper 34.

As described above, when the resin sealing body 20A is clamped by the gate break mechanism 32, the lead frame clamper 34 is urged by a pressing arm (not shown), whereby the lead frame clamper 34 It rotates in the direction of arrow A in the figure around the position where 37 is formed. Also, this lead frame clamper 3
The pallet arm 36 is also configured to rotate in the direction of arrow A in FIG. At this time, since the lead frame 21 is clamped by the pallet arm 36 by the pressing force of the lead frame clamper 34, the lead frame 21 rotates with the rotation of the pallet arm 36. On the other hand, the cull 23 is in a state of being clamped to the base 35.

Therefore, a bending force acts on the gate 24 of the resin sealing body 20A, and the gate 24 is formed narrow and thin as shown in FIG.
Cutting (gate break) is performed at the joint between the resin 4 and the resin 22. By performing the gate break, the resin sealing body 20A is independent of the cull 23 and is in an individualized state.

When the above-described gate break step is completed, a transfer step (step 14-5) is subsequently performed. This transporting step is a step of performing processing for transporting the resin sealing body 20A singulated in the gate break step to a magazine (not shown). This transfer step has conventionally been performed using a transfer mechanism 40 shown in FIG.
The transport mechanism 40 includes a main body 41, a transport arm 42, a package clamper 44, and the like. The transfer arm 42 is formed to extend downward (in the direction of the arrow Z1) from both sides of the main body 41, and a transfer claw 43 is formed at the lower end thereof.
A package clamper 44 is provided between the pair of transfer arms 42, and the package clamper 44 is configured to be movable in the directions of arrows Z1 and Z2 in the figure.

In order to take out the resin sealing body 20A from the carrier pallet 36 by the above-configured transport mechanism 40, the pair of transport arms 42 are moved so as to spread. That is,
The transfer arm 43 on the right side in the figure is moved in the direction of arrow X1 in the figure, and the transfer arm 43 on the left side in the figure is moved in the direction of arrow X2 in the figure. In this state, the pair of transfer arms 42 is moved down to position the resin sealing body 20A therebetween.

Subsequently, the resin sealing body 20A (lead frame 21) is placed on the transport claws 43 by moving the pair of transport arms 42 closer to each other. Then, by lowering the package clamper 44,
The resin sealing body 20A is clamped between the package clamper 44 and the transport claws 43. Then, while maintaining this state, the resin sealing body 20A is transported to the magazine arrangement position, and then the operation of releasing the clamped state is performed, whereby the resin sealing body 20A is stored in the magazine. .

As shown in FIG. 9, in the conventional transport mechanism 40, the outer periphery of the lead frame 21 is in contact with the transport arm 42 in the clamped state, and the package clamper 44 is In order to press the portion exposed from the resin 22 toward the transport claw 43, the resin sealing body 20A is configured to be firmly held by the transport mechanism 40. In the clamped state, the lower surface 44a of the package clamper 44 is configured to contact the upper surface of the resin 22.

Returning to FIG. 2, description will be continued. When the above sealing step is completed, the resin 22 (semiconductor element 1
1, including the components of the semiconductor device 10 such as the metal film 13)
Is separated from the lead frame 21 (step 16). In this separation step, the resin sealing body 2
0A is etched, and lead frame 2
Dissolve 1. As an etching solution used in this separation step, an etching solution having a property of dissolving only the lead frame 21 and not dissolving the metal film 13 is selected. Therefore, when the lead frame 21 is completely dissolved, the resin 22 is separated from the lead frame 21.

As described above, by using the method of separating the resin 22 from the lead frame 21 by dissolving the lead frame 21, the process of separating the resin 22 from the lead frame 21 can be performed reliably and easily. The yield can be improved. When the above separation step is completed, a division step (step 18) is subsequently performed. In this dividing step, the individual resin packages 12 (semiconductor devices 10) are formed by cutting the resin 22. As a jig for cutting and dividing the resin 22, for example, a cut-saw, a laser beam, an electron beam, or the like may be used. Each of the steps described above (steps 10 to 10)
By performing step 18), the semiconductor device 10 shown in FIG. 1 is manufactured.

[0027]

Here, the structure of the resin-formed product 20 shown in FIG. 3 will be described below. As described above, in the method of manufacturing the semiconductor device 10 shown in FIG. 1, the lead frame 21 is used as a base, and the semiconductor element 1
1 and a metal film 13 and the like, and a resin 22 is formed.
Thereafter, the lead frame 21 which is no longer required is separated by etching. Therefore, the resin-formed product 20 formed by performing the resin molding step (step 14-2) has a resin sealed body 20A having a composite structure in which the resin 22 is formed on the lead frame 21. It has become.

As described above, in the configuration in which the resin 22 is formed on the lead frame 21, due to the difference in thermal expansion between the metal lead frame 21 and the resin 22, as shown in FIG. 20A may be warped. As shown in FIG. 5, the shape of the warp is a downwardly convex warp shape. Further, the structure in which the resin 22 is formed only on one surface of the lead frame 21 also has a characteristic that the lead frame 21 and the resin 22 are easily separated (separated) by application of an external force.

Focusing on the conventional chucking mechanism 25 shown in FIG. 4 based on the above, the conventional chucking mechanism 25 has three suction pads 27 to 29, and in particular, the suction pads 28 and 29 It is configured to adsorb the resin 22. Therefore, at the time of this suction, an external force indicated by an arrow F1 in FIG. 5 acts on the resin sealing body 20A. Further, since the chuck claw 30a provided in the chucking mechanism 25 is configured to firmly hold the lead frame 21, this holding force is also applied as an external force to the resin sealing body 2.
Acts on 0A.

Therefore, in the conventional chucking mechanism 25, the suction force F1 of the suction pads 28 and 29 and the holding force of the lead frame 21 by the chuck claws 30a act as external forces, and as shown in FIG. There is a problem that the separation part 31 is generated between the frame 21 and the resin 22. When the separation part 31 is formed between the lead frame 21 and the resin 22 in this manner, the wire 18 is cut at the separation part 21 and the manufacturing yield of the semiconductor device 10 is greatly reduced.

In the conventional gate break mechanism 32 shown in FIG. 7, since the lead frame clamper 34 has the inner clamp pawl 37 and the outer clamp pawl 38,
As shown in FIG. 8, both ends of the lead frame 21 are pressed by the external force F2 in the clamped state. Therefore, when the resin sealing body 20A is warped, the above-described external force F2 acts to correct only the warpage of the lead frame 21, and therefore, even in the gate break step (step 14-4). The lead frame 21 and the resin 22 may be separated.

Since the lower surface 34a of the lead frame clamper 34 is in contact with the resin 22 in the clamped state, the lead frame clamper 34 moves the resin 22 downward while the warp shown in FIG. When pressed in the direction, the shear direction between the lead frame 21 and the resin 22 having a difference in the amount of thermal expansion (the left-right direction in the figure)
External force is generated. Therefore, there is a possibility that the lead frame 21 and the resin 22 may be separated by the generation of the shearing force.

Further, the conventional transport device 40 shown in FIG.
In the clamped state, the package clamper 44 presses the portion of the lead frame 21 exposed from the resin 22 toward the transport claw 43, and the package clamper 44
Has been configured to press the upper surface of the resin 22 downward. For this reason, the same phenomenon as described above occurs when the transporting process is performed using the transporting device 40, and the lead frame 21 and the resin 22 may be separated.

On the other hand, in the manufacturing method in which the unnecessary lead frame 21 is separated by etching after the resin sealing body 20A is formed, resin burrs, resin dust, dust, etc. If dust is attached, the dust may cause an inappropriate etching process to be performed. That is, when the etching process (separation step) is performed with the dust adhered to the lead frame 21, the dust functions as a mask, and a phenomenon that the lead frame 21 remains at the dust adhered position occurs.

When the lead frame 21 remains as described above, the lead frame 21 in which a plurality of metal films 13 remain remains.
As a result, there is a problem that the semiconductor device 10 is short-circuited and the manufacturing yield of the semiconductor device 10 is reduced. The adhesion of dust to the lead frame 21 occurs particularly in a preheating step of preheating the lead frame 21, a resin molding step of performing a resin sealing process, and a gate break step of performing a gate break.

The present invention has been made in view of the above points, and has as its object to provide a semiconductor manufacturing apparatus capable of improving the manufacturing yield of a semiconductor device.

[0037]

Means for Solving the Problems To solve the above problems, the present invention is characterized by taking the following various means. According to the first aspect of the present invention, a resin sealed body having a configuration in which a resin to be a resin package is formed on a lead frame using a mold and a plurality of the resins are connected by a gate and a cull is formed by using a suction pad In a semiconductor manufacturing apparatus having a chucking mechanism for taking out from the mold, the suction pad sucks and holds the cull of the resin sealing body, and takes out the resin sealing body from the mold only by the suction pad. It is characterized by having done.

Further, according to the second aspect of the present invention, there is provided a resin molded product having a structure in which a plurality of resin sealing bodies formed by forming a resin serving as a resin package on a lead frame are connected by gates and culls. In a semiconductor manufacturing apparatus having a gate break mechanism for fixing a frame by clamping the frame with a lead frame clamper and then performing a gate break process on the gate to separate the frame into individual resin sealing bodies, the lead frame clamper includes a gate breaker. At the time of a break, only a position near the gate of the lead frame is clamped.

According to a third aspect of the present invention, there is provided a resin molded product having a structure in which a plurality of resin sealing bodies in which a resin serving as a resin package is formed on a lead frame are connected by gates and culls. In a semiconductor manufacturing apparatus having a gate break mechanism for fixing a frame by clamping the frame with a lead frame clamper and then performing a gate break process on the gate to separate the frame into individual resin sealing bodies, the lead frame clamper includes a gate breaker. It is characterized in that it is configured to maintain a state separated from the resin during a break.

According to a fourth aspect of the present invention, there is provided a resin sealed body having a resin to be a resin package formed on a lead frame which is separated by a gate break mechanism. In a semiconductor manufacturing apparatus having a transfer mechanism that is taken out of the mechanism and stored in a magazine, a transfer arm provided in the transfer mechanism includes:
A configuration in which a transport claw for mounting the resin sealing body is provided, and the lead frame is displaceable on the transport claw in a state where the resin sealing body is mounted. It is.

According to a fifth aspect of the present invention, there is provided a semiconductor manufacturing apparatus having a cleaning mechanism for removing dust adhering to the mold after forming a resin to be a resin package on the lead frame using the mold. The cleaning mechanism includes an air blowout hole provided at a central position of the suction port for sucking the dust, suction ducts provided on both sides of the suction port, and the suction port divided into two suction sections. And a shielding plate provided so that the air flow path gradually narrows from the suction duct toward the center of the suction port.

According to a sixth aspect of the present invention, there is provided a semiconductor device having a lead frame pre-heater for preheating the lead frame before forming a resin to be a resin package on the lead frame using a mold. The apparatus is characterized in that a concave portion is formed at the mounting position of the lead frame of the lead frame preheater, and only the outer peripheral position of the lead frame is held by the lead frame preheater.

According to a seventh aspect of the present invention, there is provided a resin molded product having a structure in which a plurality of resin sealing bodies in which a resin serving as a resin package is formed on a lead frame are connected by gates and culls. In a semiconductor manufacturing apparatus having a gate break mechanism for fixing a frame by clamping it with a lead frame clamper and then performing a gate break process on the gate, and separating the frame into individual resin sealing bodies, An air blow mechanism is provided for removing dust generated by the gate break process by spraying the air with air.

Further, according to an eighth aspect of the present invention, in the semiconductor manufacturing apparatus according to the seventh aspect, a dust collecting mechanism for collecting the dust is provided at a position facing the air blow mechanism. It is. Each of the means described above operates as follows.

According to the first aspect of the present invention, a resin sealing body having a structure in which a resin serving as a resin package is formed on a lead frame may be warped due to heating or the like during resin molding. This warpage occurs due to a difference in thermal expansion between the metal lead frame and the resin. On the other hand, in a resin sealing body having a structure in which a resin to be a resin package is formed on a lead frame made of metal, the resin and the lead frame are easily separated (peeled) by application of an external force. Therefore, when an external force is applied to the resin sealing body in a state where internal stress is accumulated due to warpage, separation may easily occur.

However, when the resin molded product is taken out of the mold, the suction pad sucks and holds the cull so that the cull is taken out, so that a position different from that of the resin sealing body where separation easily occurs is held. Becomes For this reason, when taking out a resin molded product from a metallic mold, it can prevent that external force by removal operation is applied to a resin sealing object. Therefore, even if the resin sealing body is warped, it is possible to reliably prevent the resin and the lead frame from separating when the resin molded product is taken out from the mold.

According to the second aspect of the present invention, since the lead frame clamper is configured to clamp only the position near the gate of the lead frame at the time of gate break, it is ensured that the resin and the lead frame are separated. Can be prevented. That is, as described above, when the resin sealing body is warped due to the difference in thermal expansion between the lead frame and the resin, the lead frame and the resin are in a curved state. When both sides of the lead frame sandwiching the resin formation position are clamped, the lead frame is forcibly corrected for bending.

On the other hand, since the resin is not clamped, the curved state is maintained. Therefore, if the warped resin sealing body is clamped at both sides of the resin forming position, the resin and the lead frame may be separated. However, at the time of a gate break, the lead frame clamper clamps only the position near the gate of the lead frame, so that even if the resin sealing body is warped, the lead is maintained in the same state. The frame can be clamped.
Therefore, at the time of clamping, an external force for separating the lead frame and the resin does not act on the resin sealing body, so that separation of the resin and the lead frame can be reliably prevented.

According to the third aspect of the present invention, the structure in which the lead frame clamper is kept separated from the resin at the time of a gate break ensures that the resin and the lead frame are separated. Can be prevented. That is, as described above, if the resin sealing body is warped due to the difference in thermal expansion between the lead frame and the resin, the resin and the lead frame may be separated when an external force is applied thereto. is there. Therefore, when the lead frame clamper contacts and presses the resin during a gate break, this acts as an external force, and the resin and the lead frame may be separated.

However, by providing a structure in which the lead frame clamper is kept apart from the resin at the time of gate break, even if the resin sealing body is warped, the gate is maintained with the warpage maintained as it is. Breaks can be made. Therefore, at the time of a gate break, an external force for separating the lead frame and the resin does not act on the resin sealing body, so that separation of the resin and the lead frame can be reliably prevented.

According to the fourth aspect of the present invention, the transfer arm provided on the transfer mechanism is provided with a transfer claw for mounting the resin seal, so that the resin seal is provided on the transfer claw. While being held, it is transported from the gate break mechanism to the magazine. At this time, the lead frame is configured to be displaceable on the transport claws when the resin sealing body is placed. That is, a clearance is provided between the lead frame and the transport claws.

If the lead frame is held firmly by the transport claws, the clamping force acts as an external force, and the resin and the lead frame may be separated. However, by providing a clearance between the lead frame and the transport claws so that the lead frame can be displaced on the transport claws, no clamping force is applied to the lead frame at the time of clamping. And the lead frame can be reliably prevented from being separated from each other.

According to the fifth aspect of the present invention, the air blowing hole provided in the cleaning mechanism is disposed at the center position of the suction port for sucking dust, so that the direction of dust scattering by the air blowing can be changed. It can be substantially balanced with respect to the center position. Therefore, the scattering direction of the dust is not deviated in a specific direction, so that highly efficient cleaning can be performed.

Further, by providing suction ducts on both sides of the suction port and providing a shielding plate defining the suction port in two suction portions, the air blown out from the air blowout holes can be supplied to each suction port from the central portion. The air is sucked through suction sections into suction ducts provided on both sides. Accordingly, dust is sucked into the suction duct together with the flow of air. In addition, since the shielding plate is configured to gradually narrow the flow path of the air from the suction duct toward the center of the suction port, the suction portion at the center of the suction port is narrowed, and the flow velocity of the air is increased. . For this reason, it is possible to avoid a state where air is convected at the central portion of the suction port and air does not proceed to the suction duct, and dust can be reliably removed.

According to the sixth aspect of the present invention, a recess is formed at the mounting position of the lead frame of the lead frame preheater for preheating the lead frame, and only the outer peripheral position of the lead frame is held by the lead frame preheater. With this configuration, the contact area between the lead frame and the lead frame pre-heater can be reduced. Accordingly, it is possible to prevent dust adhering to the lead frame preheater from being transferred to the lead frame, and to improve the dust resistance of the lead frame.

According to the seventh aspect of the present invention, the gate break mechanism is provided with an air blow mechanism for removing dust generated by the gate break processing by blowing air, so that dust can be removed from the lead frame. Adhesion can be reliably prevented. Further, according to the invention of claim 8, by providing a dust collecting mechanism for collecting dust at a position facing the air blow mechanism,
Dust scattered by the air blow mechanism is collected by the dust collection mechanism and can be prevented from adhering to other parts of the gate break mechanism, so that dust can be more reliably prevented from adhering to the lead frame.

[0057]

Next, embodiments of the present invention will be described with reference to the drawings. 10 to 18 are views for explaining a semiconductor manufacturing apparatus according to one embodiment of the present invention. The semiconductor manufacturing apparatus according to the present embodiment is also used for manufacturing the semiconductor device 10 shown in FIG.
The semiconductor manufacturing apparatus according to the present embodiment is used in the sealing step (step 14) shown in FIG. 2, and the semiconductor manufacturing apparatus used in the other steps (steps 10, 12, 16, and 18) is There is nothing different from the past. Therefore, in the following description, only the semiconductor manufacturing apparatus used in the sealing step will be described.

The semiconductor manufacturing equipment used in the sealing step
Resin molding device 50, cleaning mechanism 60, chucking mechanism 70, gate break mechanism 80, and transport mechanism 9
0 and the like. Hereinafter, each mechanism and device constituting the semiconductor manufacturing apparatus used in the sealing step will be described. FIG. 10 shows a resin molding device 50. The resin molding device 50 is roughly composed of a mold 51, a press device 52, a preheater device 53, a cleaning mechanism 60 (not shown in FIG. 10), and the like.

The mold 51 includes an upper mold 51A and a lower mold 51B (FIG. 1).
4), and a cavity corresponding to the shape of the resin 22 is formed in the upper mold 51A.
The press device 52 is provided to press the upper mold 51A and the lower mold 51B during resin molding. The pre-heater device 53 heats (preheats) the lead frame 21 in advance before the lead frame 21 is mounted on the mold 51.
Of resin filling efficiency and lead frame 21
Of the resin and the resin 22 can be improved.

FIG. 11 is an enlarged view of the pre-heater device 53. The pre-heater device 53 includes the resin molding device 5
0, and a lead frame pre-heater 55 mounted on the mounting portion 54. The lead frame 21 is configured to be mounted on the upper surface of the lead frame pre-heater 55, and the lead frame pre-heater 55 is mounted on the mounting portion 54 after mounting the lead frame 21. Thus, the lead frame 21 is preheated by the preheater device 53.

FIG. 12 shows a lead frame pre-heater 55.
It is a figure which expands and shows. As shown in the figure, the lead frame pre-heater 55 has a configuration in which four lead frames 21 are mounted on a pre-heater main body 56. In the drawing, a rectangular area indicated by two points of transition is a lead frame mounting area 57 on which the lead frame 21 is mounted. In the present invention, the recess 5 is provided inside the lead frame mounting area 57.
8 is formed. The recess 58 is slightly smaller than the size of the lead frame mounting area 57. Therefore, when the lead frame 21 is mounted in the lead frame mounting area 57, only the outer peripheral portion of the lead frame 21 has a lead frame preheater 55. It is a configuration mounted (held) on the.

As described above, since only the outer peripheral position of the lead frame 21 is held by the lead frame pre-heater 55, the contact area between the lead frame 21 and the lead frame pre-heater 55 can be reduced. Accordingly, even if dust (resin burrs, resin dust, etc.) adheres to the lead frame preheater 55,
This dust can be prevented from being transferred (re-adhered) to the lead frame 21, and the dustproof property for the lead frame 21 can be improved.

Therefore, even if an etching process is performed on the lead frame 21 in the separation step (see FIG. 2) performed later, the lead frame 21 is completely removed without remaining, so that the semiconductor device 10 Production yield can be improved. After the preheating is completed, the lead frame 21 is taken out of the lead frame pre-heater 55. At this time, in the lead frame preheater 55 of this embodiment, since the takeout groove 59 is formed at a predetermined position on the outer periphery of the concave portion 58, the process of taking out the lead frame 21 from the leadframe preheater 55 can be easily performed.

The lead frame 21 preheated as described above is subsequently mounted on the mold 21, and the resin molding step (step 14-2) is performed. By performing the resin forming process using the mold 21, the resin molded product 20 described above with reference to FIG. 3 is formed. The resin molded product 20 is taken out of the mold 21 by a chucking mechanism 70 described later, and the mold 51 from which the resin molded product 20 has been taken out is subjected to a cleaning process.

FIGS. 13 and 14 show a cleaning mechanism 60 according to an embodiment of the present invention. The cleaning mechanism 60 includes, as shown in FIG.
It is mounted between the upper mold 51A and the lower mold 51B, and has a function of cleaning dust adhered to the upper mold 51A and the lower mold 51B by moving in the arrow X direction in the figure. Note that FIG.
FIG. 13A is a top view of the cleaning mechanism 60, and FIG.
FIG. 14B is a partially cutaway front view of the cleaning mechanism 60, and FIG. 14 is a partially cutaway side view of the cleaning mechanism 60.

The cleaning mechanism 60 generally includes a suction port 61, an air passage 62, suction sections 64 and 65, a shielding plate 66,
And suction ducts 67, 68 and the like. The suction ports 61 are provided at an upper portion facing the upper die 51A of the cleaning mechanism 60 and at a lower portion facing the lower die 51B, respectively. Each of the suction ports 61 is provided so as to extend long in the arrow X direction in the figure. Further, each suction port 61 has a hood shape, and each suction port 61 is in a state of being close to the upper mold 51A and the lower mold 51B at the time of cleaning, so that dust is not scattered outside by injection of compressed air described later. Have been.

The air passage 62 is provided inside each suction port 61 so as to extend along its longitudinal direction. Also,
The arrangement position of the air passage 62 in the suction port 61 is set to be substantially the center of the suction port 61. The air passage 62 has a configuration in which compressed air is fed into the inside thereof, and a plurality of air blowing holes 63 are provided at positions facing the upper mold 51A and the lower mold 51B. Therefore, the compressed air sent into the air passage 62 is jetted from the air blowing holes 63 toward the upper mold 51A and the lower mold 51B, whereby dust adhering to the surfaces of the upper mold 51A and the lower mold 51B is removed. Be scattered (blown).

At this time, the air passage 62 is set to be located substantially at the center of the suction port 61. Therefore, the air blowing hole 63 also blows out compressed air substantially at the center of the suction port 61. Highly efficient cleaning can be performed without being biased in a specific direction. On the other hand, a shielding plate 66 is provided inside the suction port 61, and the inside of the cleaning mechanism 60 is defined on the left and right by the shielding plate 66 to form suction portions 64 and 65.
A suction duct 6 is provided on the side of each of the suction sections 64 and 65.
The air that has scattered dust by being blown out from the air blowing holes 63 is sucked from the suction ducts 67 and 68 together with the dust.

As a result, the scattered dust is returned to the upper mold 5 again.
It does not adhere to 1A and the lower mold 51b, so that a good cleaning effect can be obtained. Note that FIG.
(B) shows the flow of air with a dashed line. In addition, shielding plate 6
As shown in FIG. 13B, 6 has a substantially rhombic shape when viewed from the front. For this reason, each suction unit 64,
65 is configured such that the flow path of the air gradually narrows from the arrangement position of the suction ducts 67 and 68 toward the center of the suction port.

With this configuration, the suction portions 64 and 65 (portions indicated by arrows B in FIG. 13B) at the central portion of the suction port 61 are narrowed, and the flow velocity of the air is increased. For this reason, it is possible to avoid a state in which air is convected at the central portion of the suction port 61 so that the air does not advance to the suction ducts 67 and 68, and thereby dust can be reliably removed.

In the conventional cleaning mechanism, there is a configuration in which a brush is provided on the suction unit and the surface of the mold is cleaned by the brush. However, in a small configuration using a brush, a large amount of dust adheres to the brush over time,
The attached dust falls off the brush and contaminates the mold. Further, in order to prevent this, it is necessary to frequently replace the brush, which deteriorates the maintainability. From this point, no brush is provided in the cleaning mechanism 60 according to the present embodiment.

FIG. 15 shows a chucking mechanism 70 according to an embodiment of the present invention. This chucking mechanism 7
Numeral 0 is used when performing the take-out step (see FIG. 2), and has a function of transporting the resin molded product 20 molded in the resin molding apparatus 50 shown in FIG. 10 to the carrier pad 33 shown in FIG. Things. The chucking mechanism 70 generally includes a main body 71, a suction pad 73, a chuck arm 74, and the like.

Here, when comparing the conventional chucking mechanism 25 shown in FIG. 4 with the chucking mechanism 70 according to the present embodiment, the conventional chucking mechanism 70 has three suction pads 27 to 29. On the other hand, the chucking mechanism 70 according to the present embodiment has a configuration in which only one suction pad 73 is provided. The suction pad 73 is connected to a suction device (not shown), and its disposition position is set at a position corresponding to the position where the cull 23 of the resin molded product 20 is formed.

On the other hand, the chuck arm 74 is formed so as to extend downward from both sides of the main body 71, and a chuck claw 74a is formed at the lower end thereof. In order to take out the resin-formed product 20 from the mold by the chucking mechanism 70 having the above configuration, first, the suction pad 73
The resin molded product 20 is separated from the mold by sucking the chuck 3, and the chuck arm 74 is operated so that the chuck claw 74 a is positioned below the lead frame 21.

At this time, in this embodiment, the chuck arm 7
4 and the chuck pawls 74a do not directly contact the lead frame 21 (the resin molded product 20). That is,
A clearance ΔW1 is provided between the chuck arm 74 and the lead frame 21 and the chuck pawl 7
4a and the lead frame 21 have a clearance ΔH
1 is provided.

With this configuration, the resin molded product 2
0 means that the suction pad 73 is held only by the suction force for sucking the cull 23, and the chuck arm 74 and the chuck claw 74a are
In the case where it deviates from 3, only the function of preventing the fall is exerted. By the way, as described above, the resin sealing body 20A
The (resin molded article 20) may be warped due to a difference in thermal expansion between the lead frame 21 and the resin 22.
In particular, it is highly likely that warpage has occurred after the completion of the resin molding step involving heat treatment. As described above, when an external force is applied to the resin sealing body 20A when the warpage occurs, the lead frame 21 and the resin 22 may be separated (peeled) as described above.

However, when the resin molded product 20 is taken out from the mold 51 as in the chucking mechanism 70 according to the present embodiment, one suction pad 73 sucks and holds only the cull 23 to perform the removal process. With this configuration, a different position (that is, the cull 23) from the resin sealing body 20A where the separation easily occurs is held. For this reason, when taking out the resin molded product 20 from the mold 51, it is possible to prevent an external force from being applied to the resin sealing body 20A from being applied, and even if the resin sealing body 20A is warped. Thus, separation of the resin 22 and the lead frame 21 can be reliably prevented.

FIG. 16 shows a gate break mechanism 80 used in the gate break step and a transfer mechanism 90 used in the transfer step.
And an air blow mechanism 100. As shown in the figure, the gate break mechanism 80, the transport mechanism 90, and the air blow mechanism 100 are arranged on the same frame 89 and base 99. First, a gate break mechanism 80 according to an embodiment of the present invention will be described. The gate break mechanism 80 cuts the gate 24 of the resin molded product 20 to form the resin sealing body 20A.
Is performed independently (individualization).

The gate break mechanism 80 is generally composed of a carrier pallet 33 and a lead frame clamper 83. The carrier pallet 33 has a resin sealing body 20A mounted thereon, and has a pair of left and right bases 35 and a pallet arm 36. The pallet arm 36 is configured to be rotatable around the base 35 in a direction indicated by an arrow A in the figure.

The carrier pallet 33 has a base 35
Are fixed to the moving base 81. In addition, the moving base 81
Is an arrow X along the rail 82 provided on the base 99.
It is configured to move in the X1 and X2 directions. Therefore, the carrier pallet 33 is also moved along the rail 82 by the arrow X in the figure.
It is configured to be movable in the X1 and X2 directions. On the other hand, the lead frame clamper 83 is
Are disposed at a position facing the lead frame 21 of the resin sealing body 20A in a state where the... Has moved to a predetermined gate break position. The lead frame clamper 83 is disposed on the base 35 disposed at the tip of the drive shaft 86 driven by the driving device 88.
As the drive shaft 86 moves, the arrow Z1,
It is configured to move in the Z2 direction.

Further, the lead frame clamper 83
By being pressed by a pressing arm 87 driven via a drive shaft 86, it is configured to be rotatable in a direction indicated by an arrow A in FIG. Here, the gate break mechanism 80 according to the present embodiment
7 is compared with the conventional gate break mechanism 32 shown in FIG. 7, the lead frame clamper 34 in the conventional gate break mechanism 32 has clamp claws 37 and 38 on both the inside and outside thereof. The gate break mechanism 80 according to the embodiment has a configuration in which the clamp claws 84 are provided only inside.

Next, a description will be given of a gate break process using the gate break mechanism 80 configured as described above. The resin molded product 20 to be subjected to the gate break processing is mounted on the carrier pallet 33 at the position shown in FIG. The carrier pallet 33 on which the resin molded product 20 is mounted is
2 moves in the direction of arrow X1 in the figure, and stops when it moves to a predetermined lower position of the lead frame clamper 83 described above.

Subsequently, the driving device 88 is activated, and the lead frame clamper 83 moves downward (moves in the direction of arrow Z1 in the figure) as described above, and the clamp claws 84 direct the lead frame 21 toward the pallet arm 36. Press (clamp). As shown in FIG. 3A, the gate 24 has a comb-like shape, and the clamp claw 8 corresponds to this shape.
4 also has a comb shape. Therefore, the clamp claw 84 is configured to clamp the lead frame 21 through the space between the comb-shaped gates 24.

FIG. 17A shows a state where the lead frame clamper 83 clamps the lead frame 21. In this state, the lower surface 83a of the lead frame clamper 83 is separated from the upper surface of the resin 22,
A clearance ΔH2 is formed. As described above,
When the resin sealing body 20A is clamped by the gate break mechanism 80, subsequently, only the above-described pressing arm 87 is further moved downward to urge the lead frame clamper 83. As a result, the lead frame clamper 83 is
It rotates in the direction of arrow A in FIG.
Further, the pallet arm 36 is also configured to rotate in the direction of arrow A in the figure with the rotation of the lead frame clamper 83.

At this time, the lead frame 21 is pressed by the pallet arm 36 by the pressing force of the lead frame clamper 83.
, And rotates with the rotation of the pallet arm 36. On the other hand, the cull 23 is clamped between the base 35 and the base 85. Therefore, as described above, when the lead frame clamper 83 and the pallet arm 36 rotate in the direction of arrow A, a bending force acts on the gate 24 of the resin sealing body 20A, and the gate 24 is moved as shown in FIG. The gate 24 and the resin 22 are cut (gate break) because they are narrow and thin.

FIG. 17B shows a gate break 80 in which gate break processing is being performed. As shown in the figure, even while the lead frame clamper 83 and the pad arm 36 rotate in the direction of the arrow A and the gate break process is performed, the clearance ΔH2 exists between the lead frame clamper 83 and the resin 22. Is maintained.

By performing the gate break, the resin sealing body 20A is independent of the cull 23 and is in a state of individualized pieces. Further, when the resin sealing body 20A is separated into individual pieces by the above-described gate break processing, the lead frame clamper 83 and the pallet arm 36 rotate in the direction opposite to the direction of the arrow A, and return to the state shown in FIG. (Gate 24 is split).

As described above, in the gate break mechanism 80 according to the present embodiment, the clamp claws 84 of the lead frame clamper 83 clamp only the position near the gate of the lead frame 21 at the time of gate break. In the clamped state, a clearance ΔH exists between the lead frame clamper 83 and the resin.
2 are formed, and are not configured to directly contact as in the related art.

As described above, the lead frame clamper 8
3 is one place of the lead frame 21 (specifically, one side)
By employing a configuration in which only the resin 22 is clamped, separation of the resin 22 and the lead frame 21 can be reliably prevented. Hereinafter, the reason will be described. As described above, when the resin sealing body 20A is warped due to a difference in thermal expansion between the lead frame 21 and the resin 22,
If the both sides of the lead frame 21 are clamped as in the related art, the warp is forcibly corrected, and the lead frame 21 and the resin 22 may be separated (see FIG. 8). Also. Even when the resin 22 is pressed, the lead frame 21 and the resin 22 may be similarly separated.

On the other hand, the gate break mechanism 80 according to the present embodiment has a configuration in which the lead frame clamper 83 (clamp claw 84) clamps only the position near the gate of the lead frame 21 at the time of gate break, so that the resin sealing is performed. Even if the body 20A is warped, the lead frame 21 can be clamped while maintaining the warpage. Therefore, at the time of clamping, no external force acts on the resin sealing body 20A to separate the lead frame 21 and the resin 22.
Can be prevented from being separated.

Further, the gate break mechanism 80 according to the present embodiment is configured to maintain the state in which the lead frame clamper 83 is separated from the resin 22 during a gate break. Therefore, even if the resin sealing body 20A is warped, a gate break can be performed with the warpage maintained. Accordingly, at the time of a gate break, an external force for separating the lead frame 21 and the resin 22 does not act on the resin sealing body 20A, so that separation of the lead frame 21 and the resin 22 can be prevented.

As described above, the gate break mechanism 80 according to the present embodiment can prevent the lead frame 21 and the resin 22 from being separated from each other at the time of clamping and at the time of gate break, so that the manufacturing yield of the semiconductor device 10 can be reduced. Can be improved. Next, a transport mechanism 90 according to an embodiment of the present invention will be described. This transport mechanism 90
Is used in the transporting step, and has a function of performing a process of transporting the resin sealing body 20A singulated in the gate break step to the magazine 98.

As shown in FIG. 18 in addition to FIG. 16, the transfer mechanism 90 is roughly composed of a main body 91, a first transfer arm 92, a second transfer arm 93, a package clamper 96, and the like. I have. The first transfer arm 92 is formed so as to extend downward (in the direction of arrow Z1) from both sides of the main body 41 in the directions of arrows X1 and X2 in the drawing, and has a transfer claw 94 at the lower end thereof. Are formed. The second transfer arm 93 is formed so as to extend downward from a position deviated by 90 degrees with respect to the first transfer arm 92 of the main body 41, and has a transfer end at a lower end thereof. A nail 95 is formed. A package clamper 96 is provided between the transfer arms 92 and 93.

Next, a description will be given of a transport process using the transport mechanism 90 having the above configuration. The resin sealing body 20A separated by the gate break mechanism 80 is transported to the lower part of each of the transport arms 92 and 93 by moving the carrier pallet 33 on the rail 82 in the direction of arrow X1 in the figure. Then, the driving device 97 disposed on the upper portion of the main body 91 is activated, and the opposing transport arms 92,
The transfer arm 92 and the transfer arms 93 and 93 are moved so as to spread each other. That is, the transfer arms 92 and 93
It moves so that the resin sealing body 20A can be inserted therein.

Subsequently, the transfer arms 92 and 93 move downward, and the transfer claws 94 and 95 come into contact with the upper surface of the carrier pallet 33. In this state, the resin sealing body 20A is located inside each of the transfer arms 92 and 93. Subsequently, the transfer arms 92, 92 and the transfer arms 93, 93 facing each other are moved so as to be close to each other, whereby the resin sealing body 20 is placed on the transfer claws 94, 95.
A (lead frame 21) is placed.

At this time, the transfer arms 92 and 93 and the package clamper 96 are configured so as not to directly contact the lead frame 21. That is, a clearance ΔW2 is formed between each of the transfer arms 92 and 93 and the lead frame 21, and a clearance ΔH3 is formed between the package clamper 96 and the resin 22. Have been. Therefore, while being held by the transfer arms 92 and 93, the resin sealing body 20A (the lead frame 21) holds the transfer claws 94,
95.

When the resin sealing body 20A is held by the transfer arms 92, 92 as described above, the transfer arms 92, 9
2 moves upward (moves in the direction of arrow Z2 in the figure), and the carrier pallet 33 moves in the direction of arrow X2 in the figure. In the present embodiment, a magazine 98 accommodating the resin sealing body 20A is provided.
Is disposed immediately below the position where the transport mechanism 90 is disposed. Therefore, the transport mechanism 90 is provided with the resin sealing body 20A described above.
Is further lowered while maintaining the holding state of the resin sealing body 2.
0A is transported to the position where the magazine 98 is disposed. And
At the time when the magazine 98 is moved to the position where the magazine 98 is disposed, the operation of releasing the clamped state is performed, whereby the resin sealing body 20A is stored in the magazine.

As described above, the transport mechanism 9 according to this embodiment
0, the lead frame 21 is mounted on the transport claws 94 and 95 with the resin sealing body 20A placed on the transport claws 94 and 95.
4,95 are displaceable. That is, a clearance ΔW2 (indicated by an arrow in FIG. 18) is provided between the lead frame 21 and each of the transfer arms 92 and 93. Thus, no clamping force is applied to the lead frame 21 during clamping (during holding), and therefore, separation of the lead frame 21 and the resin 22 can be prevented.

As described above, the gate break mechanism 80 according to the present embodiment can prevent the lead frame 21 and the resin 22 from being separated from each other at the time of clamping and at the time of gate break, so that the manufacturing yield of the semiconductor device 10 can be reduced. Can be improved. Further, as described above, the carrier pallet 33 in which the sealing resin body 20A is held by the transport mechanism 90 and only the cull 23 remains, is moved to the transport mechanism 90.
Move in the direction of the arrow X2 from the arrangement position to the position shown in FIG. The cull 23 is removed from the carrier pallet 33 by a cull removing mechanism (not shown) while the carrier pallet 33 moves in the direction of the arrow X2.

An air blow mechanism 100 is provided above the moving path. The air blow mechanism 100 is disposed on the frame 89, and blows out compressed air toward the moving path of the carrier pallet 33. Further, in the present embodiment, the arrangement position of the air blow mechanism 100 is set at a position slightly shifted from the gate break mechanism 80 in the direction of the arrow X2 in the figure.

A dust collecting mechanism 101 is provided at a position facing the air blow mechanism 100. The dust collecting mechanism 101 is connected to a dust collecting device (not shown), and is configured so that the dust collecting device can perform a master process by performing a suction process. By the way, the gate break mechanism 80
When the gate break process is performed, resin dust (dust) may be generated at the cutting position between the resin 22 and the gate 24. If the dust remains on the carrier pallet 33 when the resin molded product 20 is placed on the carrier pallet 33 in the next gate break step, the dust may adhere to the lead frame 21. As described above, if dust adheres to the lead frame 21, the lead frame 21 cannot be completely etched in the separation step (see FIG. 2) and the manufacturing yield of the semiconductor device 10 decreases as described above. It is.

However, by providing the air blow mechanism 100 as in the present embodiment, when the carrier pallet 33 returns to the initial position, dust adhering to the carrier pallet 33 is compressed by the compressed air blown out by the air blow mechanism 100. It is removed from the pallet 33.
Therefore, when the carrier pallet 33 returns to the initial position shown in FIG. 16, the carrier pallet 33 is in a state where no dust is attached. This makes it possible to completely etch the lead frame 21 in the separation step, and to improve the manufacturing yield of the semiconductor device 10.

In this embodiment, the air blow mechanism 100
A dust collection mechanism 101 that collects dust is disposed at a position facing the above. Therefore, even if dust is scattered by the air blow mechanism 100, the dust is collected by the dust collection mechanism 101. As a result, dust scattered by the air blow mechanism 100 can be prevented from adhering to other components of the semiconductor manufacturing apparatus, and thus dust can be prevented from adhering to the lead frame 20 via the other components.
Therefore, the manufacturing yield of the semiconductor device 10 can be improved also by this.

[0104]

According to the present invention as described above, the following various effects can be realized. According to the first aspect of the present invention, when removing the resin molded product from the mold, it is possible to prevent an external force due to the removing operation from being applied to the resin sealing body. Even if the sealing body is warped, separation of the resin and the lead frame can be reliably prevented.

According to the second aspect of the present invention, even if the resin sealing body is warped, the lead frame can be clamped while maintaining the warpage. An external force for separating the lead frame and the resin does not act on the sealing body, so that separation of the resin and the lead frame can be reliably prevented.

According to the third aspect of the present invention, even if a warp occurs in the resin sealing body, the gate break can be performed while maintaining the warp. An external force for separating the lead frame and the resin does not act on the sealing body, so that separation of the resin and the lead frame can be reliably prevented.

According to the fourth aspect of the present invention, since a clearance is formed between the lead frame and the transporting claws, no clamping force is applied to the lead frame during clamping, and therefore, the resin And the lead frame can be reliably prevented from being separated from each other. According to the fifth aspect of the present invention, the air blowing hole is disposed at the center position of the suction port for sucking dust, so that the scattering direction of the dust by the air blowing is substantially balanced with the center position of the suction port. Therefore, the scattering direction of the dust is not deviated in a specific direction, and highly efficient cleaning can be performed. Also, by configuring the shielding plate from the suction duct to the center of the suction port so that the flow path of the air gradually narrows, the suction portion at the center of the suction port becomes a narrowed configuration, and the flow velocity of the air increases, Therefore, it is possible to avoid a state in which air is convected at the central portion of the suction port and air does not proceed to the suction duct, and dust can be reliably removed.

According to the sixth aspect of the present invention, the contact area between the lead frame and the lead frame pre-heater can be reduced, thereby preventing dust adhering to the lead frame pre-heater from being transferred to the lead frame. As a result, the dust resistance of the lead frame can be improved. According to the seventh aspect of the present invention, dust is attached to the lead frame by providing the gate break mechanism with an air blow mechanism that scatters and removes dust generated by the gate break process by blowing air. Can be reliably prevented.

According to the eighth aspect of the present invention, dust scattered by the air blow mechanism can be prevented from being collected by the dust collecting mechanism and adhering to other parts of the gate break mechanism. Adhesion can be more reliably prevented.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining a semiconductor device manufactured by a semiconductor manufacturing apparatus according to the present invention.

FIG. 2 is a process chart showing a manufacturing process of the semiconductor device shown in FIG. 1;

FIG. 3 is a view showing a resin-formed product formed during the manufacturing of the semiconductor device shown in FIG. 1;

FIG. 4 is a view for explaining a conventional chuck mechanism.

FIG. 5 is a diagram for explaining a conventional problem (part 1).

FIG. 6 is a diagram for explaining a conventional problem (part 2).

FIG. 7 is a view for explaining a conventional gate break mechanism.

FIG. 8 is a diagram for explaining a conventional problem (part 3).

FIG. 9 is a view for explaining a conventional transport mechanism.

FIG. 10 is a view showing a resin molding apparatus constituting a semiconductor manufacturing apparatus according to one embodiment of the present invention.

FIG. 11 is an enlarged view showing a preheater device of the resin molding device shown in FIG.

FIG. 12 is a view showing a lead frame preheater constituting a semiconductor manufacturing apparatus according to one embodiment of the present invention.

FIG. 13 is a view showing a cleaning mechanism constituting a semiconductor manufacturing apparatus according to one embodiment of the present invention (part 1).

FIG. 14 is a view showing a cleaning mechanism constituting the semiconductor manufacturing apparatus according to one embodiment of the present invention (part 2).

FIG. 15 is a view showing a chucking mechanism constituting a semiconductor manufacturing apparatus according to one embodiment of the present invention.

FIG. 16 is a diagram showing a gate break mechanism and a transport mechanism that constitute the semiconductor manufacturing apparatus according to one embodiment of the present invention.

FIG. 17 is a view for explaining the configuration and operation of a gate break mechanism constituting the semiconductor manufacturing apparatus according to one embodiment of the present invention.

FIG. 18 is a view for explaining the configuration and operation of a transport mechanism constituting the semiconductor manufacturing apparatus according to one embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Semiconductor device 11 Semiconductor element 12 Resin package 13 Metal film 17 Resin protrusion 20 Resin molding 20A Resin sealing body 21 Lead frame 22 Resin 23 Cal 24 Gate 31 Peeling part 33 Carrier pallet 36 Pallet arm 50 Resin forming device 51 Mold 52 Pressing device 53 Pre-heater device 55 Lead frame pre-heater 56 Pre-heater main body 57 Lead frame mounting area 58 Recess 59 Retrieval groove 60 Cleaning mechanism 61 Suction port 62 Blow path 63 Air blow-out holes 64, 65 Suction unit 66 Shielding plate 67, 68 Suction duct 70 Chucking Mechanism 73 Suction Pad 74 Chuck Arm 74a Chuck Claw 80 Gate Break Mechanism 83 Lead Frame Clamp 84 Clamp Claw 86 Drive Shaft 87 Press Arm 88 Drive device 90 Transport mechanism 92 First transport arm 93 Second transport arm 94, 95 Transport claw 96 Package clamper 97 Drive device 98 Magazine 100 Air blow mechanism 101 Dust collection mechanism

Claims (8)

[Claims] 1. A resin molded product in which a resin to be a resin package is formed on a lead frame using a mold and a plurality of the resins are connected by a gate and a cull from the mold using a suction pad. In the semiconductor manufacturing apparatus having a chucking mechanism for taking out, the suction pad sucks and holds the cull of the resin sealing body, and the resin sealing body is taken out of the mold only by the suction pad. Semiconductor manufacturing equipment. 2. A resin molded product having a structure in which a plurality of resin sealing bodies formed by forming a resin serving as a resin package on a lead frame by gates and culls is clamped to the lead frame by a lead frame clamper. In a semiconductor manufacturing apparatus having a gate break mechanism for performing a gate break process on the gate after fixing by fixing the lead frame, the lead frame clamper is configured to separate the lead frame at the time of a gate break. A semiconductor manufacturing apparatus characterized in that only a position near a gate is clamped. 3. A resin molded product having a structure in which a plurality of resin sealing bodies formed by forming a resin serving as a resin package on a lead frame by gates and culls is clamped to the lead frame by a lead frame clamper. In the semiconductor manufacturing apparatus having a gate break mechanism for performing gate break processing of the gate after being fixed by the above, and separating the gate into individual resin sealing bodies, the lead frame clamper is separated from the resin at the time of gate break. A semiconductor manufacturing apparatus configured to maintain a state. 4. A transport for taking out a resin sealing body in which a resin to be a resin package is formed on a lead frame separated by a gate break mechanism and separated from the gate break mechanism and storing the resin sealed body in a magazine. In a semiconductor manufacturing apparatus having a mechanism, a transfer arm provided on the transfer mechanism is provided with a transfer claw for mounting the resin sealing body, and the lead is placed in a state where the resin sealing body is mounted. A semiconductor manufacturing apparatus, wherein a frame is displaceable on the transport claw. 5. A semiconductor manufacturing apparatus having a cleaning mechanism for removing dust adhering to the mold after forming a resin to be a resin package on a lead frame using a mold, wherein the cleaning mechanism comprises: An air blow-out hole arranged at a central position of a suction port for sucking, a suction duct arranged on both sides of the suction port, and defining the suction port in two suction portions, and from the suction duct A semiconductor manufacturing apparatus, comprising: a shielding plate disposed so that a flow path of the air gradually narrows toward a center portion of the suction port. 6. A semiconductor manufacturing apparatus having a lead frame pre-heater for pre-heating the lead frame before forming a resin to be a resin package on the lead frame using a mold. A semiconductor manufacturing apparatus, wherein a concave portion is formed at a mounting position of the lead frame, and only an outer peripheral position of the lead frame is held by the lead frame preheater. 7. A resin molded product having a structure in which a plurality of resin sealing bodies formed by forming a resin serving as a resin package on a lead frame by gates and culls is clamped to the lead frame by a lead frame clamper. In the semiconductor manufacturing apparatus having a gate break mechanism for performing gate break processing of the gate after being fixed by the above, and separating the gate into individual resin sealing bodies, dust generated by the gate break processing is applied to the gate break mechanism. An apparatus for manufacturing a semiconductor, comprising an air blow mechanism for removing scattering by blowing air. 8. The semiconductor manufacturing apparatus according to claim 7, wherein a dust collecting mechanism for collecting the dust is provided at a position facing the air blow mechanism.