JPH10135258A - Multiple connected wiring board and manufacture of semiconductor device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent molding failure in the molding process of a multiple connected wiring board, by a method wherein the dimension in the width direction of the multiple connected wiring board is formed to be equal to the dimension in one direction of a semiconductor device which is formed by cutting the multiple connected wiring board into chip regions. SOLUTION: A multiple connected wiring board 1 is composed of, e.g. epoxy resin, and so formed that the necessary number of, e.g. five, chip regions 1a which are cut out for wiring boards 3 of semiconductor devices 2 of a ball grid array(BGA) are continuously formed. The length of the multiple connected wiring board 1 is L1 and the width is L2 . The length L1 is constituted of the total dimension of the five chip regions 1a and four waste regions 1b sandwiched by the chip regions 1a. The width L2 constituted of the dimension of a single chip region 1a is equal to the dimension in one direction of the wiring board 3 of the semiconductor device 2. Thereby only cutting in the width direction is performed, in the work for making the respective chips of the multiple connected wiring board 1 wherein the width L2 serves as it is in the semiconductor devices 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multiple wiring board and a method for manufacturing a semiconductor device using the same, and more particularly to a technique effective when applied to individualization of a multiple wiring board.

[0002]

2. Description of the Related Art A semiconductor device, such as a BGA (Ball Grid Array), in which a semiconductor chip is encapsulated in a wiring board composed of an insulating base material and a wiring metallization formed on the base material. In the manufacturing process (1), a multiple wiring board in which individualized regions for mounting the semiconductor chips are continuously formed is used. Then, after the semiconductor chip is sealed with a resin, the multiple wiring substrates are singulated with a cutting tool to assemble individual semiconductor devices.

[0003] Examples of a detailed description of a semiconductor device using a wiring board such as a BGA include:
For example, published by Nikkei BP, “Practical Course VLSI Packaging Technology (2)” (issued May 31, 1993), p. 173
~ P178.

[0004]

Here, if the processing accuracy of the multiple wiring boards varies and the dimensions of the multiple wiring boards are different from each other, the alignment with the mold is performed in the molding operation. Therefore, the position of the positioning hole formed also varies. When such a multiple wiring board is set in a mold, the accuracy of alignment between the two is deteriorated, and the multiple wiring board is not set at an appropriate position, and a gap is generated between the multiple wiring board and the mold. . Then, a part of the sealing resin to be originally filled in the cavity leaks from the gap, and the pressure to be applied to the cavity is dispersed, and air remains in the cavity. When this air is taken into the sealing resin, it becomes a void, and a semiconductor device with poor molding is manufactured.

In the step of separating the multiple wiring boards into individual pieces after molding, the multiple wiring boards are fixed to a jig at the bottom surface, and the entire circumference is formed using a cutting tool into a shape conforming to the final external dimensions. I'm cutting. When the entire circumference is cut with the bottom fixed in this way, the fixing force that had been sufficiently applied at the start of cutting decreases as the separation of individual pieces progresses, and as the cutting is completed, the straightness of the cutting line is secured. There is a problem that becomes difficult. In this case, it is difficult to manufacture a semiconductor device having a defined good shape.

Furthermore, since the entire circumference is cut from the multiple wiring board to cut it into a product shape, the usage rate of the multiple wiring board to the product is extremely low at about 50%. This is one of the factors that hinder reduction in manufacturing costs.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a technique capable of preventing molding defects in a molding process of a multiple wiring substrate.

Another object of the present invention is to provide a technique capable of performing an operation of dividing a multiple wiring board into individual pieces according to product dimensions.

Still another object of the present invention is to provide a technique capable of improving the use efficiency of a multiple wiring board.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0011]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the multiple wiring board according to the present invention comprises:
A semiconductor device formed by continuation of singulated regions constituting a wiring substrate of a semiconductor device, wherein the widthwise dimension of the multiple wiring substrate is obtained by cutting the multiple wiring substrate into individualized regions. Characterized in that it is formed to be equal to the dimension in one direction. In the multiple wiring board, the discarded area formed between the individualized areas and cut and removed at the time of the individualization includes:
A positioning hole for positioning the multiple wiring boards can be formed. In such a multiple wiring board, BGA (Ba
ll Grid Array) or a PGA (Pin Grid Array) type semiconductor device is manufactured.

Further, a method of manufacturing a semiconductor device according to the present invention uses the above-described multiple wiring board, and the multiple wiring board having a semiconductor chip on which an integrated circuit is formed is mounted in a singulated area. A second step of setting a multiple wiring board in a mold and sealing the resin while pressing the same against the gate side of the mold, and a second step of resin sealing. A third step of obtaining a semiconductor device by singulating the wiring board with a cutting tool.
In this method of manufacturing a semiconductor device, in the third step,
It is desirable that the multiple wiring board is cut into pieces in the width direction only by holding the multiple wiring boards on both sides in the width direction avoiding the cut portion. In addition, an end mill or a round blade can be used as a cutting tool.

According to the above-described means, the individualization is completed by cutting in only one direction, and the productivity is improved. Further, since the discarded area is cut out by cutting only one direction of the multiple wiring board, the discarded area, which is an unnecessary part, is reduced, and the use efficiency for the product is improved. Further, a high-quality semiconductor device having no resin leakage to a portion other than the cavity and having no burrs or voids can be obtained. Then, the multiple wiring boards are firmly fixed in the cutting direction, and stable straightness is ensured, so that the individualizing operation can be performed according to the product dimensions.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments, the same members are denoted by the same reference numerals, and the description thereof will not be repeated.

FIG. 1 is a plan view showing a molded multiple wiring substrate according to an embodiment of the present invention, FIG. 2 is a side view of FIG. 1, and FIG. 3 is a multiple wiring substrate molded by a mold. FIG. 4 is an explanatory view showing a multiple wiring board which is singulated by a cutting tool, FIG. 5 is a sectional view taken along the line V-V in FIG. 4, and FIG. 6 is singulated and assembled. 7 is a cross-sectional view taken along the line VII-VII of FIG.

The multiple wiring board 1 according to the present embodiment is made of, for example, epoxy resin, and has a BGA (Ba
ll Grid Array) type semiconductor device 2 wiring board 3
For example, five singulated regions 1a cut out as (FIGS. 6 and 7) are continuously formed. In addition, the singulated area 1a partitioned by the virtual parting line PL
, A waste area 1b that is cut and removed at the time of singulation is formed. However, the number of singulated regions 1a in one multiple wiring substrate 1 is not limited to five, and a required number can be formed continuously.

As shown in FIG. 1, this multiple wiring board 1
Has a length L ₁ and a width L ₂ . Then, the five singulated regions 1a and the four singulated regions 1a
One of the length L ₁ comprising a total size of the waste region 1b, the width L ₂ consisting of dimensions of a single singulation region 1a is unidirectional dimensions of the wiring board 3 of the semiconductor device 2 shown in FIG. 6 Is equal to Thus, in the singulation performing this multiple wiring board 1 having a width L ₂ live directly in the semiconductor device 2,
As indicated by the parting line PL, only cutting in the width direction is performed.

In the discarded area 1b, for example, die bonding or wire bonding is performed at room temperature,
The first positioning holes 4a of a perfect circle into which the positioning pins are inserted without any gaps when processing are performed on each of two locations,
For example, when processing the multiple wiring board 1 under heating such as a molding process, every other second positioning hole 4b of an ellipse which is widened in the width direction so that the positioning pin is inserted with some margin is provided. Each is formed in one place. Therefore, when fixed by the first positioning hole 4a, the multiple wiring board 1 does not completely move, whereas when fixed by the second positioning hole 4b, the multiple wiring board 1 slides in the width direction by the gap between the positioning pin and the ellipse. .

In FIG. 1 and FIG.
In FIG. 3, a semiconductor chip 5 (FIGS. 3 and 7) is sealed with a mold resin 6, and such resin sealing is performed as shown in FIG.

The lower die 7a, which is one of the pair of mold dies 7, is provided with positioning pins 8 corresponding to the second positioning holes 4b of the multiple wiring board 1 to be set.
Therefore, when the multiple wiring board 1 having the semiconductor chip 5 mounted in the singulated area 1a is prepared and set in the mold 7 as shown in FIG. A gap S is generated between the multiple wiring substrate 1 and the gate 9 due to the two positioning holes 4b.

Therefore, as shown in FIG. 3B, the multiple wiring substrate 1 is moved by the positioning slider 10 to the mold 7.
To the gate side of Then, the second positioning hole 4
Since b has a spatial margin due to the ellipse, the multiple wiring board 1 slides in the width direction to eliminate the gap S described above. Further, thereby, the multiple wiring substrate 1 is set at a regular position of the mold 7 (that is, a position where the semiconductor chip 5 is located at the center of the cavity 11).

With the multiple wiring substrate 1 pressed against the gate side as described above, the mold is clamped as shown in FIG. Thereafter, the semiconductor chip 5 is molded by injecting molding resin into the cavity 11 formed at the mating surface of the upper mold 7b and the lower mold 7a.

Here, since the multiple wiring substrate 1 is in close contact with the gate 9 by the positioning slider 10, there is no resin leakage to the portions other than the cavities 11, and good quality resin filling without voids is performed. Further, since the multiple wiring substrate 1 is appropriately set with respect to the mold 7, the accuracy of the resin molding position is improved.

After the completion of the molding, the mold 7 is opened to take out the multiple wiring substrate 1 and a gate break for removing the runner attached to the multiple wiring substrate 1 is performed.

Thereafter, the multiple wiring substrate 1 sealed with resin
Are fixed to the fixing jig 12 and singulated as shown in FIGS.

The fixing jig 12 is provided with a stage 12a on which the multiple wiring board 1 is mounted, and can be moved toward and away from each other along both sides of the stage 12a. And a pair of substrate clampers 12b to be held from both sides. Therefore, the substrate clamper 12
When b moves close to each other, the multiple wiring board 1 on the stage 12a is held by the board clamper 12b.

At one longitudinal end of the stage 12a, there is provided a stopper 13 with which the end of the multiple wiring board 1 abuts. The stopper 13 positions the multiple wiring board 1 at an appropriate position on the stage 12a. Is done. Then, along the parting line PL of the multiple wiring substrate 1 positioned as described above, a blade passage groove 15 through which a round blade (cutting tool) 14 to be described later passes is formed by the substrate clamper 12.
b and the stage 12a.

A rotating shaft 17 rotated at a high speed by a motor 16 is provided so as to be traversable on the stage 12a along one longitudinal direction of the stage 12a. However, the stage 12a and the substrate clamper 12b may move to the rotation shaft 17 side.

A round blade 14 for cutting the multiple wiring board 1 on the stage 12a at the parting line PL is attached to the rotating shaft 17 so as to correspond to each parting line PL. Therefore, as the rotating shaft 17 moves, the round blade 14 is moved into the blade passage groove 1.
5 moves on the parting line PL which is on the same line as 5. Thus, the multiple wiring substrate 1 is divided into five singulated regions 1a and four discarded regions 1b while being mechanically fixed on both sides in the width direction by the substrate clampers 12b. Therefore, since the multiple wiring substrate 1 is firmly fixed in the cutting direction, a stable straight traveling property is secured without the cutting line by the round blade 14 being blurred.

As described above, since the dimension L _{2 in} the width direction of the multiple wiring board 1 is equal to the dimension in one direction of the wiring board 3 of the semiconductor device 2, the dimension L ₂ extends along the parting line PL shown in the drawing. The singulation is completed by cutting in only one direction.

Further, since the waste area 1b is cut out by one-way cutting instead of cutting the entire circumference of the multiple wiring board 1 into a product shape, the area of the waste area 1b is reduced.

After the individual pieces are thus formed, necessary processing such as forming bumps 18 (FIG. 7) on the back surface of the wiring board 3 is performed. Thereby, the semiconductor device 2 shown in FIGS. 6 and 7 is obtained.

On one surface of a wiring substrate 3 of the semiconductor device 2 shown in FIG.
9 are formed. The wiring metallization 19 is formed, for example, by Pb / Sn (lead / Pb / Sn) projecting over the entire surface of the other surface via a conductive contact metal 21 in a through hole 20 formed through the wiring substrate 3.
It is electrically connected to the bump 18 made of tin.
Further, the semiconductor chip 5 resin-sealed with the mold resin 6 is electrically connected to the above-described wiring metallization 19 by a bonding wire 22 made of, for example, Au (gold). Then, the one-way dimension of the wiring board 3 in the semiconductor device 2 has a widthwise dimension L ₂ of the multiple wiring substrate 1 described above.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the embodiment, and various modifications may be made without departing from the gist of the invention. It goes without saying that it is possible.

For example, the semiconductor device 2 to be manufactured is not a BGA as shown in this embodiment, but is a PGA (Pin Gr).
(id array).

In addition to cutting tools other than round blades,
For example, an end mill can be applied.

[0038]

The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows.

(1) According to the technique of the multiple wiring board of the present invention, the dimension in the width direction of the multiple wiring board is made equal to the dimension in one direction of the wiring board of the semiconductor device. In this manner, the singulation is completed by cutting, and the productivity is improved.

(2) Since the discarded area is cut out by cutting only one direction of the multiple wiring board, the discarded area, which is an unnecessary part, is reduced, the use efficiency for the product is improved, and the manufacturing cost is reduced. Can be planned.

(3) Since the resin is sealed while the multiple wiring boards are pressed against the gate, a high-quality semiconductor device free from resin leakage to the cavities and free from burrs and voids can be obtained. Obtainable. Also, since the multiple wiring board is properly set to the mold,
The resin molding position accuracy is improved.

(4) Since the multiple wiring board is cut in the width direction while holding it so as not to be cut, the solid wiring board is firmly fixed in the cutting direction and stable straightness can be secured. Individualization work can be performed according to the product dimensions.

[Brief description of the drawings]

FIG. 1 is a plan view showing a molded multiple wiring substrate according to an embodiment of the present invention.

FIG. 2 is a side view of FIG.

FIGS. 3 (a), (b), and (c) are explanatory views showing successively multiple wiring substrates molded by a molding die.

FIG. 4 is an explanatory view showing a multiple wiring board which is singulated by a cutting tool.

FIG. 5 is a sectional view taken along line VV of FIG. 4;

FIG. 6 is a perspective view showing a semiconductor device that has been singulated and assembled.

FIG. 7 is a sectional view taken along line VII-VII in FIG. 6;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Multiple wiring board 1a Separation area 1b Discard area 2 Semiconductor device 3 Wiring board 4a First positioning hole 4b Second positioning hole 5 Semiconductor chip 6 Mold resin 7 Mold 7a Lower mold 7b Upper mold 8 Positioning pin 9 Gate 10 Positioning slider 11 Cavity 12 Fixing jig 12a Stage 12b Substrate clamper 13 Stopper 14 Round blade (cutting tool) 15 Blade passage groove 16 Motor 17 Rotation axis 18 Bump 19 Wiring metallization 20 Through hole 21 Contact metal 22 Bonding Wire PL Parting line S Clearance

Claims (6)

[Claims] 1. A multiple wiring board formed by continuation of singulated regions constituting a wiring board of a semiconductor device, wherein the multiple wiring board has a dimension in a width direction, the multiple wiring board being A multiple wiring substrate, wherein the multiple wiring substrate is formed so as to have a dimension in one direction, which is cut into individualized regions, of the semiconductor device. 2. The multiple wiring board according to claim 1, wherein
A multiple wiring board, wherein a positioning hole for positioning the multiple wiring board is formed in a disposal area formed between the individualized areas and cut and removed at the time of individualization. 3. The multiple wiring board according to claim 1, wherein the semiconductor device is BGA or PGA. 4. A method for manufacturing a semiconductor device using a multiple wiring substrate according to claim 1, 2 or 3, wherein the semiconductor chip on which an integrated circuit is formed is mounted in the singulated area. A first step of preparing a continuous wiring board; a second step of setting the multiple wiring board in a mold and performing resin sealing while pressing the same against a gate side of the mold; A third step of obtaining the semiconductor device by singulating the stopped multiple wiring substrate with a cutting tool to obtain a semiconductor device. 5. The method of manufacturing a semiconductor device according to claim 4, wherein, in the third step, the multiple wiring substrate is cut in the width direction while being held on both sides in the width direction while avoiding the cut portions. A method of manufacturing a semiconductor device, wherein the multiple wiring substrate is divided into pieces by only the method. 6. The method according to claim 4, wherein the cutting tool is an end mill or a round blade.