JPH08227964A - Lead frame, semiconductor integrated circuit device, semiconductor integrated circuit device manufacture and semiconductor integrated circuit device manufacture device - Google Patents

Abstract

PURPOSE: To realize high mounting while realizing compactness by enlarging a lead pitch interval at a solder land part by providing a lead pattern which extends radially around a die pad arranged in a central part of a conductive disc member. CONSTITUTION: A circular lead frame wherein a lead is extended radially from a die pad at a central part is completed by punching a lead frame element material 9 formed to prepare one IC package to one lead frame by a press. Then, a semiconductor chip 5 is die-bonded to the lead frame 10. After a gold line 7 is wire-bonded, it is formed by molding by using resin 8. Then, resin burr 11 between leads 6 is removed by a process in a press die, a die bar 12 and an outer circumferential ring 13 are pulled down, lead bending processing is performed for the lead 6 by a punch and a die of a circular die set and a semiconductor integrated circuit is completed.

Description

Detailed Description of the Invention

[0001]

[Table of Contents] The present invention will be described in the following order. Field of Industrial Application Conventional Technology (FIGS. 14 and 15) Problem to be Solved by the Invention (FIG. 14) Means for Solving the Problem (FIG. 1) Action (FIG. 1) Embodiment (FIGS. 1 to 13) ) (1) External shape (FIG. 1) (2) Manufacturing process (FIG. 2) (3) Configuration of each part and details in each manufacturing process (FIGS. 2 to 8) (4) Effect of the embodiment (5) Others Example (FIGS. 9 to 13) Effect of the invention

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame and a semiconductor integrated circuit device, and is particularly suitable for application to a semiconductor component having a narrow lead pitch and a component used for the same. Further, the present invention relates to a method for manufacturing a semiconductor integrated circuit device and a device for manufacturing a semiconductor integrated circuit device, and is particularly suitable for application to the case of manufacturing a semiconductor component having a narrow lead pitch.

[0003]

2. Description of the Related Art Conventionally, a package form of a semiconductor component (hereinafter referred to as an IC) has been a SIP (Single In-line Paskage).
Type, DIP (Dual In-line Package) type, QFP (Quad Fl)
at Package) form etc. Among them, the QFP type has leads in four directions and is known to have a narrow lead interval. However, in the case of this QFP type IC package, since the lead pitch is narrow, when mounting the IC on the circuit board, the solder land portions of the adjacent leads are likely to be short-circuited to each other. For this reason, a very advanced technique is required to bond the solder. By the way, in the future, in order to further increase the integration density, it is desired to further narrow the QFP type lead pitch and increase the number of leads.

By the way, in FIGS. 15 (A) and 15 (B),
The lead frame conventionally used is shown below. This lead frame has a pattern in which a single lead frame is cut and then separated into a plurality of packages. A hoop material is used as the material of the lead frame, and a punching process is performed by pressing with a plurality of packages as one unit based on the pilot hole 2 (see FIG. 1).
5 (A)), and thereafter, an IC package is created through a die bonding process, a wire bonding process, and a molding process by resin sealing. Then, after covering the leads, one end of each of the leads is cut off to be independently completed as a single read cell (FIG. 15B).

However, generally, as the lead pitch of the QFP type IC package is narrowed, as shown in FIG.
As a result, the shape of the lead 1 inside becomes complicated and the interval becomes narrower, so that there is an unavoidable problem that the movement of the device during wire bonding becomes complicated.

[0006]

By the way, in the lead frame for the QFP type IC package having such a structure, if the number of the leads 1 is increased, the lead spacing becomes narrower. Therefore, the leads 1 themselves must be thinned. However, there was a problem that the strength could not be taken sufficiently.

Whether the lead frame is manufactured by the etching method or the pressing method, if the plate thickness is too thick with respect to the width of the lead 1, there are problems such as defective processing and bending of the lead 1. It was In order to prevent this, conversely, it is conceivable to reduce the plate thickness, but this leads to a problem that the lead strength of the IC becomes insufficient and the manufacturing of the lead frame by the manufacturing apparatus becomes difficult.

Further, in the pressing method, in the process of using a press die such as a tie cutter cut, a resin burr removal, a lead cut, a lead vent, etc., the punch and die of the die set are thin and easily damaged, and the die or the like must be changed. Further, even if the shape of the lead frame is changed, the mold and the like must be changed, which causes a problem of poor workability.

In the wire bonding process, it is difficult to increase the bonding speed because the length of each gold wire and the connecting position are various. Further, in the case of molding, since the upper and lower molds are strongly tightened so that the resin does not leak, an indentation is formed in the shape of the lead 1 and the mold cannot be shared with other lead frames.

Further, the conveyance of the work before and after the molding requires a magazine capable of accommodating lead frames of various sizes for conveying the lead frame, a pusher for inserting the lead frame in and out of the magazine, and the like. . For this reason, the number of types of devices for transportation has increased, which has been a cause of the operating rate of the devices not increasing.

The present invention has been made in view of the above points, and further has a small lead pitch, a small size and high integration density lead frame and a semiconductor integrated circuit device, and a semiconductor integrated circuit device capable of simplifying the manufacturing process. It is intended to propose a manufacturing method and a semiconductor integrated circuit device manufacturing apparatus having a simple structure.

[0012]

In order to solve such a problem, in the present invention, a die pad is arranged at the center of the conductive disk member, and a lead pattern is provided so as to extend radially around the die pad. To

Further, in the present invention, a die pad is arranged at the center of the conductive disk member, and a semiconductor chip is mounted on a lead frame composed of a lead pattern extending radially around the die pad and resin-sealed. Then, the package molded with the resin is rotated at high speed to remove the resin burr remaining between the leads of the lead frame.

Further, in the present invention, a die pad is arranged in the central portion of the conductive disk member, and a semiconductor chip is mounted on a lead frame composed of a lead pattern radially extending around the die pad and resin-sealed. At the time of pressing, or after that, the same mold is used regardless of the number of leads.

[0015]

[Function] The outer shape of the lead frame is made circular and the leads are spread radially from the die pad in the central portion, so that the lead pitch interval of the solder land portion can be made wider and miniaturized as compared with the case where the leads are arranged in parallel. It is possible to realize highly reliable implementation while realizing.

By rotating the package molded with resin at a high speed, resin burrs remaining between the leads of the lead frame can be removed by centrifugal force.

Further, when a semiconductor chip is mounted on the lead frame for resin encapsulation, or when pressing is performed thereafter, a die corresponding to one having a large number of leads is used, so that the same metal is used regardless of the number of leads. Types can be shared.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

(1) External Shape In FIG. 1A, reference numeral 3 indicates a semiconductor integrated circuit device. This semiconductor integrated circuit device 3 is obtained by molding a semiconductor chip 5 mounted on the center of a disk-shaped lead frame. Here, by providing the reference hole 4 in the lead frame in advance, it is possible to perform marking before the molding process, marking after the molding process, and position detection in the rotation direction at the time of mounting.

Next, the internal structure of the semiconductor integrated circuit device 3 is shown. In FIG. 1B, a semiconductor chip 5 is fixed to the central portion of the lead frame, and an electrode of the semiconductor chip 5 and a lead 6 inside the package are connected by a gold wire 7.
The semiconductor chip 5 at the center is molded with resin 8 and the leads 6 are bent.

(2) Manufacturing Process Next, the manufacturing process of the semiconductor integrated circuit device 3 is shown in FIG. First, a lead frame material 9 is manufactured so that one IC package is manufactured for each lead frame.
Punching with a press from (Fig. 2 (A)) (Fig. 2)
(B)), a circular lead frame in which leads are radially extended from the die pad in the central portion is completed (FIG. 2).
(C)). Next, the semiconductor chip 5 is die bonded to the completed lead frame 10 (FIG. 2D). And after wire-bonding the gold wire 7 (Fig. 2 (E)),
Molding is performed using the resin 8 (FIG. 2 (F)). Then, the resin burr 11 between the leads 6 is removed, the tie bar 12 and the outer peripheral ring 13 are removed by a step using a press die (FIG. 2 (G)), and the leads 6 are formed by punching and die of a circular die set. Is subjected to lead bending processing to complete the semiconductor integrated circuit device 3 (FIG. 2 (H)).

(3) Configuration of each part and details of each manufacturing process As shown in FIG. 2 (B), the lead frame 10 has a circular outer shape, which makes positioning easier than other lead frames. Therefore, the positioning method in each process can be unified.
As a result, the device in the positioning process and the like can have a simple structure, and the equipment can be downsized and the manufacturing process can be simplified.

Further, as shown in FIG. 3, the lead frame 1
0 (FIG. 2B) and the semiconductor integrated circuit device 3 (FIG. 2B).
Since the outer shape of (H) is circular, as long as there is no impact on the semiconductor chip 5, the plate-shaped lower part of the U-shaped carrier rail is formed at a predetermined angle α [°] after molding.
When used in a tilted manner, the lead frame 10 and the semiconductor integrated circuit device 3 can be transported while being rotated along the rail.

Further, as shown in FIG. 4 (A), conventionally, the shape of the bent portion of the lead 6 was flat, whereas the shape of the lead 6 was bent as shown in FIG. 4 (B). By making the portion arcuate, the strength of the lead 6 itself against the upward force can be increased, and the bending die at this time is also of a simple circular shape, and it is not particularly necessary to position the lead 6 in the rotational direction.

Subsequently, as shown in FIG. 5 (A), as the legs of the leads 6 of the lead frame 10 (FIG. 2 (B)) extend radially, the distance between the legs of the leads 6 increases, so If it is difficult to mount the legs of the leg 6 with a narrow gap, it is easier to mount the legs of the lead 6 by further extending the gap between the tips of the legs of the lead 6 extending in the longitudinal direction. On the contrary, if it is not difficult to implement,
As shown in (B), by shortening the legs of the leads 6, the size can be reduced without affecting the semiconductor chip 5 and the wire bonding.

Next, as shown in FIG. 6, when the lead frame 10 is rotated at a high speed by the motor 14, the resin burr 11 between the leads 6 has a shape in which the leads 6 are radially expanded outward. Because of this, the resin burr 11 can be easily removed by centrifugal force. As a result, the step of removing the resin burr 11 with the press die can be eliminated, and the manufacturing process can be simplified.

Further, as shown in FIG. 7, the lead frame 1
Since the outer shape of 0 is circular and the leads 6 are radially arranged, the length and angle of the gold wire 7 at the time of wire bonding (FIG. 2 (E)) can be made equal, and the gold wires adjacent to each other can be made. Problems such as short circuit of 7 and interference of bonding head during wire bonding can be solved. Also, in the operation at the time of wire bonding, by rotating the lead frame 10 to which the semiconductor chip 5 is fixed, the wire bonding can be performed quickly by a simple reciprocating motion of the bonding mechanism of the wire bonder. You can get sex.

Further, as shown in FIG. 8A, if a mold corresponding to a lead frame 10 having a large number of leads 6 is used, a lead frame having a small number of leads 6 as shown in FIG. 8B is used. Can handle. That is, the tie bar 12 (see FIG.
Since (G) is connected in a circular shape, if the package and the lead pattern have the same shape, even if the number of the leads 6 is different, the mold for molding can be shared and the influence of the indentation can be eliminated.

Accordingly, the process using the press die (FIG. 2 (G))
The mold used in the step of molding (FIG. 2 (F)) can be shared regardless of the number of the leads 6 of the lead frame 10. Furthermore, if the tie bar 12 and the outer peripheral ring 13 (FIG. 2 (G)) are made the same,
By pressing the outer peripheral ring 13 at the pressing section 15 by pressing, it is possible to perform molding without the tie bar 12 and also to cope with tie cutting by a laser.

Successively, before and after the molding, the lead frame 10 (FIG. 2 (B)) and the semiconductor integrated circuit device 3 (FIG. 2 (H)) are formed into a circular shape so that they can be conveyed by a cylindrical magazine or the like. Can be transported and convenient for handling.

(4) Effects of the Embodiments According to the above-described structure, the lead frame 10 is formed into a circular shape by radially extending the leads 6 from the semiconductor chip 5 fixed at the center, so that the lead pitch of high integration density can be obtained. A narrow semiconductor integrated circuit device can be obtained and the manufacturing process can be simplified. As a result, it becomes easy to apply to a full-automatic device that supports high-mix low-volume production, and the setup time can be shortened by changing the model of the product.

(5) Other Embodiments In the above embodiments, the lead frame 10 has a circular outer shape and the legs of the leads 6 have the same length, but the present invention is not limited to this. Not limited to this, as shown in FIG. 9, for example, a DIP type lead 6 may be formed so that the end positions of the leads 6 are aligned in a straight line so as to be longer. Further, as shown in FIGS. 10 (A) and 10 (B), in order to increase the area of the solder land portion, the length of the lead leg is set to two types, that is, the long lead 16 and the short lead 17, and they are arranged alternately. May be.

Although the semiconductor chip 5 is arranged at the center of the lead frame 10 in the above embodiment, the present invention is not limited to this, and as shown in FIG. 11, the through hole 18 is formed at the center. May be provided and supplied from there to the power supply V _CC or the ground GND.

In the above embodiment, one semiconductor chip 5 is arranged in the central portion of the lead frame 10, but the present invention is not limited to this, and as shown in FIG. A plurality of semiconductor chips 5 may be provided along the circumference of.

Further, although the semiconductor chip 5 is arranged in the central portion of the lead frame 10 in the above embodiment, the present invention is not limited to this, and as shown in FIG. 13, the central portion of the package of the IC is shown. It is also possible to provide a through hole and fix the IC by using a screw 20 or the like in the through hole, or use the through hole to provide a heat radiation effect.

[0036]

As described above, according to the present invention, the outer shape of the lead frame is circular and the leads are radially spread from the die pad in the central portion, so that the lead pitch can be narrowed, downsizing and high integration density can be achieved. It is possible to realize a lead frame and a semiconductor integrated circuit device that can be realized. Further, it is possible to realize a semiconductor integrated circuit device manufacturing method capable of realizing simplification of the manufacturing process and a semiconductor integrated circuit device manufacturing device having a simple configuration.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a configuration of a semiconductor integrated circuit device according to an embodiment of the present invention.

FIG. 2 is a schematic diagram showing a manufacturing process of a semiconductor integrated circuit device.

FIG. 3 is a schematic diagram showing a method of transporting a lead frame and a semiconductor integrated circuit device.

FIG. 4 is a schematic diagram showing a shape of a bent portion of a lead.

FIG. 5 is a schematic diagram showing the foot configurations of two types of leads.

FIG. 6 is a schematic diagram showing a method for removing resin burr.

FIG. 7 is a schematic diagram showing a positional relationship between a lead and a semiconductor chip.

FIG. 8 is a schematic diagram showing a mold pressing unit.

FIG. 9 is a schematic diagram showing a state in which lead legs are provided in a DIP type.

FIG. 10 is a schematic diagram showing a state in which there are leads of two types of lengths.

FIG. 11 is a schematic diagram showing an IC package having a hole in the center.

FIG. 12 is a schematic diagram showing an IC package provided with a plurality of semiconductor chips.

FIG. 13 is a schematic diagram showing an IC package using a screw or the like in the hole in the central portion.

FIG. 14 shows a conventional QFP type lead pitch with a narrowed I.
It is an approximate line figure showing C.

FIG. 15 is a schematic diagram showing a lead frame manufactured by a conventional pressing method.

[Explanation of symbols]

1, 6 ... Lead, 2 ... Pilot hole, 3 ... Semiconductor integrated circuit device, 4 ... Reference hole, 5 ... Semiconductor chip, 7
...... Gold wire, 8 ...... Resin, 9 ...... Lead frame material, 1
0 ... Lead frame, 11 ... Resin burr, 12 ... Tie bar, 13 ... Outer ring, 14 ... Motor, 15 ...
Oshikiri, 16 ... long lead, 17 ... short lead, 1
8 ... Through hole, 19 ... Die pad, 20 ... Screw.

Claims (12)

[Claims] 1. A lead frame comprising a die pad arranged at the center of a conductive disc member and a lead pattern extending radially around the die pad. 2. The lead frame according to claim 1, wherein the lead pattern includes long leads and short legs that are alternately arranged. 3. The lead frame according to claim 1, wherein the leads of the lead pattern are formed to be longer toward both ends of the lead so that the lead tip positions are aligned in a straight line. 4. The lead frame according to claim 1, wherein a through hole is formed in a central portion of the die pad. 5. A die pad arranged in the center of a conductive disc member, a lead pattern extending radially around the die pad, a semiconductor chip bonded on the die pad, and the lead pattern molded. A semiconductor integrated circuit device, comprising: 6. The semiconductor integrated circuit device according to claim 5, wherein the lead pattern is composed of long-leg leads and short-leg leads arranged alternately. 7. The semiconductor integrated circuit device according to claim 5, wherein the leads of the lead pattern are formed so as to be longer toward both ends of the leads so that the lead tip positions are aligned in a straight line. 8. A semiconductor integrated circuit device according to claim 5, wherein a through hole is formed in a central portion of the package, the through hole penetrating the die pad and extending from the upper surface to the lower surface of the package. 9. The semiconductor integrated circuit device according to claim 5, wherein the lead protruding from the package to the outside of the lead pattern is formed by drawing in an arcuate cross section. 10. A plurality of semiconductor chips are mounted on the die pad. The semiconductor integrated circuit device according to claim 5, wherein: 11. A semiconductor chip is mounted on a lead frame composed of a die pad arranged in the central portion of a conductive disc member and a lead pattern extending radially around the die pad, and the resin is sealed with the resin. A method of manufacturing a semiconductor integrated circuit device, comprising the step of removing a resin burr remaining between the leads of the lead frame by rotating the package consisting of 4 at a high speed. 12. A semiconductor chip is mounted on a lead frame composed of a die pad arranged in the central portion of a conductive disc member and a lead pattern extending radially around the die pad, and the semiconductor chip is resin-sealed or thereafter pressed. In this case, the semiconductor integrated circuit device manufacturing apparatus is characterized in that the same mold is shared regardless of the number of leads.