JP2940752B2 - Semiconductor resin sealing device - Google Patents
Semiconductor resin sealing deviceInfo
- Publication number
- JP2940752B2 JP2940752B2 JP4348107A JP34810792A JP2940752B2 JP 2940752 B2 JP2940752 B2 JP 2940752B2 JP 4348107 A JP4348107 A JP 4348107A JP 34810792 A JP34810792 A JP 34810792A JP 2940752 B2 JP2940752 B2 JP 2940752B2
- Authority
- JP
- Japan
- Prior art keywords
- molding
- mold
- molded product
- resin
- sealing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/7207—Heating or cooling of the moulded articles
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、エポキシ樹脂による半
導体樹脂封止装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor resin sealing device using an epoxy resin.
【０００２】[0002]
【従来の技術】図２は従来の半導体樹脂封止装置を示す
斜視図である。図２において、半導体装置の樹脂封止に
おける成形工程では、成形下金型６ａの規定位置にセッ
トされたリードフレーム１２に対し、ポット１０に投入
されたエポキシ樹脂がランナー部１１を通って成形部９
に圧入されて、成形製品８が完成する。通常成形時に
は、成形下金型６ａ、成形上金型６ｂは対象成形製品８
の大きさに応じた圧力で、締め付けられている。また、
成形下金型６ａ、成形上金型６ｂは約１７５℃に加熱さ
れており、成形時間は、３０〜９０秒が一般的である。
最後に、成形された製品は、カル７が成形製品８につな
がった状態で成形下金型６ａより取り出され、カル７が
成形製品８より取り外される。2. Description of the Related Art FIG. 2 is a perspective view showing a conventional semiconductor resin sealing device. In FIG. 2, in a molding process in resin sealing of a semiconductor device, an epoxy resin put into a pot 10 passes through a runner portion 11 to a lead frame 12 set at a prescribed position of a lower molding die 6a. 9
And the molded product 8 is completed. During normal molding, the lower molding die 6a and the upper molding die 6b are
It is tightened with the pressure according to the size of. Also,
The lower mold 6a and the upper mold 6b are heated to about 175 ° C., and the molding time is generally 30 to 90 seconds.
Finally, the molded product is taken out from the lower molding die 6a with the cull 7 connected to the molded product 8, and the cull 7 is removed from the molded product 8.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、近年、
半導体製品寸法の薄型化により、エポキシ樹脂部の成形
厚みは薄くなってきている。However, in recent years,
Due to the thinning of semiconductor product dimensions, the molding thickness of the epoxy resin portion has been reduced.
【０００４】図３は成形製品８の側面図である。図３に
おいて、寸法ｔは寸法Ａに対し、小さくなっている。寸
法Ａ：寸法ｔが約１０：１以下になると、成形部はエポ
キシ樹脂部１３とリードフレーム１４の熱膨張率の差に
より、図４のように、反りが生じてくる。反り発生は、
後工程に悪影響を与える。FIG. 3 is a side view of the molded product 8. In FIG. 3, the dimension t is smaller than the dimension A. When the dimension A: dimension t becomes about 10: 1 or less, the molded portion is warped as shown in FIG. 4 due to the difference in the coefficient of thermal expansion between the epoxy resin portion 13 and the lead frame 14. Warpage occurs
It adversely affects the post-process.
【０００５】成形材料のエポキシ樹脂は熱により時間と
共に硬化する特性があるが、通常の成形においては、生
産性を上げるため、成形時間は３０〜９０秒としてい
る。そのため、成形直後の成形製品８は完全に硬化しき
っていない。反りを防止するためには、成形下金型６
ａ、成形上金型６ｂを締め付けた状態で、エポキシ樹脂
が完全に硬化するまで放置しておけば良いが、生産性が
非常に悪くなる。[0005] The epoxy resin as a molding material has the property of being cured with time by heat, but in ordinary molding, the molding time is set to 30 to 90 seconds in order to increase productivity. Therefore, the molded product 8 immediately after molding is not completely cured. In order to prevent warpage, the lower mold 6
a) It is sufficient to leave the epoxy resin completely cured in a state in which the mold 6b is tightened during the molding, but productivity is extremely deteriorated.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するため
に、本発明の半導体樹脂封止装置は、樹脂成形後に金型
より取り出した半導体装置を徐冷する徐冷部を設けてい
る。In order to solve the above-mentioned problems, the semiconductor resin sealing device of the present invention is provided with a gradual cooling section for gradually cooling a semiconductor device taken out of a mold after resin molding.
【０００７】[0007]
【作用】上記構成において、徐冷部を設けることによ
り、半導体装置は急冷されずに徐冷されるため、成形後
の反りは防止され、不良品の発生が防止される。In the above construction, by providing the slow cooling portion, the semiconductor device is gradually cooled without being rapidly cooled, so that the warpage after molding is prevented, and the occurrence of defective products is prevented.
【０００８】[0008]
【実施例】図１は本発明の一実施例における半導体樹脂
封止装置の斜視図である。FIG. 1 is a perspective view of a semiconductor resin sealing device according to an embodiment of the present invention.
【０００９】図１において、従来例と同様に成形下金型
２ａ、成形上金型２ｂにより樹脂封止された成形製品３
は成形後、成形下金型２ａ、成形上金型２ｂより取り出
されると同時に徐冷金型１により上下からプレスされ
る。徐冷金型１には成形製品３の上下面だけを押さえ、
カル５を押さえないために、凹凸が設けられている。In FIG. 1, a molded product 3 resin-sealed by a lower molding die 2a and an upper molding die 2b as in the conventional example.
After being molded, is taken out from the lower molding die 2a and the upper molding die 2b and simultaneously pressed by the slow cooling die 1 from above and below. In the annealing mold 1, only the upper and lower surfaces of the molded product 3 are held.
Irregularities are provided in order not to hold the cull 5.
【００１０】また、ヒーター４により、徐冷金型１は１
００〜１８０℃に加熱され、徐冷金型１に接触すること
で成形製品３は、急冷されないようになっている。[0010] The heater 4 allows the slow cooling mold 1 to
The molded product 3 is heated to 00 to 180 ° C. and brought into contact with the slow cooling mold 1 so as not to be rapidly cooled.
【００１１】徐冷金型１の締め付け力は、成形製品３の
形状により、適宜合わせられ、０．２〜０．５kg／cm2
であり、これにより反り防止に効果が現れる。The tightening force of the annealing mold 1 is appropriately adjusted according to the shape of the molded product 3 and is 0.2 to 0.5 kg / cm 2.
This has the effect of preventing warpage.
【００１２】[0012]
【発明の効果】本発明の半導体樹脂封止装置によれば、
樹脂封止された半導体装置は徐冷部で徐冷され、成形時
間を長くすることなく、反りが防止される。According to the semiconductor resin sealing device of the present invention,
The semiconductor device sealed with the resin is gradually cooled in the slow cooling section, and the warpage is prevented without increasing the molding time.
【図１】本発明の一実施例における半導体樹脂封止装置
の斜視図FIG. 1 is a perspective view of a semiconductor resin sealing device according to an embodiment of the present invention.
【図２】従来の半導体樹脂封止装置の斜視図FIG. 2 is a perspective view of a conventional semiconductor resin sealing device.
【図３】従来の半導体装置の側面図FIG. 3 is a side view of a conventional semiconductor device.
【図４】従来の半導体装置の側面図FIG. 4 is a side view of a conventional semiconductor device.
１ 徐冷金型 ２ａ，６ａ 成形下金型 ２ｂ，６ｂ 成形上金型 ３，８ 成形製品 ４ ヒーター ５，７ カル ９ 成形部 １０ ポット １１ ランナー部 １２，１４ リードフレーム １３ エポキシ樹脂部 DESCRIPTION OF SYMBOLS 1 Slow cooling mold 2a, 6a Mold lower mold 2b, 6b Mold upper mold 3,8 Molded product 4 Heater 5,7 Cal 9 Molding part 10 Pot 11 Runner part 12,14 Lead frame 13 Epoxy resin part
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 21/56 B29C 45/02 B29C 45/72 B29C 71/02 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 6 , DB name) H01L 21/56 B29C 45/02 B29C 45/72 B29C 71/02
Claims (1)
成形金型と、前記成形金型により樹脂封止された成形製
品に対して、前記成形金型より取り出されると同時に前
記成形製品を徐冷する徐冷金型とよりなる半導体樹脂封
止装置であって、前記徐冷金型は前記成形金型の成形温
度に対して、その成形温度以下であって、前記成形製品
の樹脂部が急激な温度降下を引き起こさない温度で設定
され、前記成形製品の上下面だけを押さえ、成形製品の
カル部を押さえないように、前記成形製品の上下面を押
さえる凹凸部を有していることを特徴とする半導体樹脂
封止装置。1. A method for molding a resin comprising an upper mold and a lower mold.
A molding die, and a molded product sealed with resin by the molding die.
The product is removed from the molding die and
A semiconductor resin seal consisting of an annealing mold that gradually cools the molded product
Stopping device, wherein the slow cooling mold has a molding temperature of the molding mold.
Degree, below the molding temperature, the molded product
Set at a temperature where the resin part does not cause a sudden temperature drop
And hold down only the upper and lower surfaces of the molded product,
Press the upper and lower surfaces of the molded product so as not to
A semiconductor resin encapsulating device having a concave and convex portion for holding .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4348107A JP2940752B2 (en) | 1992-12-28 | 1992-12-28 | Semiconductor resin sealing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4348107A JP2940752B2 (en) | 1992-12-28 | 1992-12-28 | Semiconductor resin sealing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06204273A JPH06204273A (en) | 1994-07-22 |
| JP2940752B2 true JP2940752B2 (en) | 1999-08-25 |
Family
ID=18394790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4348107A Expired - Fee Related JP2940752B2 (en) | 1992-12-28 | 1992-12-28 | Semiconductor resin sealing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2940752B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19653778A1 (en) * | 1996-12-21 | 1998-06-25 | Richard Herbst | Method and device for removing plastic products from a plastic injection molding machine |
| JP7035243B1 (en) * | 2021-03-10 | 2022-03-14 | Ｔｏｗａ株式会社 | Resin molding equipment and manufacturing method of resin molded products |
-
1992
- 1992-12-28 JP JP4348107A patent/JP2940752B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06204273A (en) | 1994-07-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7604469B2 (en) | Degating device | |
| US5254501A (en) | Same-side gated process for encapsulating semiconductor devices | |
| JP2940752B2 (en) | Semiconductor resin sealing device | |
| JP4052939B2 (en) | Resin sealing molding method and apparatus for electronic parts | |
| JPH10326800A (en) | Manufacture of semiconductor device and mold for semiconductor manufacturing device | |
| JPH04249348A (en) | Resin sealed semiconductor device and manufacture thereof | |
| JP3116913B2 (en) | Semiconductor chip resin sealing mold and semiconductor chip resin sealing method using the same | |
| JP2626971B2 (en) | Resin encapsulation molding method and mold for electronic parts | |
| TWI778303B (en) | Method for reducing warpage occurred to substrate strip after molding process | |
| JP3099707B2 (en) | Resin sealing device for semiconductor device | |
| JP3061121B2 (en) | Semiconductor device and manufacturing method thereof | |
| JPH10270606A (en) | Structure of packaged semiconductor device | |
| JPH05226397A (en) | Thermal cure type automatic molding device for semiconductor | |
| JPH0745765A (en) | Resin sealing method for semiconductor device | |
| JP2709035B2 (en) | Semiconductor package manufacturing method | |
| JP2857075B2 (en) | Semiconductor package manufacturing method, and film and mold used therefor | |
| JPS62130531A (en) | Resin molding method for semiconductor device | |
| JPS6154633A (en) | Metal mold for semiconductor resin sealing | |
| JPS60138949A (en) | Lead frame for semiconductor device | |
| JPH0590314A (en) | Resin molding method of semiconductor | |
| JP2984082B2 (en) | Resin sealing method | |
| KR0139128Y1 (en) | Moulding apparatus of molding press for semiconductor package | |
| JP3126744B2 (en) | Gate seal injection molding apparatus and injection molding method using the same | |
| JPH1190969A (en) | Method and device for molding and manufacture of semiconductor device | |
| JP2835136B2 (en) | Molding mold for resin sealing of semiconductor devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |