JP2733179B2 - Hybrid integrated circuit manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a hybrid integrated circuit.

[0002]

2. Description of the Related Art FIG . 5 is an assembly process diagram showing an assembly process of a hybrid integrated circuit. In FIG . 5 , 1 is a heat sink made of metal, 2 is a power transistor fused to the heat sink 1, and 3 is a U-shaped. The resin film 4 is a thick film substrate with a lead frame (hereinafter, referred to as a substrate).

[0005] Reference numeral 5 denotes a power transistor 2 and a substrate 4.
6, a tie-bar portion of the lead frame is cut, and a hybrid integrated circuit electrically inspected. 7 is a mold made of resin for protecting the hybrid integrated circuit 6. A frame 8 is a completed product in which the hybrid integrated circuit 6 and the mold frame 7 are bonded together.

FIG. 6 is a schematic diagram showing a conventional apparatus for manufacturing the hybrid integrated circuit, in which reference numeral 11a denotes a resin coating machine for coating the heat sink 1 with a resin film 3a, and 12 denotes a resin coating machine.
A substrate laminating machine for laminating the heat sink 1 coated with a to the thick film substrate 4 and a furnace 13a for curing the resin film 3a on which the thick film substrate 4 is laminated at a high temperature.

[0005] Reference numeral 14 denotes an electrical connection between the power transistor 2 and the substrate 4 via a thin metal wire 5, and a composite integrated circuit 6.
Bond (W / B) / lead cut /
Inspection machine, 11b, mold frame 7 and hybrid integrated circuit 6
A resin coating machine for applying a resin film 3b for bonding
Reference numeral 15 denotes a frame bonding machine for bonding the mold frame 7 and the hybrid integrated circuit 6, and 13b denotes a furnace for hardening the resin film 3b at a high temperature.

Next, a method of manufacturing a hybrid integrated circuit device will be described. First, the heat sink 1 is applied by the resin coating machine 11a.
A resin film 3a is applied to the substrate 4 and then the substrate 4 prepared in advance and the heat sink 1 are bonded by a substrate bonding machine 12, and the resin film 3a is cured in a furnace 13a.

Next, in the wire bond / lead cut / inspection machine 14, each operation of wire bond, lead cut and inspection is performed by setting the hybrid integrated circuit 6 in the supply section. In the frame attachment, a resin film 3b is applied to the inspected hybrid integrated circuit 6 by a resin application machine 11b. next,
The hybrid integrated circuit 6 and the mold frame 7 are attached by the frame attaching machine 15, and finally, the resin film 3b is cured in the furnace 13b.

[0008]

THE INVENTION Problems to be Solved by a conventional hybrid integrated circuit made
Since the manufacturing apparatus is configured as described above, the apparatus is independently configured for each process, and when one process (operation) is completed, it is necessary for management to collectively move to the next process. In addition, there is a problem that it takes a long time to manufacture.

Particularly, in the step of curing the adhesive, it takes about one hour to thermally cure the resin films 3a and 3b as the adhesive, so that it is inevitably a batch process, which hinders the in-line operation. There was a problem.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is possible to easily and clarify the management of a manufacturing history, to manufacture a hybrid integrated circuit by an integrated system, and to reduce the manufacturing time. It is an object of the present invention to obtain a hybrid integrated circuit manufacturing apparatus capable of reducing the time.

Another object of the present invention is to provide a hybrid integrated circuit capable of further shortening the manufacturing period by passing the process to the next step without waiting for the complete curing of the resin film as an adhesive. .

[0012]

According to a first aspect of the present invention, there is provided a hybrid integrated circuit manufacturing apparatus comprising a work integrating means, a work test means, and a work frame connecting means, and a first carrier provided in each of them. Each work is transferred at a unique speed or timing along the rail, the second transfer rail, and the third transfer rail, and during the transfer, the work integration, the work test, and the work frame connection operation are performed. The work is a continuous work assembling work, and each work is continuously transferred to the next process.

In a hybrid integrated circuit device according to a second aspect of the present invention, the resin film for attaching the thick film substrate or the mold frame to the heat sink is transferred to the next step in a semi-cured state.

[0014]

According to the first aspect of the present invention, there is provided a hybrid integrated circuit manufacturing apparatus, comprising: a work integrating means which independently performs a predetermined function;
By associating the work test means and the work frame coupling means via the connection unit and continuously assembling the work via these means, a consistent assembly line without interrupting the process and quality assurance can be obtained. Uniformity and easy management of manufacturing history.

The hybrid integrated circuit manufacturing apparatus according to the second aspect of the present invention operates so that the resin film joining the heat sink, the thick film substrate, and the mold frame is transferred to the next step with the heating means in a semi-cured state. .

[0016]

[Embodiment 1] An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 21 is a magazine for supplying the heat sink 1 shown in FIG. 5, 22 is a magazine for supplying the thick film substrate 4 with a frame, and 23 is for handling the heat sink 1 and the thick film substrate 4. Robot.

Reference numeral 24 denotes a heat sink 1 and a thick film substrate 4 which are handled and processed by the robot 23.
2, a pallet for setting and transporting the pallet 25, a first transport rail 25 for transporting the pallet 24 counterclockwise, a first resin coating machine 26, and a thick film substrate 4 Is a substrate sticking machine for sticking the heat sink 1 to the heat sink 1 while handling the work stuck by the board sticking machine 27.

Further, 29 is a hot plate as a first heating means for curing the resin film 3a, 30 is a work on which the heat sink 1 and the thick film substrate 4 are adhered, and 31 is a first plate for transferring to the next step. And the robot 23 to the first connection unit 31 constitute a work integration means (A). 32 is a robot for handling the work 30, 33 is a pallet for placing and conveying the work 30 as shown in FIG. 3, and 34 is a second conveyance rail for conveying the pallet 33 counterclockwise. It is.

Reference numeral 35 denotes the power transistor 2 and the thick film substrate 4
Is a wire bonder for connecting with a thin metal wire, 36 is a lead cutter for cutting the tie bar portion of the lead,
37 is a test head for inspecting the characteristics of the work connected by the thin metal wire, 38 is the inspected work, 39 is a robot for handling the work 38, and 40 is a second for transporting to the next step. Connection unit of
The robot 32 to the second connection unit 40 constitute a work test means (B).

Further, 41 is a magazine for supplying the mold frame 7, 42 is a robot for handling the work 38 and the mold frame 7, and 43 is a work on which the work 38 and the mold frame 7 are placed as shown in FIG. A pallet for conveyance, 44 is a third conveyance rail for conveying the pallet 43 counterclockwise, and 45 is a second resin application machine for applying the resin film 3b to the heat sink 1.

Reference numeral 46 denotes a transfer machine for transferring the mold frame 7 to the work 38 coated with the resin film 3b; 47, a work on which the work 38 and the mold frame 7 are adhered; Is a robot, 49 is a hot plate as a second heating means for curing the resin film 3b, 50 is a conveyor for conveying the cured work 47 to the next step, and the magazine 41
The conveyor 50 constitutes a work frame connecting means (C).

Next, the operation will be described. First, the magazines 21 and 22 containing a plurality of pallets (not shown) on which the heat sink 1 and the thick film substrate 4 are set are set in the work supply unit, and the power for starting the operation of the apparatus is turned on. Then, the pallet is pushed out to a predetermined position, each work is clamped by the chuck claw set on the robot 23, and each work is set on the pallet 24.

Next, such a pallet is conveyed counterclockwise, and the resin 3a is transferred to the first resin coating machine 2 at a predetermined position.
6, the thick film substrate 4 is applied to the next position.
Is clamped by the substrate sticking machine 27, and is placed and attached on the heat sink 1 on which the resin film 3a is applied. Lastly, the robot 28 handles the integrated product on the hot platen 29 and sets it for a predetermined time or more to cure the resin film 3a, and then transports the resin film 3a to the next device via the connection unit 31.

The conveyed workpiece 30 is handled by the robot 32, set on the pallet 33, and conveyed to a predetermined position via the second conveying rail 34. Next, predetermined operations such as thin wire bonding, lead cutting, and testing are performed by the wire bonder 35, the lead cutter 36, and the test head 37. Finally, the work 38 is transported by the robot 39 via the connection unit 40.

On the other hand, a magazine 41 containing a plurality of pallets (not shown) on which the mold frame 7 is set is set in the work supply unit, and the pallets are extruded to a predetermined position. The robot 42 handles the workpiece 38 and the mold frame 7, sets them on the pallet 43, and transports them to a predetermined position via the third transport rail 44.

Next, the resin film 3b is applied to the second resin coater 45.
Then, the mold frame 7 is clamped by the transfer machine 46 at the next position, further placed on the heat sink 1 and adhered, and finally handled by the robot 48 on the hot platen 49. Then, the resin film 3b is hardened by placing it for a predetermined time or more, and is conveyed to the next process by the robot 48 via the conveyor 50.

Embodiment 2 FIG. In the above embodiment, in the work integration means (A) and the work frame coupling means (C), the resin films are respectively heated and cured by the hot plates 29, 49, but there is no problem in assembling in the subsequent steps. By transferring the work to the next process in the semi-hardened state, the hardening process time can be further shortened and a consistent assembly line can be formed.

[0028]

As described above, according to the first aspect of the present invention, there are provided a work integrating means, a work test means, and a work frame connecting means. Each work is conveyed at a unique speed or timing along the conveyance rail and the third conveyance rail, and during this conveyance, the work integration, the work test and the work frame connection operation are continuously performed, and each work is conveyed. Since the structure is passed to the next process, the management of the manufacturing history can be performed easily and clearly, and the integrated integrated circuit can be manufactured by an integrated system and the manufacturing period can be shortened.

According to the second aspect of the present invention, since the resin film for attaching the thick film substrate or the mold frame to the heat sink is transferred to the next step in a semi-cured state, the manufacturing period can be further shortened throughout the entire line. This has the effect of achieving what can be achieved.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a hybrid integrated circuit manufacturing apparatus according to the present invention.

FIG. 2 is a perspective view showing a work conveyed by a work integrating means in FIG. 1;

FIG. 3 is a perspective view showing a work conveyed by a work test means in FIG. 1;

FIG. 4 is a perspective view showing a work conveyed by a work frame connecting unit in FIG. 1;

FIG. 5 is an assembly process diagram showing an assembly process of the hybrid integrated circuit .

FIG. 6 is a schematic configuration diagram showing a conventional hybrid integrated circuit manufacturing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat sink 3a, 3b Resin film 4 Thick film substrate 7 Mold frame 24 Pallet 25 First transfer rail 26 First resin coating machine 27 Substrate sticking machine 29 Heating board (first heating means) 30 Work 31 First connection Unit 33 Pallet 34 Second transfer rail 35 Wire bonder 36 Lead cutter 37 Test head 38 Work 40 Second connection unit 43 Pallet 44 Third transfer rail 45 Second resin coating machine 46 Transfer machine 47 Work 49 Hot platen ( Second heating means) 50 Conveyor A Work integrating means B Work testing means C Work frame connecting means

Claims (2)

(57) [Claims] A first transfer rail for transferring each pallet on which a heat sink and a thick film substrate are set; a first resin coating machine for coating a resin film on the heat sink in the middle of the first transfer rail; A substrate attaching machine for attaching the thick film substrate to the heat sink to which the film is applied, a first heating means for curing the resin film, and a first connection for sending a work integrated by the resin film to a next step A work integration means comprising a unit, a second transfer rail for transferring a pallet on which the work sent through the first connection unit is set, and a second transfer rail provided in the middle of the second transfer rail for transferring the work. Wire bonder for bonding thin metal wires, lead cutter for lead cutting, test head for testing the circuit of the work, bonding and lead cutter A work test means comprising a second connection unit for sending a work on which a work and a circuit test have been performed to the next step; and a third work means for conveying a pallet on which the work sent via the second connection unit is set. A transfer rail, a second resin coating machine provided in the middle of the third transfer rail to apply a resin film to a heat sink of the work, and moving and attaching a mold frame to the heat sink to which the resin film is applied. A hybrid integrated circuit manufacturing apparatus, comprising: a transfer machine; a second heating means for curing the resin film; and a work frame connecting means comprising a conveyor for sending a work integrated by the resin film to a next step. 2. A first transfer rail for transferring each pallet on which a heat sink and a thick film substrate are set, a first resin coating machine for applying a resin film to the heat sink in the middle of the first transfer rail, and the resin A substrate attaching machine for attaching the thick film substrate to the heat sink to which the film is applied, a first heating means for curing the resin film, and a work integrated by the resin film, in a semi-cured state of the resin film. A work integration means comprising a first connection unit for sending the work to the next step, and a second transfer rail for transferring a pallet on which the work sent via the first connection unit is set;
A wire bonder, which is provided in the middle of the second transfer rail, for bonding a thin metal wire of the work, a lead cutter for performing a lead cut, a test head for performing a circuit test of the work, and the bonding, the lead cut, and the circuit test. The second to send the performed work to the next process
Work test means comprising a connection unit of
A third transfer rail for transferring a pallet on which a work set via the connection unit is set, and a second resin which is provided in the middle of the third transfer rail and applies a resin film to a heat sink of the work. An application machine, a transfer machine for moving and attaching a mold frame to a heat sink coated with the resin film, a second heating means for curing the resin film, and a work integrated by the resin film; And a work frame connecting means comprising a conveyor for sending to a next process in a semi-cured state.