JPH06188276A - Hybrid integrated circuit manufacturing apparatus - Google Patents

Abstract

PURPOSE:To facilitate a control of a manufacturing hysteresis and reduce a manufacturing period and obtain a uniform quality. CONSTITUTION:A hybrid integrated circuit, manufacturing apparatus comprises work integration means A. work test means b and work frame connecting means C, and each work is carried along a first carrying rail 25, a second carrying rail 34 and a third carrying rail 44 respectively installed in these means at an individual speed or timing, and during this carriage, work operations of a work integration, a work test and a work frame connection are performed, a continuous work assembly as a whole is performed and each work can be continuously transferred to the next process.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit manufacturing apparatus.

[0002]

2. Description of the Related Art FIG. 5 is an assembly process diagram showing a conventional assembly process of a hybrid integrated circuit. In the figure, 1 is a heat sink made of metal, 2 is a power transistor fused to the heat sink 1, and 3 is U. The V-shaped resin films 4 are thick film substrates with lead frames (hereinafter referred to as substrates).

Reference numeral 5 is a power transistor 2 and a substrate 4.
A thin metal wire for electrically connecting to each other, 6 a tie bar portion of the lead frame is cut, and an electrically inspected hybrid integrated circuit, and 7 a resin mold for protecting the hybrid integrated circuit 6. A frame 8 is a completed product in which the hybrid integrated circuit 6 and the mold frame 7 are bonded together.

FIG. 6 is a schematic block diagram showing a manufacturing apparatus for the above hybrid integrated circuit. 11a is a heat sink 1 and a resin film 3 is provided.
a is a resin applicator for applying a, 12 is a substrate attaching machine for attaching the heat sink 1 coated with the resin film 3a and the thick film substrate 4, 13a is a resin film 3a for attaching the thick film substrate 4 It is a furnace for curing at high temperature.

Reference numeral 14 electrically connects the power transistor 2 and the substrate 4 with a thin metal wire 5, and a hybrid integrated circuit 6 is provided.
Wire bond (W / B), lead cut,
Inspector 11b includes mold frame 7 and hybrid integrated circuit 6
A resin applicator for applying a resin film 3b for bonding
Reference numeral 15 is a frame attaching machine for attaching the mold frame 7 and the hybrid integrated circuit 6, and 13b is a furnace for curing the resin film 3b at a high temperature.

Next, a method of manufacturing the hybrid integrated circuit device will be described. First, heat sink 1 with resin coating machine 11a
Then, the resin film 3a is applied to, the substrate 4 and the heat sink 1 prepared in advance are bonded together by the substrate bonding machine 12, and the resin film 3a is cured in the furnace 13a.

Next, in the wire bond / lead cut / inspection machine 14, the hybrid integrated circuit 6 is set in the supply portion to perform wire bond, lead cut and inspection operations. In the frame application, the resin film 3b is applied to the inspected hybrid integrated circuit 6 by the resin applicator 11b. next,
The frame attaching machine 15 attaches the hybrid integrated circuit 6 and the mold frame 7, and finally the resin film 3b is cured in the furnace 13b.

[0008]

Since the conventional hybrid integrated circuit device is constructed as described above, the device is constructed independently for each process, and when one process (work) is completed, It is necessary to manage and transfer it to the process,
In addition, there is a problem that it takes a long time to manufacture.

In particular, in the step of curing the adhesive, it takes about one hour to thermally cure the resin films 3a and 3b as the adhesive, so that batch processing is unavoidable, which hinders in-line processing. There was a problem.

The invention of claim 1 has been made in order to solve the above-mentioned problems. The manufacturing history can be controlled easily and clearly, and the hybrid integrated circuit can be manufactured by an integrated system, and the manufacturing period can be improved. It is an object of the present invention to obtain a hybrid integrated circuit manufacturing apparatus capable of shortening the time.

It is an object of the present invention to obtain a hybrid integrated circuit which can further shorten the manufacturing period by passing the resin film as an adhesive to the next step without waiting for the resin film to completely cure. .

[0012]

A hybrid integrated circuit manufacturing apparatus according to a first aspect of the present invention includes a work integrating means, a work testing means, and a work frame connecting means, and a first transfer provided in each of them. Each work is transported along the rail, the second transport rail, and the third transport rail at a unique speed or timing, and while performing the work integration, work test, and work frame joining operations, the whole work is carried out. As a continuous work assembling work, each work is continuously passed to the next process.

In the hybrid integrated circuit device according to the second aspect of the present invention, the resin film for attaching the thick film substrate or the mold frame to the heat sink is passed to the next step in a semi-cured state.

[0014]

The hybrid integrated circuit manufacturing apparatus according to the first aspect of the present invention independently comprises work integrating means for performing predetermined functions,
By associating the work test means and the work frame connecting means through the connection unit and assembling the work continuously through each of these means, a consistent assembly line can be obtained without interrupting the process, and quality can be improved. Uniformity and easy management of manufacturing history.

The hybrid integrated circuit manufacturing apparatus according to the second aspect of the present invention operates so that the resin film for joining the heat sink to the thick film substrate and the mold frame is left in a semi-cured state in the heating means and passed to the next step. .

[0016]

EXAMPLES Example 1. An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 21 is a magazine for supplying the heat sink 1 shown in FIG. 5, 22 is a magazine for supplying the thick film substrate 4 with a frame, and 23 is for handling the heat sink 1 and the thick film substrate 4. Is a robot.

Reference numeral 24 denotes a heat sink 1 and a thick film substrate 4 which are handled by the robot 23 and are works.
2, a pallet for transporting the pallet 24, a first transport rail 25 for transporting the pallet 24 counterclockwise, a first resin coating machine 26, and a thick film substrate 4 27. Is a substrate sticking machine for sticking the heat sink 1 to the heat sink 1, and 28 is a robot for handling the work stuck by the board sticking machine 27.

Further, 29 is a heating plate as a first heating means for hardening the resin film 3a, 30 is a work to which the heat sink 1 and the thick film substrate 4 are attached, and 31 is a first plate for carrying to the next step. The robot 23 to the first connection unit 31, which are one connection unit, constitute a work integration means (A). 32 is a robot for handling the work 30, 33 is a pallet for placing and carrying the work 30 as shown in FIG. 3, 34 is a second carrying rail for carrying the pallet 33 counterclockwise. Is.

Reference numeral 35 is a power transistor 2 and a thick film substrate 4.
A wire bonder for connecting and with a thin metal wire, 36 is a lead cutter for cutting the tie bar portion of the lead,
37 is a test head for inspecting the characteristics of a work connected by a fine metal wire, 38 is an inspected work, 39 is a robot for handling the work 38, and 40 is a second for transporting to the next process. Is a connection unit of
The robot 32 to the second connection unit 40 constitute work test means (B).

Further, 41 is a magazine for supplying the mold frame 7, 42 is a robot for handling the work 38 and the mold frame 7, 43 is the work 38 and the mold frame 7 placed as shown in FIG. A pallet for transporting, 44 is a third transporting rail for transporting the pallet 43 counterclockwise, and 45 is a second resin coating machine for coating the resin film 3b on the heat sink 1.

Reference numeral 46 is a transfer machine for transferring the mold frame 7 onto the work 38 coated with the resin film 3b, 47 is a work to which the work 38 and the mold frame 7 are attached, and 48 is for handling the work 47. Robot, 49 is a heating plate as a second heating means for curing the resin film 3b, 50 is a conveyor for conveying the cured work 47 to the next step, and the magazine 41
~ The conveyor 50 constitutes a work frame connecting means (C).

Next, the operation will be described. First, magazines 21 and 22 containing a plurality of pallets (not shown) having the heat sink 1 and the thick film substrate 4 set therein are set in the work supply unit, and the power supply for starting the operation of the apparatus is turned on. Then, the pallet is pushed to a predetermined position, each work is clamped by the chuck claws set on the robot 23, and set on the pallet 24.

Next, such a pallet is conveyed counterclockwise, and the resin 3a is applied to the first resin coating machine 2 at a predetermined position.
6 is applied to the heat sink 1 and the thick film substrate 4 is applied at the next position.
Is clamped by the substrate sticking machine 27 and placed on the heat sink 1 coated with the resin film 3a to be stuck. Finally, the robot 28 handles the integrated material to the hot platen 29 and leaves it for a predetermined time or more to cure the resin film 3a, and then conveys it to the next device through the connection unit 31.

In this way, the transferred work 30 which is the integrated product is handled by the robot 32, set on the pallet 33, and transferred to a predetermined position via the second transfer rail 34. Next, the wire bonder 35, the lead cutter 36, and the test head 37 perform predetermined work such as bonding of fine wires, lead cutting, and testing. Finally, the robot 39 conveys the work 38 via the connection unit 40.

On the other hand, a magazine 41 accommodating a plurality of pallets (not shown) in which the mold frame 7 is set is set in the work supply section, and the pallets are pushed to a predetermined position. The robot 42 handles the work 38 and the mold frame 7, sets them on the pallet 43, and conveys them to a predetermined position via the third conveyance rails 44.

Next, the resin film 3b is applied to the second resin coating machine 45.
Is applied to the heat sink 1, the mold frame 7 is clamped by the transfer machine 46 at the next position, further mounted on the heat sink 1 and attached, and finally handled by the robot 48 to the heating plate 49. Then, the resin film 3b is hardened by being left for a predetermined time or more, and is conveyed by the robot 48 to the next step via the conveyor 50.

Example 2. In the above embodiment, in the work integration means (A) and the work frame coupling means (C), the resin films are heated and cured by the heating plates 29 and 49, respectively, but this does not hinder the assembly of the subsequent steps. By passing the work to the next process in a semi-cured state, the curing process time can be further shortened and a consistent assembly line can be formed.

[0028]

As described above, according to the first aspect of the present invention, the work integrating means, the work testing means, and the work frame connecting means are provided, and the first transfer rail and the second transfer rail provided on each of them. Each work is transported along the transport rail and the third transport rail at its own speed or timing, and during this transport, the work integration, work test, and work frame joining operations are performed continuously, Since it is configured to be passed to the next process, it is possible to easily and clearly control the manufacturing history, manufacture the hybrid integrated circuit in an integrated system, and shorten the manufacturing period.

According to the second aspect of the invention, the resin film for attaching the thick film substrate or the mold frame to the heat sink is passed to the next step in a semi-cured state, so that the manufacturing period can be further shortened throughout the entire line. There is an effect that what can be achieved.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a hybrid integrated circuit manufacturing apparatus according to the present invention.

FIG. 2 is a perspective view showing a work conveyed by the work integrating means in FIG.

FIG. 3 is a perspective view showing a work conveyed by the work test means in FIG.

4 is a perspective view showing a work conveyed by the work frame connecting means in FIG. 1. FIG.

FIG. 5 is an assembly process diagram showing a conventional assembly process of a hybrid integrated circuit.

FIG. 6 is a schematic block diagram showing a conventional hybrid integrated circuit manufacturing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat sink 3a, 3b Resin film 4 Thick film substrate 7 Mold frame 24 Pallet 25 First conveyance rail 26 First resin coating machine 27 Board sticking machine 29 Hot plate (first heating means) 30 Work piece 31 First connection Unit 33 Pallet 34 Second transfer rail 35 Wire bonder 36 Lead cutter 37 Test head 38 Work 40 Second connection unit 43 Pallet 44 Third transfer rail 45 Second resin coating machine 46 Transfer machine 47 Work 49 Hot plate ( Second heating means) 50 Conveyor A Work integration means B Work test means C Work frame connection means

Claims (2)

[Claims] 1. A first transport rail for transporting each pallet in which a heat sink and a thick film substrate are set, a first resin coating machine for coating a resin film on the heat sink in the middle of the first transport rail, and the resin. A substrate attaching machine for attaching the thick film substrate to the heat sink coated with a film, a first heating means for curing the resin film, and a first connection for delivering a work integrated by the resin film to the next step. A unit for integrating workpieces, a second transport rail for transporting a pallet in which the workpieces sent via the first connection unit are set, and a second transport rail provided in the middle of the second transport rails, A wire bonder for bonding thin metal wires, a lead cutter for performing lead cutting, a test head for performing a circuit test on the above work, and the above bonding and lead cutter. And a work test means comprising a second connection unit for sending the work subjected to the circuit test to the next process, and a third for carrying a pallet on which the work sent via the second connection unit is set. Transport rail, a second resin coating machine provided in the middle of the third transport rail for coating a resin film on the heat sink of the work, and a mold frame is moved and attached to the heat sink coated with the resin film. An apparatus for manufacturing a hybrid integrated circuit, comprising: a transfer machine; and a second heating means for curing the resin film, and a work frame connecting means composed of a conveyor for delivering the work integrated by the resin film to the next step. 2. A first transport rail for transporting each pallet on which a heat sink and a thick film substrate are set, a first resin coating machine for coating a resin film on the heat sink in the middle of the first transport rail, and the resin. A substrate attaching machine for attaching the thick film substrate to the heat sink coated with a film, a first heating means for curing the resin film, and a work integrated by the resin film are put into a semi-cured state of the resin film. And a second transport rail for transporting the pallet on which the work sent through the first connection unit is set, and the work integration means including the first connection unit for sending the work to the next process.
A wire bonder, which is provided in the middle of the second transport rail, for bonding metal thin wires of the work, a lead cutter for performing lead cutting, a test head for performing a circuit test of the work, and the bonding, lead cutting and circuit test. The second which sends the performed work to the next process
Work test means comprising a connection unit of
Third transport rail for transporting a pallet on which a work set sent through the connection unit of (3) is provided, and a second resin which is provided in the middle of the third transport rail and applies a resin film to the heat sink of the work. A coating machine, a transfer machine for moving and pasting a mold frame to a heat sink coated with the resin film, a second heating means for curing the resin film, and a work integrated by the resin film An apparatus for manufacturing a hybrid integrated circuit, comprising: a work frame connecting means including a conveyer for sending to the next step in the semi-cured state.