KR20230114197A - 열처리 장치, 열처리 방법 - Google Patents

열처리 장치, 열처리 방법 Download PDF

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Publication number
KR20230114197A
KR20230114197A KR1020230004193A KR20230004193A KR20230114197A KR 20230114197 A KR20230114197 A KR 20230114197A KR 1020230004193 A KR1020230004193 A KR 1020230004193A KR 20230004193 A KR20230004193 A KR 20230004193A KR 20230114197 A KR20230114197 A KR 20230114197A
Authority
KR
South Korea
Prior art keywords
opening
chamber
heater
closing door
heat treatment
Prior art date
Application number
KR1020230004193A
Other languages
English (en)
Korean (ko)
Inventor
준지 이시하라
아키노리 이소
히로카즈 마스다
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20230114197A publication Critical patent/KR20230114197A/ko

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254After-treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/0006Controlling or regulating processes
    • B01J19/0013Controlling the temperature of the process
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0406Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
    • B05D3/0426Cooling with air
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0486Operating the coating or treatment in a controlled atmosphere
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0493Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases using vacuum
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Furnace Details (AREA)
  • Furnace Housings, Linings, Walls, And Ceilings (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
KR1020230004193A 2022-01-24 2023-01-11 열처리 장치, 열처리 방법 KR20230114197A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2022-008471 2022-01-24
JP2022008471A JP2023107329A (ja) 2022-01-24 2022-01-24 熱処理装置、熱処理方法

Publications (1)

Publication Number Publication Date
KR20230114197A true KR20230114197A (ko) 2023-08-01

Family

ID=87210817

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020230004193A KR20230114197A (ko) 2022-01-24 2023-01-11 열처리 장치, 열처리 방법

Country Status (3)

Country Link
JP (1) JP2023107329A (ja)
KR (1) KR20230114197A (ja)
CN (1) CN116475034A (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019117250A (ja) 2017-12-27 2019-07-18 京セラドキュメントソリューションズ株式会社 画像形成装置

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* Cited by examiner, † Cited by third party
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JP4210788B2 (ja) * 2002-09-24 2009-01-21 株式会社協真エンジニアリング 加工装置の扉開閉装置
JP3718806B2 (ja) * 2003-01-16 2005-11-24 エスペック株式会社 スライドスリット式熱処理装置
EP1801529B1 (en) * 2004-09-16 2010-03-10 IHI Corporation Change-over apparatus for cooling gas passages in vacuum heat treatment furnace
DE102012103275A1 (de) * 2012-04-16 2013-10-17 Benteler Automobiltechnik Gmbh Schichtofenanlage sowie Verfahren zum Betreiben der Schichtofenanlage
JP5861080B2 (ja) * 2012-04-26 2016-02-16 パナソニックIpマネジメント株式会社 熱風循環式加熱装置
KR101982726B1 (ko) * 2013-04-16 2019-05-27 주식회사 탑 엔지니어링 기판 열처리 장치
CN203704561U (zh) * 2013-11-22 2014-07-09 深圳市腾达工业自动设备有限公司 一种三门真空烤箱
TWI698944B (zh) * 2013-12-23 2020-07-11 南韓商圓益Ips股份有限公司 批量式基板處理裝置
TWI703637B (zh) * 2016-03-08 2020-09-01 瑞士商艾維太克股份有限公司 熱處理腔室、包括該腔室之設備、工件處理系統及製造熱處理工件的方法
CN205607042U (zh) * 2016-03-29 2016-09-28 徐州伊维达技术有限公司 机械手制样密封恒温烘箱
KR101796294B1 (ko) * 2016-06-17 2017-11-15 주식회사 테라세미콘 기판처리 장치
JP6871959B2 (ja) * 2018-03-30 2021-05-19 芝浦メカトロニクス株式会社 有機膜形成装置、および有機膜の製造方法
KR102226624B1 (ko) * 2018-03-30 2021-03-12 시바우라 메카트로닉스 가부시끼가이샤 유기막 형성 장치, 및 유기막의 제조 방법
KR101935806B1 (ko) * 2018-05-31 2019-01-07 아진산업(주) 멀티 챔버형 가열기
CN108895805A (zh) * 2018-06-07 2018-11-27 广州四为科技有限公司 烘干炉
CN111326447B (zh) * 2018-12-17 2023-08-04 圆益Ips股份有限公司 基板处理装置
CN209655776U (zh) * 2019-01-19 2019-11-19 江苏盛达飞建筑材料有限公司 一种恒温干燥箱
JP7079044B2 (ja) * 2019-05-31 2022-06-01 株式会社九州日昌 加熱装置および加熱方法
CN112611176A (zh) * 2020-12-18 2021-04-06 邦达诚环境监测中心(江苏)有限公司 一种可倒挂式节能烘箱

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019117250A (ja) 2017-12-27 2019-07-18 京セラドキュメントソリューションズ株式会社 画像形成装置

Also Published As

Publication number Publication date
CN116475034A (zh) 2023-07-25
JP2023107329A (ja) 2023-08-03

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