KR20230088475A - 공급 어레인지먼트, 진공 프로세싱 시스템, 및 진공 프로세싱 시스템에서 이동하는 디바이스를 공급하는 방법 - Google Patents

공급 어레인지먼트, 진공 프로세싱 시스템, 및 진공 프로세싱 시스템에서 이동하는 디바이스를 공급하는 방법 Download PDF

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Publication number
KR20230088475A
KR20230088475A KR1020237016683A KR20237016683A KR20230088475A KR 20230088475 A KR20230088475 A KR 20230088475A KR 1020237016683 A KR1020237016683 A KR 1020237016683A KR 20237016683 A KR20237016683 A KR 20237016683A KR 20230088475 A KR20230088475 A KR 20230088475A
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KR
South Korea
Prior art keywords
arm
vacuum processing
joint
supply arrangement
feedthrough
Prior art date
Application number
KR1020237016683A
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English (en)
Korean (ko)
Inventor
노르베르트 슈파츠
슈테판 뱅거트
마티아스 크레브스
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20230088475A publication Critical patent/KR20230088475A/ko

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
KR1020237016683A 2020-10-19 2020-10-19 공급 어레인지먼트, 진공 프로세싱 시스템, 및 진공 프로세싱 시스템에서 이동하는 디바이스를 공급하는 방법 KR20230088475A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2020/059813 WO2022084712A1 (en) 2020-10-19 2020-10-19 Supply arrangement, vacuum processing system and method of supplying a moving device in a vacuum processing system

Publications (1)

Publication Number Publication Date
KR20230088475A true KR20230088475A (ko) 2023-06-19

Family

ID=81290145

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237016683A KR20230088475A (ko) 2020-10-19 2020-10-19 공급 어레인지먼트, 진공 프로세싱 시스템, 및 진공 프로세싱 시스템에서 이동하는 디바이스를 공급하는 방법

Country Status (3)

Country Link
KR (1) KR20230088475A (zh)
CN (1) CN116324011A (zh)
WO (1) WO2022084712A1 (zh)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB329991A (en) * 1928-12-22 1930-05-22 Walter Shaw Compensator stop-motion for use in winding, reeling, twisting, doubling, knitting orother textile machines
KR100261532B1 (ko) * 1993-03-14 2000-07-15 야마시타 히데나리 피처리체 반송장치를 가지는 멀티챔버 시스템
DE19851743A1 (de) * 1998-11-10 2000-05-11 Schuler Pressen Gmbh & Co Positioniereinrichtung mit Gewichtsausgleich
US8419341B2 (en) * 2006-09-19 2013-04-16 Brooks Automation, Inc. Linear vacuum robot with Z motion and articulated arm
TWI458612B (zh) * 2009-11-10 2014-11-01 Intevac Inc 可作z軸運動並具多關節手臂之線性真空機械手
KR20120086865A (ko) * 2011-01-27 2012-08-06 엘아이지에이디피 주식회사 증착물질 공급장치 및 이것을 포함하는 유기발광소자 제조용 증착장비
JP2015517031A (ja) * 2012-03-29 2015-06-18 ビーコ・エーエルディー インコーポレイテッド 基板処理用走査噴射装置アセンブリモジュール
KR101839224B1 (ko) * 2016-09-01 2018-03-15 성균관대학교산학협력단 보행로봇용 관절 완충장치
KR101903904B1 (ko) * 2017-02-23 2018-11-13 고려대학교 산학협력단 중력보상에 기반한 수동식 자세유지장치
DE102017111687A1 (de) * 2017-05-30 2018-12-06 VON ARDENNE Asset GmbH & Co. KG Bandsubstrat-Vakuumbeschichtungsanlage
US11508595B2 (en) * 2017-08-24 2022-11-22 Applied Materials, Inc. Apparatus and method for contactless transportation of a device in a vacuum processing system
DE102017129603B4 (de) * 2017-09-27 2021-07-01 VON ARDENNE Asset GmbH & Co. KG Vakuumkammeranordnung und Verfahren zum Prozessieren eines Substrats

Also Published As

Publication number Publication date
CN116324011A (zh) 2023-06-23
WO2022084712A1 (en) 2022-04-28

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