KR20230074723A - 광디바이스의 리프트 방법 및 그 장치, 광디바이스가 이설된 리셉터 기판의 제조 방법, 그리고 디스플레이의 제조 방법 - Google Patents
광디바이스의 리프트 방법 및 그 장치, 광디바이스가 이설된 리셉터 기판의 제조 방법, 그리고 디스플레이의 제조 방법 Download PDFInfo
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- KR20230074723A KR20230074723A KR1020237009310A KR20237009310A KR20230074723A KR 20230074723 A KR20230074723 A KR 20230074723A KR 1020237009310 A KR1020237009310 A KR 1020237009310A KR 20237009310 A KR20237009310 A KR 20237009310A KR 20230074723 A KR20230074723 A KR 20230074723A
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- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H01S5/00—Semiconductor lasers
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- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
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- H—ELECTRICITY
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
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- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
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- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07183—Means for monitoring
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- H01L2224/75263—
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- H01L2224/9512—
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- H01L2924/12041—
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
- Laser Beam Processing (AREA)
- Semiconductor Lasers (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Photovoltaic Devices (AREA)
- Electroluminescent Light Sources (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2020-165877 | 2020-09-30 | ||
| JP2020165877 | 2020-09-30 | ||
| PCT/JP2021/035794 WO2022071371A1 (ja) | 2020-09-30 | 2021-09-29 | 光デバイスのリフト方法及びその装置、光デバイスが移設されたレセプター基板の製造方法、並びにディスプレイの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230074723A true KR20230074723A (ko) | 2023-05-31 |
Family
ID=80950599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237009310A Ceased KR20230074723A (ko) | 2020-09-30 | 2021-09-29 | 광디바이스의 리프트 방법 및 그 장치, 광디바이스가 이설된 리셉터 기판의 제조 방법, 그리고 디스플레이의 제조 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240014200A1 (https=) |
| EP (1) | EP4224538A4 (https=) |
| JP (1) | JP7818918B2 (https=) |
| KR (1) | KR20230074723A (https=) |
| CN (3) | CN216980602U (https=) |
| TW (6) | TW202215730A (https=) |
| WO (1) | WO2022071371A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202215730A (zh) * | 2020-09-30 | 2022-04-16 | 日商信越化學工業股份有限公司 | 光學元件的雷射誘導向前轉移方法及其裝置、已轉移了光學元件的受體基板的製造方法以及顯示器的製造方法 |
| WO2023228918A1 (ja) * | 2022-05-27 | 2023-11-30 | 京セラ株式会社 | 発光装置および発光装置の製造方法 |
| TWI867551B (zh) * | 2023-05-29 | 2024-12-21 | 前源科技股份有限公司 | 可調整間距的巨量轉移電子元件的方法 |
| CN117766639B (zh) * | 2024-02-20 | 2024-05-31 | 昆山鸿仕达智能科技股份有限公司 | 光伏电池片激光诱导加工设备 |
| CN118522674A (zh) * | 2024-07-22 | 2024-08-20 | 迈为技术(珠海)有限公司 | 基板控制方法、装置、计算机设备、可读存储介质和程序产品 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007506445A (ja) | 2003-07-29 | 2007-03-22 | ジンテーズ アクチエンゲゼルシャフト クール | 骨固定要素を有する縦通材を固定する装置 |
| JP2018163900A (ja) | 2017-03-24 | 2018-10-18 | 東レエンジニアリング株式会社 | ピックアップ方法、ピックアップ装置、及び実装装置 |
| JP2020004478A (ja) | 2017-06-28 | 2020-01-09 | 丸文株式会社 | リフト装置及び使用方法 |
| JP2020129638A (ja) | 2019-02-12 | 2020-08-27 | 信越化学工業株式会社 | 微小構造体移載装置、スタンプヘッドユニット、微小構造体移載用スタンプ部品及び微小構造体集積部品の移載方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002062825A (ja) * | 2000-08-18 | 2002-02-28 | Sony Corp | 画像表示装置及びその製造方法 |
| JP4491948B2 (ja) * | 2000-10-06 | 2010-06-30 | ソニー株式会社 | 素子実装方法および画像表示装置の製造方法 |
| JP2002158237A (ja) * | 2000-11-20 | 2002-05-31 | Sony Corp | 素子の転写方法及び素子の実装方法 |
| CN101517700B (zh) * | 2006-09-20 | 2014-04-16 | 伊利诺伊大学评议会 | 用于制造可转移半导体结构、器件和器件构件的松脱策略 |
| KR20130118616A (ko) * | 2012-04-20 | 2013-10-30 | 우시오덴키 가부시키가이샤 | 레이저 리프트 오프 장치 및 레이저 리프트 오프 방법 |
| KR102081286B1 (ko) * | 2013-04-16 | 2020-04-16 | 삼성디스플레이 주식회사 | 레이저 열전사 장치, 레이저 열전사 방법 및 이를 이용한 유기발광 디스플레이 장치 제조방법 |
| JP6106522B2 (ja) * | 2013-05-17 | 2017-04-05 | スタンレー電気株式会社 | 半導体発光素子アレイ |
| US9773945B2 (en) * | 2015-01-30 | 2017-09-26 | Osram Opto Semiconductors Gmbh | Method for producing a semiconductor component and a semiconductor component |
| JP2018060993A (ja) * | 2016-09-29 | 2018-04-12 | 東レエンジニアリング株式会社 | 転写方法、実装方法、転写装置、及び実装装置 |
| JP6966281B2 (ja) | 2017-09-29 | 2021-11-10 | 東レエンジニアリング株式会社 | 転写基板、及び転写方法 |
| JP7034771B2 (ja) * | 2018-03-02 | 2022-03-14 | キオクシア株式会社 | 露光装置、露光方法、及び半導体装置の製造方法 |
| KR102652723B1 (ko) * | 2018-11-20 | 2024-04-01 | 삼성전자주식회사 | 마이크로 led 전사 장치 및 이를 이용한 마이크로 led 전사 방법 |
| CN111128843A (zh) * | 2019-12-27 | 2020-05-08 | 深圳市华星光电半导体显示技术有限公司 | Micro LED的转移方法 |
| TW202215730A (zh) * | 2020-09-30 | 2022-04-16 | 日商信越化學工業股份有限公司 | 光學元件的雷射誘導向前轉移方法及其裝置、已轉移了光學元件的受體基板的製造方法以及顯示器的製造方法 |
-
2021
- 2021-09-27 TW TW110135861A patent/TW202215730A/zh unknown
- 2021-09-27 JP JP2021156889A patent/JP7818918B2/ja active Active
- 2021-09-27 TW TW110211331U patent/TWM643626U/zh unknown
- 2021-09-27 TW TW113204743U patent/TWM661925U/zh unknown
- 2021-09-27 TW TW113210118U patent/TWM668963U/zh unknown
- 2021-09-27 TW TW114202582U patent/TWM673226U/zh unknown
- 2021-09-27 TW TW112205943U patent/TWM656434U/zh unknown
- 2021-09-29 CN CN202122368647.8U patent/CN216980602U/zh active Active
- 2021-09-29 US US18/027,807 patent/US20240014200A1/en active Pending
- 2021-09-29 CN CN202221585302.6U patent/CN219371054U/zh active Active
- 2021-09-29 EP EP21875671.6A patent/EP4224538A4/en active Pending
- 2021-09-29 KR KR1020237009310A patent/KR20230074723A/ko not_active Ceased
- 2021-09-29 CN CN202180065158.5A patent/CN116195074A/zh active Pending
- 2021-09-29 WO PCT/JP2021/035794 patent/WO2022071371A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007506445A (ja) | 2003-07-29 | 2007-03-22 | ジンテーズ アクチエンゲゼルシャフト クール | 骨固定要素を有する縦通材を固定する装置 |
| JP2018163900A (ja) | 2017-03-24 | 2018-10-18 | 東レエンジニアリング株式会社 | ピックアップ方法、ピックアップ装置、及び実装装置 |
| JP2020004478A (ja) | 2017-06-28 | 2020-01-09 | 丸文株式会社 | リフト装置及び使用方法 |
| JP2020129638A (ja) | 2019-02-12 | 2020-08-27 | 信越化学工業株式会社 | 微小構造体移載装置、スタンプヘッドユニット、微小構造体移載用スタンプ部品及び微小構造体集積部品の移載方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM668963U (zh) | 2025-04-11 |
| TWM661925U (zh) | 2024-10-21 |
| TWM656434U (zh) | 2024-06-11 |
| EP4224538A1 (en) | 2023-08-09 |
| TWM673226U (zh) | 2025-08-01 |
| US20240014200A1 (en) | 2024-01-11 |
| WO2022071371A1 (ja) | 2022-04-07 |
| JP7818918B2 (ja) | 2026-02-24 |
| CN216980602U (zh) | 2022-07-15 |
| CN219371054U (zh) | 2023-07-18 |
| EP4224538A4 (en) | 2025-01-29 |
| JP2022058237A (ja) | 2022-04-11 |
| TWM643626U (zh) | 2023-07-11 |
| CN116195074A (zh) | 2023-05-30 |
| TW202215730A (zh) | 2022-04-16 |
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