KR20230016595A - 기판 처리 방법 및 기판 처리 장치 - Google Patents

기판 처리 방법 및 기판 처리 장치 Download PDF

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Publication number
KR20230016595A
KR20230016595A KR1020220088931A KR20220088931A KR20230016595A KR 20230016595 A KR20230016595 A KR 20230016595A KR 1020220088931 A KR1020220088931 A KR 1020220088931A KR 20220088931 A KR20220088931 A KR 20220088931A KR 20230016595 A KR20230016595 A KR 20230016595A
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KR
South Korea
Prior art keywords
discharge
sub
fluid
substrate
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020220088931A
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English (en)
Korean (ko)
Inventor
사야 이노우에
사토루 다나카
신이치로 시모무라
토루 이하라
사토시 비와
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20230016595A publication Critical patent/KR20230016595A/ko
Pending legal-status Critical Current

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Classifications

    • H01L21/02101—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/80—Cleaning only by supercritical fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H01L21/02057—
    • H01L21/67034—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only

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  • Cleaning Or Drying Semiconductors (AREA)
KR1020220088931A 2021-07-26 2022-07-19 기판 처리 방법 및 기판 처리 장치 Pending KR20230016595A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2021-121925 2021-07-26
JP2021121925A JP7529629B2 (ja) 2021-07-26 2021-07-26 基板処理方法および基板処理装置

Publications (1)

Publication Number Publication Date
KR20230016595A true KR20230016595A (ko) 2023-02-02

Family

ID=84976455

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220088931A Pending KR20230016595A (ko) 2021-07-26 2022-07-19 기판 처리 방법 및 기판 처리 장치

Country Status (5)

Country Link
US (1) US12456632B2 (https=)
JP (1) JP7529629B2 (https=)
KR (1) KR20230016595A (https=)
CN (1) CN115692172A (https=)
TW (1) TW202320200A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117716476A (zh) * 2021-08-05 2024-03-15 东京毅力科创株式会社 基板处理方法和基板处理装置
JPWO2025018134A1 (https=) * 2023-07-14 2025-01-23

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014101241A (ja) 2012-11-19 2014-06-05 Japan Organo Co Ltd 精製二酸化炭素の供給システムおよび方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3868804B2 (ja) * 2001-11-27 2007-01-17 アルプス電気株式会社 基板乾燥装置及びそれを用いた基板乾燥方法
US9449862B2 (en) * 2011-06-03 2016-09-20 Tel Nexx, Inc. Parallel single substrate processing system
JP5544666B2 (ja) * 2011-06-30 2014-07-09 セメス株式会社 基板処理装置
JP2013062417A (ja) * 2011-09-14 2013-04-04 Toshiba Corp 半導体基板の超臨界乾燥方法及び装置
JP7080134B2 (ja) * 2018-08-07 2022-06-03 東京エレクトロン株式会社 基板処理装置のパーティクル除去方法および基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014101241A (ja) 2012-11-19 2014-06-05 Japan Organo Co Ltd 精製二酸化炭素の供給システムおよび方法

Also Published As

Publication number Publication date
JP7529629B2 (ja) 2024-08-06
JP2023017577A (ja) 2023-02-07
TW202320200A (zh) 2023-05-16
US12456632B2 (en) 2025-10-28
CN115692172A (zh) 2023-02-03
US20230022814A1 (en) 2023-01-26

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