TW202320200A - 基板處理方法及基板處理裝置 - Google Patents

基板處理方法及基板處理裝置 Download PDF

Info

Publication number
TW202320200A
TW202320200A TW111126769A TW111126769A TW202320200A TW 202320200 A TW202320200 A TW 202320200A TW 111126769 A TW111126769 A TW 111126769A TW 111126769 A TW111126769 A TW 111126769A TW 202320200 A TW202320200 A TW 202320200A
Authority
TW
Taiwan
Prior art keywords
discharge
fluid
substrate
flow
supply line
Prior art date
Application number
TW111126769A
Other languages
English (en)
Chinese (zh)
Inventor
井上紗綾
田中暁
下村伸一郎
井原亨
枇杷聡
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202320200A publication Critical patent/TW202320200A/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/80—Cleaning only by supercritical fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
TW111126769A 2021-07-26 2022-07-18 基板處理方法及基板處理裝置 TW202320200A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021121925A JP7529629B2 (ja) 2021-07-26 2021-07-26 基板処理方法および基板処理装置
JP2021-121925 2021-07-26

Publications (1)

Publication Number Publication Date
TW202320200A true TW202320200A (zh) 2023-05-16

Family

ID=84976455

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111126769A TW202320200A (zh) 2021-07-26 2022-07-18 基板處理方法及基板處理裝置

Country Status (5)

Country Link
US (1) US12456632B2 (https=)
JP (1) JP7529629B2 (https=)
KR (1) KR20230016595A (https=)
CN (1) CN115692172A (https=)
TW (1) TW202320200A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117716476A (zh) * 2021-08-05 2024-03-15 东京毅力科创株式会社 基板处理方法和基板处理装置
JPWO2025018134A1 (https=) * 2023-07-14 2025-01-23

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3868804B2 (ja) * 2001-11-27 2007-01-17 アルプス電気株式会社 基板乾燥装置及びそれを用いた基板乾燥方法
US9449862B2 (en) * 2011-06-03 2016-09-20 Tel Nexx, Inc. Parallel single substrate processing system
JP5544666B2 (ja) * 2011-06-30 2014-07-09 セメス株式会社 基板処理装置
JP2013062417A (ja) * 2011-09-14 2013-04-04 Toshiba Corp 半導体基板の超臨界乾燥方法及び装置
JP2014101241A (ja) 2012-11-19 2014-06-05 Japan Organo Co Ltd 精製二酸化炭素の供給システムおよび方法
JP7080134B2 (ja) * 2018-08-07 2022-06-03 東京エレクトロン株式会社 基板処理装置のパーティクル除去方法および基板処理装置

Also Published As

Publication number Publication date
JP7529629B2 (ja) 2024-08-06
JP2023017577A (ja) 2023-02-07
US12456632B2 (en) 2025-10-28
KR20230016595A (ko) 2023-02-02
CN115692172A (zh) 2023-02-03
US20230022814A1 (en) 2023-01-26

Similar Documents

Publication Publication Date Title
JP5923300B2 (ja) 基板処理装置および基板処理方法
JP7598240B2 (ja) 基板乾燥方法および基板乾燥装置
KR100858578B1 (ko) 기판처리장치 및 기판처리방법
JP7775000B2 (ja) 基板処理装置および基板処理方法
TW202131386A (zh) 基板處理裝置
KR20190053092A (ko) 기판 처리 장치, 기판 처리 방법 및 기억 매체
KR100822511B1 (ko) 기판처리장치 및 기판처리방법
TW202320200A (zh) 基板處理方法及基板處理裝置
JP7797608B2 (ja) 基板処理装置および基板処理方法
JP2023038790A5 (https=)
KR102710153B1 (ko) 기판 처리 방법 및 기판 처리 장치
JP2023017577A5 (https=)
KR101023750B1 (ko) 유체 흐름 개폐 유닛 및 이를 이용한 기판 처리 장치.
TWI896412B (zh) 基板處理裝置
KR102874974B1 (ko) 액처리 장치, 액공급 기구, 액처리 방법, 및 컴퓨터 기억 매체
US20250149353A1 (en) Substrate processing apparatus and substrate processing method
JP2022104093A (ja) 基板処理装置
TWI916466B (zh) 基板乾燥方法及基板乾燥裝置
TW202429601A (zh) 基板處理裝置及基板處理方法
KR20150076853A (ko) 노즐 유닛 및 이를 포함하는 기판 처리 장치, 그리고 상기 장치을 이용한 기판 처리 방법