JPWO2025018134A1 - - Google Patents
Info
- Publication number
- JPWO2025018134A1 JPWO2025018134A1 JP2025533948A JP2025533948A JPWO2025018134A1 JP WO2025018134 A1 JPWO2025018134 A1 JP WO2025018134A1 JP 2025533948 A JP2025533948 A JP 2025533948A JP 2025533948 A JP2025533948 A JP 2025533948A JP WO2025018134 A1 JPWO2025018134 A1 JP WO2025018134A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023116085 | 2023-07-14 | ||
| PCT/JP2024/023748 WO2025018134A1 (ja) | 2023-07-14 | 2024-07-01 | 基板処理装置及び基板処理方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025018134A1 true JPWO2025018134A1 (https=) | 2025-01-23 |
Family
ID=94281431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025533948A Pending JPWO2025018134A1 (https=) | 2023-07-14 | 2024-07-01 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2025018134A1 (https=) |
| KR (1) | KR20260038910A (https=) |
| CN (1) | CN121488622A (https=) |
| TW (1) | TW202510067A (https=) |
| WO (1) | WO2025018134A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7109328B2 (ja) * | 2018-09-26 | 2022-07-29 | 東京エレクトロン株式会社 | 基板処理システム |
| JP7493325B2 (ja) * | 2019-11-25 | 2024-05-31 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP7353227B2 (ja) * | 2020-03-30 | 2023-09-29 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法 |
| JP7529629B2 (ja) * | 2021-07-26 | 2024-08-06 | 東京エレクトロン株式会社 | 基板処理方法および基板処理装置 |
| JP7775000B2 (ja) * | 2021-09-07 | 2025-11-25 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
-
2024
- 2024-07-01 JP JP2025533948A patent/JPWO2025018134A1/ja active Pending
- 2024-07-01 WO PCT/JP2024/023748 patent/WO2025018134A1/ja active Pending
- 2024-07-01 CN CN202480045700.4A patent/CN121488622A/zh active Pending
- 2024-07-01 KR KR1020267003879A patent/KR20260038910A/ko active Pending
- 2024-07-09 TW TW113125566A patent/TW202510067A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20260038910A (ko) | 2026-03-19 |
| TW202510067A (zh) | 2025-03-01 |
| WO2025018134A1 (ja) | 2025-01-23 |
| CN121488622A (zh) | 2026-02-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260113 |