KR20260038910A - 기판 처리 장치 및 기판 처리 방법 - Google Patents
기판 처리 장치 및 기판 처리 방법Info
- Publication number
- KR20260038910A KR20260038910A KR1020267003879A KR20267003879A KR20260038910A KR 20260038910 A KR20260038910 A KR 20260038910A KR 1020267003879 A KR1020267003879 A KR 1020267003879A KR 20267003879 A KR20267003879 A KR 20267003879A KR 20260038910 A KR20260038910 A KR 20260038910A
- Authority
- KR
- South Korea
- Prior art keywords
- processing
- temperature
- pressure
- fluid
- vessel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/80—Cleaning only by supercritical fluids
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0602—Temperature monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2023-116085 | 2023-07-14 | ||
| JP2023116085 | 2023-07-14 | ||
| PCT/JP2024/023748 WO2025018134A1 (ja) | 2023-07-14 | 2024-07-01 | 基板処理装置及び基板処理方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20260038910A true KR20260038910A (ko) | 2026-03-19 |
Family
ID=94281431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020267003879A Pending KR20260038910A (ko) | 2023-07-14 | 2024-07-01 | 기판 처리 장치 및 기판 처리 방법 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2025018134A1 (https=) |
| KR (1) | KR20260038910A (https=) |
| CN (1) | CN121488622A (https=) |
| TW (1) | TW202510067A (https=) |
| WO (1) | WO2025018134A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7109328B2 (ja) * | 2018-09-26 | 2022-07-29 | 東京エレクトロン株式会社 | 基板処理システム |
| JP7493325B2 (ja) * | 2019-11-25 | 2024-05-31 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP7353227B2 (ja) * | 2020-03-30 | 2023-09-29 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法 |
| JP7529629B2 (ja) * | 2021-07-26 | 2024-08-06 | 東京エレクトロン株式会社 | 基板処理方法および基板処理装置 |
| JP7775000B2 (ja) * | 2021-09-07 | 2025-11-25 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
-
2024
- 2024-07-01 JP JP2025533948A patent/JPWO2025018134A1/ja active Pending
- 2024-07-01 WO PCT/JP2024/023748 patent/WO2025018134A1/ja active Pending
- 2024-07-01 CN CN202480045700.4A patent/CN121488622A/zh active Pending
- 2024-07-01 KR KR1020267003879A patent/KR20260038910A/ko active Pending
- 2024-07-09 TW TW113125566A patent/TW202510067A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202510067A (zh) | 2025-03-01 |
| WO2025018134A1 (ja) | 2025-01-23 |
| CN121488622A (zh) | 2026-02-06 |
| JPWO2025018134A1 (https=) | 2025-01-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| Q12 | Application published |
Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE) |