JP2023038790A5 - - Google Patents

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Publication number
JP2023038790A5
JP2023038790A5 JP2021145691A JP2021145691A JP2023038790A5 JP 2023038790 A5 JP2023038790 A5 JP 2023038790A5 JP 2021145691 A JP2021145691 A JP 2021145691A JP 2021145691 A JP2021145691 A JP 2021145691A JP 2023038790 A5 JP2023038790 A5 JP 2023038790A5
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JP
Japan
Prior art keywords
substrate
processing
fluid
processing vessel
opening
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JP2021145691A
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English (en)
Japanese (ja)
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JP2023038790A (ja
JP7775000B2 (ja
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Priority claimed from JP2021145691A external-priority patent/JP7775000B2/ja
Priority to JP2021145691A priority Critical patent/JP7775000B2/ja
Priority to TW111132043A priority patent/TW202314916A/zh
Priority to CN202211046132.9A priority patent/CN115775751A/zh
Priority to KR1020220110720A priority patent/KR20230036531A/ko
Priority to US17/929,340 priority patent/US20230073624A1/en
Publication of JP2023038790A publication Critical patent/JP2023038790A/ja
Publication of JP2023038790A5 publication Critical patent/JP2023038790A5/ja
Priority to JP2025186596A priority patent/JP2026009360A/ja
Publication of JP7775000B2 publication Critical patent/JP7775000B2/ja
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JP2021145691A 2021-09-07 2021-09-07 基板処理装置および基板処理方法 Active JP7775000B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2021145691A JP7775000B2 (ja) 2021-09-07 2021-09-07 基板処理装置および基板処理方法
TW111132043A TW202314916A (zh) 2021-09-07 2022-08-25 基板處理裝置及基板處理方法
CN202211046132.9A CN115775751A (zh) 2021-09-07 2022-08-30 基片处理装置和基片处理方法
KR1020220110720A KR20230036531A (ko) 2021-09-07 2022-09-01 기판 처리 장치 및 기판 처리 방법
US17/929,340 US20230073624A1 (en) 2021-09-07 2022-09-02 Substrate processing apparatus and substrate processing method
JP2025186596A JP2026009360A (ja) 2021-09-07 2025-11-05 基板処理装置および基板処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021145691A JP7775000B2 (ja) 2021-09-07 2021-09-07 基板処理装置および基板処理方法

Related Child Applications (1)

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JP2025186596A Division JP2026009360A (ja) 2021-09-07 2025-11-05 基板処理装置および基板処理方法

Publications (3)

Publication Number Publication Date
JP2023038790A JP2023038790A (ja) 2023-03-17
JP2023038790A5 true JP2023038790A5 (https=) 2024-07-18
JP7775000B2 JP7775000B2 (ja) 2025-11-25

Family

ID=85385701

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021145691A Active JP7775000B2 (ja) 2021-09-07 2021-09-07 基板処理装置および基板処理方法
JP2025186596A Pending JP2026009360A (ja) 2021-09-07 2025-11-05 基板処理装置および基板処理方法

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JP2025186596A Pending JP2026009360A (ja) 2021-09-07 2025-11-05 基板処理装置および基板処理方法

Country Status (5)

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US (1) US20230073624A1 (https=)
JP (2) JP7775000B2 (https=)
KR (1) KR20230036531A (https=)
CN (1) CN115775751A (https=)
TW (1) TW202314916A (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7353213B2 (ja) * 2020-02-28 2023-09-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TWI902052B (zh) * 2022-11-16 2025-10-21 日商斯庫林集團股份有限公司 處理腔室之洗淨方法、清掃用配件及基板處理系統
JP2024072489A (ja) * 2022-11-16 2024-05-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理システム
JP2024072488A (ja) * 2022-11-16 2024-05-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
KR102780098B1 (ko) * 2022-12-27 2025-03-11 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JPWO2025018134A1 (https=) * 2023-07-14 2025-01-23

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4053253B2 (ja) 2001-05-17 2008-02-27 大日本スクリーン製造株式会社 高圧処理装置及び方法
JP5426439B2 (ja) 2010-03-15 2014-02-26 株式会社東芝 超臨界乾燥方法および超臨界乾燥装置
JP6755776B2 (ja) 2016-11-04 2020-09-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
JP6906416B2 (ja) 2017-09-29 2021-07-21 東京エレクトロン株式会社 基板処理装置
KR102666133B1 (ko) 2019-01-14 2024-05-17 삼성전자주식회사 초임계 건조 장치 및 그를 이용한 기판 건조방법
JP7197396B2 (ja) 2019-02-06 2022-12-27 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2021145691A (ja) 2020-03-16 2021-09-27 株式会社平和 遊技機

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