TW202314916A - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

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Publication number
TW202314916A
TW202314916A TW111132043A TW111132043A TW202314916A TW 202314916 A TW202314916 A TW 202314916A TW 111132043 A TW111132043 A TW 111132043A TW 111132043 A TW111132043 A TW 111132043A TW 202314916 A TW202314916 A TW 202314916A
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TW
Taiwan
Prior art keywords
fluid
substrate
processing container
processing
state
Prior art date
Application number
TW111132043A
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English (en)
Chinese (zh)
Inventor
下村伸一郎
Original Assignee
日商東京威力科創股份有限公司
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Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202314916A publication Critical patent/TW202314916A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/80—Cleaning only by supercritical fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

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  • Cleaning Or Drying Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
TW111132043A 2021-09-07 2022-08-25 基板處理裝置及基板處理方法 TW202314916A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-145691 2021-09-07
JP2021145691A JP7775000B2 (ja) 2021-09-07 2021-09-07 基板処理装置および基板処理方法

Publications (1)

Publication Number Publication Date
TW202314916A true TW202314916A (zh) 2023-04-01

Family

ID=85385701

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111132043A TW202314916A (zh) 2021-09-07 2022-08-25 基板處理裝置及基板處理方法

Country Status (5)

Country Link
US (1) US20230073624A1 (https=)
JP (2) JP7775000B2 (https=)
KR (1) KR20230036531A (https=)
CN (1) CN115775751A (https=)
TW (1) TW202314916A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI902051B (zh) * 2022-11-16 2025-10-21 日商斯庫林集團股份有限公司 基板處理方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7353213B2 (ja) * 2020-02-28 2023-09-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TWI902052B (zh) * 2022-11-16 2025-10-21 日商斯庫林集團股份有限公司 處理腔室之洗淨方法、清掃用配件及基板處理系統
JP2024072489A (ja) * 2022-11-16 2024-05-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理システム
KR102780098B1 (ko) * 2022-12-27 2025-03-11 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JPWO2025018134A1 (https=) * 2023-07-14 2025-01-23

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4053253B2 (ja) 2001-05-17 2008-02-27 大日本スクリーン製造株式会社 高圧処理装置及び方法
JP5426439B2 (ja) 2010-03-15 2014-02-26 株式会社東芝 超臨界乾燥方法および超臨界乾燥装置
JP6755776B2 (ja) 2016-11-04 2020-09-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
JP6906416B2 (ja) 2017-09-29 2021-07-21 東京エレクトロン株式会社 基板処理装置
KR102666133B1 (ko) 2019-01-14 2024-05-17 삼성전자주식회사 초임계 건조 장치 및 그를 이용한 기판 건조방법
JP7197396B2 (ja) 2019-02-06 2022-12-27 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2021145691A (ja) 2020-03-16 2021-09-27 株式会社平和 遊技機

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI902051B (zh) * 2022-11-16 2025-10-21 日商斯庫林集團股份有限公司 基板處理方法

Also Published As

Publication number Publication date
JP2023038790A (ja) 2023-03-17
CN115775751A (zh) 2023-03-10
JP7775000B2 (ja) 2025-11-25
KR20230036531A (ko) 2023-03-14
JP2026009360A (ja) 2026-01-19
US20230073624A1 (en) 2023-03-09

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