KR20230036531A - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR20230036531A
KR20230036531A KR1020220110720A KR20220110720A KR20230036531A KR 20230036531 A KR20230036531 A KR 20230036531A KR 1020220110720 A KR1020220110720 A KR 1020220110720A KR 20220110720 A KR20220110720 A KR 20220110720A KR 20230036531 A KR20230036531 A KR 20230036531A
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KR
South Korea
Prior art keywords
processing
fluid
substrate
processing container
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020220110720A
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English (en)
Korean (ko)
Inventor
신이치로 시모무라
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20230036531A publication Critical patent/KR20230036531A/ko
Pending legal-status Critical Current

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    • H01L21/67034—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H01L21/02057—
    • H01L21/67126—
    • H01L21/67253—
    • H01L21/67742—
    • H01L21/68764—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/80—Cleaning only by supercritical fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

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  • Cleaning Or Drying Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
KR1020220110720A 2021-09-07 2022-09-01 기판 처리 장치 및 기판 처리 방법 Pending KR20230036531A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2021-145691 2021-09-07
JP2021145691A JP7775000B2 (ja) 2021-09-07 2021-09-07 基板処理装置および基板処理方法

Publications (1)

Publication Number Publication Date
KR20230036531A true KR20230036531A (ko) 2023-03-14

Family

ID=85385701

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220110720A Pending KR20230036531A (ko) 2021-09-07 2022-09-01 기판 처리 장치 및 기판 처리 방법

Country Status (5)

Country Link
US (1) US20230073624A1 (https=)
JP (2) JP7775000B2 (https=)
KR (1) KR20230036531A (https=)
CN (1) CN115775751A (https=)
TW (1) TW202314916A (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7353213B2 (ja) * 2020-02-28 2023-09-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TWI902052B (zh) * 2022-11-16 2025-10-21 日商斯庫林集團股份有限公司 處理腔室之洗淨方法、清掃用配件及基板處理系統
JP2024072489A (ja) * 2022-11-16 2024-05-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理システム
JP2024072488A (ja) * 2022-11-16 2024-05-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
KR102780098B1 (ko) * 2022-12-27 2025-03-11 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JPWO2025018134A1 (https=) * 2023-07-14 2025-01-23

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018074103A (ja) 2016-11-04 2018-05-10 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4053253B2 (ja) 2001-05-17 2008-02-27 大日本スクリーン製造株式会社 高圧処理装置及び方法
JP5426439B2 (ja) 2010-03-15 2014-02-26 株式会社東芝 超臨界乾燥方法および超臨界乾燥装置
JP6906416B2 (ja) 2017-09-29 2021-07-21 東京エレクトロン株式会社 基板処理装置
KR102666133B1 (ko) 2019-01-14 2024-05-17 삼성전자주식회사 초임계 건조 장치 및 그를 이용한 기판 건조방법
JP7197396B2 (ja) 2019-02-06 2022-12-27 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2021145691A (ja) 2020-03-16 2021-09-27 株式会社平和 遊技機

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018074103A (ja) 2016-11-04 2018-05-10 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体

Also Published As

Publication number Publication date
JP2023038790A (ja) 2023-03-17
CN115775751A (zh) 2023-03-10
JP7775000B2 (ja) 2025-11-25
JP2026009360A (ja) 2026-01-19
US20230073624A1 (en) 2023-03-09
TW202314916A (zh) 2023-04-01

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