KR20230015871A - 디스플레이 패널 및 디스플레이 장치 - Google Patents

디스플레이 패널 및 디스플레이 장치 Download PDF

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Publication number
KR20230015871A
KR20230015871A KR1020227017324A KR20227017324A KR20230015871A KR 20230015871 A KR20230015871 A KR 20230015871A KR 1020227017324 A KR1020227017324 A KR 1020227017324A KR 20227017324 A KR20227017324 A KR 20227017324A KR 20230015871 A KR20230015871 A KR 20230015871A
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South Korea
Prior art keywords
conductive
layer
sub
conductive member
display panel
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Pending
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KR1020227017324A
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English (en)
Korean (ko)
Inventor
천 쉬
융 차오
신인 우
융다 마
Original Assignee
보에 테크놀로지 그룹 컴퍼니 리미티드
베이징 보에 테크놀로지 디벨로프먼트 씨오., 엘티디.
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Publication of KR20230015871A publication Critical patent/KR20230015871A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H01L27/3276—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • H10K59/1795—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
    • H01L27/323—
    • H01L27/326—
    • H01L51/0097—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H01L2251/5338—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020227017324A 2020-05-21 2021-05-18 디스플레이 패널 및 디스플레이 장치 Pending KR20230015871A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202010435328.1 2020-05-21
CN202010435328.1A CN111341826B (zh) 2020-05-21 2020-05-21 显示面板和显示装置
PCT/CN2021/094326 WO2021233280A1 (zh) 2020-05-21 2021-05-18 显示面板和显示装置

Publications (1)

Publication Number Publication Date
KR20230015871A true KR20230015871A (ko) 2023-01-31

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Application Number Title Priority Date Filing Date
KR1020227017324A Pending KR20230015871A (ko) 2020-05-21 2021-05-18 디스플레이 패널 및 디스플레이 장치

Country Status (6)

Country Link
US (1) US12178102B2 (https=)
EP (1) EP3996146A4 (https=)
JP (1) JP7850067B2 (https=)
KR (1) KR20230015871A (https=)
CN (1) CN111341826B (https=)
WO (1) WO2021233280A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1086564S1 (en) * 2023-04-13 2025-07-29 Dyson Operations PTE. LTD. Hair clip

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111341826B (zh) 2020-05-21 2020-08-25 京东方科技集团股份有限公司 显示面板和显示装置
CN112328112B (zh) * 2020-11-10 2024-03-15 京东方科技集团股份有限公司 触控显示面板及其制备方法、触控显示装置
CN113473826B (zh) * 2021-06-09 2022-07-05 荣耀终端有限公司 玻璃基板、显示面板、显示器及电子设备
US12144227B2 (en) * 2021-07-06 2024-11-12 Chengdu Boe Optoelectronics Technology Co., Ltd. Display panel and display apparatus
KR102874688B1 (ko) * 2021-12-16 2025-10-22 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN115175395B (zh) * 2022-06-30 2025-06-10 固安翌光科技有限公司 一种电致发光器件和发光装置
TWI820925B (zh) * 2022-09-22 2023-11-01 友達光電股份有限公司 顯示面板

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536842A (ja) * 1991-07-26 1993-02-12 Yamaha Corp 多層配線形成法
JP4700510B2 (ja) * 1998-12-18 2011-06-15 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6545359B1 (en) 1998-12-18 2003-04-08 Semiconductor Energy Laboratory Co., Ltd. Wiring line and manufacture process thereof, and semiconductor device and manufacturing process thereof
JP2000305104A (ja) * 1999-04-19 2000-11-02 Hitachi Ltd 液晶表示装置及びその製造方法
JP3502800B2 (ja) * 1999-12-15 2004-03-02 新光電気工業株式会社 半導体装置の製造方法
US8149346B2 (en) * 2005-10-14 2012-04-03 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
US20070155180A1 (en) * 2006-01-05 2007-07-05 Chunghwa Picture Tubes, Ltd. Thin film etching method
JP4932602B2 (ja) * 2006-11-14 2012-05-16 三菱電機株式会社 多層薄膜パターン及び表示装置の製造方法
US20090173743A1 (en) 2008-01-04 2009-07-09 Ron Devecki Cylinder anti-roll/slide safety device
TWI352431B (en) * 2008-01-08 2011-11-11 Au Optronics Corp Active matrix array structure and manufacturing me
JP2012189726A (ja) * 2011-03-09 2012-10-04 Kobe Steel Ltd Ｔｉ合金バリアメタルを用いた配線膜および電極、並びにＴｉ合金スパッタリングターゲット
US20130207111A1 (en) 2012-02-09 2013-08-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device including semiconductor device, electronic device including semiconductor device, and method for manufacturing semiconductor device
JP2015050374A (ja) * 2013-09-03 2015-03-16 株式会社ジャパンディスプレイ 表示装置およびその製造方法
CN103558945A (zh) * 2013-11-13 2014-02-05 京东方科技集团股份有限公司 一种触控显示装置
KR102617379B1 (ko) * 2016-05-02 2023-12-27 삼성디스플레이 주식회사 유기발광 표시장치 및 이의 제조 방법
CN106057855B (zh) * 2016-05-30 2019-02-19 武汉华星光电技术有限公司 可折叠显示装置及其驱动方法
CN106206614B (zh) * 2016-08-25 2019-03-12 上海天马微电子有限公司 一种柔性显示面板和柔性显示装置
KR102648414B1 (ko) 2016-10-31 2024-03-18 엘지디스플레이 주식회사 인-셀 터치 폴더블 표시 장치
JP2018132589A (ja) * 2017-02-14 2018-08-23 株式会社ジャパンディスプレイ 表示装置
CN106887424B (zh) 2017-03-17 2020-11-24 京东方科技集团股份有限公司 导电图案结构及其制备方法、阵列基板和显示装置
JP2019087552A (ja) * 2017-11-01 2019-06-06 シャープ株式会社 薄膜トランジスタの製造方法、及び、薄膜トランジスタ
KR102480089B1 (ko) * 2017-12-01 2022-12-23 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
CN109459895B (zh) * 2018-12-13 2021-05-14 厦门天马微电子有限公司 显示面板和显示装置
CN109742121B (zh) * 2019-01-10 2023-11-24 京东方科技集团股份有限公司 一种柔性基板及其制备方法、显示装置
CN110462830B (zh) * 2019-06-27 2022-12-06 京东方科技集团股份有限公司 显示基板及其制备方法、显示面板和显示装置
CN110518020B (zh) * 2019-08-30 2022-02-15 武汉天马微电子有限公司 一种显示面板及其制作方法
US11310036B2 (en) 2020-02-26 2022-04-19 International Business Machines Corporation Generation of a secure key exchange authentication request in a computing environment
KR102801361B1 (ko) * 2020-03-16 2025-05-02 삼성디스플레이 주식회사 표시장치
CN111341826B (zh) * 2020-05-21 2020-08-25 京东方科技集团股份有限公司 显示面板和显示装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1086564S1 (en) * 2023-04-13 2025-07-29 Dyson Operations PTE. LTD. Hair clip

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EP3996146A1 (en) 2022-05-11
US20230180563A1 (en) 2023-06-08
EP3996146A4 (en) 2023-03-15
JP7850067B2 (ja) 2026-04-22
US12178102B2 (en) 2024-12-24
WO2021233280A1 (zh) 2021-11-25
CN111341826A (zh) 2020-06-26
CN111341826B (zh) 2020-08-25
JP2023527598A (ja) 2023-06-30

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