JP7850067B2 - 表示パネル及び表示装置 - Google Patents

表示パネル及び表示装置

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Publication number
JP7850067B2
JP7850067B2 JP2022515898A JP2022515898A JP7850067B2 JP 7850067 B2 JP7850067 B2 JP 7850067B2 JP 2022515898 A JP2022515898 A JP 2022515898A JP 2022515898 A JP2022515898 A JP 2022515898A JP 7850067 B2 JP7850067 B2 JP 7850067B2
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JP
Japan
Prior art keywords
conductive
sublayer
conductive member
sub
layer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022515898A
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English (en)
Japanese (ja)
Other versions
JP2023527598A5 (https=
JPWO2021233280A5 (https=
JP2023527598A (ja
Inventor
晨 ▲許▼
勇 ▲喬▼
新▲銀▼ ▲呉▼
永▲達▼ ▲馬▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Beijing BOE Technology Development Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Beijing BOE Technology Development Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by BOE Technology Group Co Ltd, Beijing BOE Technology Development Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of JP2023527598A publication Critical patent/JP2023527598A/ja
Publication of JP2023527598A5 publication Critical patent/JP2023527598A5/ja
Publication of JPWO2021233280A5 publication Critical patent/JPWO2021233280A5/ja
Application granted granted Critical
Publication of JP7850067B2 publication Critical patent/JP7850067B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • H10K59/1795—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
JP2022515898A 2020-05-21 2021-05-18 表示パネル及び表示装置 Active JP7850067B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202010435328.1 2020-05-21
CN202010435328.1A CN111341826B (zh) 2020-05-21 2020-05-21 显示面板和显示装置
PCT/CN2021/094326 WO2021233280A1 (zh) 2020-05-21 2021-05-18 显示面板和显示装置

Publications (4)

Publication Number Publication Date
JP2023527598A JP2023527598A (ja) 2023-06-30
JP2023527598A5 JP2023527598A5 (https=) 2024-05-27
JPWO2021233280A5 JPWO2021233280A5 (https=) 2024-05-27
JP7850067B2 true JP7850067B2 (ja) 2026-04-22

Family

ID=71183031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022515898A Active JP7850067B2 (ja) 2020-05-21 2021-05-18 表示パネル及び表示装置

Country Status (6)

Country Link
US (1) US12178102B2 (https=)
EP (1) EP3996146A4 (https=)
JP (1) JP7850067B2 (https=)
KR (1) KR20230015871A (https=)
CN (1) CN111341826B (https=)
WO (1) WO2021233280A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111341826B (zh) 2020-05-21 2020-08-25 京东方科技集团股份有限公司 显示面板和显示装置
CN112328112B (zh) * 2020-11-10 2024-03-15 京东方科技集团股份有限公司 触控显示面板及其制备方法、触控显示装置
CN113473826B (zh) * 2021-06-09 2022-07-05 荣耀终端有限公司 玻璃基板、显示面板、显示器及电子设备
US12144227B2 (en) * 2021-07-06 2024-11-12 Chengdu Boe Optoelectronics Technology Co., Ltd. Display panel and display apparatus
KR102874688B1 (ko) * 2021-12-16 2025-10-22 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN115175395B (zh) * 2022-06-30 2025-06-10 固安翌光科技有限公司 一种电致发光器件和发光装置
TWI820925B (zh) * 2022-09-22 2023-11-01 友達光電股份有限公司 顯示面板
JP1759412S (ja) * 2023-04-13 2023-12-13 ヘアクリップ

Citations (12)

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JP2000305104A (ja) 1999-04-19 2000-11-02 Hitachi Ltd 液晶表示装置及びその製造方法
JP2001176904A (ja) 1999-12-15 2001-06-29 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP2006135359A (ja) 1998-12-18 2006-05-25 Semiconductor Energy Lab Co Ltd 半導体装置
US20070155180A1 (en) 2006-01-05 2007-07-05 Chunghwa Picture Tubes, Ltd. Thin film etching method
JP2012137771A (ja) 2006-11-14 2012-07-19 Mitsubishi Electric Corp 多層薄膜パターン及び表示装置の製造方法
JP2012189726A (ja) 2011-03-09 2012-10-04 Kobe Steel Ltd Ｔｉ合金バリアメタルを用いた配線膜および電極、並びにＴｉ合金スパッタリングターゲット
US20180120997A1 (en) 2016-10-31 2018-05-03 Lg Display Co., Ltd. Foldable Display Device
JP2018132589A (ja) 2017-02-14 2018-08-23 株式会社ジャパンディスプレイ 表示装置
CN109742121A (zh) 2019-01-10 2019-05-10 京东方科技集团股份有限公司 一种柔性基板及其制备方法、显示装置
US20190171318A1 (en) 2017-12-01 2019-06-06 Samsung Display Co., Ltd. Display apparatus and method of manufacturing the same
JP2019204091A (ja) 2005-10-14 2019-11-28 株式会社半導体エネルギー研究所 表示装置
CN110518020A (zh) 2019-08-30 2019-11-29 上海天马有机发光显示技术有限公司 一种显示面板及其制作方法

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JPH0536842A (ja) * 1991-07-26 1993-02-12 Yamaha Corp 多層配線形成法
US6545359B1 (en) 1998-12-18 2003-04-08 Semiconductor Energy Laboratory Co., Ltd. Wiring line and manufacture process thereof, and semiconductor device and manufacturing process thereof
US20090173743A1 (en) 2008-01-04 2009-07-09 Ron Devecki Cylinder anti-roll/slide safety device
TWI352431B (en) * 2008-01-08 2011-11-11 Au Optronics Corp Active matrix array structure and manufacturing me
US20130207111A1 (en) 2012-02-09 2013-08-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device including semiconductor device, electronic device including semiconductor device, and method for manufacturing semiconductor device
JP2015050374A (ja) * 2013-09-03 2015-03-16 株式会社ジャパンディスプレイ 表示装置およびその製造方法
CN103558945A (zh) * 2013-11-13 2014-02-05 京东方科技集团股份有限公司 一种触控显示装置
KR102617379B1 (ko) * 2016-05-02 2023-12-27 삼성디스플레이 주식회사 유기발광 표시장치 및 이의 제조 방법
CN106057855B (zh) * 2016-05-30 2019-02-19 武汉华星光电技术有限公司 可折叠显示装置及其驱动方法
CN106206614B (zh) * 2016-08-25 2019-03-12 上海天马微电子有限公司 一种柔性显示面板和柔性显示装置
CN106887424B (zh) 2017-03-17 2020-11-24 京东方科技集团股份有限公司 导电图案结构及其制备方法、阵列基板和显示装置
JP2019087552A (ja) * 2017-11-01 2019-06-06 シャープ株式会社 薄膜トランジスタの製造方法、及び、薄膜トランジスタ
CN109459895B (zh) * 2018-12-13 2021-05-14 厦门天马微电子有限公司 显示面板和显示装置
CN110462830B (zh) * 2019-06-27 2022-12-06 京东方科技集团股份有限公司 显示基板及其制备方法、显示面板和显示装置
US11310036B2 (en) 2020-02-26 2022-04-19 International Business Machines Corporation Generation of a secure key exchange authentication request in a computing environment
KR102801361B1 (ko) * 2020-03-16 2025-05-02 삼성디스플레이 주식회사 표시장치
CN111341826B (zh) * 2020-05-21 2020-08-25 京东方科技集团股份有限公司 显示面板和显示装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006135359A (ja) 1998-12-18 2006-05-25 Semiconductor Energy Lab Co Ltd 半導体装置
JP2000305104A (ja) 1999-04-19 2000-11-02 Hitachi Ltd 液晶表示装置及びその製造方法
JP2001176904A (ja) 1999-12-15 2001-06-29 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP2019204091A (ja) 2005-10-14 2019-11-28 株式会社半導体エネルギー研究所 表示装置
US20070155180A1 (en) 2006-01-05 2007-07-05 Chunghwa Picture Tubes, Ltd. Thin film etching method
JP2012137771A (ja) 2006-11-14 2012-07-19 Mitsubishi Electric Corp 多層薄膜パターン及び表示装置の製造方法
JP2012189726A (ja) 2011-03-09 2012-10-04 Kobe Steel Ltd Ｔｉ合金バリアメタルを用いた配線膜および電極、並びにＴｉ合金スパッタリングターゲット
US20180120997A1 (en) 2016-10-31 2018-05-03 Lg Display Co., Ltd. Foldable Display Device
JP2018132589A (ja) 2017-02-14 2018-08-23 株式会社ジャパンディスプレイ 表示装置
US20190171318A1 (en) 2017-12-01 2019-06-06 Samsung Display Co., Ltd. Display apparatus and method of manufacturing the same
CN109742121A (zh) 2019-01-10 2019-05-10 京东方科技集团股份有限公司 一种柔性基板及其制备方法、显示装置
CN110518020A (zh) 2019-08-30 2019-11-29 上海天马有机发光显示技术有限公司 一种显示面板及其制作方法

Also Published As

Publication number Publication date
EP3996146A1 (en) 2022-05-11
US20230180563A1 (en) 2023-06-08
EP3996146A4 (en) 2023-03-15
KR20230015871A (ko) 2023-01-31
US12178102B2 (en) 2024-12-24
WO2021233280A1 (zh) 2021-11-25
CN111341826A (zh) 2020-06-26
CN111341826B (zh) 2020-08-25
JP2023527598A (ja) 2023-06-30

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