KR20220156442A - 드레서 보드 - Google Patents

드레서 보드 Download PDF

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Publication number
KR20220156442A
KR20220156442A KR1020220056330A KR20220056330A KR20220156442A KR 20220156442 A KR20220156442 A KR 20220156442A KR 1020220056330 A KR1020220056330 A KR 1020220056330A KR 20220056330 A KR20220056330 A KR 20220056330A KR 20220156442 A KR20220156442 A KR 20220156442A
Authority
KR
South Korea
Prior art keywords
dresser board
cutting
dressing
axis direction
dresser
Prior art date
Application number
KR1020220056330A
Other languages
English (en)
Korean (ko)
Inventor
아유무 오카노
쥰이치 후쿠하라
최정호
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20220156442A publication Critical patent/KR20220156442A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Sampling And Sample Adjustment (AREA)
KR1020220056330A 2021-05-18 2022-05-09 드레서 보드 KR20220156442A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2021-084027 2021-05-18
JP2021084027A JP2022177625A (ja) 2021-05-18 2021-05-18 ドレッサーボード

Publications (1)

Publication Number Publication Date
KR20220156442A true KR20220156442A (ko) 2022-11-25

Family

ID=84060765

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220056330A KR20220156442A (ko) 2021-05-18 2022-05-09 드레서 보드

Country Status (4)

Country Link
JP (1) JP2022177625A (ja)
KR (1) KR20220156442A (ja)
CN (1) CN115366009A (ja)
TW (1) TW202245985A (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011016175A (ja) 2009-07-07 2011-01-27 Disco Abrasive Syst Ltd 切削装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011016175A (ja) 2009-07-07 2011-01-27 Disco Abrasive Syst Ltd 切削装置

Also Published As

Publication number Publication date
JP2022177625A (ja) 2022-12-01
TW202245985A (zh) 2022-12-01
CN115366009A (zh) 2022-11-22

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