KR20220122296A - 전자 어셈블리 및 이를 제조하는 방법 - Google Patents

전자 어셈블리 및 이를 제조하는 방법 Download PDF

Info

Publication number
KR20220122296A
KR20220122296A KR1020210026758A KR20210026758A KR20220122296A KR 20220122296 A KR20220122296 A KR 20220122296A KR 1020210026758 A KR1020210026758 A KR 1020210026758A KR 20210026758 A KR20210026758 A KR 20210026758A KR 20220122296 A KR20220122296 A KR 20220122296A
Authority
KR
South Korea
Prior art keywords
electronic assembly
layer
circuit board
semiconductor integrated
metal foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020210026758A
Other languages
English (en)
Korean (ko)
Inventor
공지웅
서정주
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 캄파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 캄파니
Priority to KR1020210026758A priority Critical patent/KR20220122296A/ko
Priority to US18/278,681 priority patent/US12604737B2/en
Priority to JP2023551976A priority patent/JP2024508822A/ja
Priority to PCT/IB2022/050766 priority patent/WO2022180461A1/en
Publication of KR20220122296A publication Critical patent/KR20220122296A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • H01L23/552—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H01L23/3128—
    • H01L23/3135—
    • H01L23/3164—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/42—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/435—Cross-sectional shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
KR1020210026758A 2021-02-26 2021-02-26 전자 어셈블리 및 이를 제조하는 방법 Pending KR20220122296A (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020210026758A KR20220122296A (ko) 2021-02-26 2021-02-26 전자 어셈블리 및 이를 제조하는 방법
US18/278,681 US12604737B2 (en) 2021-02-26 2022-01-28 Electronic assembly comprising metal foil layer exposing solder bumps and method for fabricating the same
JP2023551976A JP2024508822A (ja) 2021-02-26 2022-01-28 電子アセンブリ及びその作製方法
PCT/IB2022/050766 WO2022180461A1 (en) 2021-02-26 2022-01-28 Electronic assembly and method for fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020210026758A KR20220122296A (ko) 2021-02-26 2021-02-26 전자 어셈블리 및 이를 제조하는 방법

Publications (1)

Publication Number Publication Date
KR20220122296A true KR20220122296A (ko) 2022-09-02

Family

ID=83048695

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210026758A Pending KR20220122296A (ko) 2021-02-26 2021-02-26 전자 어셈블리 및 이를 제조하는 방법

Country Status (4)

Country Link
US (1) US12604737B2 (https=)
JP (1) JP2024508822A (https=)
KR (1) KR20220122296A (https=)
WO (1) WO2022180461A1 (https=)

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7576415B2 (en) 2007-06-15 2009-08-18 Advanced Semiconductor Engineering, Inc. EMI shielded semiconductor package
US9282630B2 (en) 2012-04-30 2016-03-08 Apple Inc. Method of forming a conformal electromagnetic interference shield
KR20140066518A (ko) 2012-11-23 2014-06-02 삼성전자주식회사 반도체 장치 및 그 제조 방법
US9484313B2 (en) 2013-02-27 2016-11-01 Advanced Semiconductor Engineering, Inc. Semiconductor packages with thermal-enhanced conformal shielding and related methods
US9461025B2 (en) 2013-03-12 2016-10-04 Taiwan Semiconductor Manfacturing Company, Ltd. Electric magnetic shielding structure in packages
US9337073B2 (en) 2013-03-12 2016-05-10 Taiwan Semiconductor Manufacturing Company, Ltd. 3D shielding case and methods for forming the same
KR102251001B1 (ko) * 2014-06-26 2021-05-12 삼성전자주식회사 반도체 패키지
US9269673B1 (en) * 2014-10-22 2016-02-23 Advanced Semiconductor Engineering, Inc. Semiconductor device packages
WO2016111512A1 (en) 2015-01-09 2016-07-14 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing the same
US10586746B2 (en) 2016-01-14 2020-03-10 Chip Solutions, LLC Semiconductor device and method
KR101712288B1 (ko) * 2015-11-12 2017-03-03 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
US9907179B2 (en) * 2016-04-25 2018-02-27 Tdk Corporation Electronic circuit package
KR101858952B1 (ko) 2016-05-13 2018-05-18 주식회사 네패스 반도체 패키지 및 이의 제조 방법
KR101896435B1 (ko) 2016-11-09 2018-09-07 엔트리움 주식회사 전자파차폐용 전자부품 패키지 및 그의 제조방법
TWI612638B (zh) * 2017-01-25 2018-01-21 Siliconware Precision Industries Co., Ltd. 電子封裝件及其製法
KR101824726B1 (ko) * 2017-02-23 2018-02-01 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US10388611B2 (en) * 2017-03-13 2019-08-20 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming magnetic field shielding with ferromagnetic material
US10332862B2 (en) * 2017-09-07 2019-06-25 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method for manufacturing the same
KR101905333B1 (ko) 2017-10-19 2018-10-05 앰코테크놀로지코리아(주) 반도체 디바이스
KR102504293B1 (ko) * 2017-11-29 2023-02-27 삼성전자 주식회사 패키지 온 패키지 형태의 반도체 패키지
JP6590327B2 (ja) 2018-02-22 2019-10-16 サムソン エレクトロ−メカニックス カンパニーリミテッド． コイル部品
KR102047604B1 (ko) 2018-02-22 2019-11-21 삼성전기주식회사 코일 부품
US10937741B2 (en) * 2018-11-16 2021-03-02 STATS ChipPAC Pte. Ltd. Molded laser package with electromagnetic interference shield and method of making
DE102019202718B4 (de) * 2019-02-28 2020-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Dünnes Dual-Folienpackage und Verfahren zum Herstellen desselben
KR102212079B1 (ko) 2019-03-22 2021-02-04 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전자 어셈블리, 이를 포함하는 전자 장치 및 전자 어셈블리를 제작하는 방법

Also Published As

Publication number Publication date
US20240063139A1 (en) 2024-02-22
JP2024508822A (ja) 2024-02-28
US12604737B2 (en) 2026-04-14
WO2022180461A1 (en) 2022-09-01

Similar Documents

Publication Publication Date Title
US10490512B2 (en) Method of making plural electronic component modules
US9144183B2 (en) EMI compartment shielding structure and fabricating method thereof
TWI387070B (zh) 晶片封裝體及其製作方法
US8212340B2 (en) Chip package and manufacturing method thereof
CN102074552B (zh) 半导体元件封装及其制作方法
TWI553825B (zh) 堆疊式封裝模組與其製造方法
US9362209B1 (en) Shielding technique for semiconductor package including metal lid
US8822844B1 (en) Shielding and potting for electrical circuits
CN110349919A (zh) 电子器件模块及制造该电子器件模块的方法
US20170186698A1 (en) Electronic package having electromagnetic interference shielding and associated method
KR20180107877A (ko) 반도체 패키지 및 그의 제조 방법
US20090032300A1 (en) Method of and apparatus for providing an RF shield on an electronic component
CN104347595B (zh) 电子封装模块及其制造方法
EP2849227A1 (en) Chip package and packaging method
KR102937771B1 (ko) 반도체 패키지 및 그 제조방법
US12495501B2 (en) Module
KR20220122296A (ko) 전자 어셈블리 및 이를 제조하는 방법
CN105720016B (zh) 半导体衬底、半导体封装结构和其制造方法
KR101350610B1 (ko) 반도체 패키지
CN105023851A (zh) 电子封装模块的制造方法
CN106653734B (zh) 具有电磁干扰屏蔽的半导体装置及其制造方法
KR102060307B1 (ko) 반도체 패키지
TWI526152B (zh) 電子模組及其製造方法
US20240178155A1 (en) Multilevel package substrate with box shield
CN103928443B (zh) 堆叠式封装模块与其制造方法、电子装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000