KR20220048933A - 절삭 장치 - Google Patents

절삭 장치 Download PDF

Info

Publication number
KR20220048933A
KR20220048933A KR1020210122851A KR20210122851A KR20220048933A KR 20220048933 A KR20220048933 A KR 20220048933A KR 1020210122851 A KR1020210122851 A KR 1020210122851A KR 20210122851 A KR20210122851 A KR 20210122851A KR 20220048933 A KR20220048933 A KR 20220048933A
Authority
KR
South Korea
Prior art keywords
cutting
wafer
water
chuck table
nozzle
Prior art date
Application number
KR1020210122851A
Other languages
English (en)
Korean (ko)
Inventor
마사노리 미사이즈
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20220048933A publication Critical patent/KR20220048933A/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020210122851A 2020-10-13 2021-09-15 절삭 장치 KR20220048933A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2020-172503 2020-10-13
JP2020172503A JP2022064024A (ja) 2020-10-13 2020-10-13 切削装置

Publications (1)

Publication Number Publication Date
KR20220048933A true KR20220048933A (ko) 2022-04-20

Family

ID=81096165

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210122851A KR20220048933A (ko) 2020-10-13 2021-09-15 절삭 장치

Country Status (4)

Country Link
JP (1) JP2022064024A (ja)
KR (1) KR20220048933A (ja)
CN (1) CN114347284A (ja)
TW (1) TW202215574A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7262152B1 (ja) 2022-06-10 2023-04-21 株式会社佐竹製作所 研磨機及び研磨加工における冷却方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001135596A (ja) 1999-11-09 2001-05-18 Disco Abrasive Syst Ltd 水没式切削装置
JP2005222990A (ja) 2004-02-03 2005-08-18 Disco Abrasive Syst Ltd 切削装置および切削方法
JP2017094455A (ja) 2015-11-25 2017-06-01 株式会社ディスコ 切削装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001135596A (ja) 1999-11-09 2001-05-18 Disco Abrasive Syst Ltd 水没式切削装置
JP2005222990A (ja) 2004-02-03 2005-08-18 Disco Abrasive Syst Ltd 切削装置および切削方法
JP2017094455A (ja) 2015-11-25 2017-06-01 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
CN114347284A (zh) 2022-04-15
TW202215574A (zh) 2022-04-16
JP2022064024A (ja) 2022-04-25

Similar Documents

Publication Publication Date Title
JP7347986B2 (ja) エッジトリミング装置
JP5437034B2 (ja) 切削装置
KR102182562B1 (ko) 블레이드 커버 장치
JP2006231474A (ja) 切削装置
KR20220048933A (ko) 절삭 장치
CN110576522B (zh) 切削装置
JP6847525B2 (ja) 切削装置
JP4721968B2 (ja) スピンナ洗浄装置
JP5875331B2 (ja) 切削装置
JP2019118982A (ja) 被加工物の切削方法及び切削装置のチャックテーブル
JP5389473B2 (ja) スピンナ洗浄装置
JP2003234308A (ja) 切削装置
JP7273610B2 (ja) スピンドルユニット
CN111438085B (zh) 清洗机构
KR102631487B1 (ko) 가공 방법
JP4481668B2 (ja) 切削装置
JP5695359B2 (ja) 加工装置
JP7299773B2 (ja) 研削装置
JP7312058B2 (ja) 測定治具と水圧分布の測定方法
US20230234182A1 (en) Chuck table and grinding apparatus
CN117219535A (zh) 毛边去除装置和切削装置
JP2006073828A (ja) ダイシング装置
JP2023015609A (ja) 被加工物の切削方法
JP2023101963A (ja) 洗浄装置
JP2022163856A (ja) 搬送装置

Legal Events

Date Code Title Description
A201 Request for examination