KR20220003599A - 탑재대 및 탑재대의 제작 방법 - Google Patents
탑재대 및 탑재대의 제작 방법 Download PDFInfo
- Publication number
- KR20220003599A KR20220003599A KR1020217039218A KR20217039218A KR20220003599A KR 20220003599 A KR20220003599 A KR 20220003599A KR 1020217039218 A KR1020217039218 A KR 1020217039218A KR 20217039218 A KR20217039218 A KR 20217039218A KR 20220003599 A KR20220003599 A KR 20220003599A
- Authority
- KR
- South Korea
- Prior art keywords
- top plate
- flow path
- forming member
- path forming
- stage
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 24
- 239000003507 refrigerant Substances 0.000 claims abstract description 72
- 238000007689 inspection Methods 0.000 claims abstract description 40
- 239000011521 glass Substances 0.000 claims abstract description 29
- 239000010703 silicon Substances 0.000 claims abstract description 11
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 239000002826 coolant Substances 0.000 claims description 17
- 238000012360 testing method Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000005368 silicate glass Substances 0.000 claims description 4
- 238000007743 anodising Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 65
- 238000001816 cooling Methods 0.000 description 34
- 239000000523 sample Substances 0.000 description 25
- 239000000758 substrate Substances 0.000 description 18
- 239000013078 crystal Substances 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 238000009413 insulation Methods 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 7
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 229910052878 cordierite Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Environmental & Geological Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019090104A JP7336256B2 (ja) | 2019-05-10 | 2019-05-10 | 載置台及び載置台の作製方法 |
JPJP-P-2019-090104 | 2019-05-10 | ||
PCT/JP2020/018444 WO2020230674A1 (ja) | 2019-05-10 | 2020-05-01 | 載置台及び載置台の作製方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20220003599A true KR20220003599A (ko) | 2022-01-10 |
Family
ID=73220997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020217039218A KR20220003599A (ko) | 2019-05-10 | 2020-05-01 | 탑재대 및 탑재대의 제작 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7336256B2 (zh) |
KR (1) | KR20220003599A (zh) |
CN (1) | CN113767461B (zh) |
WO (1) | WO2020230674A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021188947A (ja) * | 2020-05-27 | 2021-12-13 | 株式会社日本マイクロニクス | 光学的接続子保持構造及び接続装置 |
EP4276632A1 (en) | 2021-03-23 | 2023-11-15 | Kioxia Corporation | Cassette housing, prober, server rack, and storage system |
JP2022154237A (ja) * | 2021-03-30 | 2022-10-13 | 東京エレクトロン株式会社 | Ledチャック |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018151369A (ja) | 2016-11-29 | 2018-09-27 | 東京エレクトロン株式会社 | 載置台及び電子デバイス検査装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101098798B1 (ko) * | 2004-05-26 | 2011-12-26 | 쿄세라 코포레이션 | 히터와 웨이퍼 가열장치 및 히터의 제조방법 |
CN101176001A (zh) * | 2005-05-19 | 2008-05-07 | 柯尼卡美能达医疗印刷器材株式会社 | 用于分析被检体中目标物质的检查芯片和微型综合分析系统 |
JP2007035747A (ja) * | 2005-07-25 | 2007-02-08 | Sumitomo Electric Ind Ltd | ウェハ保持体およびそれを搭載したウェハプローバ |
JP4877748B2 (ja) * | 2006-03-31 | 2012-02-15 | 東京エレクトロン株式会社 | 基板処理装置および処理ガス吐出機構 |
JP2008215976A (ja) * | 2007-03-02 | 2008-09-18 | Nikon Corp | 基板検査装置 |
JP5688203B2 (ja) * | 2007-11-01 | 2015-03-25 | 株式会社半導体エネルギー研究所 | 半導体基板の作製方法 |
JP2010080673A (ja) * | 2008-09-26 | 2010-04-08 | Tokyo Electron Ltd | 載置台 |
JP5957852B2 (ja) | 2011-11-10 | 2016-07-27 | 株式会社ソシオネクスト | 半導体装置の検査装置及び検査方法 |
JP2014183151A (ja) * | 2013-03-19 | 2014-09-29 | Seiko Epson Corp | モジュール、モジュールの製造方法、電子機器、および移動体 |
JP6152010B2 (ja) * | 2013-08-08 | 2017-06-21 | 株式会社Screenホールディングス | 光照射装置および光照射方法 |
JP6386923B2 (ja) * | 2015-01-26 | 2018-09-05 | 三菱電機株式会社 | 半導体評価装置およびチャックステージの検査方法 |
US9728430B2 (en) * | 2015-06-29 | 2017-08-08 | Varian Semiconductor Equipment Associates, Inc. | Electrostatic chuck with LED heating |
JP2018026498A (ja) * | 2016-08-12 | 2018-02-15 | 日東電工株式会社 | 半導体パッケージのマスキング方法 |
CN109983350B (zh) * | 2016-11-29 | 2022-02-22 | 东京毅力科创株式会社 | 载置台和电子器件测试装置 |
-
2019
- 2019-05-10 JP JP2019090104A patent/JP7336256B2/ja active Active
-
2020
- 2020-05-01 KR KR1020217039218A patent/KR20220003599A/ko not_active Application Discontinuation
- 2020-05-01 WO PCT/JP2020/018444 patent/WO2020230674A1/ja active Application Filing
- 2020-05-01 CN CN202080033045.2A patent/CN113767461B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018151369A (ja) | 2016-11-29 | 2018-09-27 | 東京エレクトロン株式会社 | 載置台及び電子デバイス検査装置 |
Also Published As
Publication number | Publication date |
---|---|
JP7336256B2 (ja) | 2023-08-31 |
JP2020188076A (ja) | 2020-11-19 |
WO2020230674A1 (ja) | 2020-11-19 |
CN113767461B (zh) | 2024-01-23 |
CN113767461A (zh) | 2021-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR20220003599A (ko) | 탑재대 및 탑재대의 제작 방법 | |
JP6994313B2 (ja) | 載置台及び電子デバイス検査装置 | |
US11340283B2 (en) | Testing device | |
WO2018100881A1 (ja) | 載置台及び電子デバイス検査装置 | |
WO2019225332A1 (ja) | 検査装置及び温度制御方法 | |
US11169204B2 (en) | Temperature control device, temperature control method, and inspection apparatus | |
JP7304722B2 (ja) | 温度制御装置、温度制御方法、および検査装置 | |
US11221358B2 (en) | Placement stand and electronic device inspecting apparatus | |
Hanss et al. | Reliability of sintered and soldered high power chip size packages and flip chip LEDs | |
JP7213080B2 (ja) | 載置台 | |
JP2024052751A (ja) | 載置台及び検査装置 | |
US20090174422A1 (en) | Probe Card and Manufacturing Method Thereof | |
KR102524161B1 (ko) | 탑재대, 검사 장치 및 탑재대의 온도 조정 방법 | |
JP7474678B2 (ja) | 載置台、検査装置及び検査方法 | |
WO2023234049A1 (ja) | 検査装置及び載置台 | |
JP2022032473A (ja) | 検査方法及び検査装置 | |
JP2023177195A (ja) | 検査装置及び載置台 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
E902 | Notification of reason for refusal |