KR20210075027A - 냉각 장치, 냉각 방법 및 반도체 패키지의 제조 방법 - Google Patents
냉각 장치, 냉각 방법 및 반도체 패키지의 제조 방법 Download PDFInfo
- Publication number
- KR20210075027A KR20210075027A KR1020200173289A KR20200173289A KR20210075027A KR 20210075027 A KR20210075027 A KR 20210075027A KR 1020200173289 A KR1020200173289 A KR 1020200173289A KR 20200173289 A KR20200173289 A KR 20200173289A KR 20210075027 A KR20210075027 A KR 20210075027A
- Authority
- KR
- South Korea
- Prior art keywords
- cooling
- substrate
- calibration
- cooling position
- board
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 302
- 238000000034 method Methods 0.000 title claims abstract description 86
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 275
- 230000008569 process Effects 0.000 claims description 69
- 238000012937 correction Methods 0.000 claims description 38
- 230000007246 mechanism Effects 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 11
- 230000001105 regulatory effect Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims 4
- 230000001276 controlling effect Effects 0.000 claims 2
- 238000012545 processing Methods 0.000 description 28
- 238000010586 diagram Methods 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 238000001035 drying Methods 0.000 description 13
- 239000011521 glass Substances 0.000 description 9
- 239000003507 refrigerant Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 230000018109 developmental process Effects 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Drying Of Solid Materials (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019224332A JP2021093479A (ja) | 2019-12-12 | 2019-12-12 | 冷却装置、冷却方法および半導体パッケージの製造方法 |
JPJP-P-2019-224332 | 2019-12-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20210075027A true KR20210075027A (ko) | 2021-06-22 |
Family
ID=76312741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020200173289A KR20210075027A (ko) | 2019-12-12 | 2020-12-11 | 냉각 장치, 냉각 방법 및 반도체 패키지의 제조 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2021093479A (zh) |
KR (1) | KR20210075027A (zh) |
CN (1) | CN112992727A (zh) |
TW (1) | TW202129741A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022185703A (ja) | 2021-06-03 | 2022-12-15 | 株式会社やまびこ | 草刈機、グラウンド整備システムおよびグラウンド整備方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08274148A (ja) * | 1995-01-30 | 1996-10-18 | Sony Corp | 基体固定装置及び基体の固定方法 |
JP4513960B2 (ja) * | 2004-10-22 | 2010-07-28 | セイコーエプソン株式会社 | スリットコート式塗布装置及びスリットコート式塗布方法 |
JP4485374B2 (ja) * | 2005-01-25 | 2010-06-23 | 東京エレクトロン株式会社 | 冷却処理装置 |
KR100842060B1 (ko) * | 2007-02-12 | 2008-06-30 | (주)지티엔이 | 웨이퍼 교정 장치를 갖는 반도체 가열 및 냉각 시스템 |
JP2008306016A (ja) * | 2007-06-08 | 2008-12-18 | Tokyo Ohka Kogyo Co Ltd | 温調装置 |
JP6436828B2 (ja) * | 2015-03-26 | 2018-12-12 | 株式会社テックインテック | 熱処理装置 |
JP2017224687A (ja) * | 2016-06-14 | 2017-12-21 | 株式会社ジェイデバイス | 半導体パッケージの製造方法 |
JP6284996B1 (ja) * | 2016-11-04 | 2018-02-28 | Towa株式会社 | 検査方法、樹脂封止装置、樹脂封止方法及び樹脂封止品の製造方法 |
-
2019
- 2019-12-12 JP JP2019224332A patent/JP2021093479A/ja active Pending
-
2020
- 2020-12-07 TW TW109142978A patent/TW202129741A/zh unknown
- 2020-12-11 CN CN202011458722.3A patent/CN112992727A/zh active Pending
- 2020-12-11 KR KR1020200173289A patent/KR20210075027A/ko unknown
Also Published As
Publication number | Publication date |
---|---|
TW202129741A (zh) | 2021-08-01 |
CN112992727A (zh) | 2021-06-18 |
JP2021093479A (ja) | 2021-06-17 |
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