KR20210043567A - 주석 합금 전기 도금욕 및 그것을 사용한 도금 방법 - Google Patents

주석 합금 전기 도금욕 및 그것을 사용한 도금 방법 Download PDF

Info

Publication number
KR20210043567A
KR20210043567A KR1020217002953A KR20217002953A KR20210043567A KR 20210043567 A KR20210043567 A KR 20210043567A KR 1020217002953 A KR1020217002953 A KR 1020217002953A KR 20217002953 A KR20217002953 A KR 20217002953A KR 20210043567 A KR20210043567 A KR 20210043567A
Authority
KR
South Korea
Prior art keywords
plating
nickel
tin alloy
acid
tin
Prior art date
Application number
KR1020217002953A
Other languages
English (en)
Korean (ko)
Inventor
유타카 모리
고 나가타
사토시 유아사
Original Assignee
딥솔 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 딥솔 가부시키가이샤 filed Critical 딥솔 가부시키가이샤
Publication of KR20210043567A publication Critical patent/KR20210043567A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020217002953A 2018-08-21 2019-07-12 주석 합금 전기 도금욕 및 그것을 사용한 도금 방법 KR20210043567A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-154703 2018-08-21
JP2018154703A JP7121390B2 (ja) 2018-08-21 2018-08-21 すず合金電気めっき浴及びそれを用いためっき方法
PCT/JP2019/027743 WO2020039791A1 (ja) 2018-08-21 2019-07-12 すず合金電気めっき浴及びそれを用いためっき方法

Publications (1)

Publication Number Publication Date
KR20210043567A true KR20210043567A (ko) 2021-04-21

Family

ID=69592564

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217002953A KR20210043567A (ko) 2018-08-21 2019-07-12 주석 합금 전기 도금욕 및 그것을 사용한 도금 방법

Country Status (6)

Country Link
US (1) US20210317591A1 (ja)
EP (1) EP3842572A4 (ja)
JP (1) JP7121390B2 (ja)
KR (1) KR20210043567A (ja)
CN (1) CN112513337A (ja)
WO (1) WO2020039791A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114318433A (zh) * 2021-10-28 2022-04-12 中国航发西安动力控制科技有限公司 一种镀锡、除锡溶液配方及在零件表面镀锡的工艺

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6029482A (ja) 1983-07-28 1985-02-14 Nippon Kagaku Sangyo Kk 錫及び錫合金電気めつき液
EP0770709B1 (en) * 1995-10-25 2000-04-12 Tosoh Corporation Low hydrogen over voltage cathode and process for production thereof
JPH09241885A (ja) 1996-03-11 1997-09-16 Okuno Chem Ind Co Ltd 錫−コバルト合金メッキ浴
JP3425645B2 (ja) * 1997-11-19 2003-07-14 石原薬品株式会社 スズ及びスズ合金メッキ浴、当該メッキ浴の管理方法及び調製方法
GB0106131D0 (en) * 2001-03-13 2001-05-02 Macdermid Plc Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
US20050173255A1 (en) * 2004-02-05 2005-08-11 George Bokisa Electroplated quaternary alloys
JP2006009039A (ja) 2004-06-21 2006-01-12 Rambo Chemicals (Hong Kong) Ltd ウィスカー成長が抑制されたスズ系めっき皮膜及びその形成方法
JP5642928B2 (ja) 2007-12-12 2014-12-17 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 青銅の電気めっき
JP5396583B2 (ja) 2008-02-07 2014-01-22 石原ケミカル株式会社 電気スズ又はスズ合金メッキ浴、当該メッキ皮膜を形成した電子部品
JP5150016B2 (ja) * 2009-05-12 2013-02-20 石原薬品株式会社 スズ又はスズ合金メッキ浴、及び当該メッキ浴を用いたバレルメッキ方法
JP5412612B2 (ja) 2011-08-22 2014-02-12 石原ケミカル株式会社 スズ及びスズ合金メッキ浴、当該浴により電着皮膜を形成した電子部品
JP6145671B2 (ja) 2012-12-24 2017-06-14 石原ケミカル株式会社 スズ又はスズ合金メッキ浴及び当該メッキ浴を用いて皮膜形成した電子部品
JP7009679B2 (ja) * 2015-07-29 2022-01-26 石原ケミカル株式会社 電気スズ及び電気スズ合金メッキ浴、当該メッキ浴を用いた電着物の形成方法

Also Published As

Publication number Publication date
JP2020029582A (ja) 2020-02-27
JP7121390B2 (ja) 2022-08-18
CN112513337A (zh) 2021-03-16
EP3842572A1 (en) 2021-06-30
EP3842572A4 (en) 2022-05-18
WO2020039791A1 (ja) 2020-02-27
US20210317591A1 (en) 2021-10-14

Similar Documents

Publication Publication Date Title
US5039576A (en) Electrodeposited eutectic tin-bismuth alloy on a conductive substrate
KR101532559B1 (ko) 청동 전기도금
US6652731B2 (en) Plating bath and method for depositing a metal layer on a substrate
EP1300488B1 (en) Plating path and method for depositing a metal layer on a substrate
EP1716949B1 (en) Immersion method
JP4812365B2 (ja) 錫電気めっき液および錫電気めっき方法
EP1308540B1 (en) Plating bath and method for depositing a metal layer on a substrate
CA2275214C (en) Process to electrolytically deposit copper layers
US20110089043A1 (en) Modified copper-tin electrolyte and process for the deposition of bronze layers
KR20110003519A (ko) Ｐｄ 및 Ｐｄ-Ｎｉ 전해질 욕조
JPH0471292A (ja) 印刷回路用銅箔及びその表面処理方法
KR20140033908A (ko) 니켈 도금액, 및 이를 이용한 니켈 도금층 형성 방법
EP0663460A1 (en) Tin-zinc alloy electroplating bath and method for electroplating using the same
KR20210043567A (ko) 주석 합금 전기 도금욕 및 그것을 사용한 도금 방법
JP2003027277A (ja) スズメッキ浴、スズメッキ方法及び当該メッキ浴を用いてスズメッキを施した電子部品
US4265715A (en) Silver electrodeposition process
EP0397663B1 (en) Electrodeposition of tin-bismuth alloys
JP6621169B2 (ja) めっき品の製造方法
JP2023030496A (ja) アルミニウム材上への熱処理式の導電性皮膜形成方法
JPH0742595B2 (ja) 変調電流電解用の光沢スズ系金属めっき液
JP4817166B2 (ja) スズ−銅合金めっき液
JP2010150606A (ja) 電解再生式の無電解スズメッキ方法