KR20210011395A - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR20210011395A
KR20210011395A KR1020207035452A KR20207035452A KR20210011395A KR 20210011395 A KR20210011395 A KR 20210011395A KR 1020207035452 A KR1020207035452 A KR 1020207035452A KR 20207035452 A KR20207035452 A KR 20207035452A KR 20210011395 A KR20210011395 A KR 20210011395A
Authority
KR
South Korea
Prior art keywords
cooling
chamber
temperature
cooling body
heat treatment
Prior art date
Application number
KR1020207035452A
Other languages
English (en)
Korean (ko)
Inventor
켄이치 시게토미
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20210011395A publication Critical patent/KR20210011395A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020207035452A 2018-05-21 2019-05-08 기판 처리 장치 KR20210011395A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-097196 2018-05-21
JP2018097196 2018-05-21
PCT/JP2019/018443 WO2019225319A1 (ja) 2018-05-21 2019-05-08 基板処理装置

Publications (1)

Publication Number Publication Date
KR20210011395A true KR20210011395A (ko) 2021-02-01

Family

ID=68617296

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207035452A KR20210011395A (ko) 2018-05-21 2019-05-08 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP6937906B2 (ja)
KR (1) KR20210011395A (ja)
CN (1) CN112119482B (ja)
WO (1) WO2019225319A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002228375A (ja) 2001-01-26 2002-08-14 Tokyo Electron Ltd 加熱処理装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164333A (ja) * 2000-11-27 2002-06-07 Tokyo Electron Ltd 熱処理装置
JP2004079677A (ja) * 2002-08-13 2004-03-11 Dainippon Screen Mfg Co Ltd 熱処理装置
JP4519037B2 (ja) * 2005-08-31 2010-08-04 東京エレクトロン株式会社 加熱装置及び塗布、現像装置
JP4781192B2 (ja) * 2006-07-31 2011-09-28 大日本スクリーン製造株式会社 ロードロック装置、それを備えた基板処理装置および基板処理システム
JP2008244224A (ja) * 2007-03-28 2008-10-09 Sumitomo Precision Prod Co Ltd プラズマ処理装置
JP2009176862A (ja) * 2008-01-23 2009-08-06 Sokudo Co Ltd 基板処理装置
JP2010182906A (ja) * 2009-02-06 2010-08-19 Tokyo Electron Ltd 基板処理装置
JP5322847B2 (ja) * 2009-08-20 2013-10-23 東京エレクトロン株式会社 加熱処理装置及び熱処理装置
JP5107318B2 (ja) * 2009-08-24 2012-12-26 東京エレクトロン株式会社 加熱処理装置
JP5501193B2 (ja) * 2010-10-26 2014-05-21 東京エレクトロン株式会社 基板処理装置
JP3180048U (ja) * 2012-09-20 2012-11-29 東京エレクトロン株式会社 熱処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002228375A (ja) 2001-01-26 2002-08-14 Tokyo Electron Ltd 加熱処理装置

Also Published As

Publication number Publication date
CN112119482A (zh) 2020-12-22
JPWO2019225319A1 (ja) 2021-05-27
JP6937906B2 (ja) 2021-09-22
CN112119482B (zh) 2023-09-05
WO2019225319A1 (ja) 2019-11-28

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