KR20200136308A - 워크 캐리어 및 워크 캐리어의 제조 방법 - Google Patents
워크 캐리어 및 워크 캐리어의 제조 방법 Download PDFInfo
- Publication number
- KR20200136308A KR20200136308A KR1020200049524A KR20200049524A KR20200136308A KR 20200136308 A KR20200136308 A KR 20200136308A KR 1020200049524 A KR1020200049524 A KR 1020200049524A KR 20200049524 A KR20200049524 A KR 20200049524A KR 20200136308 A KR20200136308 A KR 20200136308A
- Authority
- KR
- South Korea
- Prior art keywords
- work
- carrier
- carrier substrate
- holding hole
- concave portion
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims abstract description 83
- 229920005989 resin Polymers 0.000 claims abstract description 76
- 239000011347 resin Substances 0.000 claims abstract description 76
- 238000005520 cutting process Methods 0.000 claims description 25
- 238000001746 injection moulding Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 10
- 238000009751 slip forming Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 description 47
- 239000000463 material Substances 0.000 description 27
- 229920003002 synthetic resin Polymers 0.000 description 18
- 239000000057 synthetic resin Substances 0.000 description 18
- 238000005498 polishing Methods 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- -1 polyethylene terephthalate Polymers 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
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- 239000007924 injection Substances 0.000 description 5
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- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910001315 Tool steel Inorganic materials 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
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- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011151 fibre-reinforced plastic Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 125000005487 naphthalate group Chemical group 0.000 description 2
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- 229920002312 polyamide-imide Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
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- 239000010935 stainless steel Substances 0.000 description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 229920001283 Polyalkylene terephthalate Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
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- 239000004697 Polyetherimide Substances 0.000 description 1
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
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- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- FXNGWBDIVIGISM-UHFFFAOYSA-N methylidynechromium Chemical group [Cr]#[C] FXNGWBDIVIGISM-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920002215 polytrimethylene terephthalate Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2019-098599 | 2019-05-27 | ||
JP2019098599 | 2019-05-27 | ||
JPJP-P-2019-217090 | 2019-11-29 | ||
JP2019217090A JP7356709B2 (ja) | 2019-05-27 | 2019-11-29 | ワークキャリア及びワークキャリアの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20200136308A true KR20200136308A (ko) | 2020-12-07 |
Family
ID=73548682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020200049524A KR20200136308A (ko) | 2019-05-27 | 2020-04-23 | 워크 캐리어 및 워크 캐리어의 제조 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7356709B2 (zh) |
KR (1) | KR20200136308A (zh) |
TW (1) | TW202042970A (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003340711A (ja) | 2002-05-22 | 2003-12-02 | Sagami Pci Kk | 研磨機用キャリア |
JP2010179375A (ja) | 2009-02-03 | 2010-08-19 | Sumco Corp | 被研磨物キャリア及び研磨製品の製造方法 |
JP2018144221A (ja) | 2017-03-06 | 2018-09-20 | 信越半導体株式会社 | 両面研磨装置用キャリア |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000117621A (ja) * | 1998-10-08 | 2000-04-25 | Memc Kk | インサートキャリア |
JP6673772B2 (ja) * | 2016-07-27 | 2020-03-25 | スピードファム株式会社 | ワークキャリア及びワークキャリアの製造方法 |
CN209288995U (zh) * | 2018-09-17 | 2019-08-23 | 杭州中芯晶圆半导体股份有限公司 | 一种研磨过程中减少硅片破裂的装置 |
-
2019
- 2019-11-29 JP JP2019217090A patent/JP7356709B2/ja active Active
-
2020
- 2020-04-23 KR KR1020200049524A patent/KR20200136308A/ko not_active Application Discontinuation
- 2020-04-28 TW TW109114098A patent/TW202042970A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003340711A (ja) | 2002-05-22 | 2003-12-02 | Sagami Pci Kk | 研磨機用キャリア |
JP2010179375A (ja) | 2009-02-03 | 2010-08-19 | Sumco Corp | 被研磨物キャリア及び研磨製品の製造方法 |
JP2018144221A (ja) | 2017-03-06 | 2018-09-20 | 信越半導体株式会社 | 両面研磨装置用キャリア |
Also Published As
Publication number | Publication date |
---|---|
JP7356709B2 (ja) | 2023-10-05 |
TW202042970A (zh) | 2020-12-01 |
JP2020192665A (ja) | 2020-12-03 |
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E902 | Notification of reason for refusal |