KR20200105527A - 에지 전도체 - Google Patents
에지 전도체 Download PDFInfo
- Publication number
- KR20200105527A KR20200105527A KR1020207024220A KR20207024220A KR20200105527A KR 20200105527 A KR20200105527 A KR 20200105527A KR 1020207024220 A KR1020207024220 A KR 1020207024220A KR 20207024220 A KR20207024220 A KR 20207024220A KR 20200105527 A KR20200105527 A KR 20200105527A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- edge
- conductor
- conductors
- display tile
- Prior art date
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 596
- 239000000758 substrate Substances 0.000 claims abstract description 438
- 239000000463 material Substances 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 45
- 229910000679 solder Inorganic materials 0.000 claims description 45
- 229920006254 polymer film Polymers 0.000 claims description 30
- 238000007906 compression Methods 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000011888 foil Substances 0.000 claims description 17
- 230000006835 compression Effects 0.000 claims description 16
- 238000005452 bending Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 230000001154 acute effect Effects 0.000 claims description 4
- 229920000307 polymer substrate Polymers 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims 2
- 239000000853 adhesive Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 16
- 239000010408 film Substances 0.000 description 16
- 239000011521 glass Substances 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000011324 bead Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 210000004185 liver Anatomy 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 208000014903 transposition of the great arteries Diseases 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H01L27/3293—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/18—Tiled displays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862622334P | 2018-01-26 | 2018-01-26 | |
US62/622,334 | 2018-01-26 | ||
PCT/US2019/015077 WO2019147888A1 (fr) | 2018-01-26 | 2019-01-25 | Conducteurs de bord |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20200105527A true KR20200105527A (ko) | 2020-09-07 |
Family
ID=67396267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020207024220A KR20200105527A (ko) | 2018-01-26 | 2019-01-25 | 에지 전도체 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2021511674A (fr) |
KR (1) | KR20200105527A (fr) |
CN (1) | CN111656871A (fr) |
TW (1) | TW201943319A (fr) |
WO (1) | WO2019147888A1 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220134602A (ko) * | 2020-01-27 | 2022-10-05 | 코닝 인코포레이티드 | 에지 도전체 코팅 |
TWI737325B (zh) * | 2020-06-01 | 2021-08-21 | 友達光電股份有限公司 | 顯示裝置及其框體 |
WO2021255203A2 (fr) * | 2020-06-18 | 2021-12-23 | Barco N.V. | Système et procédé de connexion de panneaux d'affichage |
CN113644085B (zh) * | 2020-08-14 | 2023-06-02 | 友达光电股份有限公司 | 电子装置及电子装置的制造方法 |
WO2023091329A1 (fr) * | 2021-11-22 | 2023-05-25 | Corning Incorporated | Procédés et appareil pour fabriquer un appareil électronique |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6778198B2 (en) * | 2002-01-18 | 2004-08-17 | Xerox Corporation | Glass substrate printed wiring board printhead for electric paper |
US8599353B2 (en) * | 2010-05-28 | 2013-12-03 | 3M Innovative Properties Company | Display comprising a plurality of substrates and a plurality of display materials disposed between the plurality of substrates that are connected to a plurality of non-overlapping integral conductive tabs |
US9351400B1 (en) * | 2013-02-21 | 2016-05-24 | Apple Inc. | Electrical connections between conductive contacts |
WO2014164477A1 (fr) * | 2013-03-12 | 2014-10-09 | Apple Inc. | Baisse de la résistance de couche d'une couche conductrice |
TWI671721B (zh) * | 2014-09-15 | 2019-09-11 | 比利時商巴而可公司 | 顯示磚、用於顯示磚的框架及其製作方法 |
-
2019
- 2019-01-25 TW TW108102890A patent/TW201943319A/zh unknown
- 2019-01-25 WO PCT/US2019/015077 patent/WO2019147888A1/fr active Application Filing
- 2019-01-25 KR KR1020207024220A patent/KR20200105527A/ko not_active Application Discontinuation
- 2019-01-25 JP JP2020540768A patent/JP2021511674A/ja not_active Abandoned
- 2019-01-25 CN CN201980010301.3A patent/CN111656871A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2019147888A1 (fr) | 2019-08-01 |
JP2021511674A (ja) | 2021-05-06 |
TW201943319A (zh) | 2019-11-01 |
CN111656871A (zh) | 2020-09-11 |
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E902 | Notification of reason for refusal |