JP6693707B2 - 基板集積インターコネクト - Google Patents
基板集積インターコネクト Download PDFInfo
- Publication number
- JP6693707B2 JP6693707B2 JP2015080486A JP2015080486A JP6693707B2 JP 6693707 B2 JP6693707 B2 JP 6693707B2 JP 2015080486 A JP2015080486 A JP 2015080486A JP 2015080486 A JP2015080486 A JP 2015080486A JP 6693707 B2 JP6693707 B2 JP 6693707B2
- Authority
- JP
- Japan
- Prior art keywords
- interconnect
- printed circuit
- circuit board
- layers
- stabilizing structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title description 8
- 238000000034 method Methods 0.000 claims description 48
- 230000000087 stabilizing effect Effects 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 30
- 230000008569 process Effects 0.000 claims description 29
- 238000010146 3D printing Methods 0.000 claims description 18
- 238000003475 lamination Methods 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 7
- 239000012811 non-conductive material Substances 0.000 claims description 5
- 230000008901 benefit Effects 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09754—Connector integrally incorporated in the PCB or in housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
Description
110 プリント回路基板 (printed circuit board)
115 第1の複数の層 (first plurality of layers)
120 インターコネクト (interconnect)
121 第2の複数の層 (second plurality of layers)
125 安定化構造 (stabilizing structure)
126 非ゼロ長 (non-zero length)
130 接点 (contact)
210 力 (force)
300 方法 (method)
310 ステップ (step)
320 ステップ (step)
Claims (18)
- 三次元印刷プロセスを用いて形成される第1の複数の層と、頂面と、該頂面と反対の底面と、前記頂面上の第1の平面とを含む、プリント回路基板と、
該プリント回路基板と一体的なインターコネクトとを含み、
該インターコネクトは、前記頂面の前記第1の平面より下に位置付けられ、前記第1の平面とは異なる第2の平面に沿って方向付けられ、
前記インターコネクトは、
前記第1の複数の層の少なくとも一部の上の第2の複数の層を含み、前記第2の複数の層は、前記三次元印刷プロセスを用いて形成され、
安定化構造を含み、
該安定化構造内に位置付けられる接点を含み、
前記安定化構造は、非伝導性の第1の材料を含み、前記接点は、前記第1の材料と異なる第2の材料を含み、
前記接点は、電気接点を含み、
前記インターコネクトは、構成部品コネクタを含む、
装置。 - 第1の複数の層を堆積させることによってプリント回路基板を形成すること、及び
前記第1の複数の層の少なくとも一部の上に第2の複数の層を堆積させることによって前記プリント回路基板と一体的なインターコネクトを形成することを含み、
前記プリント回路基板は、頂面と、該頂面と反対の底面と、前記頂面上の第1の平面とを含み、
該インターコネクトは、安定化構造と、該安定化構造内に位置付けられる接点とを含み、
前記安定化構造は、第1の材料で作製され、前記接点は、前記第1の材料と異なる第2の材料で作製され、
前記インターコネクトは、前記頂面の前記第1の平面より下に位置付けられ、前記第1の平面とは異なる第2の平面に沿って方向付けられる、
方法。 - 前記第2の複数の層は、前記インターコネクトが前記プリント回路基板と同一平面内に位置付けられるように、前記第1の複数の層の上に堆積させられ、当該方法は、前記プリント回路基板の表面に対して垂直な方向において前記インターコネクトを再配向することを更に含む、請求項2に記載の方法。
- 前記プリント回路基板及び前記インターコネクトは、積層プロセスを用いて形成される、請求項2に記載の方法。
- 前記プリント回路基板及び前記インターコネクトは、三次元印刷プロセスを用いて形成される、請求項2に記載の方法。
- 前記インターコネクトは、前記プリント回路基板の表面に対して垂直な方向において非ゼロ長だけ延びる、請求項2に記載の方法。
- 前記接点は、電気的又は光学的である、請求項2に記載の方法。
- 前記インターコネクトは、構成部品コネクタを含む、請求項2に記載の方法。
- 前記インターコネクトは、マイクロプロセッサソケットを含む、請求項2に記載の方法。
- 前記第1の材料は、非伝導性材料である、請求項2に記載の方法。
- 第1の複数の層と、頂面と、該頂面と反対の底面と、前記頂面上の第1の平面とを含む、プリント回路基板と、
該プリント回路基板と一体的なインターコネクトとを含み、
該インターコネクトは、
前記第1の複数の層の少なくとも一部の上の第2の複数の層と、
安定化構造と、
該安定化構造内に位置付けられる接点とを含み、
前記安定化構造は、第1の材料で作製され、前記接点は、前記第1の材料と異なる第2の材料で作製され、
前記インターコネクトは、前記頂面の前記第1の平面より下に位置付けられ、前記第1の平面とは異なる第2の平面に沿って方向付けられる、
装置。 - 前記プリント回路基板及びインターコネクトは、積層プロセスを用いて形成される、請求項11に記載の装置。
- 前記プリント回路基板及びインターコネクトは、三次元印刷プロセスを用いて形成される、請求項11に記載の装置。
- 前記インターコネクトは、前記プリント回路基板と同一平面内に形成される、請求項11に記載の装置。
- 前記インターコネクトは、前記プリント回路基板の表面に対して垂直な方向において非ゼロ長だけ延びる、請求項11に記載の装置。
- 前記接点は、電気的又は光学的である、請求項11に記載の装置。
- 前記インターコネクトは、構成部品コネクタを含む、請求項11に記載の装置。
- 前記第1の材料は、非伝導性材料である、請求項11に記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/269,736 | 2014-05-05 | ||
US14/269,736 US9386693B2 (en) | 2014-05-05 | 2014-05-05 | Board integrated interconnect |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015213162A JP2015213162A (ja) | 2015-11-26 |
JP6693707B2 true JP6693707B2 (ja) | 2020-05-13 |
Family
ID=53002494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015080486A Active JP6693707B2 (ja) | 2014-05-05 | 2015-04-10 | 基板集積インターコネクト |
Country Status (5)
Country | Link |
---|---|
US (1) | US9386693B2 (ja) |
EP (1) | EP2943048A1 (ja) |
JP (1) | JP6693707B2 (ja) |
KR (1) | KR102045596B1 (ja) |
TW (1) | TWI674821B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150013901A1 (en) * | 2013-07-11 | 2015-01-15 | Hsio Technologies, Llc | Matrix defined electrical circuit structure |
US9783130B2 (en) * | 2015-12-01 | 2017-10-10 | Delphi Technologies, Inc. | Interior trim components with integrated electrical wiring |
DE102016002052A1 (de) | 2015-12-18 | 2017-06-22 | Liebherr-Components Biberach Gmbh | Schaltschrank sowie Verfahren zu dessen Herstellung |
WO2019171923A1 (ja) * | 2018-03-09 | 2019-09-12 | オムロン株式会社 | 樹脂構造体の製造方法および樹脂構造体 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3353070A (en) | 1965-12-13 | 1967-11-14 | Bunker Ramo | Molded sandwich electrical connector with improved connector pins and encapsulating structure |
US4109298A (en) | 1976-07-26 | 1978-08-22 | Texas Instruments Incorporated | Connector with printed wiring board structure |
DE3501710A1 (de) | 1985-01-19 | 1986-07-24 | Allied Corp., Morristown, N.J. | Leiterplatte mit integralen positioniermitteln |
DE3501711A1 (de) * | 1985-01-19 | 1986-10-02 | Allied Corp., Morristown, N.J. | Leiterplatte mit integralem steckverbinder |
JPH02165691A (ja) * | 1988-12-20 | 1990-06-26 | Matsushita Electric Ind Co Ltd | 貼り合せ型多層配線回路基板 |
US5012391A (en) | 1989-08-17 | 1991-04-30 | Amp Incorporated | Molded electrical interconnection system |
US5156552A (en) * | 1990-02-23 | 1992-10-20 | General Electric Company | Circuit board edge connector |
US5132877A (en) * | 1990-07-05 | 1992-07-21 | Branan Mac W | Molded electrical assembly having an integral connector |
US5433819A (en) * | 1993-05-26 | 1995-07-18 | Pressac, Inc. | Method of making circuit boards |
US5397239A (en) * | 1993-12-17 | 1995-03-14 | Circuit-Wise, Inc. | Molded hinged connector |
US5675888A (en) | 1994-07-25 | 1997-10-14 | Owen; Marvin Leroy | Molded printed circuit board with wipe-in connector and method of making same |
US5521992A (en) | 1994-08-01 | 1996-05-28 | Motorola, Inc. | Molded optical interconnect |
US5914534A (en) | 1996-05-03 | 1999-06-22 | Ford Motor Company | Three-dimensional multi-layer molded electronic device and method for manufacturing same |
US7557452B1 (en) | 2000-06-08 | 2009-07-07 | Micron Technology, Inc. | Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same |
US6506062B1 (en) * | 2001-08-01 | 2003-01-14 | Visteon Global Technologies, Inc. | Circuit board having an integrated circuit board connector and method of making the same |
US7277770B2 (en) | 2003-07-15 | 2007-10-02 | Huang Wen C | Direct write process and apparatus |
NL1035663C2 (nl) | 2008-07-04 | 2010-01-05 | Thales Nederland Bv | Een werkwijze voor het vervaardigen van een driedimensionale multi-layered (meerlagen) doorverbindingsvoorziening. |
US8067305B2 (en) | 2008-09-03 | 2011-11-29 | Ultratech, Inc. | Electrically conductive structure on a semiconductor substrate formed from printing |
FR2936359B1 (fr) | 2008-09-25 | 2010-10-22 | Commissariat Energie Atomique | Connexion par emboitement de deux inserts soudes. |
EP2244291A1 (en) | 2009-04-20 | 2010-10-27 | Nxp B.V. | Multilevel interconnection system |
US8441808B2 (en) | 2010-09-22 | 2013-05-14 | Palo Alto Research Center Incorporated | Interposer with microspring contacts |
TW201415977A (zh) * | 2012-10-12 | 2014-04-16 | Boardtek Electronics Corp | 一種電路板製作方法 |
-
2014
- 2014-05-05 US US14/269,736 patent/US9386693B2/en active Active
-
2015
- 2015-03-04 TW TW104106862A patent/TWI674821B/zh active
- 2015-04-09 EP EP15162923.5A patent/EP2943048A1/en active Pending
- 2015-04-10 JP JP2015080486A patent/JP6693707B2/ja active Active
- 2015-04-29 KR KR1020150060229A patent/KR102045596B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20150126778A (ko) | 2015-11-13 |
KR102045596B1 (ko) | 2019-11-15 |
JP2015213162A (ja) | 2015-11-26 |
TWI674821B (zh) | 2019-10-11 |
US20150319850A1 (en) | 2015-11-05 |
EP2943048A1 (en) | 2015-11-11 |
TW201543972A (zh) | 2015-11-16 |
US9386693B2 (en) | 2016-07-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11309114B2 (en) | Stacked body and method of producing stacked body | |
JP6693707B2 (ja) | 基板集積インターコネクト | |
US10051730B2 (en) | Multilayer substrate manufacturing method and multilayer substrate | |
US9324491B2 (en) | Inductor device and electronic apparatus | |
US20150000959A1 (en) | Multilayer printed circuit board having anisotropy condictive film and method for manufacturing same | |
US10028388B2 (en) | Component-embedded substrate | |
EP2575417B1 (en) | Printed circuit board assembly | |
WO2017217308A1 (ja) | 電子部品、振動板、電子機器および電子部品の製造方法 | |
JP6673304B2 (ja) | 多層基板 | |
TWI472273B (zh) | 電路板及其製作方法 | |
KR20160121914A (ko) | 연성접합부를 포함한 연성인쇄회로기판의 접합구조 | |
JP2011151103A (ja) | 電子部品相互の接続構造及び接続方法 | |
JPWO2016117122A1 (ja) | 配線板の製造方法、および配線板 | |
CN210075747U (zh) | 多层基板 | |
KR100651465B1 (ko) | 전자 회로 모듈 및 집적 회로 장치의 제작 방법과 그를이용한 전자 회로 모듈 | |
JP2016082074A (ja) | 電装装置およびその製造方法 | |
US11043626B2 (en) | Multilayer substrate | |
CN215268953U (zh) | 树脂多层基板 | |
JP6070290B2 (ja) | 樹脂多層部品およびその製造方法 | |
JP6525319B2 (ja) | シート状コイル部品とシート状コイル部品の実装体およびシート状コイル部品の実装方法 | |
JP2009267060A (ja) | 接続構造 | |
WO2019240000A1 (ja) | 電気素子の製造方法、電気素子、および電気素子の実装構造 | |
KR101478290B1 (ko) | 연성회로기판의 olb단자부 구조 | |
TW202116123A (zh) | 電路跨線結構及其製造方法 | |
JP2017175088A (ja) | プリント配線板、及びプリント配線板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180404 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190225 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190305 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190603 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190903 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191125 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200317 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200416 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6693707 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |